BURR-BROWN REG1117, REG1117A User Manual

Page 1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments

查询REG1117供应商

800mA and 1A Low Dropout Positive Regulator

1.8V, 2.5V, 2.85, 3.3V, 5V, and Adjustable

REG1117

REG1117A

SBVS001D − OCTOBER 1992 − REVISED JULY 2004

FEATURES

D FIXED AND ADJUSTABLE VERSIONS D 2.85V MODEL FOR SCSI-2 ACTIVE

TERMINATION

D OUTPUT CURRENT:

REG1117: 800mA max REG1117A: 1A max

D OUTPUT TOLERANCE: +1% max D DROPOUT VOLTAGE:

REG1117: 1.2V max at IO = 800mA REG1117A: 1.3V max at IO = 1A

D INTERNAL CURRENT LIMIT D THERMAL OVERLOAD PROTECTION D SOT-223 AND DDPAK SURFACE-MOUNT

PACKAGES

APPLICATIONS

D SCSI-2 ACTIVE TERMINATION D HAND-HELD DATA COLLECTION DEVICES D HIGH EFFICIENCY LINEAR REGULATORS D BATTERY-POWERED INSTRUMENTATION D BATTERY MANAGEMENT CIRCUITS FOR

NOTEBOOK AND PALMTOP PCs

D CORE VOLTAGE SUPPLY: FPGA, PLD, DSP,

CPU

DESCRIPTION

The REG1117 is a family of easy-to-use three-terminal voltage regulators. The family includes a variety of fixedand adjustable-voltage versions, two currents (800mA and 1A) and two package types (SOT-223 and DDPAK). See the chart below for available options.

Output voltage of the adjustable versions is set with two external resistors. The REG1117 low dropout voltage allows its use with as little as 1V input-output voltage differential.

Laser trimming assures excellent output voltage accuracy without adjustment. An NPN output stage allows output stage drive to contribute to the load current for maximum efficiency.

800mA 1A

VOLTAGE SOT-223 DDPAK SOT-223 DDPAK

1.8V n n

2.5V n n

2.85V n

3.3V n n 5V n n

Adjustable n n n

semiconductor products and disclaimers thereto appears at the end of this data sheet.

All trademarks are the property of their respective owners.

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SBVS001D − OCTOBER 1992 − REVISED JULY 2004

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ABSOLUTE MAXIMUM RATINGS

(1)

Power Dissipation Internally Limited. . . . . . . . . . . . . . . . . . . . . . . . . .

Input Voltage +15V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Operating Junction Temperature Range −40°C to +125°C. . . . . . . .

Storage Temperature Range −65°C to +150°C. . . . . . . . . . . . . . . . .

Lead Temperature (soldering, 10s) (1)

Stresses above these ratings may cause permanent damage.

(2)

See Soldering Methods section.

(2)

CONNECTION DIAGRAM

Front View

Plastic SOT−223

Ground (Adj.)

OUT

(1)

+300°C. . . . . . . . . . . . . . . . .

Tab isV

OUT

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe

proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to

complete device failure. Precision integrated circuits may be more susceptible t o damage because very small parametric changes could cause the device not to meet its published specifications.

Plastic DDPAK

Tab is

OUT

Ground (Adj.)

(1)

OUT

NOTE: (1) Adjustable−Voltage Model.

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−40°C to

−40 C to

−40°C to

−40 C to

−40°C to

−40 C to

−40°C to

−40 C to

−40°C to

−40 C to

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SBVS001D − OCTOBER 1992 − REVISED JULY 2004

PACKAGE/ORDERING INFORMATION

PRODUCT VO/I

REG1117-2.85 2.85/800mA SOT223-3 DCY

REG1117-3.3 3.3/800mA SOT223-3 DCY

REG1117F-3.3 3.3/800mA DDPAK-3 KTT

REG1117-5 5V/800mA SOT223-3 DCY

REG1117 Adj./800mA SOT223-3 DCY

REG1117A-1.8 1.8V/1A SOT223-3 DCY

REG11 17F A-1.8 1.8/1A DDPAK-3 KTT

REG1117A-2.5 2.5/1A SOT223-3 DCY

REG11 17F A-2.5 2.5/1A DDPAK-3 KTT

REG1117FA-5 5/1A DDPAK-3 KTT

REG1117A Adj./1A SOT223-3 DCY

REG1117FA Adj./1A DDPAK-3 KTT

(1)

For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.

