Page 1
查询REG113-3供应商
REG113
SBVS031D – MARCH 2001 – REVISED SEPTEMBER 2005
DMOS
400mA Low-Dropout Regulator
FEATURES
● CAP-FREE DMOS TOPOLOGY:
Ultra Low Dropout Voltage:
250mV typ at 400mA
Output Capacitor
not
Required for Stability
● UP TO 500mA PEAK, TYPICAL
● FAST TRANSIENT RESPONSE
●
VERY LOW NOISE:
28µVrms
● HIGH ACCURACY: ±1.5% max
● HIGH EFFICIENCY:
I
= 850µA at I
GND
Not Enabled: I
= 400mA
OUT
= 0.01µA
GND
● 2.5V, 2.85V, 3.0V, 3.3V, AND 5.0V OUTPUT VERSIONS
● OTHER OUTPUT VOLTAGES AVAILABLE UPON
REQUEST
● FOLDBACK CURRENT LIMIT
● THERMAL PROTECTION
● SMALL SURFACE-MOUNT PACKAGES:
SOT23-5 and MSOP-8
APPLICATIONS
● PORTABLE COMMUNICATION DEVICES
● BATTERY-POWERED EQUIPMENT
● PERSONAL DIGITAL ASSISTANTS
● MODEMS
● BAR-CODE SCANNERS
● BACKUP POWER SUPPLIES
DESCRIPTION
The REG113 is a family of low-noise, low-dropout linear
regulators with low ground pin current. Its new DMOS topology provides significant improvement over previous designs,
including low-dropout voltage (only 250mV typ at full load),
and better transient performance. In addition, no output
capacitor is required for stability, unlike conventional lowdropout regulators that are difficult to compensate and require expensive low ESR capacitors greater than 1µF.
Typical ground pin current is only 850µA (at I
and drops to 10nA when not enabled. Unlike regulators with
PNP pass devices, quiescent current remains relatively constant over load variations and under dropout conditions.
The REG113 has very low output noise (typically 28µVrms
for V
in portable communications equipment. Accuracy is maintained over temperature, line, and load variations. Key
parameters are tested over the specified temperature range
(–40°C to +85°C).
The REG113 is well protected—internal circuitry provides a
current limit which protects the load from damage, furthermore, thermal protection circuitry keeps the chip from being
damaged by excessive temperature. The REG113 is available in SOT23-5 and MSOP-8 packages.
= 3.3V with CNR = 0.01µF), making it ideal for use
OUT
Enable
V
IN
+
0.1µF
NR
(2)
REG113
GND
+
C
OUT
V
OUT
OUT
(1)
= 400mA)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
NOTES: (1) Optional. (2) NR = Noise Reduction.
Copyright © 2001-2005, Texas Instruments Incorporated
www.ti.com
Page 2
ABSOLUTE MAXIMUM RATINGS
Supply Input Voltage, VIN.......................................................–0.3V to 12V
Enable Input Voltage, V
NR Pin Voltage, VNR.............................................................–0.3V to 6.0V
Output Short-Circuit Duration ......................................................Indefinite
Operating Temperature Range (T
Storage Temperature Range (T
Lead Temperature (soldering, 3s).................................................. +240°C
NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability.
....................................................... –0.3V to V
EN
) ................................ –55°C to +125°C
J
) ................................... –65°C to +150°C
A
(1)
IN
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION
PRODUCT V
REG113xx-
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com.
(2) Output voltages from 2.5V to 5.1V in 50mV increments are available; minimum order quantities apply. Contact factory for details and availability.
yyyy/zzz
(1)
(2)
OUT
XX is package designator.
YYYY is typical output voltage (5 = 5.0V, 2.85 = 2.85V, A = Adjustable).
ZZZ is package quantity.
PIN CONFIGURATIONS
Top View
V
GND
Enable
IN
1
2
3
SOT
(N Package)
5
V
OUT
4
NR
Enable
V
V
OUT
NR
IN
1
2
3
4
(E Package)
MSOP
8
GND
7
GND
6
GND
5
GND
NOTE: Leads 5 through 8 are fused to the lead frame and can be
used for improved thermal dissipation.
