Sampling Frequency: 7.2kHz to 26kHz
Dynamic Range: 88dB (typ) at fS = 8kHz, fIN = 1kHz
● SYSTEM CLOCK: 512f
S
● MASTER OR SLAVE OPERATION
● ON-CHIP CRYSTAL OSCILLATOR CIRCUIT
● ADC-TO-DAC LOOP-BACK MODE
● TIME SLOT MODE SUPPORTS UP TO
FOUR CODECs ON A SINGLE SERIAL
INTERFACE
● POWER-DOWN MODE: 60µA (typ)
DESCRIPTION
The PCM3500 is a low cost, 16-bit CODEC designed
for modem Analog Front End (AFE) and speech processing applications. The PCM3500’s low power operation from +2.7V to +3.6V power supplies, along
with an integrated power-down mode, make it ideal for
portable applications.
The PCM3500 integrates all of the functions needed for
a modem or voice CODEC, including delta-sigma
● POWER SUPPLY: Single +2.7V to +3.6V
● SMALL PACKAGE: SSOP-24
APPLICATIONS
● SOFTWARE MODEMS FOR:
Personal Digital Assistant
Notebook and Hand-Held PCs
Set-Top Box
Digital Television
Embedded Systems
● PORTABLE VOICE RECORDER/PLAYER
● SPEECH RECOGNITION/SYNTHESIS
● TELECONFERENCING PRODUCTS
digital-to-analog and analog-to-digital converters, input anti-aliasing filter, digital high-pass filter for DC
blocking, and an output low-pass filter. The synchronous serial interface provides for a simple, or glue-free
interface to popular DSP and RISC processors. The
serial interface also supports Time Division Multiplexing (TDM), allowing up to four CODECs to share a
single 4-wire serial bus.
SBAS117
V
IN
AGND
V
1
REF
V
COM
V
2
REF
V
OUT
AGND
International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
ELECTROSTATIC
DISCHARGE SENSITIVITY
published specifications.
PACKAGE/ORDERING INFORMATION
PACKAGESPECIFIED
PRODUCTPACKAGENUMBERRANGEMARKINGNUMBER
DRAWINGTEMPERATUREPACKAGEORDERINGTRANSPORT
PCM3500E24-Lead SSOP338–25°C to +85°CPCM3500EPCM3500ERails
"""""PCM3500E/2KTape and Reel
NOTES: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K indicates 2000 devices per reel). Ordering 2,000 pieces
of “PCM3500E/2K” will get a single 2000-piece Tape and Reel.
(1)
MEDIA
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no
responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice.
No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN
product for use in life support devices and/or systems.
3PCM3500
®
Page 4
PIN CONFIGURATION
Top ViewSSOP
PCM3500
1
V
COM
2
V
1
REF
3
V
2
REF
4
V
IN
5
AGND
6
M/S
7
TSC
8
BCK
9
FS
10
DIN
11
DOUT
12
FSO
V
AGND
V
OUT
AGND
PDWN
LOOP
HPFD
XTI
XTO
SCKIO
DGND
V
24
CC
23
22
21
20
19
18
17
16
15
14
13
DD
PIN ASSIGNMENTS
PINNAMEI/ODESCRIPTION
1V
2V
3V
4V
5AGND—Analog Ground for the ADC Input Signal.
6M/SINMaster/Slave Select. This pin is used to determine the operating mode for the serial interface. A logic ‘0’ on this pin selects the Slave
7TSCINTime Slot Mode Control. This pin is used to select the time slot operating mode. A logic ‘0’ on this pin disables Time Slot Mode. A
8BCKI/OBit Clock. This pin serves as the bit (or shift) clock for the serial interface. This pin is an input in Slave Mode and an output in Master
9FSI/OFrame Sync. This pin serves as the frame synchronization clock for the serial interface. This pin is an input in Slave Mode and an
10DININSerial Data Input. This pin is used to write 16-bit data to the DAC.
11DOUTOUTSerial Data Output. The ADC outputs 16-bit data on this pin.
12FSOOUTFrame Sync Output. Active only when Time Slot Mode is enabled. This pin is set to a high impedance state when Time Slot mode
13V
14DGND—Digital Ground. Internally connected through the substrate to analog ground.
15SCKIOI/OSystem Clock Input/Output. This pin is a system clock output when using the crystal oscillator or XTI as the system clock input; when
16XTOOUTCrystal Oscillator Output.
17XTIINCrystal Oscillator Input or an External System Clock Input.
18HPFDINHigh-Pass Filter Disable. When this pin is set to a logic ‘1’, the HPF function in the ADC is disabled.
19LOOPINADC-to-DAC Loop-Back Control. When this pin is set to logic ‘1’, the ADC data is fed to the DAC input.
20PDWNINPower Down and Reset Control. When this pin is logic ‘0’, Power-Down Mode is enabled. The PCM3500 is reset on the rising edge
21AGND—Analog Ground for the DAC Output Signal.
22V
23AGND—Analog Ground. This is the ground for the internal analog circuitry.
24V
NOTES: (1) Schmitt-Trigger input. (2) Schmitt-Trigger input with an internal pull-down resistor. (3) Tri-state output in Time Slot Mode.
OUTCommon-Mode Voltage (0.5V
COM
1—Decouple Pin for Reference Voltage 1 (0.99VCC). This pin should be connected to ground through a capacitor.
REF
2—Decouple Pin for Reference Voltage 2 (0.2VCC). This pin should be connected to ground through a capacitor.
REF
INAnalog Input for the ADC.
IN
Mode. A logic ‘1’ on this pin selects the Master Mode.
logic ‘1’ on this pin enables Time Slot Mode.
(1)
Mode.
output in Master Mode.
. This pin should be connected to ground through a capacitor.
CC)
(2)
(2)
(1)
(1)
(3)
is disabled (TSC = 0).
—Digital Power Supply. Used to power the digital section of the ADC and DAC, as well as the serial interface and mode control logic.
