REF102
®
3
TEMPERATURE MAX INITIAL MAX DRIFT
PRODUCT PACKAGE RANGE ERROR (mV) (ppm/
°C)
REF102AU 8-Pin SOIC –25°C to +85°C ±10 ±10
REF102AP 8-Pin Plastic DIP –25°C to +85°C ±10 ±10
REF102BP 8-Pin Plastic DIP –25°C to +85°C ±5 ±5
REF102AM Metal TO-99 –25°C to +85°C ±10 ±10
REF102BM Metal TO-99 –25°C to +85°C ±5 ±5
REF102CM Metal TO-99 –25°C to +85°C ±2.5 ±2.5
REF102RM Metal TO-99 –55°C to +125°C ±10 ±10
REF102SM Metal TO-99 –55°C to +125°C ±5 ±5
ORDERING INFORMATION
PIN CONFIGURATIONS
Top View DIP/SOIC
8
71
4
53
26
Common
Trim
V
OUT
NCNC
NC
Noise Reduction
8
7
6
5
1
2
3
4
Noise Reduction
NC
V
OUT
Trim
NC
V+
Com
NC
V+
Top View TO-99
Input Voltage...................................................................................... +40V
Operating Temperature
P,U ..................................................................................–25°C to +85°C
M ................................................................................... –55°C to +125°C
Storage Temperature Range
P,U ..................................................................................–40°C to +85°C
M ................................................................................... –65°C to +150°C
Lead Temperature (soldering, 10s)................................................ +300°C
(SOIC, 3s) ....................................................... +260°C
Short-Circuit Protection to Common or V+............................... Continuous
ABSOLUTE MAXIMUM RATINGS
PACKAGE INFORMATION
PACKAGE DRAWING
PRODUCT PACKAGE NUMBER
(1)
REF102AU 8-Pin SOIC 182
REF102AP 8-Pin Plastic DIP 006
REF102BP 8-Pin Plastic DIP 006
REF102AM Metal-TO-99 001
REF102BM Metal-TO-99 001
REF102CM Metal-TO-99 001
REF102RM Metal-TO-99 001
REF102SM Metal-TO-99 001
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.