Burr-Brown MPC100 User Manual

MPC100
MPC100
查询MPC100供应商
®
Wide Bandwidth
4 x 1 VIDEO MULTIPLEXER
FEATURES
BANDWIDTH: 250MHz (1.4Vp-p)
LOW INTERCHANNEL CROSSTALK:
60dB (30MHz, DIP); 70dB (30MHz, SO)
LOW SWITCHING TRANSIENTS:
+2.5/–1.2mV
LOW DIFFERENTIAL GAIN/PHASE
ERRORS: 0.05%, 0.01
LOW QUIESCENT CURRENT:
One Channel Selected: No Channel Selected:
APPLICATIONS
VIDEO ROUTING AND MULTIPLEXING
(CROSSPOINTS)
RADAR SYSTEMS
DATA ACQUISITION
INFORMATION TERMINALS
SATELLITE OR RADIO LINK IF ROUTING
°
±4.6mA
±230µA
MPC100
The MPC100 consists of four identical monolithic inte­grated open-loop buffer amplifiers, which are con­nected internally at the output. The unidirectional trans­mission path consists of bipolar complementary buffers, which offer extremely high output-to-input isolation. The MPC100 multiplexer enables one of the four input channels to connect to the output. The output of the multiplexer is in a high-impedance state when no chan­nel is selected. When one channel is selected with a digital “1” at the corresponding SEL-input, the compo­nent acts as a buffer with high input impedance and low output impedance.
The wide bandwidth of over 250MHz at 1.4Vp-p signal level, high linearity and low distortion, and low input voltage noise of 4nV/Hz make this crosspoint switch suitable for RF and video applications. All performance is specified with ±5V supply voltage, which reduces power consumption in comparison with ±15V designs. The multiplexer is available in space­saving SO-14 and DIP packages. Both are designed and specified for operation over the industrial tem­perature range (–40°C to +85°C.)
IN
1
DB1
DESCRIPTION
The MPC100 is a very wide bandwidth 4-to-1 channel video signal multiplexer which can be used in a wide
IN
2
IN
3
DB2
DB3
V
OUT
variety of applications. MPC100 is designed for wide-bandwidth systems,
4
DB4
IN
including high-definition television and broadcast
SEL
SEL
SEL
equipment. Although it is primarily used to route video signals, the harmonic and dynamic attributes of the MPC100 make it appropriate for other analog
TRUTH TABLE
SEL
signal routing applications such as radar, communica­tions, computer graphics, and data acquisition sys­tems.
International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111
Internet: http://www.burr-brown.com/ • FAXLine: (800) 548-6133 (US/Canada Only) • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
©
1991 Burr-Brown Corporation PDS-1133F Printed in U.S.A. March, 1995
SEL
SEL
1
0 0 0 0 HI-Z 1000IN 0100IN 0010IN 0001IN
2
1
SEL
2
4
3
SEL
3
V
4
OUT
1 2 3 4
SPECIFICATIONS
At VCC = ±5V, RL = 10k, R
PARAMETER CONDITIONS MIN TYP MAX UNITS DC CHARACTERISTICS
INPUT OFFSET VOLTAGE R
Initial +10 ±30 mV vs Temperature ±30 µV/°C vs Supply (Tracking) V vs Supply (Non-tracking) V vs Supply (Non-tracking) V Initial Matching Between the Four Channels ±3mV
INPUT BIAS CURRENT
Initial +4 ±10 µA vs Temperature 20 nA/°C vs Supply (Tracking) V vs Supply (Non-tracking) V vs Supply (Non-tracking) V
INPUT IMPEDANCE
Resistance Channel On 0.88 M Capacitance Channel On 1.0 pF Capacitance Channel Off 1.0 pF
INPUT NOISE
Voltage Noise Density f Signal-to-Noise Ratio S/N = 0.7/V
INPUT VOLTAGE RANGE Gain Error 10% ±4.2 V TRANSFER CHARACTERISTICS Voltage Gain
CHANNEL SELECTION INPUTS
Logic 1 Voltage +2.0 V Logic 0 Voltage 0 +0.8 V Logic 1 Current V Logic 0 Current V
SWITCHING CHARACTERISTICS V SEL to Channel ON Time 90% Point of V SEL to Channel OFF Time 10% Point of V Switching Transient, Positive Measured While Switching +2.5 mV Switching Transient, Negative Between Two Grounded Channels –1.2 mV
OUTPUT
Voltage V Resistance One Channel Selected 11 Resistance No Channel Selected 900 M Capacitance No Channel Selected 1.5 pF
POWER SUPPLY
Rated Voltage ±5V Derated Performance ±4.5 ±5.5 V Quiescent Current One Channel Selected ±4.6 ±5mA
TEMPERATURE RANGE
Operating, AP, AU –40 +85 °C Storage, AP, AU –40 +125 °C Thermal Resistance,
θ
AP, AU 90 °C/W
= 50, and TA = +25°C, unless otherwise noted.