2
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REG113
SBVS031D
Page 3
ELECTRICAL CHARACTERISTICS
Boldface limits apply over the specified temperature range, TJ = –40°C to +85°C.
At TJ = +25°C, VIN = V
OUT
+ 1V, V
ENABLE
= 1.8V, I
= 5mA, CNR = 0.01µF, and C
OUT
OUT
PARAMETER CONDITION MIN TYP MAX UNITS
OUTPUT VOLTAGE
Output Voltage Range V
REG113-2.5 2.5 V
OUT
REG113-2.85 2.85 V
REG113-3 3.0 V
REG113-3.3 3.3 V
REG113-5 5.0 V
Accuracy ±0.5 ±1.5 %
Over Temperature
vs Temperature dV
vs Line and Load
Over Temperature
DC DROPOUT VOLTAGE
(2)
For all models I
Over Temperature I
/dT 50 ±2.3 ppm/°C
OUT
V
DROP
I
= 5mA to 400mA, VIN = (V
OUT
I
= 5mA to 400mA,
OUT
VIN = (V
I
= 5mA 4 10 mV
OUT
= 400mA 250 325 mV
OUT
= 400mA 410 mV
OUT
+ 0.6V) to 10V ±3.0 %
OUT
+ 0.4V) to 10V
OUT
VOLTAGE NOISE
f = 10Hz to 100kHz V
Without C
With C
OUTPUT CURRENT
Current Limit
NR
NR
(3)
Over Temperature 600 mA
Short-Circuit Current Limit I
n
I
CL
SC
CNR = 0, C
CNR = 0.01µF, C
= 0 23µVrms/V • V
OUT
= 10µF7µVrms/V • V
OUT
RIPPLE REJECTION
f = 120Hz 65 dB
ENABLE CONTROL
V
HIGH (output enabled) V
ENABLE
LOW (output disabled) –0.2 0.5 V
V
ENABLE
I
HIGH (output enabled) I
ENABLE
LOW (output disabled) V
I
ENABLE
Output Disable Time C
Output Enable Softstart Time C
ENABLE
ENABLE
V
= 1.8V to VIN, VIN = 1.8V to 6.5
ENABLE
= 0V to 0.5V 2 100 nA
ENABLE
= 1.0µF, R
OUT
= 1.0µF, R
OUT
= 13Ω 50 µs
LOAD
= 13Ω 1.5 ms
LOAD
THERMAL SHUTDOWN
Junction Temperature
Shutdown 160 °C
Reset from Shutdown 140 °C
GROUND PIN CURRENT
Ground Pin Current I
GND
Enable Pin LOW V
INPUT VOLTAGE V
Operating Input Voltage Range
(5)
IN
Specified Input Voltage Range V
Over Temperature V
I
= 5mA 400 500 µA
OUT
I
= 400mA 850 1000 µA
OUT
≤ 0.5V 0.01 0.2 µA
ENABLE
> 1.8V V
IN
> 1.8V V
IN
TEMPERATURE RANGE
Specified Range T
Operating Range T
Storage Range T
Thermal Resistance
SOT23-5 Surface-Mount
MSOP-8 Surface-Mount
J
J
A
θ
JA
θ
JC
θ
JA
Junction-to-Ambient 200 °C/W
Junction-to-Case 35
Junction-to-Ambient 160
NOTES: (1) The REG113 does not require a minimum output capacitor for stability. However, transient response can be improved with proper capacitor selection.
(2) Dropout voltage is defined as the input voltage minus the output voltage that produces a 2% change in the output voltage from the value at V
+ 1V at fixed load.
(3) Current limit is the output current that produces a 10% change in output voltage from VIN = V
(4) For V
(5) The REG113 no longer regulates when VIN < V
> 6.5V, see typical characteristic
ENABLE
I
ENABLE
OUT
vs V
+ V
ENABLE
DROP (MAX)
.