DD
This pin is not internally connected to V
XTI is connected to ground, this pin is a system clock input.
of this signal.
OUTAnalog Output from the DAC Output Filter.
OUT
—Analog Power Supply. Used to power the analog circuitry of the ADC and DAC.
CC
(2)
.
CC
(1)
(2)
(2)
®
PCM3500
4
Page 5
TYPICAL PERFORMANCE CURVES
DAC SECTION
DIGITAL FILTER
INTERPOLATION FILTER FREQUENCY RESPONSE
0
–10
–20
–30
–40
–50
–60
Amplitude (dB)
–70
–80
–90
–100
0
ANALOG FILTER
1
Normalized Frequency (• f
23
4
)
S
INTERPOLATION FILTER
0.2
0.0
–0.2
–0.4
Amplitude (dB)
–0.6
–0.8
–1.0
PASSBAND RIPPLE CHARACTERISTICS
00.10.20.30.40.5
Normalized Frequency (• fS Hz)
OUTPUT FILTER FREQUENCY RESPONSE
0
–10
–20
–30
–40
–50
–60
Amplitude (dB)
–70
–80
–90
–100
1001k10k100k1M10M
STOPBAND CHARACTERISTICS
Frequency (Hz)
0
–1
–2
–3
–4
–5
–6
–7
Amplitude (dB)
–8
–9
–10
OUTPUT FILTER FREQUENCY RESPONSE
PASSBAND CHARACTERISTICS
1001011k10k100k
Frequency (Hz)
5PCM3500
®
Page 6
TYPICAL PERFORMANCE CURVES (Cont.)
TA = +25°C, VCC = VDD = +3.3V, fS = 8kHz, and f
= 1kHz, unless otherwise specified.
SIGNAL
DAC SECTION
DAC OUTPUT SPECTRA
0
–20
–40
–60
–80
Amplitude (dB)
–100
–120
–140
0
–20
–40
–60
THD+N (dB)
–80
–100
DAC OUTPUT SPECTRUM (–0dB, N = 8192)
12340
Frequency (kHz)
TOTAL HARMONIC DISTORTION + NOISE
vs SIGNAL NOISE
THD+N fluctuates with signal level
as harmonics are limited to second
and third components.
–84–72–60–48–36–24–120–96
Signal Level (dB)
0
–20
–40
–60
–80
Amplitude (dB)
–100
–120
–140
0
–20
–40
–60
–80
Amplitude (dB)
–100
–120
–140
DAC OUTPUT SPECTRUM (–60dB, N = 8192)
12340
Frequency (kHz)
DAC OUT-OF-BAND NOISE SPECTRUM
(BPZ, N = 2048)
8 162432 404856640
Frequency (kHz)
®
PCM3500
6
Page 7
TYPICAL PERFORMANCE CURVES (Cont.)
Dynamic Range and SNR (dB)
DYNAMIC RANGE AND SIGNAL-TO-NOISE RATIO
vs TEMPERATURE
(T
A
= –25°C to +85°C)
Temperature (°C)
96
94
92
90
88
–250255075100–50
Dynamic Range
SNR
Dynamic Range and SNR (dB)
DYNAMIC RANGE AND SIGNAL-TO-NOISE RATIO
vs SUPPLY VOLTAGE
(V
CC
= VDD = +2.7V to +3.6V)
Supply Voltage (V)
96
94
92
90
88
2.73.03.33.63.92.4
Dynamic Range
SNR
Dynamic Range and SNR (dB)
DYNAMIC RANGE AND SIGNAL-TO-NOISE RATIO
vs SAMPLING FREQUENCY
(f
S
= 8kHz to 26kHz)
f
S
(kHz)
96
94
92
90
88
81624320
BW = 3.4kHz
Dynamic Range
SNR
DAC SECTION
DAC CHARACTERISTICS vs TEMPERATURE, SUPPLY, AND SAMPLING FREQUENCY
ADC CHARACTERISTICS vs TEMPERATURE, SUPPLY AND SAMPLING FREQUENCY
TOTAL HARMONIC DISTORTION + NOISE
–84
–86
–88
THD+N at –0.5dB (dB)
–90
–92
–84
–86
–88
–250255075100–50
TOTAL HARMONIC DISTORTION + NOISE
vs TEMPERATURE
(T
= –25°C to +85°C)
A
Temperature (°C)
vs SUPPLY VOLTAGE
= VDD = +2.7V to +3.6V)
(V
CC
DYNAMIC RANGE AND SIGNAL-TO-NOISE RATIO
92
90
88
86
Dynamic Range and SNR (dB)
84
92
90
88
–250255075100–50
DYNAMIC RANGE AND SIGNAL-TO-NOISE RATIO
vs TEMPERATURE
(T
vs SUPPLY VOLTAGE
= VDD = +2.7V to +3.6V)
(V
CC
= –25°C to +85°C)
A
SNR
Dynamic Range
Temperature (°C)
Dynamic Range
SNR
THD+N at –0.5dB (dB)
–90
–92
–84
–86
–88
THD+N at –0.5dB (dB)
–90
–92
2.73.03.33.63.92.4
TOTAL HARMONIC DISTORTION + NOISE
Supply Voltage (V)
vs SAMPLING FREQUENCY
= 8kHz to 26kHz)
(f
S
81624320
(kHz)
f
S
BW = 3.4kHz
86
Dynamic Range and SNR (dB)
84
96
94
92
90
Dynamic Range and SNR (dB)
88
2.73.03.33.63.92.4
DYNAMIC RANGE AND SIGNAL-TO-NOISE RATIO
vs SAMPLING FREQUENCY
(f
81624320
Supply Voltage (V)
= 8kHz to 26kHz)
S
SNR
Dynamic Range
f
(kHz)
S
BW = 3.4kHz
®
PCM3500
10
Page 11
I
CC
, I
DD
and I
CC
+ I
DD
(mA)
SUPPLY CURRENT vs SUPPLY VOLTAGE
Supply Voltage (V)
12
10
8
6
4
2
0
2.73.03.33.63.92.4
ICC + I
DD
ICC + I
DD
at Power Down
I
CC
I
DD
TYPICAL PERFORMANCE CURVES (Cont.)