PACKAGE-LEAD

(1)

PACKAGE

DESIGNATOR

OPERATING

TEMPERATURE

RANGE

−40°C to +125°C

+125°C

−40°C to +125°C

+125°C

−40°C to +125°C

+125°C

−40°C to +125°C

+125°C

PACKAGE

MARKING

BB11172

BB11174

BB1117F4

BB11175

BB1117

R111718

REG11 17F A1.8

R111725

REG1117FA2.5

BB1117FA5.0

BB1117A

REG1117FA

ORDERING

NUMBER

REG1117-2.85 Rails, 80 REG1117-2.85

REG1117-3.3 Rails, 80 REG1117-3.3

REG1117F-3.3KTTT

REG1117F-3.3/500

REG1117-5 Rails, 80 REG1117-5

REG1117 Rails, 80

REG1117 REG1117A-1.8 Rails, 80 REG1117A-1.8

REG1117FA-1.8KTTT

REG1117FA-1.8/500

REG1117A-2.5 Rails, 80 REG1117A-2.5

REG1117FA-2.5KTTT

REG1117FA-2.5/500

REG1117FA-5/KTTT

REG1117FA-5/500

REG1117A Rails, 80 REG1117A

REG1117FA/KTTT

REG1117FA/500

TRANSPORT

MEDIA,

QUANTITY

T ape and Reel,

2500

T ape and Reel,

2500

T ape and Reel,

500

T ape and Reel,

2500

T ape and Reel,

2500

T ape and Reel,

2500

T ape and Reel,

500

T ape and Reel,

2500

T ape and Reel,

500

T ape and Reel,

500

T ape and Reel,

2500

T ape and Reel,

500

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SBVS001D − OCTOBER 1992 − REVISED JULY 2004

ELECTRICAL CHARACTERISTICS

At TJ = +25°C, unless otherwise noted.

REG1117, REG1 117A

PARAMETER CONDITION MIN TYP MAX UNIT

OUTPUT VOLTAGE

REG1117-2.85 IO = 10mA, VIN = 4.85V 2.820 2.85 2.880 V

See Note 1 IO = 0 to 800mA, VIN = 4.05V to 10V 2.790 2.85 2.910 V

REG1117-3.3 IO = 10mA, VIN = 5.3V 3.270 3.30 3.330 V

See Note 1 IO = 0 to 800mA, VIN = 4.8V to 10V 3.240 3.30 3.360 V

REG1117-5 IO = 10mA, VIN = 7V 4.950 5.00 5.050 V

See Note 1 IO = 0 to 800mA, VIN = 6.5V to 10V 4.900 5.00 5.100 V

REG1117A-1.8 IO = 10mA, VIN = 3.8V 1.782 1.8 1.818 V

See Note 1 IO = 0 to 1A, VIN = 3.8V to 10V 1.764 1.8 1.836 V

REG1117A-2.5 IO = 10mA, VIN = 4.5V 2.475 2.5 2.525 V

See Note 1 IO = 0 to 1A, VIN = 4.5V to 10V 2.450 2.5 2.550 V

REG1117A-5 IO = 10mA, VIN = 7V 4.950 5.0 5.050 V

See Note 1 IO = 0 to 1A, VIN = 7V to 10V 4.900 5.0 5.100 V

REFERENCE VOLTAGE

REG1117 (Adjustable) IO = 10mA, VIN − VO = 2V 1.238 1.250 1.262 V

See Note 1 IO = 10 to 800mA, VIN − VO = 1.4 to 10V 1.225 1.250 1.280 V

REG1117A (Adjustable) IO = 10mA, VIN − VO = 2V 1.238 1.250 1.262 V

See Note 1 IO = 10mA to 1A, VIN − VO = 1.4 to 10V 1.225 1.250 1.280 V

LINE REGULATION

(1)

(1) (1) (1)

(1)

(1)(2)

(3)

