BURR-BROWN PCM3500 User Manual

Page 1
®
For most current data sheet and other product
information, visit www.burr-brown.com
Low Voltage, Low Power, 16-Bit, Mono
PCM3500
PCM3500
VOICE/MODEM CODEC
TM
FEATURES
16-BIT DELTA-SIGMA DAC AND ADC
DESIGNED FOR MODEM ANALOG FRONT END:
Supports up to 56kbps Operation
Sampling Frequency: 7.2kHz to 26kHz Dynamic Range: 88dB (typ) at fS = 8kHz, fIN = 1kHz
SYSTEM CLOCK: 512f
S
MASTER OR SLAVE OPERATION
ON-CHIP CRYSTAL OSCILLATOR CIRCUIT
ADC-TO-DAC LOOP-BACK MODE
TIME SLOT MODE SUPPORTS UP TO
FOUR CODECs ON A SINGLE SERIAL INTERFACE
POWER-DOWN MODE: 60µA (typ)
DESCRIPTION
The PCM3500 is a low cost, 16-bit CODEC designed for modem Analog Front End (AFE) and speech pro­cessing applications. The PCM3500’s low power op­eration from +2.7V to +3.6V power supplies, along with an integrated power-down mode, make it ideal for portable applications.
The PCM3500 integrates all of the functions needed for a modem or voice CODEC, including delta-sigma
POWER SUPPLY: Single +2.7V to +3.6V
SMALL PACKAGE: SSOP-24
APPLICATIONS
SOFTWARE MODEMS FOR:
Personal Digital Assistant Notebook and Hand-Held PCs Set-Top Box Digital Television Embedded Systems
PORTABLE VOICE RECORDER/PLAYER
SPEECH RECOGNITION/SYNTHESIS
TELECONFERENCING PRODUCTS
digital-to-analog and analog-to-digital converters, in­put anti-aliasing filter, digital high-pass filter for DC blocking, and an output low-pass filter. The synchro­nous serial interface provides for a simple, or glue-free interface to popular DSP and RISC processors. The serial interface also supports Time Division Multiplex­ing (TDM), allowing up to four CODECs to share a single 4-wire serial bus.
SBAS117
V
IN
AGND
V
1
REF
V
COM
V
2
REF
V
OUT
AGND
International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111
Twx: 910-952-1111 • Internet: http://www.burr-brown.com/ • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
© 1999 Burr-Brown Corporation PDS-1524B Printed in U.S.A. February, 2000
AAF HPF
Reference
SMF
∆Σ
Modulator
(ADC)
Multi-Level
DAC
AGND V
V
CC
Power
DGND
Decimation
Digital Filter
Loop
Serial I/O Interface
Interpolation Digital Filter
Mode Control
M/S
HPFD TSC
Clock Gen/ OSC
XTIXTOLOOP
DD
∆Σ
Modulator
PDWN
1 PCM3500
FS
BCK
DIN
DOUT
FSO
SCKIO
®
Page 2
SPECIFICATIONS
All specifications at +25°C, VDD = V
PARAMETER CONDITIONS MIN TYP MAX UNITS RESOLUTION 16 Bits
DATA FORMAT
Serial Data Interface Format DSP Format Serial Data Bit Length 16 Bits Serial Data Format Sampling Frequency, f
S
System Clock Frequency, 512f
DIGITAL INPUT/OUTPUT
Logic Family CMOS Input Logic Level: V
Input Logic Current: I
Output Logic Level: V
(1)
IH
(1)
V
IL
(2)
IN
(3)
I
IN
(4)
OH
(4)
V
OL
ADC CHARACTERISTICS DC ACCURACY
Input Voltage 0.6 V Gain Error ±2 ±5 % of FSR Offset Error High-Pass Filter Disabled ±2 % of FSR Input Resistance 50 k
AC ACCURACY
THD+N f Dynamic Range Without A-Weighting 82 88 dB
Signal-to-Noise Ratio Without A-Weighting 82 88 dB Crosstalk DAC Channel Idle, 0dB Input 80 85 dB Passband Ripple (internal HPF enabled) 0.0002f Passband Ripple (internal HPF disabled) 0fS to 0.425f Roll-Off at 0.00002f Roll-Off at 0.56f
S
S
Stopband Rejection 0.58fS to f Group Delay 18/f
DAC CHARACTERISTICS DC ACCURACY
Output Voltage 0.6 V Gain Error ±1 ±5 % of FSR Offset Error High Pass Filter Disabled ±1 % of FSR Load Resistance 10 k
AC ACCURACY
THD+N f Dynamic Range Without A-Weighted 84 92 dB Signal-to-Noise Ratio Without A-Weighted 84 92 dB Crosstalk ADC Channel Idle, 0dB Input 84 92 dB Passband Ripple 0f Group Delay 12/f
POWER SUPPLY REQUIREMENTS
Voltage Range VCC, V Supply Current, I Total Supply Current in Power-Down Mode V
+ I
CC
DD
Total Power Dissipation V
TEMPERATURE RANGE
Operating –25 +85 °C Storage –55 +125 °C Thermal Resistance,
Θ
JA
= 3.3V, fS = 8kHz, and nominal system clock (XTI) = 512fS, unless otherwise noted. Measurement band is 100Hz to 0.425fS.
CC
PCM3500E
MSB-First, Binary Two’s Complement
ADC and DAC 7.2 8 26 kHz
S
3.686 4.096 13.312 MHz
0.7 • V
DD
0.3 • V
DD
±1 µA
100 µA
I
= –1mA V
OUT
I
= +1mA 0.3 VDC
OUT
= 1kHz, VIN = –0.5dB –85 –80 dB
IN
to 0.425f
S
S
S
– 0.3 VDC
DD
CC
±0.05 dB ±0.05 dB
High-Pass Filter Enabled –3 dB High-Pass Filter Enabled –30 dB
S
= 1kHz, V
IN
S
VCC = 3.3V 9 12 mA
= VDD = 3.3V, XTI Stopped 60 µA
CC
= VDD = 3.3V 30 40 mW
CC
= 0dB –90 –82 dB
OUT
to 0.425f
S
DD
2.7 3.3 3.6 VDC
–65 dB
S
CC
4m sec
±0.4 dB
S
4m sec
100 °C/W
VDC VDC
Vp-p
Vp-p
NOTES: (1) Pins 6, 7, 8, 9, 10, 15, 17, 18, 19, 20 (M/S, TSC, BCK, FS, DIN, SCKIO, XTI, HPFD, LOOP, PDWN). (2) Pins 8, 9, 10, 15, 17 (BCK, FS, DIN, SCKIO (Schmitt-Trigger input) XTI. (3) Pins 6, 7, 18, 19, 20 (M/S, TSC, HPFD, LOOP, PDWN; Schmitt-Trigger input with internal pull-down). (4) Pins 8, 9, 11, 12, 15, 16 (BCK, FS, DOUT, FSO, SCKIO, XTO).
®
PCM3500
2
Page 3
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, +VDD, +VCC............................................................. +6.5V
Supply Voltage Differences...............................................................±0.1V
GND Voltage Differences..................................................................±0.1V
Digital Input Voltage................................................... –0.3V to V
Input Current (any pins except supply) ........................................... ±10mA
Power Dissipation .......................................................................... 300mW
Operating Temperature Range ......................................... –25°C to +85°C
Storage Temperature...................................................... –55°C to +125°C
Junction Temperature ...................................................................... 150°C
Lead Temperature (soldering, 5s).................................................. +260°C
(reflow, 10s) ................................................................................ +235°C
DD
+ 0.3V
This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degrada­tion to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its
ELECTROSTATIC DISCHARGE SENSITIVITY
published specifications.