TA = +25°C, VCC = VDD = +3.3V, fS = 8kHz, and f
SUPPLY CURRENT vs SUPPLY VOLTAGE AND SAMPLING FREQUENCY
= 1kHz, unless otherwise specified.
SIGNAL
12
10
(mA)
DD
8
+ I
CC
6
and I
DD
4
, I
CC
I
2
0
SUPPLY CURRENT vs SUPPLY VOLTAGE
ICC + I
DD
I
CC
I
DD
ICC + I
at Power Down
DD
2.73.03.33.63.92.4
Supply Voltage (V)
®
11PCM3500
Page 12
SYSTEM CLOCK AND RESET/
POWER DOWN
SYSTEM CLOCK INPUT AND OUTPUT
The PCM3500 requires a system clock for operating the
digital filters and delta-sigma data converters.
The system clock may be supplied from an external master
clock or generated using the on-chip crystal oscillator circuit. Figure 1 shows the required connections for external
and crystal clock operation. The system clock must operate
at 512 times the sampling frequency, fS, with sampling
frequencies from 7.2kHz to 26kHz. This gives an effective
system clock frequency range of 3.6864MHz to 13.312MHz.
Table I shows system clock frequencies for common sampling frequencies.
For external clock operation, XTI (pin 17) or SCKIO (pin 15)
is driven by a master clock source. If SCKIO is used as the
system clock input, then XTI must be connected to ground.
SAMPLING FREQUENCY (kHz)SYSTEM CLOCK FREQUENCY (MHz)
84.096
11.0255.6448
168.192
22.0511.2896
2412.288
TABLE I. System Clock Frequencies for Common Sam-
pling Frequencies.
For either case, XTO (pin 16) should be left open. The system
clock source should be free of noise and exhibit low phase
jitter in order to obtain optimal dynamic performance from
the PCM3500. Figure 2 shows the system clock timing
requirements associated with an external master clock.
For crystal oscillator operation, a crystal is connected between XTI (pin 17) and XTO (pin 16), along with the
necessary load capacitors (10pF to 33pF per pin, as shown
in Figure 1). A fundamental-mode, parallel resonant crystal
is required.
External
Clock
SCKIO
XTI
R
XTO
PCM3500
EXTERNAL CLOCK INPUT-SCKIO
(XTO must be open)
FIGURE 1. System Clock Generation.
External
Clock
SCKIO
XTI
R
XTO
PCM3500
EXTERNAL CLOCK INPUT-XTI
(XTO must be open)
C
1
Crystal
C
2
C1, C2 = 10pF to 33pF
SCKIO
XTI
R
XTO
PCM3500
CRYSTAL RESONATOR
CONNECTION
t
"H"
XTI
or
SCKIO
"L"
t
CLKIL
System Clock Pulse Width HIGH t
System Clock Pulse Width LOW t
FIGURE 2. External System Clock Timing Requirements.
®
PCM3500
CLKIH
12
CLKIH
CLKIL
1/512f
S
20ns (min)
20ns (min)
0.7V
0.3V
DD
DD
Page 13
Reset and Power Down
The PCM3500 supports power-on reset, external reset, and
power-down operations. Power-on reset is performed by
internal circuitry automatically at power up, while the external reset is initiated using the PDWN input (pin 20).
Power-on reset occurs when power and system clock are
initially applied to the PCM3500. The internal reset circuitry requires that the system clock be active at power up,
with at least three system clock cycles occurring prior to
VDD = 2.2V. When VDD exceeds 2.2V, the power-on reset
comparator enables the initialization sequence, which requires 1024 system clock periods for completion. During
the initialization sequence, the DAC output is forced to
AGND, and the ADC output is forced to a high impedance
state. After the initialization sequence has completed, the
DAC and ADC outputs experience a delay before they
output a valid signal or data. Refer to Figures 3 and 5 for
power-on reset and post-reset delay timing.
External reset is performed by first setting PDWN = ‘0’ and
then setting PDWN = ‘1’. The LOW to HIGH transition on
2.4V
V
2.2V
DD
2.0V
Internal Reset
1024 System Clock Periods
System Clock
PDWN causes the reset initialization sequence to start.
During the initialization sequence, the DAC output is forced
to AGND, and the ADC output is forced to a high impedance
state. After the initialization sequence has completed, the
DAC and ADC outputs experience a delay before they
output a valid signal or data. Refer to Figures 4 and 5 for
external reset and post-reset delay timing.
Power-down mode is enabled by setting PDWN = ‘0’.
During power-down mode, minimum current is drawn when
the system clock is removed, resulting in 60µA (typical)
power supply current. The PDWN input includes an internal
pull-down resistor, which places the PCM3500 in powerdown mode at power-up if the PDWN pin is left unconnected. Ideally, the PDWN input should be driven by active
logic in order to control reset and power-down operation. If
the PDWN pin is to be unused in the system application, it
should be connected to VDD to enable normal operation. By
setting PDWN = ‘1’ when exiting power-down mode, the
PCM3500 will initiate an external reset as described earlier
in this section.
Reset
Reset Removal
FIGURE 3. Power-On Reset Timing.
PDWN
Internal Reset
System Clock
FIGURE 4. External Reset Timing.
Internal Reset
or Power Down
DAC V
OUT
ADC DOUT
Reset
Power Down
GND
PWDN = LOW Pulse Width
t
= 40ns minimum
RST
t
RST
Reset
1024 System Clock Periods
Reset Removal or Power Down OFF
Ready/Operation
(2048/fS)
t
DACDLY1
V
COM
(0.5VCC)
t
(2304/fS)
ADCDLY1
High Impedance
Reset Removal
(1)
NOTE: (1) The HPF transient response (exponentially attenuated signal from ±0.2% DC of FSR with 200ms time constant) appears initially.