. In dropout, the impedance from VIN to V
(6) See Figure 7.
= 0.1µF
(4)
(1)
, unless otherwise noted.
REG113NA
REG113EA
425 500 575 mA
1.8 V
1.8 10 V
+ 0.4 10 V
OUT
+ 0.6 10 V
OUT
–40 +85 °C
–55 +125 °C
–65 +150 °C
+ 1V and I
OUT
±2.3 %
±1 ±2.3 %
OUT
OUT
200 mA
IN
1 100 nA
(6)
(6)
= 5mA.
OUT
is typically less than 1Ω at TJ = +25°C.
OUT
µVrms
µVrms
°C/W
°C/W
V
= V
IN
OUT
REG113
SBVS031D
www.ti.com
3
Page 4
TYPICAL CHARACTERISTICS
For all models, at TJ = +25°C and V
= 1.8V, unless otherwise noted.
ENABLE
1.0
0.8
0.6
OUTPUT VOLTAGE CHANGE vs I
(Referred to I
= 200mA at +25°C)
OUT
OUT
–55°C
+25°C
+125°C
0.4
0.2
0
–0.2
–0.4
–0.6
Ouput Voltage Change (%)
–0.8
–1.0
0 50 100 150 200 250 300 350 400
Output Current (mA)
LINE REGULATION
40
(Referred to V
= V
IN
OUT
+ 1V at IO = 200mA)
30
20
10
0
–10
–20
Ouput Voltage Change (mV)
–30
–40
01234567
VIN – V
OUT
(V)
5mA
200mA
400mA
LOAD REGULATION vs TEMPERATURE
(V
= V
+ 1V)
IN
0
–0.1
OUT
I
I
OUT
OUT
= 40mA to 400mA
= 5mA to 400mA
–0.2
–0.3
–0.4
–0.5
–0.6
Ouput Change (%)
–0.7
–0.8
–0.9
–50 –25 0 25 50 75 100 125
Temperature (°C)
LINE REGULATION vs TEMPERATURE
0
–0.05
–0.10
I
= 200mA, (V
OUT
I
= 200mA, (V
OUT
+ 1V) < VIN < 10
OUT
+ 0.4V) < V
OUT
–0.15
–0.20
–0.25
–0.30
–0.35
Ouput Change (%)
= 400mA, (V
OUT
I
= 400mA, (V
OUT
+ 1V) < VIN < 10
OUT
+ 0.4V) < VIN < 10
OUT
I
–0.40
–0.45
–0.50
–50 –25 0 25 50 75 100 125
Temperature (°C)
IN
< 10
400
DC DROPOUT VOLTAGE vs OUTPUT CURRENT
350
300
250
200
150
100
DC Dropout Voltage (mV)
50
0
0 50 100 150 200 250 350300 400
4
Output Current (mA)
–55°C
+25°C
+125°C
www.ti.com
400
DC DROPOUT VOLTAGE vs TEMPERATURE
350
I
= 400mA
OUT
300
250
200
150
100
DC Dropout Voltage (mV)
50
0
–50 –25 0 25 50 75 100 125
Junction Temperature (°C)
REG113
SBVS031D
Page 5
TYPICAL CHARACTERISTICS (Cont.)
0
10
20
30
40
50
60
70
80
90
100
5
15
25
35
45
55
65
75
85
95
30
25
20
15
10
5
0
Percentage of Units (%)
V
OUT
Drift (ppm/°C)
OUTPUT VOLTAGE DRIFT HISTOGRAM
For all models, at TJ = +25°C and V
= 1.8V, unless otherwise noted.