IO = 0, VIN = 4.25 to 10V 1 7 mV

IO = 0, VIN = 4.8 to 10V 2 7 mV

IO = 0, VIN = 6.5 to 15V 3 10 mV IO = 10mA, VIN − VO = 1.5 to 13.75V 0.1 0.4 % IO = 10mA, VIN − VO = 1.5 to 13.75V 0.1 0.4 %

IO = 0, VIN = 3.8V to 10V 1 7 mV IO = 0, VIN = 4.5V to 10V 1 7 mV

IO = 0, VIN = 7V to 15V 3 10 mV

IO = 0 to 800mA, VIN = 4.25V 2 10 mV

IO = 0 to 800mA, VIN = 4.8V 3 12 mV IO = 0 to 800mA, VIN = 6.5V 3 15 mV

IO = 10 to 800mA, VIN − VO = 3V 0.1 0.4 %

IO = 10mA to 1A, VIN − VO = 3V 0.1 0.4 %

IO = 0 to 1A, VIN = 3.8V 2 10 mV

IO = 100mA 1.00 1.10 V

IO = 800mA 1.10 1.20 V

REG1117-2.85 REG1117-3.3 REG1117-5 REG1117 (Adjustable) REG1117A (Adjustable) REG1117A-1.8 REG1117A-2.5 REG1117A-5.0

LOAD REGULATION

REG1117-2.85 REG1117-3.3 REG1117-5 REG1117 (Adjustable) REG1117A (Adjustable) REG1117A-1.8 REG1117A-2.5 IO = 0 to 1A, VIN = 4.5V 2 10 mV REG1117A-5 IO = 0 to 1A, VIN = 7.0V 3 15 mV

DROPOUT VOLTAGE

All Models

See Note 1 IO = 500mA 1.05 1.15 V REG1117 Models REG1117A IO = 1A 1.2 1.30 V

See Note 1 IO = 1A 1.2 1.55 V (1)

Specification applies over the full specified junction temperature range, 0°C to +125°C.

(2)

REG1117 and REG1117A adjustable versions require a minimum load current for ±3% regulation.

(3)

Dropout voltage is the input voltage minus output voltage that produces a 1% decrease in output voltage.

(4)

Percentage change in unloaded output voltage before versus after a 30ms power pulse of IO = 800mA (REG11 17 models), IO = 1A (REG11 17A), VIN − VO = 1.4V (reading taken 10ms after pulse).

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SBVS001D − OCTOBER 1992 − REVISED JULY 2004

ELECTRICAL CHARACTERISTICS (continued)

At TJ = +25°C, unless otherwise noted.

REG1117, REG1 117A

PARAMETER UNITMAXTYPMINCONDITION

CURRENT LIMIT

REG1117 Models VIN − VO = 5V 800 950 1200 mA REG1117A VIN − VO = 5V 1000 1250 1600 mA

MINIMUM LOAD CURRENT

(4)

(1)(2)

(1)

(1)(2)

(1)

VIN − VO = 13.75V 1.7 5 mA

VIN − VO = 5V 4 10 mA

IO = 10mA, VIN − VO = 1.4 to 10V 50 120 µA

IO = 10mA to 800mA, VIN − VO = 1.4 to 10V 0.5 5 µA

IO = 10mA to 1A, VIN − VO = 1.4 to 10V 0.5 5 µA

30ms Pulse 0.01 0.1 %/W

= 3V + 1VPP Ripple 62 dB

OUT

(Junction-to-Case at Tab)

dc 3 °C/W

(Junction-to-Case at Tab)

Adjustable Models

QUIESCENT CURRENT

Fixed-Voltage Models

ADJUSTABLE PIN CURRENT

vs Load Current, REG1117 vs Load Current, REG1117A

THERMAL REGULATION

All Models

RIPPLE REJECTION

All Models f = 120Hz, VIN − V

TEMPERATURE DRIFT

Fixed-Voltage Models TJ = 0°C to +125°C 0.5 % Adjustable Models TJ = 0°C to +125°C 2 %

LONG-TERM STABILITY

All Models TA = 125°C, 1000Hr 0.3 %

OUTPUT NOISE

rms Noise, All Models f = 10Hz to 10kHz 0.003 %

THERMAL RESISTANCE

Thermal Resistance, q

3-Lead SOT-223 Surface-Mount 15 °C/W 3-Lead DDPAK Surface-Mount f > 50Hz 2 °C/W

Thermal Resistance, q

3-Lead DDPAK Surface-Mount No Heatsink 65 °C/W

(1)

Specification applies over the full specified junction temperature range, 0°C to +125°C.