SOURCE
= 0, R
IN
= ±4.5V to ±5.5V –40 –80 dB
CC
= +4.5V to +5.5V –50 dB
CC
= –4.5V to –5.5V –50 dB
CC
= ±4.5V to ±5.5V ±380 nA/V
CC
= +4.5V to +5.5V +1.0 µA/V
CC
= –4.5V to –5.5V –11.0 µA/V
CC
= 20kHz to 10MHz 4.0 nV/Hz
B
= 1k, VIN = ±2V 0.982 V/V
R
L
R
= 10k, VIN = ±2.8V 0.98 0.992 V/V
L
SEL SEL
= –0.3V to +0.7V, f = 5MHz
I
= ±3V, RL = 5kΩ±2.8 ±2.98 V
IN
No Channel Selected ±230 ±350 µA
JA
MPC100AP, AU
= 0
SOURCE
5MHz 98 dB
N
CC
= 5.0V 100 150 µA = 0.8V 0.002 5 µA
= 1Vp-p 0.25 µs
O
= 1Vp-p 0.25 µs
O
V
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.
®
MPC100
2
SPECIFICATIONS
At VCC = ±5V, RL = 10k, R
PARAMETER CONDITIONS MIN TYP MAX UNITS AC CHARACTERISTICS FREQUENCY DOMAIN LARGE SIGNAL BANDWIDTH (–3dB) V
SMALL SIGNAL BANDWIDTH V GROUP DELAY TIME 450 ps DIFFERENTIAL GAIN f = 4.43MHz, V
DIFFERENTIAL PHASE f = 4.43MHz, V
GAIN FLATNESS PEAKING V
HARMONIC DISTORTION f = 30MHz, V
Second Harmonic –53 dBc Third Harmonic –67 dBc
CROSSTALK V MPC100AP All Hostile f = 5MHz, –82 dB
Off Isolation f = 5MHz, –70 dB
MPC100AU All Hostile f = 5MHz, –78 dB
Off Isolation f = 5MHz, –75 dB
TIME DOMAIN RISE TIME V
SLEW RATE V
= 50, and TA = +25°C, unless otherwise noted.