ENABLE
18
OUTPUT VOLTAGE ACCURACY HISTOGRAM
16
14
12
10
8
6
Percentage of Units (%)
4
2
0
0.0
0.2
–1.0
–0.8
–0.6
–0.4
–0.2
0.4
Error (%)
OUTPUT VOLTAGE vs TEMPERATURE
0.8
(Referred to I
0.6
0.4
= 200mA at +25°C)
OUT
I
I
I
OUT
OUT
OUT
0.2
0
–0.2
–0.4
Output Voltage Change (%)
–0.6
–0.8
–50 –25 0 25 50 75 100 125
Temperature (°C)
0.6
0.8
= 5mA
= 200mA
= 400mA
1.0
GROUND PIN CURRENT, NOT ENABLED
vs TEMPERATURE
1µ
V
= 0.5V
ENABLE
V
= V
+ 1V
IN
OUT
100n
(A)
10n
GND
I
1n
100p
–50 25–25 0 50 75 100 125
Temperature (°C)
REG113
1000
GROUND CURRENT vs LOAD CURRENT
V
= 2.5V
900
800
OUT
= 3.3V
V
OUT
= 5.0V
V
OUT
700
600
(µA)
500
GND
I
400
300
200
100
0
0 50 100 150 200 250 300 350 400
Load Current (mA)
SBVS031D
www.ti.com
1000
GROUND CURRENT vs TEMPERATURE
I
950
= 400mA
OUT
V
OUT
V
OUT
V
OUT
900
(µA)
850
GND
I
800
750
700
–50 –25 0 25 50 75 100 125
Temperature (°C)
= 2.5V
= 3.3V
= 5.0V
5
Page 6
TYPICAL CHARACTERISTICS (Cont.)
For all models, at TJ = +25°C and V
= 1.8V, unless otherwise noted.
ENABLE
80
RIPPLE REJECTION vs FREQUENCY
I
= 2mA
I
OUT
OUT
= 100mA
C
I
OUT
OUT
= 2mA
= 10µF
I
OUT
C
OUT
= 100mA
= 10µF
70
60
50
40
30
Ripple Rejection (dB)
20
10
C
= 0µF
OUT
0
10 100 1k 10k 100k 10M1M
Frequency (Hz)
60
RMS NOISE VOLTAGE vs C
OUT
REG113-5.0
50
40
REG113-3.3
30
20
Noise Voltage (µVrms)
10
C
OUT
10Hz < BW < 100kHz
0
= 0.01µF
REG113-2.5
0.1 1 10
C
(µF)
OUT
30
RIPPLE REJECTION vs (V
– V
IN
25
20
15
10
Frequency = 100kHz
Ripple Rejection (dB)
C
= 10µF
OUT
5
V
= 3.3V
OUT
I
= 100mA
OUT
0
1.0 0.9 0.60.8 0.7 0.5 0.4 0.3 00.2 0.1
VIN – V
OUT
(V)
RMS NOISE VOLTAGE vs C
110
100
90
80
REG113-3.3
REG113-5.0
70
60
50
REG113-2.5
Noise Voltage (µVrms)
40
C
= 0µF
OUT
30
10Hz < BW < 100kHz
20
1 100 1k10
CNR (pF)
NR
OUT
)
10k
10
I
= 100mA
OUT
C
= 0µF
NR
(µV/√Hz)
N
e
1
0.1
C
C
= 0µF
OUT
C
0.01
10 100 1k 10k 100k
OUT
OUT
= 1µF
= 10µF
10
I
= 100mA
OUT
C
= 0.01µF
NR
1
(µV/√Hz)
N
e
0.1
0.01
10 100 1k 10k 100k
Frequency (Hz)
NOISE SPECTRAL DENSITY
6
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NOISE SPECTRAL DENSITY
C
Frequency (Hz)
OUT
C
= 0µF
C
= 1µF
OUT
= 10µF
OUT
REG113
SBVS031D
Page 7
TYPICAL CHARACTERISTICS (Cont.)
For all models, at TJ = +25°C and V
= 1.8V, unless otherwise noted.
