BURR-BROWN UAF42 User Manual

Page 1
UNIVERSAL ACTIVE FIL TER
UAF42
UAF42
UAF42
FEATURES
VERSATILE—
LOW-PASS, HIGH-PASS BAND-PASS, BAND-REJECT
SIMPLE DESIGN PROCEDURE
ACCURATE FREQUENCY AND Q —
±0.5%
CAPACITORS
DESCRIPTION
The UAF42 is a universal active filter which can be configured for a wide range of low-pass, high-pass, and band-pass filters. It uses a classical state-variable analog architecture with an inverting amplifier and two integrators. The integrators include on-chip 1000pF capacitors trimmed to 0.5%. This solves one of the most difficult problems of active filter design— obtaining tight tolerance, low-loss capacitors.
A DOS-compatible filter design program allows easy implementation of many filter types such as Butterworth, Bessel, and Chebyshev. A fourth, un­committed FET-input op amp (identical to the other
APPLICATIONS
TEST EQUIPMENT
COMMUNICATIONS EQUIPMENT
MEDICAL INSTRUMENTATION
DATA ACQUISITION SYSTEMS
MONOLITHIC REPLACEMENT FOR UAF41
three) can be used to form additional stages, or for special filters such as band-reject and Inverse Chebyshev.
The classical topology of the UAF42 forms a time­continuous filter, free from the anomalies and switch­ing noise associated with switched-capacitor filter types.
The UAF42 is available in 14-pin plastic DIP and SOL-16 surface-mount packages, specified for the – 25°C to +85°C temperature range.
SBFS002
High-Pass
Out
R
R
In
1
In
2
R
In
3
R = 50k ±0.5%
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Internet: http://www.burr-brown.com/ • FAXLine: (800) 548-6133 (US/Canada Only) • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
©
1990 Burr-Brown Corporation PDS-1070H Printed in U.S.A. January, 1998
Band-Pass
1000pF
R
NOTE: (1) ±0.5%
Out
(1)
GND
Low-Pass
1000pF
Out
(1)
V+
V–
Page 2
SPECIFICATIONS
ELECTRICAL
At TA = +25°C, VS = ±15V, unless otherwise noted.
UAF42AP, AU PARAMETER CONDITIONS MIN TYP MAX UNITS FILTER PERFORMANCE
Frequency Range, fn 0 to 100 kHz Frequency Accuracy f = 1kHz 1 % vs Temperature 0.01 %/°C Maximum Q 400 — Maximun (Q • Frequency) Product 500 kHz Q vs Temperature (f
Q Repeatability (f Offset Voltage, Low-Pass Output ±5mV
O
(f
O
O
Resistor Accuracy 0.5 1% %
OFFSET VOLTAGE
(1)
Input Offset Voltage ±0.5 ±5mV vs Temperature ±3 µV/°C vs Power Supply V
INPUT BIAS CURRENT
(1)
= ±6 to ±18V 80 96 dB
S
Input Bias Current VCM = 0V 10 50 pA Input Offset Current V
NOISE
Input Voltage Noise
Noise Density: f = 10Hz 25 nV/Hz
f = 10kHz 10 nV/Hz
Voltage Noise: BW = 0.1 to 10Hz 2 µVp-p
Input Bias Current Noise
Noise Density: f = 10kHz 2 fA/Hz
INPUT VOLTAGE RANGE
(1)
Common-Mode Input Range ±11.5 V Common-Mode Rejection V
INPUT IMPEDANCE
(1)
Differential 1013 || 2 || pF Common-Mode 10
OPEN-LOOP GAIN
(1)
Open-Loop Voltage Gain VO = ±10V, RL = 2k 90 126 dB
FREQUENCY RESPONSE
(1)
Slew Rate 10 V/µs Gain-Bandwidth Product G = +1 4 MHz Total Harmonic Distortion G = +1, f = 1kHz 0.0004 %
(1)
OUTPUT
Voltage Output RL = 2kΩ±11 ±11.5 V Short Circuit Current ±25 mA
POWER SUPPLY
Specified Operating Voltage ±15 V Operating Voltage Range ±6 ±18 V Current ±6 ±7mA
TEMPERATURE RANGE
Specification –25 +85 °C Operating –25 +85 °C Storage –40 +125 °C Thermal Resistance,
θ
JA
Same as specification for UAF42AP. NOTES: (1) Specifications apply to uncommitted op amp, A
. The three op amps forming the filter are identical to A4 but are tested as a complete filter.
