®
OPA124
3
CONNECTION DIAGRAMS
Top View DIP
1
2
3
4
8
7
6
5
Substrate
+V
S
Output
Offset Trim
Offset Trim
–In
+In
–V
S
Top View SOIC
1
2
3
4
8
7
6
5
Substrate
+V
S
Output
NC
NC
–In
+In
–V
S
NC = No Connect
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
PACKAGE/ORDERING INFORMATION
BIAS OFFSET
PACKAGE TEMPERATURE CURRENT DRIFT
PRODUCT PACKAGE DRAWING NUMBER
(1)
RANGE pA, max µV/° C, max
OPA124U 8-Lead SOIC 182 –25°C to +85°C 5 7.5
OPA124P 8-Pin Plastic DIP 006 –25°C to +85°C 5 7.5
OPA124UA 8-Lead SOIC 182 –25°C to +85°C2 4
OPA124PA 8-Pin Plastic DIP 006 –25°C to +85°C2 4
OPA124PB 8-Pin Plastic DIP 006 –25°C to +85°C1 2
NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book.
ABSOLUTE MAXIMUM RATINGS
(1)
Supply ........................................................................................... ±18VDC
Internal Power Dissipation
(2)
......................................................... 750mW
Differential Input Voltage
(3)
..........................................................±36VDC
Input Voltage Range
(3)
.................................................................±18VDC
Storage Temperature Range .......................................... –65°C to +150°C
Operating Temperature Range ....................................... –40°C to +125°C
Lead Temperature (soldering, 10s)................................................ +300°C
Output Short Circuit Duration
(4)
............................................... Continuous
Junction Temperature .................................................................... +175°C
NOTES: (1) Stresses above these ratings may cause permanent damage.
(2) Packages must be derated based on
θ
JA
= 90°C/W for PDIP and 100°C/W
for SOIC. (3) For supply voltages less than ±18VDC, the absolute maximum
input voltage is equal to +18V > V
IN
> –VCC – 6V. See Figure 2. (4) Short circuit
may be to power supply common only. Rating applies to +25°C ambient.
Observe dissipation limit and T
J
.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.