ENABLE
3.5
CURRENT LIMIT FOLDBACK
3.0
V
= 3.3V
OUT
2.5
2.0
I
1.5
Output Voltage (V)
1.0
I
SC
0.5
0
0 50 100 150 200 250 300 350 400 450 500 550
Output Current Limit (mA)
LOAD TRANSIENT RESPONSE
REG113-3.3
C
= 0
OUT
C
= 10µF
500mV/div
OUT
CL
V
= 4.3V
IN
600
CURRENT LIMIT vs TEMPERATURE
550
500
450
400
350
ICL (Current Limit)
I
(Short-Circuit Current)
SC
300
250
Output Current (mA)
200
150
100
–50 –25 0 25 50 75 100 125
Temperature (°C)
LINE TRANSIENT RESPONSE
REG113-3.3
I
= 400mA
C
= 0
C
OUT
OUT
= 10µF
V
OUT
V
OUT
25mV/div
OUT
V
OUT
V
OUT
400mA
40mA
1V/div1V/div
C
R
LOAD
OUT
TURN-ON
= 0µF
= 660Ω
10µs/div
250µs/div
C
R
OUT
LOAD
= 10µF
= 13Ω
V
= 0µF
C
OUT
= 13Ω
R
LOAD
REG113-3.3
= V
+ 1V
IN
OUT
C
= 0.01µF
NR
I
OUT
V
OUT
V
ENABLE
5.3V
4.3V
1V/div1V/div
R
C
OUT
LOAD
= 0µF
= 660Ω
50µs/div
TURN-OFF
200µs/div
C
R
OUT
LOAD
= 10µF
= 13Ω
C
OUT
R
LOAD
= 1.0µF
= 13Ω
REG113-3.3
V
IN
V
OUT
V
ENABLE
REG113
SBVS031D
www.ti.com
7
Page 8
TYPICAL CHARACTERISTICS (Cont.)
For all models, at TJ = +25°C and V
I
10µ
1.0µ
(A)
100n
ENABLE
I
T = +125°C
10n
1n
678910
ENABLE
T = +25°C
T = –55°C
= 1.8V, unless otherwise noted.
ENABLE
vs V
ENABLE
V
(V)
ENABLE
BASIC OPERATION
V
= 3.0V
OUT
R
LOAD
500mV/div
POWER-UP/POWER-DOWN
= 12Ω
1s/div
The REG113 series of LDO (low dropout) linear regulators
offers a wide selection of fixed output voltage versions and
an adjustable output version. The REG113 belongs to a
family of new generation LDO regulators that use a DMOS
pass transistor to achieve ultra low-dropout performance
and freedom from output capacitor constraints. Ground pin
current remains under 1mA over all line, load, and temperature conditions. All versions have thermal and over-current
protection, including foldback current limit.
The REG113 does not require an output capacitor for
regulator stability and is stable over most output currents
and with almost any value and type of output capacitor up
to 10µF or more. For applications where the regulator output
current drops below several milliamps, stability can be
enhanced by adding a 1kΩ to 2kΩ load resistor, using
capacitance values smaller than 10µF, or keeping the effective series resistance greater than 0.05Ω including the
capacitor ESR and parasitic resistance in printed circuit
board traces, solder joints, and sockets.
Although an input capacitor is not required, it is a good
standard analog design practice to connect a 0.1µF low
ESR capacitor across the input supply voltage; this is
recommended to counteract reactive input sources and
improve ripple rejection by reducing input voltage ripple.
Figure 1 shows the basic circuit connections for the fixed
voltage models.
Enable
V
IN
0.1µF
REG113
In Out
Gnd NR
C
0.01µF
NR
Optional
V
OUT
C
OUT
FIGURE 1. Fixed Voltage Nominal Circuit for the REG113.
3.5
3.0
V
OUT
2.5
2.0
1.5
Output Voltage (V)
1.0
0.5
0
0 50 100 150 200 250 300 350 400 450 500 550
CURRENT LIMIT FOLDBACK
= 3.3V
I
SC
Output Current Limit (mA)
I
CL
FIGURE 2. Foldback Current Limit of the REG113-3.3 at 25°C.
INTERNAL CURRENT LIMIT
The REG113 internal current limit has a typical value of
500mA. A foldback feature limits the short-circuit current to
a typical short-circuit value of 200mA. A curve of V
versus I
is given in Figure 2, and in the Typical Charac-
OUT
teristics section.