SOURCE
= 5.0Vp-p, C
O
V
= 2.8Vp-p, C
O
V
= 1.4Vp-p, C
O
= 0.2Vp-p, C
O
IN
VDC = 0 to 0.7V 0.05 % VDC = 0 to 1.4V 0.06 %
IN
VDC = 0 to 0.7V 0.01 Degrees VDC = 0 to 1.4V 0.02 Degrees
= 0.2Vp-p, DC to 30MHz 0.04 dB
O
V
= 0.2Vp-p, DC to 100MHz 0.05 dB
O
= 1.4Vp-p, RL = 1k
O
= 1.4Vp-p, Figures 4 and 8
I
f = 30MHz, –60 dB
f = 30MHz, –71 dB
f = 30MHz, –70 dB
f = 30MHz –76 dB
= 1.4Vp-p, Step 10% to 90%
O
C
= 1pF, R
OUT
OUT
= 2Vp-p
O
C
= 1pF 650 V/µs
OUT
C
= 22pF 460 V/µs
OUT
C
= 47pF 320 V/µs
OUT
MPC100AP, AU
= 1pF 70 MHz
OUT
= 1pF 140 MHz
OUT
= 1pF 250 MHz
OUT
= 1pF 450 MHz
OUT
= 0.3Vp-p
= 0.3Vp-p
= 22 3.3 ns
®
3
MPC100
CONNECTION DIAGRAM
Top View DIP/SO-14
DB1
IN
GND
IN
GND
IN
GND
IN
1
1
2
DB2
3
2
4
DB3
5
3
6
DB4
7
4
MPC100
14
SEL
1
SEL
13
2
–V
12
CC
V
11
OUT
+V
10
CC
SEL
9
3
SEL
8
4
ABSOLUTE MAXIMUM RATINGS
Power Supply Voltage (±VCC) ..............................................................±6V
Analog Input Voltage (IN
Logic Input Voltage ................................................... –0.6V to +V
Operating Temperature..................................................... –40°C to +85°C
Storage Temperature...................................................... –40°C to +125°C
Output Current .................................................................................. ±6mA
Junction Temperature .................................................................... +175°C
Lead Temperature (soldering, 10s)................................................ +300°C
Digital Input Voltages (SEL
NOTE: (1) Inputs are internally diode-clamped to ±V
through IN4)
1
through SEL4)
1
(1)
................................±VCC, ±0.7V
CC
(1)
........... –0.5V to +VCC +0.7V
.
CC
+0.6V
FUNCTIONAL DESCRIPTION
IN1-IN GND Analog input shielding grounds, connect to system ground SEL
1
V
OUT
–V
CC
+V
CC
Four analog input channels
4
- SEL4Channel selection inputs Analog output; tracks selected channel Negative supply voltage; typical –5VDC Positive supply voltage; typical +5VDC
ELECTROSTATIC DISCHARGE SENSITIVITY
Electrostatic discharge can cause damage ranging from per­formance degradation to complete device failure. Burr-Brown Corporation recommends that all integrated circuits be handled and stored using appropriate ESD protection methods.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet published speci­fications.
PACKAGE/ORDERING INFORMATION
PRODUCT RANGE PACKAGE NUMBER
TEMPERATURE DRAWING
MPC100AP –40°C to +85°C 14-Pin Plastic DIP 010 MPC100AU –40°C to +85°C SO-14 Surface Mount 235
NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book.
PACKAGE
(1)
®
MPC100
4
TYPICAL PERFORMANCE CURVES
–40 –20 0 20 60 80 100
Temperature (°C)
–5
5 4 3 2 1
0 –1 –2 –3 –4
Bias Current (µA)
INPUT BIAS CURRENT vs TEMPERATURE
40
At V
= ±5V, R
CC
LOAD
= 10k, R
= 50, and TA = +25°C, unless otherwise noted.
SOURCE
5 4 3 2 1 0
–1
Voltage (mV)
–2 –3 –4
–5
–40 –20 0 20 60 80 100
1.0M
100k
10k
OFFSET VOLTAGE vs TEMPERATURE
40
Temperature (°C)
INPUT IMPEDANCE vs FREQUENCY
100
OUTPUT IMPEDANCE vs FREQUENCY
30
10
Input Impedance ()
1k
100
10k 100k 1M 10M 100M 1G
TOTAL QUIESCENT CURRENT vs TEMPERATURE
9 8
One Channel Selected
7 6 5 4 3
Supply Current (mA)
2 1
0
–40 –20 0 20 60 80 100
Frequency (Hz)
40
Temperature (°C)
3
Output Impedance ()
1
10k 100k 1M 10M 100M 1G
Frequency (Hz)
TOTAL QUIESCENT CURRENT vs TEMPERATURE
300
No Channel Selected
250
200
150
100
Supply Current (µA)
50
0
–40 –20 0 20 60 80 100
Temperature (°C)
5
40
®
MPC100
TYPICAL PERFORMANCE CURVES (CONT)
(µs)
At V
= ±5V, R
CC
LOAD
= 10k, R
= 50, and TA = +25°C, unless otherwise noted.