4
4
• Q) < 10
5
• Q) < 10
5
• Q) < 10
= 0V 5 pA
CM
= ±10V 80 96 dB
CM
0.01 %/°C
0.025 %/°C 2%
13
|| 6 || pF
100 °C/W
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.
UAF42
2
Page 3
PIN CONFIGURATION
Top View
Low-Pass V
V
V Auxiliary Op Amp, +In Auxiliary Op Amp, –In
Auxiliary Op Amp, V
Bandpass V
O
IN3
IN2
O
O
Plastic DIP, P
1 2 3 4 5 6 7
14
Frequency Adj
13
High-Pass V
12
V
IN1
11
Ground
10
V+
9
V–
8
Frequency Adj
2
O
1
ABSOLUTE MAXIMUM RATINGS
Power Supply Voltage ....................................................................... ±18V
Input Voltage............................................................................. ±V
Output Short Circuit .................................................................Continuous
Operating Temperature:
Plastic DIP, P; SOIC, U ................................................. –40°C to +85°C
Storage Temperature:
Plastic DIP, P; SOIC, U ............................................... –40°C to +125°C
Junction Temperature:
Plastic DIP, P; SOIC, U .............................................................. +125°C
Lead Temperature (soldering, 10s)................................................ +300°C
S
±0.7V
U Package
SOL-16, 16-Pin SOIC
Low-Pass V
NC V V
Auxiliary Op Amp, +In Auxiliary Op Amp, –In
Auxiliary Op Amp, V
Bandpass V
NOTE: NC: No Connection. For best
performance connect all “NC” pins to
ground to minimize inter-lead capacitance.
1
O
2 3
IN3
4
IN2
5 6 7
O
8
O
16
Frequency Adj
15
NC
14
High-Pass V
13
V
IN1
12
Ground
11
V+
10
V–
9
Frequency Adj
2
O
1
PACKAGE/ORDERING INFORMATION
PACKAGE
DRAWING TEMPERATURE
PRODUCT PACKAGE NUMBER
UAF42AP Plastic 14-pin DIP 010 –25°C to +85°C UAF42AU SOL-16 211 –25°C to +85°C
NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book.
(1)
RANGE
ELECTROSTATIC DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
3
UAF42
Page 4
APPLICATIONS INFORMATION
The UAF42 is a monolithic implementation of the proven state-variable analog filter topology. Pin-compatible with the popular UAF41 Analog Filter, it provides several improvements.
Slew Rate of the UAF42 has been increased to 10V/µs versus 1.6V/µs for the UAF41. Frequency • Q product of the UAF42 has been improved, and the useful natural frequency extended by a factor of four to 100kHz. FET­input op amps on the UAF42 provide very low input bias current. The monolithic construction of the UAF42 provides lower cost and improved reliability.
DESIGN PROGRAM
Application Bulletin AB-035 and a computer-aided design program, available from Burr-Brown, make it easy to design and implement many kinds of active filters. The DOS­compatible program guides you through the design process and automatically calculates component values.
Low-pass, high-pass, band-pass and band-reject (notch) filters can be designed. The program supports the three most commonly used all-pole filter types: Butterworth, Chebyshev and Bessel. The less-familiar Inverse Chebyshev is also supported, providing a smooth passband response with ripple in the stop-band.
With each data entry, the program automatically calculates and displays filter performance. This allows a spreadsheet­like “what if” design approach. For example, you can quickly determine, by trial and error, how many poles are required for a desired attenuation in the stopband. Gain/phase plots may be viewed for any response type.