FIGURE 5. DAC and ADC Output for Reset and Power Down.
13PCM3500
®
Page 14
SERIAL INTERFACE
The serial interface of the PCM3500 is a 4-wire synchronous
serial port. It includes FS (pin 9), BCK (pin 8), DIN (pin 10)
and DOUT (pin 11). FS is the frame synchronization clock,
BCK is the serial bit or shift clock, DIN is the serial data input
for the DAC, and DOUT is the serial data output for the ADC.
The frame sync, FS, operates at the sampling frequency (fS).
The bit clock, BCK, operates at 16fS for normal operation.
DIN and DOUT also operate at the bit clock rate. Both FS
and BCK must be synchronous with the system clock (guar-
FS
BCK
anteed in Master Mode). Data for DIN is clocked into the
serial interface on the rising edge of BCK, while data for
DOUT is clocked out of the serial interface on the falling
edge of BCK.
Figure 6 shows the serial interface format for the PCM3500.
The serial data for DIN and DOUT must be in Binary Two’s
Complement, MSB-first format. Figures 7 and 8 show the
timing specifications for the serial interface when used in
Slave and Master Modes.
DIN
DOUT
15 14 13 12 11210543151413 12 11
15 14 13 12 11210543151413 12 11
FIGURE 6. Serial Interface Format.
FS
(input)
t
FSSU
BCK
(input)
DIN
(input)
t
DISU
DOUT
(output)
NOTES: Timing measurement reference level is (VIH/VIL)/2. RIsing and falling time is measured
from 10% to 90% of IN/OUT signal swing. Load capacitance of DOUT signal is 50pF.
t
FSW
1/f
S
16-Bit/Frame
t
FSHD
t
DIHD
t
MSBMSBLSBLSB
MSBMSBLSBLSB
FSP
t
BCKP
t
BCKH
t
BCKL
t
CKDO
210543
210543
0.5V
DD
0.5V
DD
0.5V
DD
0.5V
DD
SYMBOL DESCRIPTIONMINTYPMAXUNITS
t
BCKP
t
BCKH
t
BCKL
t
FSW
t
FSP
t
FSSU
t
FSHD
t
DISU
t
DIHD
t
CKDO
t
R
t
F
BCK Period2400ns
BCK Pulse Width HIGH800ns
BCK Pulse Width LOW800ns
FS Pulse Width HIGHt
FS Period1/f
FS Set Up Time to BCK Rising Edge60ns
FS Hold Time to BCK Rising Edge60ns
DIN Set Up Time to BCK Rising Edge60ns
DIN Hold Time to BCK Rising Edge60ns
Delay Time BCK Falling Edge to DOUT080ns
Rising Time of All Signals30ns
Falling Time of All Signals30ns
FIGURE 7. Serial Interface Timing for Slave Mode.
®
PCM3500
14
BCKP
– 60t
BCKPtBCKP
S
+ 60ns
Page 15
t
FSP
t
FSW
FS
(output)
t
CKFS
BCK
(output)
DIN
(input)
t
DISU
DOUT
(output)
NOTES: Timing measurement reference level is (VIH/VIL)/2. Rising and falling time is measured from
10% to 90% of IN/OUT signal swing. Load capacitance of DOUT, FS, BCK signal is 50pF.
SYMBOL DESCRIPTIONMINTYPMAXUNITS
t
BCKP
t
BCKH
t
BCKL
t
CKFS
t
FSW
t
FSP
t
DISU
t
DIHD
t
CKDO
t
R
t
F
BCK Period240016000ns
BCK Pulse Width HIGH12008000ns
BCK Pulse Width LOW12008000ns
Delay Time BCK Falling Edge to FS– 4040ns
FS Pulse Width HIGHt
FS Period1/f
DIN Set Up Time to BCK Rising Edge60ns
DIN Hold Time to BCK Rising Edge60ns
Delay Time BCK Falling Edge to DOUT080ns
Rising Time of All Signals30ns
Falling Time of All Signals30ns
t
DIHD
t
BCKH
BCKP
t
BCKP
t
BCKL
– 60t
t
CKDO
BCKPtBCKP
S
+ 60ns
0.5V
0.5V
0.5V
0.5V
DD
DD
DD
DD
FIGURE 8. Serial Interface Timing for Master Mode.
System
Clock
Controller
PCM3500
XTI
FS
BCK
DIN
DOUT
M/S
TSC
GND
GND
Slave Mode
FIGURE 9. Slave and Master Mode Connections.
MASTER/SLAVE OPERATION
The serial interface supports both Slave and Master Mode
operation. The mode is selected by the M/S input (pin 6).
Table II shows mode and pin settings corresponding to the
M/S input selection. Figure 9 shows connections for Slave
and Master mode operation.
SERIAL
M/S (PIN 6)MODEFS (PIN)BCK (PIN 8)
0SlaveInputInput
1MasterOutputOutput
INTERFACE
TABLE II. Master/Slave Mode Selection.
System
Clock
Controller
PCM3500
XTI
FS
BCK
DIN
DOUT
M/S
TSC
V
DD
GND
Master Mode
Slave Mode Operation
In Slave Mode, the FS and BCK pins are inputs to the
PCM3500. Both FS and BCK should be derived from the
system clock signal (XTI or SCKIO) to ensure proper
synchronization. Slave Mode is best suited for applications
where the DSP or controller is capable of generating the FS,
BCK, and system clocks using an on-chip serial port and/or
timing generator.
Master Mode Operation
In Master Mode operation, both FS and BCK are clock
outputs generated by the PCM3500 from the system clock
input (XTI, SCKIO, or a crystal). In Master Mode, the timing
and phase relationships between system clock, FS, and BCK
are managed internally to provide optimal synchronization.
