3
®
DAC1221
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
ABSOLUTE MAXIMUM RATINGS
(1)
AV
DD
to DVDD................................................................................... ±0.3V
AV
DD
to AGND ........................................................................ –0.3V to 4V
DV
DD
to DGND ....................................................................... –0.3V to 4V
AGND to DGND ............................................................................... ±0.3V
V
REF
Voltage to AGND .......................................................... 1.0V to 1.5V
Digital Input Voltage to DGND .............................. –0.3V to DV
DD
+ 0.3V
Digital Output Voltage to DGND ........................... –0.3V to DV
DD
+ 0.3V
Package Power Dissipation ............................................. (T
JMAX
– TA)/
θ
JA
Maximum Junction Temperature (T
JMAX
) ..................................... +150°C
Thermal Resistance,
θ
JA
SSOP-16............................................................................... 200°C/W
Lead Temperature (soldering, 10s) ............................................... +300°C
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
PIN CONFIGURATION
Top View SSOP
PIN DESCRIPTIONS
PIN NAME DESCRIPTION
1DV
DD
Digital Supply, +3V nominal
2X
OUT
Digital, System Clock Output
3X
IN
Digital, System Clock Input
4 DGND Digital Ground
5AV
DD
Analog Supply, +3V nominal
6 DNC Do Not Connect
7C
3
Analog, Filter Capacitor
8C
2B
Analog, Filter Capacitor
9C
1
Analog, Filter Capacitor
10 C
2A
Analog, Filter Capacitor
11 V
OUT
Analog Output Voltage
12 V
REF
Analog, Reference Input
13 AGND Analog Ground
14 CS Digital, Chip Select Input
15 SDIO Digital, Serial Data Input/Output
16 SCLK Digital, Clock Input for Serial Data Transfer
1
2
3
4
5
6
7
8
DV
DD
X
OUT
X
IN
DGND
AV
DD
DNC
C
3
C
2B
SCLK
SDIO
CS
AGND
V
REF
V
OUT
C
2A
C
1
16
15
14
13
12
11
10
9
DAC1221E
PACKAGE SPECIFIED
DRAWING TEMPERATURE PACKAGE ORDERING TRANSPORT
PRODUCT PACKAGE NUMBER RANGE MARKING NUMBER
(1)
MEDIA
DAC1221E SSOP-16 322 –40°C to +85°C DAC1221E DAC1221E Rails
" " " " " DAC1221E/2K5 Tape and Reel
NOTE: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 2500 pieces
of “DAC1221E/2K5” will get a single 2500-piece Tape and Reel.
PACKAGE/ORDERING INFORMATION