8
OUT
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ENABLE
The Enable pin is active high and compatible with standard
TTL-CMOS levels. Inputs below 0.5V (max) turn the regulator off and all circuitry is disabled. Under this condition,
ground pin current drops to approximately 10nA. When not
used, the Enable pin can be connected to V
.
IN
REG113
SBVS031D
Page 9
OUTPUT NOISE
A precision bandgap reference is used to generate the
internal reference voltage, V
. This reference is the domi-
REF
nant noise source within the REG113 and generates approximately 29µVrms in the 10Hz to 100kHz bandwidth at the
reference output. The regulator control loop gains up the
reference noise, so that the noise voltage of the regulator is
approximately given by:
V Vrms
=µ
N
Since the value of V
is 1.26V, this relationship reduces to:
REF
V
=
N
Connecting a capacitor, C
RR
+
12
=µ •29
29
2
R
Vrms
µ
•23
V
OUT
V
, from the Noise Reduction (NR)
NR
Vrms
V
V
OUT
REF
(1)
(2)
pin to ground (as shown in Figure 3) forms a low-pass filter
for the voltage reference. For C
= 10nF, the total noise in
NR
the 10Hz to 100kHz bandwidth is reduced by approximately
a factor of 2.8 for V
shown in Figure 4, and as
= 3.3V. This noise reduction effect is
OUT
RMS Noise Voltage vs C
NR
in the
Typical Characteristics section.
Noise can be further reduced by carefully choosing an output
capacitor, C
with very low (< 0.22µF) or very high (> 2.2µF) values of C
(see the
. Best overall noise performance is achieved
OUT
RMS Noise Voltage vs C
typical characteristic).
OUT
OUT
The REG113 uses an internal charge pump to develop an
internal supply voltage sufficient to drive the gate of the
DMOS pass element above V
. The charge-pump switching
IN
noise (nominal switching frequency = 2MHz) is not measurable at the output of the regulator over most values of I
and C
OUT
.
OUT
DROPOUT VOLTAGE
The REG113 uses an N-channel DMOS as the pass element. When (V
(V
), the DMOS pass device behaves like a resistor;
DROP
therefore, for low values of (V
to-output resistance is the Rds
(typically 600m
– V
IN
Ω
). For static (DC) loads, the REG113 will
) is less than the dropout voltage
OUT
– V
IN
ON
), the regulator input-
OUT
of the DMOS pass element
110
100
90
80
REG113-3.3
70
REG113-2.5
60
50
Noise Voltage (Vrms)
40
C
OUT
30
10Hz < BW < 100kHz
20
0.1 100 1k10 10k
RMS NOISE VOLTAGE vs C
REG113-5.0
= 0µF
CNR (pF)
NR
FIGURE 4. Output Noise versus Noise Reduction Capacitor.
typically maintain regulation down to a (VIN – V
) voltage
OUT
drop of 250mV at full rated output current. In Figure 5, the
bottom line (DC dropout) shows the minimum V
to V
IN
OUT
voltage drop required to prevent dropout under DC load
conditions.
600
500
400
300
200
Dropout Voltage (mV)
100
0
0 50 100 150 200 250 350300 400
DROPOUT VOLTAGE vs I
Dropout for 0mA to I
DC Dropout
I
OUT
OUT
(mA)
OUT
Transient
FIGURE 5. Transient and DC Dropout.
NR
Enable
FIGURE 3. Block Diagram.
REG113
SBVS031D
C
NR
(optional)
(1.26V)
REG113
V
IN
Low-Noise
Charge Pump
V
REF
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Over-Current
Over Temp
Protection
DMOS
Output
GND
V
OUT
9
Page 10
For large step changes in load current, the REG113 requires
a larger voltage drop across it to avoid degraded transient
response. The boundary of this transient dropout region is
shown as the top line in Figure 5. Values of V
IN
to V
OUT
voltage
drop above this line insure normal transient response.