The basic building element of the most commonly used filter types is the second-order section. This section provides a complex-conjugate pair of poles. The natural frequency, ω and Q of the pole pair determines the characteristic response of the section. The low-pass transfer function is
2
VO(s)
VI(s)
ALPω
=
2
+ s ωn/Q + ω
s
n
2
n
(1)
The high-pass transfer function is
2
VHP(s)
VI(s)
=
AHPs
2
+ s ωn/Q + ω
s
2
n
(2)
The band-pass transfer function is
V
(s)
BP
VI(s)
ABP(ωn/Q) s
=
2
s
+ s ωn/Q + ω
2
n
(3)
A band-reject response is obtained by summing the low-pass and high-pass outputs, yielding the transfer function
V
BR
VI(s)
(s)
=
ABR(s2 +ω
2
+ s ωn/Q + ω
s
2
)
n
2
n
(4)
The most commonly used filter types are formed with one or more cascaded second-order sections. Each section is de­signed for ω
and Q according to the filter type (Butterworth,
n
Bessel, Chebyshev, etc.) and cutoff frequency. While tabu­lated data can be found in virtually any filter design text, the design program eliminates this tedious procedure.
Second-order sections may be non-inverting (Figure 1) or inverting (Figure 2). Design equations for these two basic configurations are shown for reference. The design program solves these equations, providing complete results, includ­ing component values.
,
n
UAF42
4
Page 5
LP OutBP OutHP Out
R
F1
13 8 7 14
R
1
50k
R
2
2
50k
C
1
1000pF
R
F2
112
C
2
1000pF
50k
R
V
G
IN
3
R
Q
A
1
R
4
50k
A
2
A
3
UAF42
11
NOTE: If R gain-setting resistor by connecting V
= 50k, you can eliminate the external
G
to pin 2. Pin numbers are for DIP
IN
package. SOL-16 pinout is different.
Design Equations
R
1
1 +
R
=
R
G
R
=
R
R
=
R
2
1
1
1
+
+
R
R
2
A
1
4 G
R
G
Q
4
R
2
1 +
R
=
LP
R
G
1
1
1
1
+
+
R
R
R
G
Q
4
1. ω
2. Q =
3. QA
n2
=
LP
R1 R
R4 (RG + RQ)
1 +
1 +
= QA
R
2
F1 RF2 C1 C2
R
G RQ
R
2
R
1
R
1
HP
R
2
= A
4. A
LP
F1 C1 F2 C2
F1 C1 F2 C2
1/2
5. A
HP
1/2
6. A
BP
R2 R R1 R
R1 R
BP
R2 R
FIGURE 1. Non-Inverting Pole-Pair.
5
UAF42
Page 6
LP OutBP OutHP Out
R
V
IN
G
R
F1
13 8 7 14
R
1
50k
R
2
2
50k
C
1
1000pF
R
F2
112
C
2
1000pF
50k
A
3
R
Q
1
R
4
50k
A
2
A
3
UAF42
11 NOTE: If R Q-setting resistor by connecting pin 2 to ground.
= 50k, you can eliminate the external
Q
Pin numbers are for DIP package. SOL-16 pinout is different.
Design Equations
1. ω
n2
=
R1 R
F1 RF2 C1 C2
R
2
4. A
R
1
=
LP
R
G
2. Q =
3. QA
1 +
= QA
LP
FIGURE 2. Inverting Pole-Pair.
R
4
R
Q
HP
1
1
1
+
+
R
R
1
2
R
1
= A
BP
R
2
1
R
G
R1 R R2 R
R
R1 R2 R
F1 C1 F2 C2
F1 C1
1/2
F2 C2
1/2
5. A
6. A
BP
R
=
HP
R
=
1 +
R
2 1
2
A
=
LP
R
G
R
4
R
Q
1
1
1
1
+
R
G
+
R
R
R
1
2
G
UAF42
6
Page 7
PACKAGE OPTION ADDENDUM
www.ti.com
28-Nov-2005
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package Drawing
Pins Package
Qty
Eco Plan
UAF42AP ACTIVE PDIP N 14 25 TBD Call TI Level-NA-NA-NA
UAF42AP-1 OBSOLETE PDIP N 14 TBD Call TI Call TI
UAF42AU ACTIVE SOIC DW 16 48 Pb-Free
UAF42AU-1 OBSOLETE SOIC DW 16 TBD Call TI Call TI
UAF42AUE4 ACTIVE SOIC DW 16 48 Pb-Free
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
(3)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
Page 8
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