15PCM3500
®
Page 16
SYNCHRONIZATION REQUIREMENTS
The PCM3500 requires that FS and BCK be synchronous
with the system clock. Internal circuitry is included to detect
a loss of synchronization between FS and the system clock
input. If the phase relationship between FS and the system
clock varies more than ± 1.5 BCK periods, the PCM3500
will detect a loss of synchronization. Upon detection, the
DAC output is forced to 0.5VCC and the DOUT pin is forced
to a high impedance state. This occurs within one sampling
clock (FS) period of initial detection. Figure 10 shows the
loss of synchronization operation and the DAC and ADC
output delays associated with it.
TIME SLOT OPERATION
The PCM3500 serial interface supports Time Division
Multiplexing (TDM) using the Time Slot Mode. Up to four
PCM3500s may be connected on the same 4-wire serial
Synchronization
Lost
interface bus. This is useful for system applications that
require multiple modem or voice channels. Figure 11 shows
examples of Time Slot Mode connections.
Time Slot Mode defines a 64-bit long frame, composed of
four time slots. Each slot is 16 bits long and corresponds to
one of four CODECs. The FS pin on the first PCM3500
(CODEC A, Slot 0) is used as the master frame sync, and
operates at the sampling frequency, fS. The bit clock, BCK,
operates at 64fS. DIN and DOUT of each CODEC also
operate at 64fS. Figure 12 shows the operation of the Time
Slot Mode.
Time Slot operation is enabled or disabled using the TSC
input (pin 7). The state of the TSC pin is updated at poweron reset, or on the rising edge of PWDN input (if using
external reset or power-down mode). A forced reset is
required when changing from Slave to Master Mode, or visa
versa, in real time.
Resynchronization
State of
Synchronization
DAC V
ADC DOUT
NOTE: (1) The HPF transient response (exponentially attenuated signal from ±0.2% DC of FSR
with 200ms time constant) appears initially.
SynchronousAsynchronous
within
1/f
Undefined Data
OUT
Normal
Undefined Data
Normal
S
High Impedance
V
COM
(0.5 VCC)
FIGURE 10. Loss of Synchronization Operation and Timing.
Table III shows the TSC pin settings and corresponding
mode selections. When Time Slot Mode is enabled, FSO
(pin 12) is used as a frame sync output, which is connected
to the FS input of the next PCM3500 in the Time Slot
sequence. Figures 13 and 14 provide detailed timing for
Time Slot Mode operation.
TSC (PIN 7)TIME SLOT MODE
0Time Slot Mode Disabled, Normal Operation
1Time Slot Operation Enable
TABLE III. Time Slot Mode Selection.
ADC-TO-DAC LOOP BACK
The PCM3500 includes a Loop-Back Mode, which directly
feeds the ADC data to the DAC input. This mode is designed
for diagnostic testing and system adjustment. Loop-Back
Mode is enabled and disabled using the LOOP input (pin
19). Table IV shows the LOOP pin settings and corresponding mode selections. The serial interface continues to oper-
t
FSW
FS
(input)
BCK
(input)
DIN
(input)
DOUT
(output)
FSO
(output)
t
FSSU
t
DISU
High Impedance
t
FSHD
t
DIHD
t
HZDO
ate in Loop-Back Mode, allowing the host to read the ADC
data at the DOUT pin.
LOOP (PIN 19)LOOP-BACK MODE
0Loop-Back Mode Disabled, Normal Operation
1Loop-Back Mode Enabled
TABLE IV. Loop-Back Mode Selection.
HIGH-PASS FILTER
The PCM3500 includes a digital high-pass filter in the ADC
which may be used to remove the DC offset created by the
analog front-end (AFE) section. The high-pass filter response
is shown in Figure 15. The high-pass filter may be enabled or
disabled using the HPFD input (pin 18). Table V shows the
HPFD pin settings and corresponding mode selections.
HPFD (PIN 18)HIGH-PASS FILTER MODE
0High-Pass Filter On
1High-Pass Filter Off
TABLE V. High-Pass Filter Mode Selection.
t
FSP
0.5V
DD
t
BCKP
0.5V
DD
t
BFSO
t
BCKL
t
CKDO
t
FSOW
t
BCKH
0.5V
DD
High Impedance
0.5V
DD
t
DOHZ
0.5V
DD
NOTES: Timing measurement reference level is (VIH/VIL)/2. Rising and falling time is measured from
10% to 90% of IN/OUT signal swing. Load capacitance of DOUT, and FSO signal is 50pF.
FS Period1/f
FS Set Up TIme to BCK Rising Edge60ns
FS Hold TIme to BCK RIsing Edge60ns
DIN Set Up Time to BCK Rising Edge60ns
DIN Hold Time to BCK Rising Edge60ns
Delay Time BCK Falling Edge to DOUT080ns
Delay Time BCK Falling Edge to DOUT Active20ns
Delay Time BCK Falling Edge to DOUT Inactive19.5ns
FSO Pulse Width HIGHt
BCKP
– 60t
BCKPtBCKP
Delay Time BCK Falling Edge to FSO080ns
Rising Time of All Signals30ns
Falling Time of All Signals30ns
FIGURE 13. Serial Interface Timing for Time Slot Mode Operation (Slave Mode).
®
PCM3500
18
+ 60ns
S
+ 60ns
Page 19
t
FSP
t
FSW
FS
(output)
t
BCKP
BCK
(output)
t
BCKL
t
BCKH
DIN
(input)
t
DIHD
DOUT
t
DISU
High Impedance
(output)
t
HZDO
t
CKDO
FSO
(output)
t
BFSO
t
FSOW
NOTES: Timing measurement reference level is (VIH/VIL)/2. Rising and falling time is measured from
10% to 90% of IN/OUT signal swing. Load capacitance of DOUT, FSO, FS, and BCK signal is 50pF.
