California Eastern Laboratories ZICM900P2 Users Manual

PRELIMINARY DATA SHEET

MeshConnect™ Sub-G Module Series

ZICM0868Px
ZICM0900Px

868 / 900 MHz Transceiver Based Modules

Development Kits Available:

ZICM0868P2-KIT1-1 and ZICM0900P2-KIT1-1

DESCRIPTION

CEL's MeshConnect™ Module Series provides high performance
and low cost Sub-G modules for a broad range of wireless net-

works. The MeshConnect certied and qualied modules enable

customers to accelerate time to market by greatly reducing design

and certication phases of development.

CEL's MeshConnect™ Sub-G modules (868/900MHz) are based
on the Silicon Labs SoC ICs (single-chip solutions). Each IC con­sists of an RF transceiver with baseband modem, a hard-wired
MAC and an embedded 8051 microcontroller with internal RAM
(4kB) and Flash (64kB) memory. The device provides numer­ous general-purpose I/O pins and peripheral functions such as
timers and UARTs.

The MeshConnect Sub-G modules have 2 different output powers
(+12dBm and +19dBm). They provide a reliable transmission, to
reduce the number of nodes in a network. They are especially
useful for open outdoor applications where the nodes are physi­cally far apart. The higher power Modules have an outstanding

118dB link budget ensuring high quality connections even in

harsh environments.

APPLICATIONS

• Metering

• RFID

• RemoteKeylessEntry

• HomeAutomation

• Security

• Irrigation

• WeatherStations

• Andmore...

™

MeshConnect

ZICM0868Px ZICM0900Px

Sub-G Modules

Best Reliable Performance

• Good sensitivity providing longer range for Non-line-of-site

aplications

• Low operating (receive) current

FEATURES

•FrequencyRange:

 902- 928 MHz 
 868 MHz

•Sensitivity:-99dBm

•MaxOutputPower:

+ 12 dBm @ 3.6 VDC (ZICM0xxxP0)

+ 19 dBm @ 3.6 VDC (ZICM0xxxP2)

•DataRate:0.123to150kbps

•Upto21GPIOPins

•HighSpeed8051MCU:

30 MHz
4kB RAM / 64 kB Flash

•10-BitADC:

300 ksps, 18-ch inputs

•SerialCommunication:

UARTs, SPI (Master/Slave)
SMBus, PCA

•Modulation:  
 FSK

•RFPowerConsumption 

 24 mA Receive
 18 mA @ + 1 dBm transmit 
 30 mA @ + 12 dBm transmit
 90 mA @ + 19 dBm transmit

•Auto-FrequencyCalibration(AFC)

•FrequencyHoppingCapability

•Upto12milesofrange

•OperatingTemperatureRange:
 -40 to +85ºC

•SoftwareSupport:
 Synapse SNAP Embedded Firmware
 Wireless M-Bus (868MHz Only)
 Silicon Labs EZMac
 CEL Protocol

•FCC,CEandICcerticationsin
 Progress

•ROHScompliant

The information in this document is subject to change without notice, please conrm data is current

Document No: 0009-00-07-00-000 (Issue ES)

Date Published: December 7, 2010

Page 1

ORDERING INFORMATION

Part Number Order Number Description

ZICM0868P0-1CU 868 MHz Module, +12dBm output power with U.FL connector for external antenna

ZICM0868P2-1CU 868 MHz Module, +19dBm output power with U.FL connector for external antenna

ZICM0868P0-1CS 868 MHz Module, +12dBm output power with RP-SMA connector for external antenna

ZICM0868P2-1CS 868 MHz Module, +19dBm output power with RP-SMA connector for external antenna

ZICM0868P0-1C

ZICM0868P2-1C

MeshConnect™ Sub-G

(Eruope Only)

MeshConnect™ Sub-G

MeshConnect™ Sub-G

Development Kits

ZICM0868P0-1CU-SN

ZICM0868P2-1CU-SN

ZICM0868P0-1CS-SN

ZICM0868P2-1CS-SN

ZICM0868P0-1C-SN

ZICM0868P2-1C-SN

ZICM0900P0-1CU 900 MHz Module, +12dBm output power with U.FL connector for external antenna

ZICM0900P2-1CU 900 MHz Module, +19dBm output power with U.FL connector for external antenna

ZICM0900P0-1CS 900 MHz Module, +12dBm output power with RP-SMA connector for external antenna

ZICM0900P2-1CS 900 MHz Module, +19dBm output power with RP-SMA connector for external antenna

ZICM0900P0-1C

ZICM0900P2-1C

ZICM0900P0-1CU-SN

ZICM0900P2-1CU-SN

ZICM0900P0-1CS-SN

ZICM0900P2-1CS-SN

ZICM0900P0-1C-SN

ZICM0900P2-1C-SN

ZICM0868P2-KIT1-1 868 MHz Evaluation board for +19 dBm module

ZICM0900P2-KIT1-1 900 MHz Evaluation board for +19 dBm module

MeshConnect™ Sub-G Module Series

868 MHz Module, +12dBm output power with a connection for 1/4 wave wire antenna
(in place of RP-SMA)

868 MHz Module, +19dBm output power with a connection for 1/4 wave wire antenna
(in place of RP-SMA)

868 MHz Module, +12dBm output power with U.FL connector for external antenna
with SNAP Operating System software and MAC address

868 MHz Module, +19dBm output power with U.FL connector for external antenna
with SNAP Operating System software and MAC address

868 MHz Module, +12dBm output power with RP-SMA connector for external antenna
with SNAP Operating System software and MAC address

868 MHz Module, +19dBm output power with RP-SMA connector for external antenna
with SNAP Operating System software and MAC address

868 MHz Module, +12dBm output power for 1/4 wave wire antenna (in place of
RP-SMA) with SNAP Operating System software and MAC address

868 MHz Module, +19dBm output power for 1/4 wave wire antenna(in place of
RP-SMA) with SNAP Operating System software and MAC address

900 MHz Module, +12dBm output power with a connection for 1/4 wave wire antenna
(in place of RP-SMA)

900 MHz Module, +19dBm output power with a connection for 1/4 wave wire antenna
(in place of RP-SMA)

900 MHz Module, +12dBm output power with U.FL connector for external antenna
with SNAP Operating System software and MAC address

900 MHz Module, +19dBm output power with U.FL connector for external antenna
with SNAP Operating System software and MAC address

900 MHz Module, +12dBm output power with RP-SMA connector for external antenna
with SNAP Operating System software and MAC address

900 MHz Module, +19dBm output power with RP-SMA connector for external antenna
with SNAP Operating System software and MAC address

900 MHz Module, +12dBm output power for 1/4 wave wire antenna (in place of
RP-SMA) with SNAP Operating System software and MAC address

900 MHz Module, +19dBm output power for 1/4 wave wire antenna (in place of
RP-SMA) with SNAP Operating System software and MAC address

Page 2

MODULE BLOCK DIAGRAM

ANT

SI100x

MeshConnect™ Sub-G Module Series

Sub-G

T/R

Switch

External
Memory

Optional

Low Pass

Filter

DEVELOPMENT KIT

CEL's Development Kit assist users in both evaluation and
development. As a stand-alone radio system, the kit allows
users to place the modules into the target environment
and evaluate performance on-site. The Development Kit
also serves as an invaluable aid in application develop­ment. Through the many interface headers on the board,
the user has access to all of the MeshConnect module
pins, enabling easy connection to target systems for ap­plication development.

The interface board features a serial communication
interface, a power management module, and peripherals
such as a buzzer, push-button switches, LEDs, and GPIO
headers.

™

MeshConnect

Sub-G Module Development Kit

For more detail information regarding MeshConnect
Development Kits, refer to the respective development
kit user guides documents. (Available at CEL’s website

http://www.cel.com)

DEVELOPMENT KIT ORDERING INFORMATION

Part Number Order Number Description

MeshConnect™ Sub-G

Development Kits

ZICM0868P2-KIT1-1 868 MHz Evaluation board for +19dBm module

ZICM0900P2-KIT1-1 900 MHz Evaluation board for +19dBm module

Kit Contents:

• Evaluation Boards w/Module (2)

• USB Cables (1)

• AA Batteries (4)

• Software & Technical Information CD (1)

Page 3

TABLE OF CONTENTS

Introduction and Overview

MeshConnect™ Sub-G Module Series

Description..............................................................................................................................................................................................

Features..................................................................................................................................................................................................

Applications............................................................................................................................................................................................

Ordering Information.............................................................................................................................................................................

Module Block Diagram........................................................................................................................................................................... 3

Development Kit..................................................................................................................................................................................... 3

System Level Function

Transceiver IC.........................................................................................................................................................................................

Antenna.................................................................................................................................................................................... 5

Additional Flash Memory....................................................................................................................................................................... 5

Electrical Specication

Absolute Maximum Ratings...................................................................................................................................................................

Recommended (Operating Condition)..................................................................................................................................................

DC Characteristics..................................................................................................................................................................................

RF Characteristics..................................................................................................................................................................................

Pin Signal & Interfaces

Pin Signals I/O Conguration................................................................................................................................................................

I/O Pin Assignment.................................................................................................................................................................................

Software/Firmware..................................................................................................................................................................................

Module Dimensions................................................................................................................................................................................

Module Footprint....................................................................................................................................................................................

1

1

1

2

5

6

6

6

7

8

8

9

10

11

Processing.........................................................................................................................................................................................

Agency Certications...................................................................................................................................................................

Shipment, Storage & Handling.................................................................................................................................................

References & Revision History.................................................................................................................................................

12

13

14

15

Page 4

MeshConnect™ Sub-G Module Series

TRANSCEIVER IC

The MeshConnect Sub-G modules are based on the Silicon Labs Si1000 and Si1002 SOC transceiver ICs. These ICs
incorporate the RF transceiver with the baseband modem, a hardwired MAC, and an embedded 8051 microcontroller,
offering a high performance solution for all Sub-G applications.

For more information about the Silicon Labs ICs, visit http://www.silabs.com.

ANTENNA

The MeshConnect Sub-G modules include RF connectors for external antenna options only (There is no trace antenna
option). The following options are supported by CEL:

• U.FL connector

• RP-SMA connector

• A Connection for 1/4 wave wire antenna in place of RP-SMA

Here are some design guidelines to help ensure antenna performance:

• Never place the antenna close to metallic objects.

• In the overall design, ensure that wiring and other components are not placed near the antenna.

• Do not place the antenna in a metallic or metalized plastic enclosure.

• Keep plastic enclosures 1cm or more from the antenna in any direction.

ADDITIONAL FLASH MEMORY (Optional)

The Silicon Labs Transceiver ICs (Si1000 and Si1002) have an embedded 64kB of ash. Additional memory (1MB) can be

mounted on the module (as an option) to enable Over The Air (OTA) programming capability.

This is a custom solution as an option for all part numbers.

Page 5