PACKAGE/ORDERING INFORMATION
PACKAGE SPECIFIED
PRODUCT PACKAGE NUMBER RANGE MARKING NUMBER
DRAWING TEMPERATURE PACKAGE ORDERING TRANSPORT
PCM3500E 24-Lead SSOP 338 –25°C to +85°C PCM3500E PCM3500E Rails
" " " " " PCM3500E/2K Tape and Reel
NOTES: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K indicates 2000 devices per reel). Ordering 2,000 pieces of “PCM3500E/2K” will get a single 2000-piece Tape and Reel.
(1)
MEDIA
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.
3 PCM3500
®
Page 4
PIN CONFIGURATION
Top View SSOP
PCM3500
1
V
COM
2
V
1
REF
3
V
2
REF
4
V
IN
5
AGND
6
M/S
7
TSC
8
BCK
9
FS
10
DIN
11
DOUT
12
FSO
V
AGND
V
OUT
AGND
PDWN
LOOP HPFD
XTI
XTO
SCKIO
DGND
V
24
CC
23 22 21 20 19 18 17 16 15 14 13
DD
PIN ASSIGNMENTS
PIN NAME I/O DESCRIPTION
1V 2V 3V 4V 5 AGND Analog Ground for the ADC Input Signal. 6 M/S IN Master/Slave Select. This pin is used to determine the operating mode for the serial interface. A logic ‘0’ on this pin selects the Slave
7 TSC IN Time Slot Mode Control. This pin is used to select the time slot operating mode. A logic ‘0’ on this pin disables Time Slot Mode. A
8 BCK I/O Bit Clock. This pin serves as the bit (or shift) clock for the serial interface. This pin is an input in Slave Mode and an output in Master
9 FS I/O Frame Sync. This pin serves as the frame synchronization clock for the serial interface. This pin is an input in Slave Mode and an
10 DIN IN Serial Data Input. This pin is used to write 16-bit data to the DAC. 11 DOUT OUT Serial Data Output. The ADC outputs 16-bit data on this pin. 12 FSO OUT Frame Sync Output. Active only when Time Slot Mode is enabled. This pin is set to a high impedance state when Time Slot mode
13 V
14 DGND Digital Ground. Internally connected through the substrate to analog ground. 15 SCKIO I/O System Clock Input/Output. This pin is a system clock output when using the crystal oscillator or XTI as the system clock input; when
16 XTO OUT Crystal Oscillator Output. 17 XTI IN Crystal Oscillator Input or an External System Clock Input. 18 HPFD IN High-Pass Filter Disable. When this pin is set to a logic ‘1’, the HPF function in the ADC is disabled. 19 LOOP IN ADC-to-DAC Loop-Back Control. When this pin is set to logic ‘1’, the ADC data is fed to the DAC input. 20 PDWN IN Power Down and Reset Control. When this pin is logic ‘0’, Power-Down Mode is enabled. The PCM3500 is reset on the rising edge
21 AGND Analog Ground for the DAC Output Signal. 22 V 23 AGND Analog Ground. This is the ground for the internal analog circuitry. 24 V
NOTES: (1) Schmitt-Trigger input. (2) Schmitt-Trigger input with an internal pull-down resistor. (3) Tri-state output in Time Slot Mode.
OUT Common-Mode Voltage (0.5V
COM
1 Decouple Pin for Reference Voltage 1 (0.99VCC). This pin should be connected to ground through a capacitor.
REF
2 Decouple Pin for Reference Voltage 2 (0.2VCC). This pin should be connected to ground through a capacitor.
REF
IN Analog Input for the ADC.
IN
Mode. A logic ‘1’ on this pin selects the Master Mode.
logic ‘1’ on this pin enables Time Slot Mode.
(1)
Mode.
output in Master Mode.
. This pin should be connected to ground through a capacitor.
CC)
(2)
(2)
(1)
(1)
(3)
is disabled (TSC = 0).
Digital Power Supply. Used to power the digital section of the ADC and DAC, as well as the serial interface and mode control logic.
DD
This pin is not internally connected to V
XTI is connected to ground, this pin is a system clock input.
of this signal.
OUT Analog Output from the DAC Output Filter.
OUT
Analog Power Supply. Used to power the analog circuitry of the ADC and DAC.
CC
(2)
.
CC
(1)
(2)
(2)
®
PCM3500
4
Page 5
TYPICAL PERFORMANCE CURVES DAC SECTION
DIGITAL FILTER
INTERPOLATION FILTER FREQUENCY RESPONSE
0 –10 –20 –30 –40 –50 –60
Amplitude (dB)
–70 –80 –90
–100
0
ANALOG FILTER
1
Normalized Frequency (• f
23
4
)
S
INTERPOLATION FILTER
0.2
0.0
–0.2
–0.4
Amplitude (dB)
–0.6
–0.8
–1.0
PASSBAND RIPPLE CHARACTERISTICS
0 0.1 0.2 0.3 0.4 0.5
Normalized Frequency (• fS Hz)
OUTPUT FILTER FREQUENCY RESPONSE
0 –10 –20 –30 –40 –50 –60
Amplitude (dB)
–70 –80 –90
–100
100 1k 10k 100k 1M 10M
STOPBAND CHARACTERISTICS
Frequency (Hz)
0 –1 –2 –3 –4 –5 –6 –7
Amplitude (dB)
–8 –9
–10
OUTPUT FILTER FREQUENCY RESPONSE
PASSBAND CHARACTERISTICS
100101 1k 10k 100k
Frequency (Hz)
5 PCM3500
®
Page 6
TYPICAL PERFORMANCE CURVES (Cont.)
TA = +25°C, VCC = VDD = +3.3V, fS = 8kHz, and f
= 1kHz, unless otherwise specified.
SIGNAL
DAC SECTION
DAC OUTPUT SPECTRA
0
–20
–40
–60
–80
Amplitude (dB)
–100
–120
–140
0
–20
–40
–60
THD+N (dB)
–80
–100
DAC OUTPUT SPECTRUM (–0dB, N = 8192)
12340
Frequency (kHz)
TOTAL HARMONIC DISTORTION + NOISE
vs SIGNAL NOISE
THD+N fluctuates with signal level
as harmonics are limited to second
and third components.
–84 –72 –60 –48 –36 –24 –12 0–96
Signal Level (dB)
0
–20
–40
–60
–80
Amplitude (dB)
–100
–120
–140
0
–20
–40
–60
–80
Amplitude (dB)
–100
–120
–140
DAC OUTPUT SPECTRUM (–60dB, N = 8192)
12340
Frequency (kHz)
DAC OUT-OF-BAND NOISE SPECTRUM
(BPZ, N = 2048)
8 162432 404856640
Frequency (kHz)
®
PCM3500
6
Page 7
TYPICAL PERFORMANCE CURVES (Cont.)