SOURCE
5 4 3 2 1
0 –1 –2
Output Voltage (V)
–3 –4
–5
5–4–3–2–1012345
Output Voltage (V)
TRANSFER FUNCTION
Input Voltage (V)
SWITCHING ENVELOPE (Video Signal)
Time
+0.7V
0V
–0.3V
100
10
Voltage Noise (nV/ Hz)
0.1
12 10
Output Voltage (mV)
–2 –4
INPUT VOLTAGE NOISE SPECTRAL DENSITY
1
100 1k 100k 1M 10M 100M
SWITCHING TRANSIENTS (Channel To Channel)
SEL1
8 6
SEL2
4 2 0
0 20 40 60 80 100 120 140 160 180 200
10k
Frequency (Hz)
Without bandwidth
limiting lowpass filter.
Time (ns)
5V
5V
SWITCHING TRANSIENTS (Channel To Channel)
SEL1
SEL2
Output Voltage (mV)
–4
0 20 40 60 80 100 120 140 160 180 200
®
36MHz Low pass filter acc.
Eureka Rec. EU95-PG03
in the signal path.
Time (ns)
MPC100
5V
5V
SMALL SIGNAL PULSE RESPONSE
0 —
Output Voltage (40mV/Div)
= 1pF, t
OUT
(Generator) V
Time (ns)
= t
RISE
= 0.2Vp-p
I
FALL
= 2ns
C
6
TYPICAL PERFORMANCE CURVES (CONT)
At V
= ±5VDC, R
CC
LOAD
= 10k, R
= 50, and TA = +25°C, unless otherwise noted.
SOURCE
SMALL SIGNAL PULSE RESPONSE
0 —
Output Voltage (40mV/Div)
C
= 47pF, t
OUT
(Generator) V
LARGE SIGNAL PULSE RESPONSE
0 —
Output Voltage (1V/Div)
= 47pF, t
C
OUT
(Generator) V
Time (ns)
RISE
I
Time (ns)
= t
RISE
= t
FALL
= 0.2Vp-p
= 5ns
FALL
= 5Vp-p
I
= 2ns
LARGE SIGNAL PULSE RESPONSE
0 —
Output Voltage (1V/Div)
Time (ns)
= 1pF, t
C
OUT
(Generator) V
RISE
= t
FALL
= 5Vp-p
I
= 5ns
GROUP DELAY TIME vs FREQUENCY
2.5 2
1.5 1
0.5 0
–0.5
Delay Time (ns)
V
–1
–1.5
–2
–2.5
1M 10M 100M 500M
150
I
Group Delay Time
R
I
DUT
R
OUT
50
V
OUT
300mV
Out
=
PO
Frequency (Hz)
20 15 10
5 0
–5
–10
Gain (dB)
–15 –20 –25
dB
BANDWIDTH vs C
R
C
OUT
WITH RECOMMENDED R
OUT
f
OUT
–3dB
OUT
1p 0500MHz
10p 22340MHz
250MHz
15
22p
215MHz
12
33p
130MHz
10
47p
10pF 22pF
33pF
47pF
1M 10M 100M 1G
Frequency (Hz)
1pF
0.5
GAIN FLATNESS
0.4
0.3
0.2
0.1
0.2Vp-p
0
–0.1
Output (dB)
–0.2
R
= 150, RO1 = 1k
C
OUT
IN
= 22pF, R
OUT
= 15
–0.3 –0.4
–0.5
300k
1M 10M 100M 1G
Frequency (Hz)
®
7
MPC100
TYPICAL PERFORMANCE CURVES (CONT)
At V
= ±5V, R
CC
LOAD
= 10k, R
= 50, and TA = +25°C, unless otherwise noted.
