3
®
DAC716
DIFFERENTIAL
LINEARITY ERROR TEMPERATURE
PRODUCT PACKAGE T
MIN
to T
MAX
RANGE
DAC716P Plastic DIP ±8 LSB –40°C to +85°C
DAC716U Plastic SOIC ±8 LSB –40°C to +85°C
DAC716PB Plastic DIP ±4 LSB –40°C to +85°C
DAC716UB Plastic SOIC ±4 LSB –40°C to +85°C
DAC716PK Plastic DIP ±2 LSB 0°C to +70°C
DAC716UK Plastic SOIC ±2 LSB 0°C to +70°C
PIN CONFIGURATION
Top View
ELECTROSTATIC
DISCHARGE SENSITIVITY
Electrostatic discharge can cause damage ranging from performance degradation to complete device failure. BurrBrown Corporation recommends that all integrated circuits
be handled and stored using appropriate ESD protection
methods.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet
published specifications.
PIN DESCRIPTIONS
PIN LABEL DESCRIPTION
1 CLK Serial Data Clock
2A
0
Enable for Input Register (Active Low)
3A
1
Enable for D/A Latch (Active Low)
4 SDI Serial Data Input
5 SDO Serial Data Output
6 DCOM Digital Supply Ground
7+V
CC
Positive Power Supply
8 ACOM Analog Supply Ground
9V
OUT
D/A Output
10 NC No Connection
11 NC No Connection
12 V
REF OUT
Voltage Reference Output
13 Offset Adjust Offset Adjust
14 Gain Adjust Gain Adjust
15 –V
CC
Negative Power Supply
16 CLR Clear
ORDERING INFORMATION
SOIC/DIP
+V
CC
to Common .................................................................... 0V to +17V
–V
CC
to Common .................................................................... 0V to –17V
+V
CC
to –VCC....................................................................................... 34V
ACOM to DCOM ...............................................................................±0.5V
Digital Inputs to Common............................................. –1V to (V
CC
–0.7V)
External Voltage Applied to BPO and Range Resistors..................... ±V
CC
V
REF OUT
......................................................... Indefinite Short to Common
V
OUT
............................................................... Indefinite Short to Common
SDO ............................................................... Indefinite Short to Common
Power Dissipation ..........................................................................750mW
Storage Temperature ...................................................... –60°C to +150°C
Lead Temperature (soldering, 10s)................................................ +300°C
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
ABSOLUTE MAXIMUM RATINGS
(1)
CLK
A
0
A
1
SDI
SDO
DCOM
+V
CC
ACOM
DAC716
CLR
–V
CC
Gain Adjust
Offset Adjust
V
REF OUT
NC
NC
V
OUT
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
PACKAGE DRAWING
PRODUCT PACKAGE NUMBER
(1)
DAC716P Plastic DIP 180
DAC716U Plastic SOIC 211
NOTE: (1) For detailed drawing and dimension table, please see end of data sheet,
or Appendix C of Burr-Brown IC Data Book.
PACKAGE INFORMATION