Dynamic Range and SNR (dB)
DYNAMIC RANGE AND SIGNAL-TO-NOISE RATIO
vs TEMPERATURE
(T
A
= –25°C to +85°C)
Temperature (°C)
96
94
92
90
88
–25 0 25 50 75 100–50
Dynamic Range
SNR
Dynamic Range and SNR (dB)
DYNAMIC RANGE AND SIGNAL-TO-NOISE RATIO
vs SUPPLY VOLTAGE
(V
CC
= VDD = +2.7V to +3.6V)
Supply Voltage (V)
96
94
92
90
88
2.7 3.0 3.3 3.6 3.92.4
Dynamic Range
SNR
Dynamic Range and SNR (dB)
DYNAMIC RANGE AND SIGNAL-TO-NOISE RATIO
vs SAMPLING FREQUENCY
(f
S
= 8kHz to 26kHz)
f
S
(kHz)
96
94
92
90
88
81624320
BW = 3.4kHz
Dynamic Range
SNR
DAC SECTION
DAC CHARACTERISTICS vs TEMPERATURE, SUPPLY, AND SAMPLING FREQUENCY
TOTAL HARMONIC DISTORTION + NOISE
–88
–90
–92
THD+N at –0dB (dB)
–94
–96
–88
–90
–25 0 25 50 75 100–50
TOTAL HARMONIC DISTORTION + NOISE
vs TEMPERATURE
(T
= –25°C to +85°C)
A
Temperature (°C)
vs SUPPLY VOLTAGE
(V
= VDD = +2.7V to +3.6V)
CC
–92
THD+N at –0dB (dB)
–94
–96
–88
–90
–92
THD+N at –0dB (dB)
–94
–96
2.7 3.0 3.3 3.6 3.92.4
TOTAL HARMONIC DISTORTION + NOISE
Supply Voltage (V)
vs SAMPLING FREQUENCY
(f
= 8kHz to 26kHz)
S
81624320
f
(kHz)
S
BW = 3.4kHz
®
7 PCM3500
Page 8
TYPICAL PERFORMANCE CURVES ADC SECTION
DIGITAL FILTER
0 –20 –40 –60 –80
–100 –120
Amplitude (dB)
–140 –160 –180 –200
0.2
0.0
–0.2
–0.4
Amplitude (dB)
–0.6
–0.8
–1.0
DECIMATION FILTER FREQUENCY RESPONSE
81624320
Normalized Frequency (• f
DECIMATION FILTER
PASSBAND RIPPLE CHARACTERISTICS
0.1 0.2 0.3 0.4 0.50 Normalized Frequency (• f
S
S
Hz)
Hz)
STOPBAND ATTENUATION CHARACTERISTICS
0 –10 –20 –30 –40 –50 –60
Amplitude (dB)
–70 –80 –90
–100
0 –1 –2 –3 –4 –5 –6
Amplitude (dB)
–7 –8 –9
–10
0.45 0.46 0.47 0.48 0.49 0.50 0.51 0.52 0.53 0.54 0.55
DECIMATION FILTER
0.2 0.4 0.6 0.8 1.00 Normalized Frequency (• f
DECIMATION FILTER TRANSITION
BAND CHARACTERISTICS
–4.13dB at 0.5 • f
Normalized Frequency (• f
S
S
Hz)
Hz)
S
0 –10 –20 –30 –40 –50 –60
Amplitude (dB)
–70 –80 –90
–100
HIGH-PASS FILTER FREQUENCY RESPONSE
STOPBAND CHARACTERISTICS
0.1 0.2 0.3 0.4 0.50 Normalized Frequency (• f
®
/1000 Hz)
S
PCM3500
8
0.0 –0.1 –0.2 –0.3 –0.4 –0.5 –0.6
Amplitude (dB)
–0.7 –0.8 –0.9
–10
HIGH-PASS FILTER FREQUENCY RESPONSE
PASSBAND CHARACTERISTICS
12340
Normalized Frequency (• f
/1000 Hz)
S
Page 9
TYPICAL PERFORMANCE CURVES (Cont.)
ANTI-ALIASING FILTER
PASSBAND CHARACTERISTICS
Frequency (Hz)
Amplitude (dB)
0 –0.1 –0.2 –0.3 –0.4 –0.5 –0.6 –0.7 –0.8 –0.9 –1.0
1k100101 10k 100k
TA = +25°C, VCC = VDD = +3.3V, fS = 8kHz, and f
= 1kHz, unless otherwise specified.
SIGNAL
ADC SECTION
ANALOG FILTER
ANTI-ALIASING FILTER
0
–5 –10 –15 –20 –25 –30
Amplitude (dB)
–35 –40 –45 –50
ADC OUTPUT SPECTRA
STOPBAND CHARACTERISTICS
1k100 10k 100k 1M 10M
Frequency (Hz)
0
–20
–40
–60
–80
Amplitude (dB)
–100
–120
–140
ADC OUTPUT SPECTRUM (–0.5dB, N = 8192)
12340
Frequency (kHz)
0
–20
–40
–60
THD+N (dB)
–80
–100
0
–20
–40
–60
–80
Amplitude (dB)
–100
–120
–140
TOTAL HARMONIC DISTORTION + NOISE
THD+N fluctuates with signal level
as harmonics are limited to second
and third components.
–84 –72 –60 –48 –36 –24 –12 0–96
vs SIGNAL NOISE
Signal Level (dB)
9 PCM3500
ADC OUTPUT SPECTRUM (–60dB, N = 8192)
12340
Frequency (kHz)
®
Page 10
TYPICAL PERFORMANCE CURVES (Cont.)
TA = +25°C, VCC = VDD = +3.3V, fS = 8kHz, and f
= 1kHz, unless otherwise specified.
SIGNAL
ADC SECTION
ADC CHARACTERISTICS vs TEMPERATURE, SUPPLY AND SAMPLING FREQUENCY
TOTAL HARMONIC DISTORTION + NOISE
–84
–86
–88
THD+N at –0.5dB (dB)
–90
–92
–84
–86
–88
–25 0 25 50 75 100–50
TOTAL HARMONIC DISTORTION + NOISE
vs TEMPERATURE
(T
= –25°C to +85°C)
A
Temperature (°C)
vs SUPPLY VOLTAGE
= VDD = +2.7V to +3.6V)
(V
CC
DYNAMIC RANGE AND SIGNAL-TO-NOISE RATIO
92
90
88
86
Dynamic Range and SNR (dB)
84
92
90
88
–25 0 25 50 75 100–50
DYNAMIC RANGE AND SIGNAL-TO-NOISE RATIO
vs TEMPERATURE
(T
vs SUPPLY VOLTAGE
= VDD = +2.7V to +3.6V)
(V
CC
= –25°C to +85°C)
A
SNR
Dynamic Range
Temperature (°C)
Dynamic Range
SNR
THD+N at –0.5dB (dB)
–90
–92
–84
–86
–88
THD+N at –0.5dB (dB)
–90
–92
2.7 3.0 3.3 3.6 3.92.4
TOTAL HARMONIC DISTORTION + NOISE
Supply Voltage (V)
vs SAMPLING FREQUENCY
= 8kHz to 26kHz)
(f
S
81624320
(kHz)
f
S
BW = 3.4kHz
86
Dynamic Range and SNR (dB)
84
96
94
92
90
Dynamic Range and SNR (dB)
88
2.7 3.0 3.3 3.6 3.92.4
DYNAMIC RANGE AND SIGNAL-TO-NOISE RATIO
vs SAMPLING FREQUENCY
(f
81624320
Supply Voltage (V)
= 8kHz to 26kHz)
S
SNR
Dynamic Range
f
(kHz)
S
BW = 3.4kHz
®
PCM3500
10
Page 11
I
CC
, I
DD
and I
CC
+ I
DD
(mA)
SUPPLY CURRENT vs SUPPLY VOLTAGE
Supply Voltage (V)
12
10
8
6
4
2
0
2.7 3.0 3.3 3.6 3.92.4
ICC + I
DD
ICC + I
DD
at Power Down
I
CC
I
DD
TYPICAL PERFORMANCE CURVES (Cont.)