SOURCE
20 15 10
5 0
–5
–10
Output (dBm)
–15 –20
C
–25
dB
20 15 10
5 0
–5
–10
Output (dBm)
–15 –20
C
–25
dB
300k
BANDWIDTH vs OUTPUT VOLTAGE
5Vp-p
2.8Vp-p
1.4Vp-p
0.6Vp-p
0.2Vp-p
OUT
= 1pF, R
OUT
= 0
RIN = 150
1M 10M 100M 1G300k
Frequency (Hz)
BANDWIDTH MATCHING (DB1...DB4)
2.8Vp-p
= 22pF, R
OUT
OUT
= 15
1M 10M 100M 1G
Frequency (Hz)
BANDWIDTH vs R
LOAD
20 15 10
5 0
–5
–10
Output (dBm)
–15 –20
C
–25
= 22pF, R
OUT
RL = 500 = 1k = 10k
= 15Ω, VO = 2.8Vp-p
OUT
dB
1M
300k 10M 100M 1G
Frequency (Hz)
30MHz HARMONIC DISTORTION
10dB/Div
Harmonic Distortion (dB)
Frequency (Hz)
V
= 2.8Vp-p, RL = 1k, C
OUT
OUT
= 1pF
®
MPC100
30MHz HARMONIC DISTORTION
10dB/Div
Harmonic Distortion (dB)
V
= 2.8Vp-p, RL = 10k, C
OUT
Frequency (Hz)
8
OUT
= 1pF
APPLICATIONS INFORMATION
The MPC100 operates from ±5V power supplies (±6V maximum). Do not attempt to operate with larger power supply voltages or permanent damage may occur. The buffer outputs are not current-limited or protected. If the output is shorted to ground, currents up to 18mA could flow. Momen­tary shorts to ground (a few seconds) should be avoided, but are unlikely to cause permanent damage.
INPUT PROTECTION
All pins on the MPC100 are internally protected from ESD by means of a pair of back-to-back reverse-biased diodes to either power supply as shown in Figure 1. These diodes will begin to conduct when the input voltage exceeds either power supply by about 0.7V. This situation can occur with loss of the amplifier’s power supplies while a signal source is still present. The diodes can typically withstand a continu­ous current of 30mA without destruction. To insure long term reliability, however, diode current should be externally limited to 10mA or less whenever possible.
The internal protection diodes are designed to withstand
2.5kV (using Human Body Model) and will provide ad­equate ESD protection for most normal handling proce­dures. However, static damage can cause subtle changes in amplifier input characteristics without necessarily destroy­ing the device. In precision buffer amplifiers, this may cause a noticeable degradation of offset voltage and drift. There­fore, static protection is strongly recommended when han­dling the MPC100.
Static damage has been well recognized for MOSFET de­vices, but any semiconductor device deserves protection from this potentially damaging source. The MPC100 incor­porates on-chip ESD protection diodes as shown in Figure 1. This eliminates the need for the user to add external protec­tion diodes, performance.
+V
–V
ESD Protection diodes
CC
internally connected to all pins.
Internal CircuitryExternal Pin
CC
FIGURE 1. Internal ESD Protection.
DISCUSSION OF PERFORMANCE
The MPC100 video multiplexer allows the user to connect any one of four analog input channels (IN of the component and to switch between channels within less than 0.5µs. It consists of four identical unity-gain buffer amplifiers, which are connected together internally at the output. The open loop buffers consisting of complementary
-IN4) to the output
1
emitter followers applies no feedback, so their low fre­quency gain is slightly less than unity and somewhat depen­dent on loading. Unlike devices using MOS bilateral switch­ing elements, the bipolar complementary buffers form an unidirectional transmission path and thus provide high out­put-to-input isolation. Switching stages compatible to TTL level digital signals are provided for each buffer to select the input channel. When no channel is selected, the output of the device is high-impedance and allows the user to wire more MPC100s together to form switch multi-channel matrices.