(2)

REG1117 and REG1117A adjustable versions require a minimum load current for ±3% regulation.

(3)

Dropout voltage is the input voltage minus output voltage that produces a 1% decrease in output voltage.

(4)

Percentage change in unloaded output voltage before versus after a 30ms power pulse of IO = 800mA (REG11 17 models), IO = 1A (REG11 17A), VIN − VO = 1.4V (reading taken 10ms after pulse).

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SBVS001D − OCTOBER 1992 − REVISED JULY 2004

SIMPLIFIED SCHEMATIC

Thermal

Limit

Current

Limit

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10X

Ground (Fixed−voltage Models) Adj.(Adjustable−voltage Model)

(Substrate)

OUT

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TYPICAL CHARACTERISTICS

At TA = +25°C, all models, unless otherwise noted.

SHORT−CIRCUIT CURRENT vsTEMPERATURE

REG1117A

REG1117 Models

−

25 0 25 50 75 100

Temperature (_C)

Short−Circuit Current(mA)

1400

1300

1200

1100

1000

900

800

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SBVS001D − OCTOBER 1992 − REVISED JULY 2004

LOAD REGULATION

(∆

= 800mA)

1 0 1

−

Output Voltage Deviation (mV)

−

25 0 25 50 75 100

LOAD

REG1117−2.85

REG1117A−1.8

REG1117−5

Temperature(_C)

6 5 4 3 2 1 0

Output Voltage Change (mV)

−

2.0

1.0

−

1.0

Output Voltage Change (%)

−

2.0

−

LINE REGULATION vsTEMPERATURE

VIN=6.5Vto15V REG1117−5

REG1117A−1.8

=3.8Vto10V

−

25 0 25 50 75 100

Temperature (_C)

OUTPUT VOLTAGE vs TEMPERATURE

−

25 0 25 50 75 100

Temperature (_C)

IO=10mA

100

90 80 70 60 50 40 30

Ripple Rejection (dB)

20 10

10 100 1k 10k 100k

8 7 6 5 4 3 2

Quiescent Current (mA)

1 0

−

RIPPLE REJECTION vs FREQUENCY

=100mA

OUT

=1.0V

RIPPLE

Frequency (Hz)

QUIESCENT CURRENT vs TEMPERATURE

Fixed−Voltage Models

−

25 0 25 50 75 100

Temperature (_C)

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SBVS001D − OCTOBER 1992 − REVISED JULY 2004

TYPICAL CHARACTERISTICS (continued)

At TA = +25°C, all models, unless otherwise noted.

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LOAD TRANSIENT RESPONSE

0.1 0

0.1

−

Deviations (V)

Output Voltage

=10µF

0.5 0

0.5

−

Load Current (A)

0 20406080100

Time (µs)

=10µF

OUT

Tantalum V

=4.25V

Preload =0.1A

APPLICATIONS INFORMATION

Figure 1 shows the basic hookup diagram for fixed-voltage models. All models require an output capacitor for proper operation, and for improving high-frequency load regulation; a 10µF tantalum capacitor is recommended. Aluminum electrolytic types of 50µF or greater can also be used. A high-quality capacitor should be used to assure that the ESR (Effective Series Resistance) is less than

0.5Ω.