TA = +25°C, VCC = VDD = +3.3V, fS = 8kHz, and f
SUPPLY CURRENT vs SUPPLY VOLTAGE AND SAMPLING FREQUENCY
= 1kHz, unless otherwise specified.
SIGNAL
12
10
(mA)
DD
8
+ I
CC
6
and I
DD
4
, I
CC
I
2
0
SUPPLY CURRENT vs SUPPLY VOLTAGE
ICC + I
DD
I
CC
I
DD
ICC + I
at Power Down
DD
2.7 3.0 3.3 3.6 3.92.4 Supply Voltage (V)
®
11 PCM3500
Page 12
SYSTEM CLOCK AND RESET/ POWER DOWN
SYSTEM CLOCK INPUT AND OUTPUT
The PCM3500 requires a system clock for operating the digital filters and delta-sigma data converters.
The system clock may be supplied from an external master clock or generated using the on-chip crystal oscillator cir­cuit. Figure 1 shows the required connections for external and crystal clock operation. The system clock must operate at 512 times the sampling frequency, fS, with sampling frequencies from 7.2kHz to 26kHz. This gives an effective system clock frequency range of 3.6864MHz to 13.312MHz.
Table I shows system clock frequencies for common sam­pling frequencies.
For external clock operation, XTI (pin 17) or SCKIO (pin 15) is driven by a master clock source. If SCKIO is used as the system clock input, then XTI must be connected to ground.
SAMPLING FREQUENCY (kHz) SYSTEM CLOCK FREQUENCY (MHz)
8 4.096
11.025 5.6448 16 8.192
22.05 11.2896 24 12.288
TABLE I. System Clock Frequencies for Common Sam-
pling Frequencies.
For either case, XTO (pin 16) should be left open. The system clock source should be free of noise and exhibit low phase jitter in order to obtain optimal dynamic performance from the PCM3500. Figure 2 shows the system clock timing requirements associated with an external master clock.
For crystal oscillator operation, a crystal is connected be­tween XTI (pin 17) and XTO (pin 16), along with the necessary load capacitors (10pF to 33pF per pin, as shown in Figure 1). A fundamental-mode, parallel resonant crystal is required.
External
Clock
SCKIO
XTI
R
XTO
PCM3500
EXTERNAL CLOCK INPUT-SCKIO
(XTO must be open)
FIGURE 1. System Clock Generation.
External
Clock
SCKIO
XTI
R
XTO
PCM3500
EXTERNAL CLOCK INPUT-XTI
(XTO must be open)
C
1
Crystal
C
2
C1, C2 = 10pF to 33pF
SCKIO
XTI
R
XTO
PCM3500
CRYSTAL RESONATOR
CONNECTION
t
"H"
XTI
or
SCKIO
"L"
t
CLKIL
System Clock Pulse Width HIGH t System Clock Pulse Width LOW t
FIGURE 2. External System Clock Timing Requirements.
®
PCM3500
CLKIH
12
CLKIH
CLKIL
1/512f
S
20ns (min) 20ns (min)
0.7V
0.3V
DD
DD
Page 13
Reset and Power Down
The PCM3500 supports power-on reset, external reset, and power-down operations. Power-on reset is performed by internal circuitry automatically at power up, while the exter­nal reset is initiated using the PDWN input (pin 20).
Power-on reset occurs when power and system clock are initially applied to the PCM3500. The internal reset cir­cuitry requires that the system clock be active at power up, with at least three system clock cycles occurring prior to VDD = 2.2V. When VDD exceeds 2.2V, the power-on reset comparator enables the initialization sequence, which re­quires 1024 system clock periods for completion. During the initialization sequence, the DAC output is forced to AGND, and the ADC output is forced to a high impedance state. After the initialization sequence has completed, the DAC and ADC outputs experience a delay before they output a valid signal or data. Refer to Figures 3 and 5 for power-on reset and post-reset delay timing.
External reset is performed by first setting PDWN = ‘0’ and then setting PDWN = ‘1’. The LOW to HIGH transition on
2.4V
V
2.2V
DD
2.0V
Internal Reset
1024 System Clock Periods
System Clock
PDWN causes the reset initialization sequence to start. During the initialization sequence, the DAC output is forced to AGND, and the ADC output is forced to a high impedance state. After the initialization sequence has completed, the DAC and ADC outputs experience a delay before they output a valid signal or data. Refer to Figures 4 and 5 for external reset and post-reset delay timing.
Power-down mode is enabled by setting PDWN = ‘0’. During power-down mode, minimum current is drawn when the system clock is removed, resulting in 60µA (typical) power supply current. The PDWN input includes an internal pull-down resistor, which places the PCM3500 in power­down mode at power-up if the PDWN pin is left uncon­nected. Ideally, the PDWN input should be driven by active logic in order to control reset and power-down operation. If the PDWN pin is to be unused in the system application, it should be connected to VDD to enable normal operation. By setting PDWN = ‘1’ when exiting power-down mode, the PCM3500 will initiate an external reset as described earlier in this section.
Reset
Reset Removal
FIGURE 3. Power-On Reset Timing.
PDWN
Internal Reset
System Clock
FIGURE 4. External Reset Timing.
Internal Reset
or Power Down
DAC V
OUT
ADC DOUT
Reset
Power Down
GND
PWDN = LOW Pulse Width
t
= 40ns minimum
RST
t
RST
Reset
1024 System Clock Periods
Reset Removal or Power Down OFF
Ready/Operation
(2048/fS)
t
DACDLY1
V
COM
(0.5VCC)
t
(2304/fS)
ADCDLY1
High Impedance
Reset Removal
(1)
NOTE: (1) The HPF transient response (exponentially attenuated signal from ±0.2% DC of FSR with 200ms time constant) appears initially.
FIGURE 5. DAC and ADC Output for Reset and Power Down.
13 PCM3500
®
Page 14
SERIAL INTERFACE
The serial interface of the PCM3500 is a 4-wire synchronous serial port. It includes FS (pin 9), BCK (pin 8), DIN (pin 10) and DOUT (pin 11). FS is the frame synchronization clock, BCK is the serial bit or shift clock, DIN is the serial data input for the DAC, and DOUT is the serial data output for the ADC.
The frame sync, FS, operates at the sampling frequency (fS). The bit clock, BCK, operates at 16fS for normal operation. DIN and DOUT also operate at the bit clock rate. Both FS and BCK must be synchronous with the system clock (guar-
FS
BCK
anteed in Master Mode). Data for DIN is clocked into the serial interface on the rising edge of BCK, while data for DOUT is clocked out of the serial interface on the falling edge of BCK.
Figure 6 shows the serial interface format for the PCM3500. The serial data for DIN and DOUT must be in Binary Two’s Complement, MSB-first format. Figures 7 and 8 show the timing specifications for the serial interface when used in Slave and Master Modes.
DIN
DOUT
15 14 13 12 11 210543 151413 12 11
15 14 13 12 11 210543 151413 12 11
FIGURE 6. Serial Interface Format.