In the transient dropout region between DC and Transient,
transient response recovery time increases. The time required to
recover from a load transient is a function of both the magnitude
and rate of the step change in load current and the available
headroom V
tions (full-scale load change with (V
to V
IN
voltage drop. Under worst-case condi-
OUT
IN
– V
) voltage drop close
OUT
to DC dropout levels), the REG113 can take several hundred
microseconds to re-enter the specified window of regulation.
TRANSIENT RESPONSE
The REG113 response to transient line and load conditions
improves at lower output voltages. The addition of a capacitor
(nominal value 0.47µF) from the output pin to ground may
improve the transient response. In the adjustable version, the
addition of a capacitor, C
(nominal value 10nF), from the
FB
output to the adjust pin also improves the transient response.
THERMAL PROTECTION
Power dissipated within the REG113 can cause the junction
temperature to rise, however, the REG113 has thermal
shutdown circuitry that protects the regulator from damage.
The thermal protection circuitry disables the output when
the junction temperature reaches approximately 160°C,
allowing the device to cool. When the junction temperature
cools to approximately 140°C, the output circuitry is again
enabled. Depending on various conditions, the thermal
protection circuit can cycle on and off. This limits the
dissipation of the regulator, but can have an undesirable
effect on the load.
Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heat sink.
For reliable operation, junction temperature should be limited
to 125°C, maximum. To estimate the margin of safety in a
complete design (including heat sink), increase the ambient
temperature until the thermal protection is triggered. Use
worst-case loads and signal conditions. For good reliability,
thermal protection should trigger more than 35°C above the
maximum expected ambient condition of the application. This
produces a worst-case junction temperature of 125°C at the
highest expected ambient temperature and worst-case load.
The internal protection circuitry of the REG113 is designed to
protect against overload conditions and is not intended to
replace proper heat sinking. Continuously running the REG113
into thermal shutdown will degrade reliability.
POWER DISSIPATION
The REG113 is available in two different package configurations. The ability to remove heat from the die is different for each
package type and, therefore, presents different considerations
in the printed circuit board (PCB) layout. On the MSOP-8
package, leads 5 through 8 are fused to the lead frame and may
be used to improve the thermal performance of the package.
The PCB area around the device that is free of other components moves the heat from the device to the ambient air.
Although it is difficult or impossible to quantify all of the
variables in a thermal design of this type, performance data for
several simplified configurations are shown in Figure 6. In all
cases the PCB copper area is bare copper, free of solder resist
mask, and not solder plated. All examples are for 1-ounce
copper and in the case of the MSOP-8, the copper area is
connected to fused leads 5 to 8. See Figure 7 for thermal
resistance for varying areas of copper. Using heavier copper
can increase the effectiveness in removing the heat from the
device. In those examples where there is copper on both sides
of the PCB, no connection has been provided between the two
sides. The addition of plated through holes will improve the heat
sink effectiveness.
MAXIMUM POWER DISSIPATION vs TEMPERATURE
3.0
Condition 1
2.5
2.0
1.5
1.0
Power Dissipation (W)
0.5
0
–50 –25 0 25 50 75 100 125
Ambient Temperature (°C)
CONDITION PACKAGE PCB AREA
1 MSOP-8 1 sq. in. Cu, 1 Side 71
2 MSOP-8 0.25 sq. in. Cu, 1 Side 90
3 SOT-23-8 None 200
FIGURE 6. Maximum Power Dissipation versus Ambient Tem-
perature for the Various Packages and PCB Heat
Sink Configurations.
Condition 2
Condition 3
θ
JA
10
www.ti.com
REG113
SBVS031D
Page 11
THERMAL RESISTANCE vs PCB COPPER AREA
160
150
140
130
120
110
100
90
80
70
60
Thermal Resistance,
JA
(°C/W)
θ
012345
Copper Area (inches
2
)
Power dissipation depends on input voltage, load conditions, and duty cycle and is equal to the product of the
average output current times the voltage across the output
element (V
IN
to V
voltage drop):
OUT
PVV I
=•( – )
DIN
OUT OUT
(3)
Power dissipation can be minimized by using the lowest possible
input voltage necessary to assure the required output voltage.
