3
®
AFE1124
PIN CONFIGURATION
PACKAGE
DRAWING TEMPERATURE
PRODUCT PACKAGE NUMBER
(1)
RANGE
AFE1124E 28-Pin SSOP 324 –40 to +85
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
PACKAGE/ORDERING INFORMATION
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN
assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject
to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not
authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.
NC
NC
DV
DD
DGND
txbaudCLK
tx48xCLK
Data In
rxbaudCLK
rx48xCLK
Data Out
DV
DD
DGND
AV
DD
rxHYB–
NC
AGND
txLINE+
AV
DD
txLIKNE–
AGND
AV
DD
vrREFN
VCM
vrREFP
AGND
rxLINE+
rxLINE–
rxHYB+
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
AFE1124
Analog Inputs: Current .............................................. ±100mA, Momentary
±10mA, Continuous
Voltage.................................. AGND –0.3V to AV
DD
+0.3V
Analog Outputs Short Circuit to Ground (+25°C) ..................... Continuous
AV
DD
to AGND ........................................................................ –0.3V to 6V
DV
DD
to DGND........................................................................ –0.3V to 6V
Digital Input Voltage to DGND ..................................–0.3V to DV
DD
+0.3V
Digital Output Voltage to DGND ...............................–0.3V to DV
DD
+0.3V
AGND, DGND, Differential Voltage..................................................... 0.3V
Junction Temperature (T
J
) ............................................................. +150°C
Storage Temperature Range .......................................... –40°C to +125°C
Lead Temperature (soldering, 3s).................................................. +260°C
Power Dissipation .......................................................................... 700mW
ABSOLUTE MAXIMUM RATINGS
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.