FS
(input)
t
FSSU
BCK
(input)
DIN
(input)
t
DISU
DOUT
(output)
NOTES: Timing measurement reference level is (VIH/VIL)/2. RIsing and falling time is measured from 10% to 90% of IN/OUT signal swing. Load capacitance of DOUT signal is 50pF.
t
FSW
1/f
S
16-Bit/Frame
t
FSHD
t
DIHD
t
MSBMSB LSB LSB
MSBMSB LSB LSB
FSP
t
BCKP
t
BCKH
t
BCKL
t
CKDO
210543
210543
0.5V
DD
0.5V
DD
0.5V
DD
0.5V
DD
SYMBOL DESCRIPTION MIN TYP MAX UNITS
t
BCKP
t
BCKH
t
BCKL
t
FSW
t
FSP
t
FSSU
t
FSHD
t
DISU
t
DIHD
t
CKDO
t
R
t
F
BCK Period 2400 ns BCK Pulse Width HIGH 800 ns BCK Pulse Width LOW 800 ns FS Pulse Width HIGH t FS Period 1/f FS Set Up Time to BCK Rising Edge 60 ns FS Hold Time to BCK Rising Edge 60 ns DIN Set Up Time to BCK Rising Edge 60 ns DIN Hold Time to BCK Rising Edge 60 ns Delay Time BCK Falling Edge to DOUT 0 80 ns Rising Time of All Signals 30 ns Falling Time of All Signals 30 ns
FIGURE 7. Serial Interface Timing for Slave Mode.
®
PCM3500
14
BCKP
– 60 t
BCKPtBCKP
S
+ 60 ns
Page 15
t
FSP
t
FSW
FS
(output)
t
CKFS
BCK
(output)
DIN
(input)
t
DISU
DOUT
(output)
NOTES: Timing measurement reference level is (VIH/VIL)/2. Rising and falling time is measured from 10% to 90% of IN/OUT signal swing. Load capacitance of DOUT, FS, BCK signal is 50pF.
SYMBOL DESCRIPTION MIN TYP MAX UNITS
t
BCKP
t
BCKH
t
BCKL
t
CKFS
t
FSW
t
FSP
t
DISU
t
DIHD
t
CKDO
t
R
t
F
BCK Period 2400 16000 ns BCK Pulse Width HIGH 1200 8000 ns BCK Pulse Width LOW 1200 8000 ns Delay Time BCK Falling Edge to FS – 40 40 ns FS Pulse Width HIGH t FS Period 1/f DIN Set Up Time to BCK Rising Edge 60 ns DIN Hold Time to BCK Rising Edge 60 ns Delay Time BCK Falling Edge to DOUT 0 80 ns Rising Time of All Signals 30 ns Falling Time of All Signals 30 ns
t
DIHD
t
BCKH
BCKP
t
BCKP
t
BCKL
– 60 t
t
CKDO
BCKPtBCKP
S
+ 60 ns
0.5V
0.5V
0.5V
0.5V
DD
DD
DD
DD
FIGURE 8. Serial Interface Timing for Master Mode.
System
Clock
Controller
PCM3500
XTI FS BCK DIN DOUT
M/S
TSC
GND GND
Slave Mode
FIGURE 9. Slave and Master Mode Connections.
MASTER/SLAVE OPERATION
The serial interface supports both Slave and Master Mode operation. The mode is selected by the M/S input (pin 6). Table II shows mode and pin settings corresponding to the M/S input selection. Figure 9 shows connections for Slave and Master mode operation.
SERIAL
M/S (PIN 6) MODE FS (PIN) BCK (PIN 8)
0 Slave Input Input 1 Master Output Output
INTERFACE
TABLE II. Master/Slave Mode Selection.
System
Clock
Controller
PCM3500
XTI FS BCK DIN DOUT
M/S
TSC
V
DD
GND
Master Mode
Slave Mode Operation
In Slave Mode, the FS and BCK pins are inputs to the PCM3500. Both FS and BCK should be derived from the system clock signal (XTI or SCKIO) to ensure proper synchronization. Slave Mode is best suited for applications where the DSP or controller is capable of generating the FS, BCK, and system clocks using an on-chip serial port and/or timing generator.
Master Mode Operation
In Master Mode operation, both FS and BCK are clock outputs generated by the PCM3500 from the system clock input (XTI, SCKIO, or a crystal). In Master Mode, the timing and phase relationships between system clock, FS, and BCK are managed internally to provide optimal synchronization.
15 PCM3500
®
Page 16
SYNCHRONIZATION REQUIREMENTS
The PCM3500 requires that FS and BCK be synchronous with the system clock. Internal circuitry is included to detect a loss of synchronization between FS and the system clock input. If the phase relationship between FS and the system clock varies more than ± 1.5 BCK periods, the PCM3500 will detect a loss of synchronization. Upon detection, the DAC output is forced to 0.5VCC and the DOUT pin is forced to a high impedance state. This occurs within one sampling clock (FS) period of initial detection. Figure 10 shows the loss of synchronization operation and the DAC and ADC output delays associated with it.
TIME SLOT OPERATION
The PCM3500 serial interface supports Time Division Multiplexing (TDM) using the Time Slot Mode. Up to four PCM3500s may be connected on the same 4-wire serial
Synchronization
Lost
interface bus. This is useful for system applications that require multiple modem or voice channels. Figure 11 shows examples of Time Slot Mode connections.
Time Slot Mode defines a 64-bit long frame, composed of four time slots. Each slot is 16 bits long and corresponds to one of four CODECs. The FS pin on the first PCM3500 (CODEC A, Slot 0) is used as the master frame sync, and operates at the sampling frequency, fS. The bit clock, BCK, operates at 64fS. DIN and DOUT of each CODEC also operate at 64fS. Figure 12 shows the operation of the Time Slot Mode.
Time Slot operation is enabled or disabled using the TSC input (pin 7). The state of the TSC pin is updated at power­on reset, or on the rising edge of PWDN input (if using external reset or power-down mode). A forced reset is required when changing from Slave to Master Mode, or visa versa, in real time.
Resynchronization
State of
Synchronization
DAC V
ADC DOUT
NOTE: (1) The HPF transient response (exponentially attenuated signal from ±0.2% DC of FSR with 200ms time constant) appears initially.
Synchronous Asynchronous
within
1/f
Undefined Data
OUT
Normal
Undefined Data
Normal
S
High Impedance
V
COM
(0.5 VCC)
FIGURE 10. Loss of Synchronization Operation and Timing.
Controller
t
DACDLY2
(0.5 VCC)
PCM3500
(CODEC A, Slot 0)
FS BCK
DIN DOUT FSO
Synchronous
(32/fS)
V
COM
t
ADCDLY2
SCKIO
XTI
XTO
M/S
TSC
(32/fS)
Normal
(1)
Normal
V
DD
V
DD
FIGURE 11. Time Slot Mode Connections.
®
PCM3500
To Two PCM3500s
PCM3500
(CODEC B, Slot 1)
FS BCK
DIN DOUT FSO
16
SCKIO
XTI
XTO
M/S
TSC
GND V
DD
Page 17
One Frame = 1/f
, 64 Bits per Frame, 16 Bits per Slot
S
FS
BCK
FS (A)
FSO (A)
FS (B)
FSO (B)
FS (C)
FSO (C)
FS (D)
FSO (D)
DIN
DOUT (A)
DOUT (B)
CODEC A CODEC B
Slot 0, 16 Bits Slot 1, 16 Bits Slot 2, 16 Bits Slot 3, 16 Bits
MSB LSB
CODEC C CODEC D
High Impedance
High Impedance
DOUT (C)
DOUT (D)
FIGURE 12. Time Slot Mode Operation.
High ImpedanceHigh Impedance
High Impedance
17 PCM3500
®
Page 18
Table III shows the TSC pin settings and corresponding mode selections. When Time Slot Mode is enabled, FSO (pin 12) is used as a frame sync output, which is connected to the FS input of the next PCM3500 in the Time Slot sequence. Figures 13 and 14 provide detailed timing for Time Slot Mode operation.
TSC (PIN 7) TIME SLOT MODE
0 Time Slot Mode Disabled, Normal Operation 1 Time Slot Operation Enable
TABLE III. Time Slot Mode Selection.