DIN Set Up Time to BCK Rising Edge60ns
DIN Hold Time to BCK Rising Edge60ns
Delay Time BCK Falling Edge to DOUT080ns
Delay Time BCK Falling Edge to DOUT Active20ns
Delay Time BCK Falling Edge to DOUT Inactive19.5ns
FSO Pulse Width HIGHt
BCKP
– 60t
BCKPtBCKP
+ 60ns
Delay Time BCK Falling Edge to FSO080ns
Rising Time of All Signals30ns
Falling Time of All Signals30ns
0.5V
DD
t
CKFS
0.5V
DD
0.5V
DD
High Impedance
0.5V
DD
t
DOHZ
0.5V
DD
FIGURE 14. Serial Interface Timing for Time Slot Mode Operation (Master Mode).
0
–10
–20
–30
–40
–50
–60
Amplitude (dB)
–70
–80
–90
–100
HIGH-PASS FILTER FREQUENCY RESPONSE
STOPBAND CHARACTERISTICS
0.10.20.30.40.50
Normalized Frequency (• f
/1000 Hz)
S
0.0
–0.1
–0.2
–0.3
–0.4
–0.5
–0.6
Amplitude (dB)
–0.7
–0.8
–0.9
–10
HIGH-PASS FILTER FREQUENCY RESPONSE
PASSBAND CHARACTERISTICS
12340
Normalized Frequency (• f
FIGURE 15. High-Pass Filter Response.
19PCM3500
/1000 Hz)
S
®
Page 20
APPLICATIONS INFORMATION
BASIC CIRCUIT CONNECTIONS
The basic connection diagram for the PCM3500 is shown in
Figure 16. Included are the required power supply bypass and
reference decoupling capacitors. The DAC output, V
the ADC input, VIN, should be AC-coupled to external circuitry.
Reference Pin Connections
The V
voltage is used internally to bias the input and
COM
output amplifier stages of the PCM3500. It is brought out
OUT
, and
unbuffered on pin 1 for decoupling. A 1µF to 10µF aluminum electrolytic or tantalum capacitor is recommended for
decoupling purposes. This capacitor should be located as
close as possible to pin 1.
The V
voltage is typically equal to VCC/2, and may be
COM
used to bias external input and output circuitry. However,
since the V
pin is not a buffered output, it must drive a
COM
high impedance load to avoid excessive loading. Buffering
the V
pin with an external op amp configured as a
COM
voltage follower is recommended when driving multiple bias
nodes. Figure 17 shows examples of using V
COM
with
external circuitry.
C
3
+
C
4
+
C
5
+
Serial
Interface
+
C
6
C1, C2: Power supply bypass capacitors. Parallel combination of a 1µF to 10µF aluminum electrolytic capacitor and 0.1µF ceramic capacitor.
, C4, C5: V
C
3
C
, C7: Input/output AC-coupling capacitors. Use a 0.1µF to 10µF aluminum electrolytic capacitor.
6
REF
and V
bypass capacitors. Use a 1µF to 10µF aluminum electrolytic capacitor.
COM
1
V
2
V
3
V
4
V
5
AGND
6
M/S
7
TSC
8
BCK
9
FS
10
DIN
11
DOUT
12
FSO
PCM3500
COM
1
REF
2
REF
IN
Analog Line Interface Circuit
Telecom Line
AGND
V
AGND
PDWN
LOOP
HPFD
XTO
SCKIO
DGND
V
OUT
XTI
V
24
CC
23
22
21
20
19
18
17
16
15
14
13
DD
+
C
1
C
2
+
+3.3V
External Reset
Power-Down Control
External Clock System
+
C
7
FIGURE 16. Basic Connection Diagram.
(a) Biasing an External Active Filter Stage
Non-Polarized
PCM3500
V
OUT
V
COM
FIGURE 17. Using V
1µF
+
4.7µF
to Bias External Circuitry.
®
COM
PCM3500
V
CC
OPA343
20
(b) Using a Buffer to Provide Bias for Multiple or
Low Input Impedance Nodes
Use voltage follower
PCM3500
V
COM
+
4.7µF
to buffer V
OPA340
COM
To Bias
Nodes
Page 21
V
1 (pin 2) and V
REF
2 (pin 3) are reference voltages used
REF
by the delta-sigma modulators. They are brought out strictly
for decoupling purposes. V
1 and V
REF
2 are not to be
REF
used to bias external circuits. A 1µF to 10µF aluminum
electrolytic or tantalum capacitor is recommended for
decoupling on each pin. These capacitors should be located
as close as possible to pins 2 and 3.
Power Supplies and Grounding
VCC (pin 24) and VDD (pin 13) should be connected directly
to the +2.7V to +3.6V analog power supply, as shown in
Figure 16. The AGNDs (pins 5, 21, and 23) and DGND (pin
14) should be connected directly to the analog ground.
Power supply bypass capacitors should be located as close
to the power supply pins as possible in order to ensure a low
impedance connection. A combination of a 10µF aluminum
electrolytic or tantalum capacitor in parallel with a 0.1µF
ceramic capacitor is recommended for both VCC and VDD.
VDD and VCC should not be connected to separate digital and
analog power supplies. This can lead to an SCR latch-up
condition, which can cause either degraded device performance or catastrophic failures.
PCB LAYOUT GUIDELINES
The recommended PCB layout technique is shown in Figure
18. The analog and digital section of the board are separated
by a split ground plane, with the PCM3500 positioned
entirely over the analog section of the board. The AGNDs
(pins 5, 20, and 23) and DGND (pin 14) are connected
directly to the analog ground plane. The power supply pins,
VCC (pin 13) and VDD (pin 24), are routed directly to the
+2.7V to +3.6V analog power supply using wide copper
traces (100 mils or wider recommended) or a power plane.
Power supply bypass and reference decoupling capacitors
are shown located as close as possible to the PCM3500.