10µF

Tantalum

REG1117

10µF Tantalum

60 40 20

Deviation (mV)

Output Voltage

−

5.25

4.25

3.25

Input Voltage (V)

0 20 40 60 80 100 120 140 160 180 200

LINE TRANSIENTRESPONSE

CIN=1µF C

=10µFTantalum

OUT

=0.1A

OUT

Time (µs)

Figure 2 shows a hookup diagram for the adjustable voltage model. Resistor values are shown for some commonly-used output voltages. V alues for other voltages can be calculated from the equation shown in Figure 2. For best load regulation, connect R

close to the ground side of the load as shown.

close to the output pin and

THERMAL CONSIDERATIONS

The REG1117 has current limit and thermal shutdown circuits that protect it from overload. The thermal shutdown activates at approximately T operation, however, the junction temperature should not be allowed to exceed 125°C. Any tendency to activate the thermal shutdown in normal use is an indication of an inadequate heat sink or exc e s s i v e power dissipation. The power dissipation is equal to:

PD = (VIN – V

OUT

) I

The junction temperature can be calculated by:

= 165°C. For continuous

OUT

Figure 1. Fixed-Voltage Model—Basic

Connections

10µF

NOTES: (1) C

REG1117

(Adj)

(1)

10µF

optional. Improves high−frequency line rejection. (2) Resistors are standard 1% values.

Figure 2. Adjustable-Voltage Model—Basic Connections

TJ = TA + PD (qJA)

where TA is the ambient temperature, and qJA is the junction-to-ambient thermal resistance.

10µF

Load

R1+R

= x (1.25V) + (50µA) (R2)

This term is negligible with proper choice of values−see table at right.

OUT

(V)(Ω)

1.25 Open Short

1.5 750 147

2.1 158 107

2.85 169 215 3 137 191

3.3 115 187 5 113 340

10 113 787

1 (2)

(Ω)

2 (2)

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SBVS001D − OCTOBER 1992 − REVISED JULY 2004

A simple experiment will determine whether the maximum recommended junction temperature is exceeded in an actual circuit board and mounting configuration: Increase the ambient temperature above that expected in normal operation until the device’s thermal shutdown is activated. If this occurs at more than 40°C above the maximum expected ambient temperature, then T

will be less than

125°C during normal operation. The internal protection circuitry of the REG1117 was

designed to protect against overload conditions. It was not intended to replace proper heat sinking. Continuously running the REG1117 into thermal shutdown will degrade reliability.

0.45

LAYOUT CONSIDERATIONS

The DDPAK (REG1117F-3.3 and REG1117FA) is a surface-mount power package that has excellent thermal characteristics. For best thermal performance, the mounting tab should be soldered directly to a circuit board copper area, as shown in Figure 3. Increasing the copper area improves heat dissipation. Figure 4 shows typical thermal resistance from junction-to-ambient as a function of the copper area.

3−Lead DDPAK

0.51

(1)

0.085

All measurements in inches.

0.155 0.05

NOTE: (1) For improved thermal performance increase footprint area. See Figure 4 (Thermal Resistance vs Circuit Board Copper Area).

Figure 3. DDPAK Footprint

THERMAL RESISTANCE vs

(°C/W)

Thermal Resistance, q

012345

CIRCUIT BOARD COPPER AREA

DDPAK Surface Mount Package

Copper Area (inches

REG1117F

1oz copper

)

0.2

0.10

Circuit Board CopperArea

REG1117F

DDPAK Surface−Mount Package

Figure 4. DDPAK Thermal Resistance versus Circuit Board Copper Area

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(1)

THERMAL

BOARD

COPPER

JUNCTION-

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SBVS001D − OCTOBER 1992 − REVISED JULY 2004

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The SOT-223 package derives heat sinking from conduction through its copper leads, especially the large mounting tab. These must be soldered to a circuit board with a substantial amount of copper remaining, as shown in Figure 5. Circuit board traces connecting the tab and the leads should be made as large as practical. The mounting tab of both packages is electrically connected to V

Total Area: 50 x 50mm

35 x 17mm

16 x 10 mm 16 x 10 mm

≈59_

Without backside copper:

With solid backside copper:

JA JA

≈49_

C/W C/W

OUT

Figure 5. SOT-223 Circuit Board Layout Example

Other nearby circuit traces, including those on the back side of the circuit board, help conduct heat away from the device, even though they may not be electrically connected. Make all nearby copper traces as wide as possible and leave only narrow gaps between traces.

Table 1 shows approximate values of q

for various circuit

board and copper areas for the SOT-223 package. Nearby heat dissipating components, circuit board mounting conditions, and ventilation can dramatically affect the actual q

. Proper heat sinking significantly increases the

maximum power dissipation at a given ambient temperature, as shown in Figure 6.

