California Micro Devices CSPPT32-900J, CSPPT32-900F, CSPPT16-900J, CSPPT16-900F, CSPPT16-680J Datasheet

CALIFORNIA MICRO DEVICES

Chip Scale Parallel Termination Array

CSPPT

Features

• 8,16 or 32 integrated high frequency
bussed terminations

• Ultra small footprint Chip Scale Package

• Ceramic substrate

• 0.35mm Eutectic Solder Bumps, 0.65mm pitch

Product Description

The CSPPT is a high performance Integrated Passive
Device (IPD) which provides parallel terminations
suitable for use in high speed bus applications. Eight (8),
sixteen (16), or thirty-two (32) parallel termination
versions are provided. These resistors provide excellent
high frequency performance in excess of 3GHz and are
manufactured to an absolute tolerance as low as ±1%.

SCHEMATIC DIAGRAMS

B

R1

R1 R1

Applications

• Parallel resistive bus termination

• Bussed resistor array

The Chip Scale Package provides an ultra small
footprint for this IPD and provides minimal parasitics
compared to conventional packaging. Typical bump
inductance is less than 25pH. The large solder bumps
and ceramic substrate allow for standard attachment to
laminate printed circuit boards without the use of
underfill.

R1

D

R1

R1

C

B

R1

R1

A

12

R1 R1

R1

R1 R1

R1

4

3

CSPPT16

R1

A

12

R1

3

R1

R1

4

5

CSPPT08

R1

R1

R1

R1

R1

R1

5

D

R1

R1

C

B

R1

R1

A

12

R1 R1

R1

R1 R1

R1

4

3

R1

R1

R1

R1

R1

R1

5

67 9

R1 R1

R1

R1 R1

R1

R1

R1 R1

R1

R1

8

R1

R1

R1

R1

R1

10

CSPPT32

© 2000 California Micro Devices Corp. All rights reserved.

11/10/2000

215 Topaz Street, Milpitas, California 95035 Tel: [phone] Fax: [phone] www.calmicro.com

C1290700

1

CALIFORNIA MICRO DEVICES

eulaVrotsiseR74=1R ,Ω 05 ,Ω 65 ,Ω86,Ω 09 ,Ω 001 ,Ω

RecnareloTetulosbA%5±,%1±

srotsiseRfoRCTmpp001±

rotsiseR/gnitaRrewoPWm001

Package Diagram (Bumps Up View)

0.2234mm

B

A

0.35mm
Dia.

Bumps

egnaRerutarepmeTgnitarepOC°58otC°04–

3.0468mm

0.65
mm

1

23 54

CSPPT08

0.65
mm

CSPPT

SEULAVDRADNATS

1.0968mm

0.381mm

0.643mm

0.2234mm

0.35mm
Dia.

Bumps

D

C

B

A

3.0468mm

0.65

0.2234mm

0.35mm
Dia.

Bumps

D

C

B

A

1

mm

2345

CSPPT16

6.2968mm

0.65
mm

1

2345678 109

0.65
mm

0.65
mm

2.3968mm

0.381mm

0.643mm

2.3968mm

0.381mm

0.643mm

©2000 California Micro Devices Corp. All rights reserved.

2

CSPPT32

11/10/2000215 Topaz Street, Milpitas, California 95035 Tel: [phone] Fax: [phone] www.calmicro.com