FIGURE 7. Thermal Resistance versus PCB Area for the MSOP-8.
REG113
SBVS031D
www.ti.com
11
Page 12
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable Device Status
REG113EA-2.5/250 ACTIVE MSOP DGK 8 250 Green (RoHS &
REG113EA-2.5/2K5 ACTIVE MSOP DGK 8 2500 Green (RoHS &
REG113EA-2.85/250 ACTIVE MSOP DGK 8 250 Green (RoHS &
REG113EA-2.85/2K5 ACTIVE MSOP DGK 8 2500 Green (RoHS &
REG113EA-3.3/250 ACTIVE MSOP DGK 8 250 Green (RoHS &
REG113EA-3.3/2K5 ACTIVE MSOP DGK 8 2500 Green (RoHS &
REG113EA-3/250 ACTIVE MSOP DGK 8 250 Green (RoHS &
REG113EA-3/2K5 ACTIVE MSOP DGK 8 2500 Green (RoHS &
REG113EA-3/2K5G4 ACTIVE MSOP DGK 8 2500 Green (RoHS &
REG113EA-5/250 ACTIVE MSOP DGK 8 250 Green (RoHS &
REG113EA-5/250G4 ACTIVE MSOP DGK 8 250 Green (RoHS &
REG113EA-5/2K5 ACTIVE MSOP DGK 8 2500 Green (RoHS &
REG113EA-5/2K5G4 ACTIVE MSOP DGK 8 2500 Green (RoHS &
REG113EA285250G4 ACTIVE MSOP DGK 8 250 Green (RoHS &
REG113EA2852K5G4 ACTIVE MSOP DGK 8 2500 Green (RoHS &
REG113EA33250G4 ACTIVE MSOP DGK 8 250 Green (RoHS &
REG113EA332K5G4 ACTIVE MSOP DGK 8 2500 Green (RoHS &
REG113NA-2.5/250 ACTIVE SOT-23 DBV 5 250 Green (RoHS &
REG113NA-2.5/250G4 ACTIVE SOT-23 DBV 5 250 Green (RoHS &
REG113NA-2.5/3K ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
REG113NA-2.5/3KG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
REG113NA-2.85/250 ACTIVE SOT-23 DBV 5 250 Green (RoHS &
REG113NA-2.85/3K ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
REG113NA-2.85/3KG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
REG113NA-3.3/250 ACTIVE SOT-23 DBV 5 250 Green (RoHS &
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
14-Mar-2006
(3)
Addendum-Page 1
Page 13
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
REG113NA-3.3/250G4 ACTIVE SOT-23 DBV 5 250 Green (RoHS &
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
14-Mar-2006
(3)
no Sb/Br)
REG113NA-3.3/3K ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
REG113NA-3.3/3KG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
REG113NA-3/250 ACTIVE SOT-23 DBV 5 250 Green (RoHS&
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
REG113NA-3/250G4 ACTIVE SOT-23 DBV 5 250 Green (RoHS&
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
REG113NA-3/3K ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
REG113NA-3/3KG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
REG113NA-5/250 ACTIVE SOT-23 DBV 5 250 Green (RoHS&
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
REG113NA-5/3K ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
REG113NA2.85/250G4 ACTIVE SOT-23 DBV 5 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1)
The marketing status values aredefined as follows:
ACTIVE: Product device recommended fornew designs.
LIFEBUY: TI has announced thatthe device will be discontinued,and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announcedbut is not in production.Samples may or may not be available.
OBSOLETE: TI has discontinued theproduction of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availabilityinformation and additional product contentdetails.
TBD: The Pb-Free/Green conversion planhas not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Freeproducts are suitable for usein specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb donot exceed 0.1% by weightin homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be availablefor release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annualbasis.
Addendum-Page 2
Page 14
Page 15
Page 16
IMPORTANT NOTICE
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