The PCM3500 is oriented so that the digital pins are facing
the ground plane split. Digital connections should be made
as short and direct as possible to limit high frequency
radiation and coupling. Series resistors (from 20Ω to 100Ω)
may be put in series with the system clock, FS, BCK, and
FSO lines to reduce or eliminate overshoot on clock edges,
further reducing radiated emissions. The split ground plane
should be connected at one point by a trace, wire, or ferrite
bead. Often the board will be designed to have several
jumper points for the common ground connection, so that
the best performance can be derived through experimentation.
An alternative technique, using a single power supply or
battery, is shown in Figure 19. This technique is more
suitable for portable applications.
Digital Power
Supply
+3.3V
Host
and
Logic
Digital I/Os
DIGITAL SECTIONANALOG SECTION
Common
Connection
Split Grounds
Analog Power
Supply
+3.3V
V
CCVDD
PCM3500
AGND
DGND
Analog
Ground
Digital
Ground
FIGURE 18. Recommended PCB Layout Technique.
Common
Supply
V
Host
and
Logic
Digital I/Os
DIGITAL SECTIONANALOG SECTION
Split Grounds
CC
PCM3500
AGND
Analog
Ground
V
DD
DGND
Ferrite
Beads
Digital
Ground
FIGURE 19. PCB Layout Using a Single-Supply or Battery.
21PCM3500
®
Page 22
OUTPUT FILTER CIRCUITS FOR THE DAC
The PCM3500’s DAC uses delta-sigma conversion techniques. It uses oversampling and noise shaping to improve
in-band (f = fS/2) signal-to-noise performance at the expense
of increased out-of-band noise. The DAC output must be
low-pass filtered to attenuate the out-of-band noise to a
reasonable level.
The PCM3500 includes a low-pass filter in the on-chip
output amplifier circuit. The frequency response for this
filter is shown in Figure 20. Although this filter helps to
lower the out-of-band noise, it is not adequate for many
applications. This is especially true for applications where
the sampling frequency is below 16kHz, since the out-ofband noise above fS/2 is in the audio spectrum. An external
filter circuit, either passive or active, is required to provide
additional attenuation of the out-of-band noise. The lowpass filter order will be dependent upon the out-of-band
noise requirements for a particular system. Generally, a 2ndorder or better low-pass circuit will be required, with the
cut-off frequency set to fS/2 or less.
Burr-Brown Application Bulletin AB-034 provides information for designing both Multiple Feedback and SallenKey active filter circuits using software available from BurrBrown’s web site. Another excellent reference for both
passive and active filter design is the “Electronic FilterDesign Handbook, Third Edition” by Williams and Taylor,
published by McGraw-Hill.
ON-CHIP ANALOG FRONT END FOR THE ADC
The PCM3500 A/D converter includes a fully differential
input delta-sigma modulator. In order to simplify connection
for single-ended applications, an analog front end (AFE)
circuit has been included on the PCM3500 just prior to the
modulator. The AFE circuit is shown in Figure 21.
0
–10
–20
–30
–40
–50
–60
Amplitude (dB)
–70
–80
–90
–100
1001k10k100k1M10M
STOPBAND FREQUENCY RESPONSE
OUTPUT FILTER
Frequency (Hz)
FIGURE 20. DAC Output Amplifier Filter Response.
1.0µF
V
+
IN
50kΩ
4
0
–1
–2
–3
–4
–5
–6
–7
Amplitude (dB)
–8
–9
–10
PASSBAND FREQUENCY RESPONSE
OUTPUT FILTER
1001011k10k100k
Frequency (Hz)
(+)
V
COM
1
V
+
+
1
REF
2
2
V
REF
3
+
FIGURE 21. On-Chip AFE Circuit for the ADC.
®
PCM3500
Reference
22
(–)
Delta-Sigma
Modulator
Page 23
The AFE circuit consists of a single-ended-to-differential
Host
CPU
Controls (ring detect, off hook, etc.)
Modem
Software
PCM3500
CODEC
Data
Access
Arrangement
(DAA)
Data
Tip
Ring
converter, with the first stage of the circuit doubling as a
low-pass, anti-alias filter. The frequency response for the
filter is shown in Figure 22. Since the delta-sigma modulator
oversamples the input at 64fS, the anti-alias filter requirements are relaxed, with only a single-pole filter being required. If an application requires further band limiting of the
input signal, a simple RC filter at the VIN input (pin 4) can
be used, as shown in Figure 23.
SOFTWARE MODEM
APPLICATIONS
The PCM3500 was designed to meet the requirements for
software-based analog modems, supporting up to 56kbps
In a software modem application, the PCM3500 is paired
with a Data Access Arrangement (DAA) and a host CPU to
(1)
provide the complete modem function. Figure 24 shows a
simplified block diagram of a software modem using the
PCM3500.
The DAA provides the interface between the CODEC and
two-wire telephone line. The DAA provides numerous
functions, including two-to-four wire conversion, modemside to line-side isolation, ring detection, hook switch control, line current compensation, and overvoltage protection.
The host CPU provides the data pump and supervisory
functions for the software modem application. The host
executes modem software code, which includes the necessary routines for transmit and receive functions, error detection and correction, echo cancellation, and CODEC/DAA
control and supervision.
NOTE: (1) Data transmission is limited to 53kbps over standard telephone
.
lines. Actual transmission rates vary depending upon the quality of the
lines and switching equipment for a given connection.
ANTI-ALIASING FILTER
0
–5
–10
–15
–20
–25
–30
–35
Amplitude (dB)
–40
–45
–50
STOPBAND CHARACTERISTICS
1k10010k100k1M10M
Frequency (Hz)
FIGURE 22. Anti-Alias Filter Frequency Response.