ADC-TO-DAC LOOP BACK
The PCM3500 includes a Loop-Back Mode, which directly feeds the ADC data to the DAC input. This mode is designed for diagnostic testing and system adjustment. Loop-Back Mode is enabled and disabled using the LOOP input (pin
19). Table IV shows the LOOP pin settings and correspond­ing mode selections. The serial interface continues to oper-
t
FSW
FS
(input)
BCK
(input)
DIN
(input)
DOUT
(output)
FSO
(output)
t
FSSU
t
DISU
High Impedance
t
FSHD
t
DIHD
t
HZDO
ate in Loop-Back Mode, allowing the host to read the ADC data at the DOUT pin.
LOOP (PIN 19) LOOP-BACK MODE
0 Loop-Back Mode Disabled, Normal Operation 1 Loop-Back Mode Enabled
TABLE IV. Loop-Back Mode Selection.
HIGH-PASS FILTER
The PCM3500 includes a digital high-pass filter in the ADC which may be used to remove the DC offset created by the analog front-end (AFE) section. The high-pass filter response is shown in Figure 15. The high-pass filter may be enabled or disabled using the HPFD input (pin 18). Table V shows the HPFD pin settings and corresponding mode selections.
HPFD (PIN 18) HIGH-PASS FILTER MODE
0 High-Pass Filter On 1 High-Pass Filter Off
TABLE V. High-Pass Filter Mode Selection.
t
FSP
0.5V
DD
t
BCKP
0.5V
DD
t
BFSO
t
BCKL
t
CKDO
t
FSOW
t
BCKH
0.5V
DD
High Impedance
0.5V
DD
t
DOHZ
0.5V
DD
NOTES: Timing measurement reference level is (VIH/VIL)/2. Rising and falling time is measured from 10% to 90% of IN/OUT signal swing. Load capacitance of DOUT, and FSO signal is 50pF.
SYMBOL DESCRIPTION MIN TYP MAX UNITS
t
BCKP
t
BCKH
t
BCKL
t
FSW
t
FSP
t
FSSU
t
FSHD
t
DISU
t
DIHD
t
CKDO
t
HZDO
t
DOHZ
t
FSOW
t
BFSO
t
R
t
F
BCK Period 600 ns BCK Pulse Width HIGH 200 ns BCK Pulse Width LOW 200 ns FS Pulse Width HIGH t
BCKP
– 60 t
BCKPtBCKP
FS Period 1/f FS Set Up TIme to BCK Rising Edge 60 ns FS Hold TIme to BCK RIsing Edge 60 ns DIN Set Up Time to BCK Rising Edge 60 ns DIN Hold Time to BCK Rising Edge 60 ns Delay Time BCK Falling Edge to DOUT 0 80 ns Delay Time BCK Falling Edge to DOUT Active 20 ns Delay Time BCK Falling Edge to DOUT Inactive 19.5 ns FSO Pulse Width HIGH t
BCKP
– 60 t
BCKPtBCKP
Delay Time BCK Falling Edge to FSO 0 80 ns Rising Time of All Signals 30 ns Falling Time of All Signals 30 ns
FIGURE 13. Serial Interface Timing for Time Slot Mode Operation (Slave Mode).
®
PCM3500
18
+ 60 ns
S
+ 60 ns
Page 19
t
FSP
t
FSW
FS
(output)
t
BCKP
BCK
(output)
t
BCKL
t
BCKH
DIN
(input)
t
DIHD
DOUT
t
DISU
High Impedance
(output)
t
HZDO
t
CKDO
FSO
(output)
t
BFSO
t
FSOW
NOTES: Timing measurement reference level is (VIH/VIL)/2. Rising and falling time is measured from 10% to 90% of IN/OUT signal swing. Load capacitance of DOUT, FSO, FS, and BCK signal is 50pF.
SYMBOL DESCRIPTION MIN TYP MAX UNITS
t
BCKP
t
BCKH
t
BCKL
t
CKFS
t
FSW
t
FSP
t
DISU
t
DIHD
t
CKDO
t
HZDO
t
DOHZ
t
FSOW
t
BFSO
t
R
t
F
BCK Period 600 4000 ns BCK Pulse Width HIGH 300 2000 ns BCK Pulse Width LOW 300 2000 ns Delay Time BCK Falling Edge to FS –40 40 ns FS Pulse Width HIGH t FS Period 1/f
BCKP
– 60 t
BCKPtBCKP
S
+ 60 ns
DIN Set Up Time to BCK Rising Edge 60 ns DIN Hold Time to BCK Rising Edge 60 ns Delay Time BCK Falling Edge to DOUT 0 80 ns Delay Time BCK Falling Edge to DOUT Active 20 ns Delay Time BCK Falling Edge to DOUT Inactive 19.5 ns FSO Pulse Width HIGH t
BCKP
– 60 t
BCKPtBCKP
+ 60 ns Delay Time BCK Falling Edge to FSO 0 80 ns Rising Time of All Signals 30 ns Falling Time of All Signals 30 ns
0.5V
DD
t
CKFS
0.5V
DD
0.5V
DD
High Impedance
0.5V
DD
t
DOHZ
0.5V
DD
FIGURE 14. Serial Interface Timing for Time Slot Mode Operation (Master Mode).
0 –10 –20 –30 –40 –50 –60
Amplitude (dB)
–70 –80 –90
–100
HIGH-PASS FILTER FREQUENCY RESPONSE
STOPBAND CHARACTERISTICS
0.1 0.2 0.3 0.4 0.50 Normalized Frequency (• f
/1000 Hz)
S
0.0 –0.1 –0.2 –0.3 –0.4 –0.5 –0.6
Amplitude (dB)
–0.7 –0.8 –0.9
–10
HIGH-PASS FILTER FREQUENCY RESPONSE
PASSBAND CHARACTERISTICS
12340
Normalized Frequency (• f
FIGURE 15. High-Pass Filter Response.
19 PCM3500
/1000 Hz)
S
®
Page 20
APPLICATIONS INFORMATION
BASIC CIRCUIT CONNECTIONS
The basic connection diagram for the PCM3500 is shown in Figure 16. Included are the required power supply bypass and reference decoupling capacitors. The DAC output, V the ADC input, VIN, should be AC-coupled to external cir­cuitry.
Reference Pin Connections
The V
voltage is used internally to bias the input and
COM
output amplifier stages of the PCM3500. It is brought out
OUT
, and
unbuffered on pin 1 for decoupling. A 1µF to 10µF alumi­num electrolytic or tantalum capacitor is recommended for decoupling purposes. This capacitor should be located as close as possible to pin 1.
The V
voltage is typically equal to VCC/2, and may be
COM
used to bias external input and output circuitry. However, since the V
pin is not a buffered output, it must drive a
COM
high impedance load to avoid excessive loading. Buffering the V
pin with an external op amp configured as a
COM
voltage follower is recommended when driving multiple bias nodes. Figure 17 shows examples of using V
COM
with
external circuitry.
C
3
+
C
4
+
C
5
+
Serial
Interface
+
C
6
C1, C2: Power supply bypass capacitors. Parallel combination of a 1µF to 10µF aluminum electrolytic capacitor and 0.1µF ceramic capacitor.
, C4, C5: V
C
3
C
, C7: Input/output AC-coupling capacitors. Use a 0.1µF to 10µF aluminum electrolytic capacitor.
6
REF
and V
bypass capacitors. Use a 1µF to 10µF aluminum electrolytic capacitor.
COM
1
V
2
V
3
V
4
V
5
AGND
6
M/S
7
TSC
8
BCK
9
FS
10
DIN
11
DOUT
12
FSO
PCM3500
COM
1
REF
2
REF
IN
Analog Line Interface Circuit
Telecom Line
AGND
V
AGND
PDWN
LOOP
HPFD
XTO
SCKIO
DGND
V
OUT
XTI
V
24
CC
23 22 21 20 19 18 17 16 15 14 13
DD
+
C
1
C
2
+
+3.3V
External Reset
Power-Down Control
External Clock System
+
C
7
FIGURE 16. Basic Connection Diagram.
(a) Biasing an External Active Filter Stage
Non-Polarized
PCM3500
V
OUT
V
COM
FIGURE 17. Using V
1µF
+
4.7µF
to Bias External Circuitry.
®
COM
PCM3500
V
CC
OPA343
20
(b) Using a Buffer to Provide Bias for Multiple or Low Input Impedance Nodes
Use voltage follower
PCM3500
V
COM
+
4.7µF
to buffer V
OPA340
COM
To Bias
Nodes
Page 21
V
1 (pin 2) and V
REF
2 (pin 3) are reference voltages used
REF
by the delta-sigma modulators. They are brought out strictly for decoupling purposes. V
1 and V
REF
2 are not to be
REF
used to bias external circuits. A 1µF to 10µF aluminum electrolytic or tantalum capacitor is recommended for decoupling on each pin. These capacitors should be located as close as possible to pins 2 and 3.
Power Supplies and Grounding
VCC (pin 24) and VDD (pin 13) should be connected directly to the +2.7V to +3.6V analog power supply, as shown in Figure 16. The AGNDs (pins 5, 21, and 23) and DGND (pin
14) should be connected directly to the analog ground. Power supply bypass capacitors should be located as close to the power supply pins as possible in order to ensure a low impedance connection. A combination of a 10µF aluminum electrolytic or tantalum capacitor in parallel with a 0.1µF ceramic capacitor is recommended for both VCC and VDD.
VDD and VCC should not be connected to separate digital and analog power supplies. This can lead to an SCR latch-up condition, which can cause either degraded device perfor­mance or catastrophic failures.
PCB LAYOUT GUIDELINES
The recommended PCB layout technique is shown in Figure
18. The analog and digital section of the board are separated
by a split ground plane, with the PCM3500 positioned entirely over the analog section of the board. The AGNDs (pins 5, 20, and 23) and DGND (pin 14) are connected directly to the analog ground plane. The power supply pins, VCC (pin 13) and VDD (pin 24), are routed directly to the +2.7V to +3.6V analog power supply using wide copper traces (100 mils or wider recommended) or a power plane. Power supply bypass and reference decoupling capacitors are shown located as close as possible to the PCM3500.
The PCM3500 is oriented so that the digital pins are facing the ground plane split. Digital connections should be made as short and direct as possible to limit high frequency radiation and coupling. Series resistors (from 20 to 100Ω) may be put in series with the system clock, FS, BCK, and FSO lines to reduce or eliminate overshoot on clock edges, further reducing radiated emissions. The split ground plane should be connected at one point by a trace, wire, or ferrite bead. Often the board will be designed to have several jumper points for the common ground connection, so that the best performance can be derived through experimenta­tion.
An alternative technique, using a single power supply or battery, is shown in Figure 19. This technique is more suitable for portable applications.
Digital Power
Supply
+3.3V
Host
and
Logic
Digital I/Os
DIGITAL SECTION ANALOG SECTION
Common
Connection
Split Grounds
Analog Power
Supply
+3.3V
V
CCVDD
PCM3500
AGND
DGND
Analog Ground
Digital
Ground
FIGURE 18. Recommended PCB Layout Technique.
Common
Supply
V
Host
and
Logic
Digital I/Os
DIGITAL SECTION ANALOG SECTION
Split Grounds
CC
PCM3500
AGND
Analog
Ground
V
DD
DGND
Ferrite Beads
Digital
Ground
FIGURE 19. PCB Layout Using a Single-Supply or Battery.
21 PCM3500
®
Page 22
OUTPUT FILTER CIRCUITS FOR THE DAC
The PCM3500’s DAC uses delta-sigma conversion tech­niques. It uses oversampling and noise shaping to improve in-band (f = fS/2) signal-to-noise performance at the expense of increased out-of-band noise. The DAC output must be low-pass filtered to attenuate the out-of-band noise to a reasonable level.
The PCM3500 includes a low-pass filter in the on-chip output amplifier circuit. The frequency response for this filter is shown in Figure 20. Although this filter helps to lower the out-of-band noise, it is not adequate for many applications. This is especially true for applications where the sampling frequency is below 16kHz, since the out-of­band noise above fS/2 is in the audio spectrum. An external filter circuit, either passive or active, is required to provide additional attenuation of the out-of-band noise. The low­pass filter order will be dependent upon the out-of-band
noise requirements for a particular system. Generally, a 2nd­order or better low-pass circuit will be required, with the cut-off frequency set to fS/2 or less.
Burr-Brown Application Bulletin AB-034 provides infor­mation for designing both Multiple Feedback and Sallen­Key active filter circuits using software available from Burr­Brown’s web site. Another excellent reference for both passive and active filter design is the “Electronic Filter Design Handbook, Third Edition” by Williams and Taylor, published by McGraw-Hill.
ON-CHIP ANALOG FRONT END FOR THE ADC
The PCM3500 A/D converter includes a fully differential input delta-sigma modulator. In order to simplify connection for single-ended applications, an analog front end (AFE) circuit has been included on the PCM3500 just prior to the modulator. The AFE circuit is shown in Figure 21.
0 –10 –20 –30 –40 –50 –60
Amplitude (dB)
–70 –80 –90
–100
100 1k 10k 100k 1M 10M
STOPBAND FREQUENCY RESPONSE
OUTPUT FILTER
Frequency (Hz)
FIGURE 20. DAC Output Amplifier Filter Response.
1.0µF
V
+
IN
50k
4
0 –1 –2 –3 –4 –5 –6 –7
Amplitude (dB)
–8 –9
–10
PASSBAND FREQUENCY RESPONSE
OUTPUT FILTER
100101 1k 10k 100k
Frequency (Hz)
(+)
V
COM
1
V
+
+
1
REF
2
2
V
REF
3
+
FIGURE 21. On-Chip AFE Circuit for the ADC.
®
PCM3500
Reference
22
(–)
Delta-Sigma
Modulator
Page 23
The AFE circuit consists of a single-ended-to-differential
Host CPU
Controls (ring detect, off hook, etc.)
Modem
Software
PCM3500
CODEC
Data
Access
Arrangement
(DAA)
Data
Tip Ring
converter, with the first stage of the circuit doubling as a low-pass, anti-alias filter. The frequency response for the filter is shown in Figure 22. Since the delta-sigma modulator oversamples the input at 64fS, the anti-alias filter require­ments are relaxed, with only a single-pole filter being re­quired. If an application requires further band limiting of the input signal, a simple RC filter at the VIN input (pin 4) can be used, as shown in Figure 23.
SOFTWARE MODEM APPLICATIONS
The PCM3500 was designed to meet the requirements for software-based analog modems, supporting up to 56kbps In a software modem application, the PCM3500 is paired with a Data Access Arrangement (DAA) and a host CPU to
(1)
provide the complete modem function. Figure 24 shows a simplified block diagram of a software modem using the PCM3500.
The DAA provides the interface between the CODEC and two-wire telephone line. The DAA provides numerous functions, including two-to-four wire conversion, modem­side to line-side isolation, ring detection, hook switch con­trol, line current compensation, and overvoltage protection.
The host CPU provides the data pump and supervisory functions for the software modem application. The host executes modem software code, which includes the neces­sary routines for transmit and receive functions, error detec­tion and correction, echo cancellation, and CODEC/DAA control and supervision.
NOTE: (1) Data transmission is limited to 53kbps over standard telephone
.
lines. Actual transmission rates vary depending upon the quality of the lines and switching equipment for a given connection.
ANTI-ALIASING FILTER
0
–5 –10 –15 –20 –25 –30 –35
Amplitude (dB)
–40 –45 –50
STOPBAND CHARACTERISTICS
1k100 10k 100k 1M 10M
Frequency (Hz)
FIGURE 22. Anti-Alias Filter Frequency Response.
PCM3500
=
1
2π RC
R
+
V
IN
C
Analog
Input
f
–3dB
0 –0.1 –0.2 –0.3 –0.4 –0.5 –0.6 –0.7
Amplitude (dB)
–0.8 –0.9 –1.0
ANTI-ALIASING FILTER
PASSBAND CHARACTERISTICS
1k100101 10k 100k
Frequency (Hz)
FIGURE 23. Optional External Low-Pass Filter for the
ADC.
FIGURE 24. Software Modem Block Diagram.
®
23 PCM3500
Page 24
HLDR
LEDCT
HLDCAP
HKP
HKN
LINPWR
HLFWV
LR1
LR2
END
CEN
C1A
V
DD
V
SS
SRVCT
SRVAN
HIN
VFCAP
ONHKMC
TXAN
TXCT
C2
BIASEN
C1B
123456789
101112
2423222120191817161514
13
U1
DL207
IL388
876
5
123
4
R
5
150k
R
6
150k
C
1
15nF
C
1
15nF
C
3
150nF
C
4
27nF
R
2
10M
D2 Bridge
R
1
16.5
1%
R
9
3.9
R
4
356k
Q
2
TN2540
SOT89
Q
1
MMBT6520
SOT23
R
3
10M
C
23
0.33µF
250V
R
20
15k
C
15
1nF
L
2
LI0805D121R
P3100BA70
RV
1
L
1
LI0805D121R
D
1
CMPZDA18V
C
14
1nF
C
8
15nF
C
2
150nF
C
9
470pF
C
7
68nF
C
10
470pF
IL388
U4
U3
123
4
876
5
RING
TIP
F1
F1250T
R
19
2.4k 1W, 2010
R
16
6.8M
R
18
12
Q
3
FZT605
Q
4
BC817-40
C
22
22µF, 35V
R
14
0
+
+
C1B
V
REF
C2
RXCT
RXAN
ONHKML
ONHKM
HIN
SRVAN
SRVCT
TXMP
V
DD
C1A
LSTAT
RNG
OFFHKL
OFFHK
RXOUT
ACREF
TXBIAS
AUDIN
AUDOUT
V
SS
LEDCT
123456789
101112
2423222120191817161514
13
U2
DM207
V
INVOUTVCOM
4
22
1
U5
PCM3500
R
10
10k
R
7
25.5k
R
13
27k
C
17
4.7nF
R
14
22k
RINGD
+3.3V to 7V
OH–
R
8
121k
C
5
15nF
C
18
1µF
C
20
10µF
ISOLATION BARRIERISOLATION BARRIER
NOTES: All resistors are 0.1W, 5%, 0805, unless otherwise noted.
All capacitors values are 10%, unless otherwise noted.
Optional components.
®
PCM3500
FIGURE 25. Modem AFE Application Circuit.
24
Page 25
Software Modem AFE Application Circuit
Figure 25 shows an applications circuit which utilizes the PCM3500 and the DAA2000 from Infineon Technologies (Siemens) to implement a complete modem AFE. The DAA2000 provides modem-side (DM207) and line-side (DL207) interfaces, with optical isolation separating the functions. The PCM3500 is connected to the modem-side of the DAA2000. The PCM3500’s serial interface and hard­ware mode controls are connected to the host CPU.
THEORY OF OPERATION
ADC SECTION
The PCM3500 A/D converter consists of two reference circuits, a mono single-to-differential converter, a fully dif­ferential 5th-order delta-sigma modulator, a decimation fil­ter (including digital high pass), and a serial interface circuit. The block diagram on the front page of this data sheet illustrates the architecture of the ADC section, Figure 21 shows the single-to-differential converter, and Figure 26 illustrates the architecture of the 5th-order delta-sigma modu­lator and transfer functions.
An internal reference circuit with three external capacitors provides all reference voltages which are required by the ADC, which defines the full-scale range for the converter. The internal single-to-differential voltage converter saves the design, space and extra parts needed for external cir­cuitry required by many delta-sigma converters. The internal full-differential signal processing architecture provides a
wide dynamic range and excellent power supply rejection performance. The input signal is sampled at a 64x oversampling rate, eliminating the need for a sample-and­hold circuit, and simplifying anti-alias filtering require­ments. The 5th-order delta-sigma noise shaper consists of five integrators which use a switched-capacitor topology, a comparator, and a feedback loop consisting of a one-bit DAC. The delta-sigma modulator shapes the quantization noise, shifting it out of the audio band in the frequency domain. The high order of the modulator enables it to randomize the modulator outputs, reducing idle tone levels.
The 64fS one-bit data stream from the modulator is con­verted to 1fS, 16-bit data words by the decimation filter, which also acts as a low-pass filter to remove the shaped quantization noise. The DC components can be removed by a high-pass filter function contained within the decimation filter.
DAC SECTION
The delta-sigma DAC section of PCM3500 is based on a 5­level amplitude quantizer and a 3rd-order noise shaper. This section converts the oversampled input data to 5-level delta­sigma format. A block diagram of the 5-level delta-sigma modulator is shown in Figure 27. This 5-level delta-sigma modulator has the advantage of stability and clock jitter sensitivity over the typical one-bit (2 level) delta-sigma modulator. The combined oversampling rate of the delta­sigma modulator and the internal 8x interpolation filter is 64fS for a 512fS system clock. The theoretical quantization noise performance of the 5-level delta-sigma modulator is
shown in Figure 28.
Analog In
X(z)
+ –
1st SW-CAP
Integrator
+
1-Bit DAC
2nd SW-CAP
Integrator
3rd SW-CAP
Integrator
+
+
Y(z) = STF(z) • X(z) + NTF(z) • Qn(z) Signal Transfer Function Noise Transfer Function
FIGURE 26. Simplified 5th-Order Delta-Sigma Modulator.
H(z)
+
+
+
4th SW-CAP
Integrator
+
STF(z) = H(z)/[1 + H(z)] NTF(z) = 1/[1 + H(z)]
5th SW-CAP
Integrator
+
25 PCM3500
+
+
Comparator
Qn(z)
Digital Out
Y(z)
®
Page 26
In
18-Bit
+
+
8f
S
–1
Z
+
+
–1
Z
+
++
+
+
–1
Z
Out
64f
S
FIGURE 27. 5-Level Delta-Sigma Modulator Block Digram.
0 –10 –20 –30 –40 –50 –60 –70 –80 –90
Gain (–dB)
–100 –110 –120 –130 –140 –150
0 5 10 15 20 25 30
3rd-ORDER ∆Σ MODULATOR
Frequency (kHz)
5-level Quantizer
4 3 2 1 0
FIGURE 28. Quantization Noise Spectrum.
®
PCM3500
26
Page 27
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
Customers are responsible for their applications using TI components. In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 2000, Texas Instruments Incorporated
Loading...