Table 1. SOT-223 qJA for Various Board

Configurations

SOT-223

TOTAL PC

AREA

2500mm 2500mm 2500mm 2500mm 2500mm 1600mm 2500mm 2500mm 1600mm

900mm 900mm

(1)

Tab is attached to the topside copper.

TOPSIDE

AREA

2500mm

1250mm

2 2 2 2 2 2

2 2 2

950mm 2500mm 1800mm

600mm 1250mm

915mm

600mm

340mm

2 2

2 2 2 2 2

BACKSIDE

AREA

2500mm 2500mm 2500mm

2 2 2

0 51°C/W 0 53°C/W

1600mm

0 58°C/W 0 59°C/W 0 67°C/W

900mm

0 85°C/W

RESISTANCE TO-AMBIENT

46°C/W 47°C/W 49°C/W

55°C/W

72°C/W

SOLDERING METHODS

Both REG1117 packages are suitable for infrared reflow and vapor-phase reflow soldering techniques. The high rate of temperature change that occurs with wave soldering or hand soldering can damage the REG1117.

INSPEC Abstract Number: B91007604, C91012627. Kelly, E.G. “Thermal Characteristics of Surface 5WK9Ω Packages.” The Proceedings of SMTCON Technology Conference and Exposition: Competitive Surface Mount Technology, April 3−6, 1990, Atlantic City, NJ, USA. Abstract Publisher: IC Manage, 1990, Chicago, IL, USA.

. Surface Mount

MAXIMUM POWER DISSIPATION

=46_C/W

(2500mm2topside and backside copper)

=65_C/W

Power Dissipation (Watts)

(340mm2topside copper, no backside copper)

0 255075100125

vs AMBIENT TEMPERATURE

=27_C/W

(4in2one ozcopper mounting pad)

(no heatsink)

=85_C/W

Ambient Temperature (_C)

PD=(TJ(max)−TA)/

TJ(max) =150_C

DDPAK SOT−223

Figure 6. Maximum Power Dissipation versus Ambient Temperature

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SBVS001D − OCTOBER 1992 − REVISED JULY 2004

TERMPWR

Ω

1N5817

REG1117−2.85

2.85V 2.85V

10µF10µF

110

(Upto27Lines)

