®
3 DAC7621
PIN CONFIGURATION
Top View SSOP
VDD to GND .......................................................................... –0.3V to 6V
Digital Inputs to GND .............................................. –0.3V to V
DD
+ 0.3V
V
OUT
to GND ........................................................... –0.3V to VDD + 0.3V
Power Dissipation ........................................................................ 325mW
Thermal Resistance,
θ
JA
........................................................... 150°C/W
Maximum Junction Temperature.................................................. +150°C
Operating Temperature Range ...................................... –40°C to +85°C
Storage Temperature Range ....................................... –65 °C to +150°C
Lead Temperature (soldering, 10s) .............................................. +300°C
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
ABSOLUTE MAXIMUM RATINGS
(1)
PIN DESCRIPTIONS
PIN LABEL DESCRIPTION
1 CLR Reset. Resets the DAC register to zero. Active
LOW. Asynchronous input.
2V
DD
Postive Power Supply
3V
OUT
DAC Output Voltage
4 AGND Analog Ground
5 DGND Digital Ground
6 DB11 Data Bit 11, MSB
7 DB10 Data Bit 10
8 DB9 Data Bit 9
9 DB8 Data Bit 8
10 DB7 Data Bit 7
11 DB6 Data Bit 6
12 DB5 Data Bit 5
13 DB4 Data Bit 4
14 DB3 Data Bit 3
15 DB2 Data Bit 2
16 DB1 Data Bit 1
17 DB0 Data Bit 0, LSB
18 R/W Read and Write Control
19 CS Chip Select. Active LOW.
20 LOADDAC Loads the internal DAC register. The DAC register
is a transparent latch and is transparent when
LOADDAC is LOW (regardless of the state of CS or
CLK).
ELECTROSTA TIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
PACKAGE/ORDERING INFORMATION
MINIMUM
RELATIVE DIFFERENTIAL SPECIFICATION PACKAGE
ACCURACY NONLINEARITY TEMPERATURE DRAWING ORDERING TRANSPORT
PRODUCT (LSB) (LSB) RANGE PACKAGE NUMBER
(1)
NUMBER
(2)
MEDIA
DAC7621E ±2 ±1 –40°C to +85°C 20-Lead SSOP 334 DAC7621E Rails
"" " " ""DAC7621E/1K Tape and Reel
DAC7621EB ±1 ±1 –40°C to +85°C 20-Lead SSOP 334 DAC7621EB Rails
"" " " ""DAC7621EB/1K Tape and Reel
NOTES: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. (2) Models with a slash (/) are
available only in Tape and Reel in the quantities indicated (e.g., /1K indicates 1000 devices per reel). Ordering 1000 pieces of “DAC7621E/1K” will get a single
1000-piece Tape and Reel. For detailed Tape and Reel mechanical information, refer to Appendix B of Burr-Brown IC Data Book.
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
CLR
V
DD
V
OUT
AGND
DGND
DB11 (MSB)
DB10
DB9
DB8
DB7
LOADDAC
CS
R/W
DB0 (LSB)
DB1
DB2
DB3
DB4
DB5
DB6
DAC7621E