PCM3500
=
1
2π RC
R
+
V
IN
C
Analog
Input
f
–3dB
0
–0.1
–0.2
–0.3
–0.4
–0.5
–0.6
–0.7
Amplitude (dB)
–0.8
–0.9
–1.0
ANTI-ALIASING FILTER
PASSBAND CHARACTERISTICS
1k10010110k100k
Frequency (Hz)
FIGURE 23. Optional External Low-Pass Filter for the
ADC.
FIGURE 24. Software Modem Block Diagram.
®
23PCM3500
Page 24
HLDR
LEDCT
HLDCAP
HKP
HKN
LINPWR
HLFWV
LR1
LR2
END
CEN
C1A
V
DD
V
SS
SRVCT
SRVAN
HIN
VFCAP
ONHKMC
TXAN
TXCT
C2
BIASEN
C1B
123456789
101112
2423222120191817161514
13
U1
DL207
IL388
876
5
123
4
R
5
150kΩ
R
6
150kΩ
C
1
15nF
C
1
15nF
C
3
150nF
C
4
27nF
R
2
10MΩ
D2 Bridge
R
1
✽
16.5Ω
1%
R
9
3.9Ω
R
4
356kΩ
Q
2
TN2540
SOT89
Q
1
MMBT6520
SOT23
R
3
10MΩ
C
23
✽
0.33µF
250V
R
20
✽
15kΩ
C
15
1nF
L
2
LI0805D121R
P3100BA70
✽
RV
1
L
1
LI0805D121R
D
1
CMPZDA18V
C
14
1nF
C
8
✽
15nF
C
2
150nF
C
9
470pF
C
7
68nF
C
10
470pF
IL388
U4
U3
123
4
876
5
RING
TIP
F1
F1250T
R
19
✽
2.4kΩ
1W, 2010
R
16
✽
6.8MΩ
R
18
✽
12Ω
Q
3
✽
FZT605
Q
4
✽
BC817-40
C
22
22µF, 35V
R
14
✽
0Ω
+
+
C1B
V
REF
C2
RXCT
RXAN
ONHKML
ONHKM
HIN
SRVAN
SRVCT
TXMP
V
DD
C1A
LSTAT
RNG
OFFHKL
OFFHK
RXOUT
ACREF
TXBIAS
AUDIN
AUDOUT
V
SS
LEDCT
123456789
101112
2423222120191817161514
13
U2
DM207
V
INVOUTVCOM
4
22
1
U5
PCM3500
R
10
10kΩ
R
7
25.5kΩ
R
13
✽
27kΩ
C
17
✽
4.7nF
R
14
22kΩ
RINGD
+3.3V to 7V
OH–
R
8
121kΩ
C
5
15nF
C
18
1µF
C
20
10µF
ISOLATION BARRIERISOLATION BARRIER
NOTES: All resistors are 0.1W, 5%, 0805, unless otherwise noted.
All capacitors values are 10%, unless otherwise noted.
✽ Optional components.
®
PCM3500
FIGURE 25. Modem AFE Application Circuit.
24
Page 25
Software Modem AFE Application Circuit
Figure 25 shows an applications circuit which utilizes the
PCM3500 and the DAA2000 from Infineon Technologies
(Siemens) to implement a complete modem AFE. The
DAA2000 provides modem-side (DM207) and line-side
(DL207) interfaces, with optical isolation separating the
functions. The PCM3500 is connected to the modem-side of
the DAA2000. The PCM3500’s serial interface and hardware mode controls are connected to the host CPU.
THEORY OF OPERATION
ADC SECTION
The PCM3500 A/D converter consists of two reference
circuits, a mono single-to-differential converter, a fully differential 5th-order delta-sigma modulator, a decimation filter (including digital high pass), and a serial interface circuit.
The block diagram on the front page of this data sheet
illustrates the architecture of the ADC section, Figure 21
shows the single-to-differential converter, and Figure 26
illustrates the architecture of the 5th-order delta-sigma modulator and transfer functions.
An internal reference circuit with three external capacitors
provides all reference voltages which are required by the
ADC, which defines the full-scale range for the converter.
The internal single-to-differential voltage converter saves
the design, space and extra parts needed for external circuitry required by many delta-sigma converters. The internal
full-differential signal processing architecture provides a
wide dynamic range and excellent power supply rejection
performance. The input signal is sampled at a 64x
oversampling rate, eliminating the need for a sample-andhold circuit, and simplifying anti-alias filtering requirements. The 5th-order delta-sigma noise shaper consists of
five integrators which use a switched-capacitor topology, a
comparator, and a feedback loop consisting of a one-bit
DAC. The delta-sigma modulator shapes the quantization
noise, shifting it out of the audio band in the frequency
domain. The high order of the modulator enables it to
randomize the modulator outputs, reducing idle tone levels.
The 64fS one-bit data stream from the modulator is converted to 1fS, 16-bit data words by the decimation filter,
which also acts as a low-pass filter to remove the shaped
quantization noise. The DC components can be removed by
a high-pass filter function contained within the decimation
filter.
DAC SECTION
The delta-sigma DAC section of PCM3500 is based on a 5level amplitude quantizer and a 3rd-order noise shaper. This
section converts the oversampled input data to 5-level deltasigma format. A block diagram of the 5-level delta-sigma
modulator is shown in Figure 27. This 5-level delta-sigma
modulator has the advantage of stability and clock jitter
sensitivity over the typical one-bit (2 level) delta-sigma
modulator. The combined oversampling rate of the deltasigma modulator and the internal 8x interpolation filter is
64fS for a 512fS system clock. The theoretical quantization
noise performance of the 5-level delta-sigma modulator is
shown in Figure 28.
Analog In
X(z)
+
–
1st SW-CAP
Integrator
+
1-Bit
DAC
–
2nd SW-CAP
Integrator
3rd SW-CAP
Integrator
+
+
Y(z) = STF(z) • X(z) + NTF(z) • Qn(z)
Signal Transfer Function
Noise Transfer Function
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
Customers are responsible for their applications using TI components.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 2000, Texas Instruments Incorporated
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