Ω

Figure 7. SCSI Active Termination Configuration

REG1117−5

VIN> 12V

10µF100

In Out

10µF

GND

Ω

5V to 10V

TERMPWR

Ω

110

Ω

110

10µF100

REG1117−2.85

10µF 10µF

REG1117−5

In Out

GND

2.5V

REF1004−2.5

OUT

1N5817

7.5VVIN>9.0V

Figure 8. Adjusting Output of Fixed Voltage Models

10µF

Ω

6.5V

10µF

Figure 10. Battery Backed-Up Regulated Supply

10µF 100µF

Figure 9. Regulator with Reference

REG1117−5

In Out

GND

Ω

REG1117−5

In Out

GND

REG1117−5

In Out

GND

5.2V Line

5.0V Battery

100µF

Floating Input

Figure 11. Low Dropout Negative Supply

=−5V

OUT

Page 12

PACKAGE OPTION ADDENDUM

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PACKAGING INFORMATION

Orderable Device Status

REG1117 ACTIVE SOT-223 DCY 4 80 TBD CU SNPB Level-3-220C-168 HR

REG1117-2.85 ACTIVE SOT-223 DCY 4 80 TBD CU SNPB Level-3-220C-168 HR

REG1117-2.85/2K5 ACTIVE SOT-223 DCY 4 2500 TBD CU SNPB Level-3-220C-168HR

REG1117-3.3 ACTIVE SOT-223 DCY 4 80 TBD CU SNPB Level-3-220C-168 HR

REG1117-3.3/2K5 ACTIVE SOT-223 DCY 4 2500 TBD CU SNPB Level-3-220C-168 HR

REG1117-5 ACTIVE SOT-223 DCY 4 80 TBD CU SNPB Level-3-220C-168 HR

REG1117-5/2K5 ACTIVE SOT-223 DCY 4 2500 TBD CU SNPB Level-3-220C-168 HR

REG1117/2K5 ACTIVE SOT-223 DCY 4 2500 TBD CU SNPB Level-3-220C-168 HR

REG1117A ACTIVE SOT-223 DCY 4 80 TBD CU SNPB Level-3-220C-168 HR

REG1117A-1.8 ACTIVE SOT-223 DCY 4 80 TBD CU SNPB Level-3-220C-168 HR

REG1117A-1.8/2K5 ACTIVE SOT-223 DCY 4 2500 TBD CU SNPB Level-3-220C-168HR

REG1117A-2.5 ACTIVE SOT-223 DCY 4 80 TBD CU SNPB Level-3-220C-168 HR

REG1117A-2.5/2K5 ACTIVE SOT-223 DCY 4 2500 TBD CU SNPB Level-3-220C-168HR

REG1117A/2K5 ACTIVE SOT-223 DCY 4 2500 TBD CU SNPB Level-3-220C-168 HR

REG1117F-3.3 OBSOLETE DDPAK/

REG1117F-3.3/500 ACTIVE DDPAK/

REG1117F-3.3KTTT ACTIVE DDPAK/

REG1117FA OBSOLETE DDPAK/

REG1117FA-1.8 OBSOLETE DDPAK/

REG1117FA-1.8/500 ACTIVE DDPAK/

REG1117FA-1.8KTTT ACTIVE DDPAK/

REG1117FA-2.5 OBSOLETE DDPAK/

REG1117FA-2.5/500 ACTIVE DDPAK/

REG1117FA-2.5KTTT ACTIVE DDPAK/

REG1117FA-5.0 OBSOLETE DDPAK/

REG1117FA-5.0/500 ACTIVE DDPAK/

REG1117FA-5.0KTTT ACTIVE DDPAK/

REG1117FA/500 ACTIVE DDPAK/

REG1117FA2.5KTTTG3 ACTIVE DDPAK/

REG1117FAKTTT ACTIVE DDPAK/

(1)

Package

Type

TO-263

Package Drawing

KTT 3 TBD CallTI Call TI

KTT 3 500 Green (RoHS &

KTT 3 50 Green (RoHS &

KTT 3 TBD CallTI Call TI

KTT 3 500 Green (RoHS &

KTT 3 50 Green (RoHS &

KTT 3 TBD CallTI Call TI

KTT 3 500 Green (RoHS &

KTT 3 50 Green (RoHS &

KTT 3 TBD CallTI Call TI

KTT 3 500 TBD CU SN Level-3-235C-168HR

KTT 3 50 TBD CU SN Level-3-235C-168HR

KTT 3 500 Green (RoHS &

KTT 3 50 Green (RoHS &

Pins Package

Qty

Eco Plan

no Sb/Br)

(2)

Lead/Ball Finish MSL Peak Temp

CU SN Level-2-260C-1 YEAR

27-Sep-2005

(3)

Addendum-Page 1

Page 13

PACKAGE OPTION ADDENDUM

www.ti.com

(1)

The marketing status values are defined as follows:

27-Sep-2005

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

Page 14

MECHANICAL DATA

MPDS094A – APRIL 2001 – REVISED JUNE 2002

DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE

6,70 (0.264) 6,30 (0.248)

3,10 (0.122)

2,90 (0.114)

0,10 (0.004)

7,30 (0.287) 6,70 (0.264)

1 2 3

2,30 (0.091)

4,60 (0.181)

1,80 (0.071) MAX

0,10 (0.0040) 0,02 (0.0008)

NOTES: A. All linear dimensions are in millimeters (inches).

B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion. D. Falls within JEDEC TO-261 Variation AA.

3,70 (0.146) 3,30 (0.130)

0,84 (0.033) 0,66 (0.026)

0,10 (0.004)

1,70 (0.067) 1,50 (0.059)

Seating Plane

0,08 (0.003)

0°–10°

Gauge Plane

0,25 (0.010)

0,75 (0.030) MIN

0,35 (0.014) 0,23 (0.009)

4202506/B 06/2002

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

Page 15

Page 16

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty . Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.

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BURR-BROWN REG1117, REG1117A User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual