The OPT101 is a monolithic photodiode with on-chip
transimpedance amplifier. Output voltage increases
linearly with light intensity. The amplifier is designed
for single or dual power supply operation, making it
ideal for battery operated equipment.
The integrated combination of photodiode and
transimpedance amplifier on a single chip eliminates
the problems commonly encountered in discrete designs such as leakage current errors, noise pick-up and
gain peaking due to stray capacitance. The 0.09 x 0.09
inch photodiode is operated in the photoconductive
mode for excellent linearity and low dark current.
The OPT101 operates from +2.7V to +36V supplies
and quiescent current is only 120µA. It is available in
clear plastic 8-pin DIP, 5-pin SIP and J-formed DIP for
surface mounting. Temperature range is 0°C to 70°C.
0.7
Ultraviolet
0.6
0.5
0.4
0.3
0.2
Voltage Output (V/µW)
0.1
0
200 300 400 500 600 700 800 900 1000 1100
SPECTRAL RESPONSIVITY
Blue
Green
Yellow
Using Internal
1MΩ Resistor
Wavelength (nm)
Red
Infrared
0.7
0.6
0.5
0.4
0.3
0.2
Photodiode Responsivity (A/W)
0.1
0
(SIP)
International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111
NOTES: (1) Deviation in percent of full scale from best-fit straight line. (2) Referred to Output. Includes all error sources.
(1)
FS Output = 24V±0.01% of FS
2
(2.29 x 2.29mm)5.2mm
(2)
= +2.7V to +36V10100µV/V
= 0.1Hz to 20kHzVS = +15V, V
B
S
= –15V300µVrms
PIN3
W±0.5%
vs Temperature±50ppm/°C
= 10Vp-p14kHz
OUT
= 10V Step28µs
OUT
= 10V Step160µs
0.1%80µs
OUT
1%70µs
) – 1.3(VS) – 1.15V
S
= 36V15mA
S
= 0V120240µA
PIN3
R
= ∞, V
L
θ
JA
= 10V220µA
OUT
100°C/W
2
PHOTODIODE SPECIFICATIONS
TA = +25°C, VS = +2.7V to +36V unless otherwise noted.
Photodiode of OPT101P
PARAMETERCONDITIONSMINTYPMAXUNITS
Photodiode Area(0.090 x 0.090in)0.008in
(2.29 x 2.29mm)5.2mm
Current Responsivity650nm0.45A/W
650nm865µA/W/cm
Dark CurrentV
vs Temperaturedoubles every 7°C
= 7.5mV2.5pA
DIODE
Capacitance1200pF
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
®
OPT101
2
2
2
2
OP AMP SPECIFICATIONS
At TA = +25°C, VS = +2.7V to +36V, λ = 650nm, internal 1MΩ feedback resistor, and RL = 10kΩ, unless otherwise noted.
OPT101 Op Amp
PARAMETERCONDITIONSMINTYPMAXUNITS
INPUT
Offset Voltage±0.5mV
vs Temperature±2.5µV/°C
vs Power Supply10µV/V
Input Bias Current(–) Input165pA
vs Temperature(–) Input1pA/°C
Input Impedance
Differential400 || 5MΩ || pF
Common-Mode250 || 35GΩ || pF
Common-Mode Input Voltage RangeLinear Operation0 to [(V
Common-Mode Rejection90dB
OPEN-LOOP GAIN
Open-loop Voltage Gain90dB
FREQUENCY RESPONSE
Gain-Bandwidth Product
(2)
Slew Rate1V/µs
Settling Time 1%5.8µs
0.1%7.7µs
0.05%8.0µs
OUTPUT
Voltage Output, High(V
Short-Circuit CurrentV
= +36V15mA
S
– 1.3(VS) – 1.15V
S)
POWER SUPPLY
Operating Voltage Range+2.7+36V
Quiescent CurrentDark, V
R
= 0V120240µA
PIN3
∞, V
= 10V220µA
L
OUT
NOTES: (1) Op amp specifications provided for information and comparison only. (2) Stable gains ≥ 10V/V.
Operating Temperature..................................................... –25°C to +85°C
Storage Temperature........................................................ –25°C to +85°C
Junction Temperature ...................................................................... +85°C
Lead Temperature (soldering, 10s)................................................ +300°C
(Vapor-Phase Soldering Not Recommended)
“Common”
or pin 3) ................................0 to +36V
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and
installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
MOISTURE SENSITIVITY
AND SOLDERING
Clear plastic does not contain the structural-enhancing fillers
used in black plastic molding compound. As a result, clear
plastic is more sensitive to environmental stress than black
plastic. This can cause difficulties if devices have been stored
in high humidity prior to soldering. The rapid heating during
soldering can stress wire bonds and cause failures. Prior to
soldering, it is recommended that plastic devices be baked-out
at +85°C for 24 hours.
The fire-retardant fillers used in black plastic are not compatible with clear molding compound. The OPT101 plastic
packages cannot meet flammability test, UL-94.
PACKAGE INFORMATION
PRODUCTCOLORPACKAGENUMBER
OPT101PClear8-Pin Plastic DIP006-1
OPT101P-JClear 8-Lead Surface Mount
OPT101WClear5-Pin Plastic SIP321
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book. (2) 8-pin DIP with J-formed
leads for surface mounting.
PACKAGE DRAWING
(2)
(1)
006-4
®
OPT101
4
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