If one channel is selected with a digital “1” at the corre­sponding SEL-input, the MPC100 acts as a buffer amplifier with high input impedance and low output impedance. The truth table on the front page describes the relationship between the digital inputs (SEL inputs (IN
to IN4), and which signal is selected at the
1
to SEL4) and the analog
1
output. The 2-4 address decoder and chip select logic is not
integrated. The selected design increases the flexibility of address decoding in complex distribution fields, eases BUS-controlled channel selection, simplifies channel se­lection monitoring for the user, and lowers transient peaks. All of these characteristics make the multiplexer, in effect, a quad switchable high-speed buffer. It requires DC cou­pling and termination resistors when directly driven from a low impedance cable. High-current output amplifiers are recommended when driving low-impedance transmission lines or inputs.
An advanced complementary bipolar process, consisting of pn-junction isolated high-frequency NPN and PNP transis­tors, provides wide bandwidth while maintaining low crosstalk and harmonic distortion. The single chip band­width of over 250MHz at an output voltage of 1.4Vp-p allows the design of large crosspoint or distribution fields in HDTV-quality with an overall system bandwidth of 36MHz. The buffer amplifiers also offer low differential gain (0.05%) and phase (0.01°) errors. These parameters are essential for video applications and demonstrate how well the signal path maintains a constant small-signal gain and phase for the low-level color subcarrier at 4.43MHz (PAL) or 3.58MHz (NSTC) as the brightness (luminance) signal is ramped through its specified range. The bipolar construction also ensures that the input impedance remains high and constant between ON and OFF states. The ON/ OFF input capacitance ratio is near unity, and does not vary with power supply voltage variations. The low output capacitance of 1.5pF when no channel is selected is a very important parameter for large distribution fields. Each par­allel output capacitance is an additional load and reduces the overall system bandwidth.
Bipolar video crosspoint switches are virtually glitch-free when compared to signal switches using CMOS or DMOS devices. The MPC100 operates with a fast make-before­break switching action to keep the output switching tran­sients small and short. Switching from one channel to another causes the signal to mix at the output for a short time, but it interferes only minimally with the input signals.
®
9
MPC100
The transient peaks remain less than +2.5mV and –1.2mV. Subsequent equipment might interpret large negative output glitches as synchronization pulses. To remove this problem, the output must be clamped during the switching dead time. With the MPC100, the generated output transients are ex­tremely small and clamping is unnecessary. The switching time between two channels is less than 0.5µs. This short time period allows easy switching during the vertical blank­ing time. The signal envelope during the transition from one channel to another rises and falls symmetrically and shows less overshooting or DC settling transients.
Power consumption is a serious problem when designing large crosspoint fields with high component density. Most of the buffers are always in off-state. One important design goal was to attain low off-state quiescent current when no channel is selected. The low supply current of ±230µA in off-state and ±4.6mA when one channel is selected, as well as the reduced ±5V supply voltage, conserves power, simpli­fies the power supply design, and results in cooler, more reliable operation.
CIRCUIT LAYOUT
The high-frequency performance of the MPC100 can be greatly affected by the physical layout of the circuit. The following tips are offered as suggestions, not as absolutes. Oscillations, ringing, poor bandwidth and settling, higher crosstalk, and peaking are all typical problems which plague high-speed components when they are used incorrectly.
• Bypass power supplies very close to the device pins. Use
tantalum chip capacitors (approximately 2.2µF), a parallel 470pF ceramic chip capacitor may be added if desired. Surface-mount types are recommended due to their low lead inductance.
• PC board traces for signal and power lines should be wide to reduce impedance or inductance.
• Make short and low inductance traces. The entire physical circuit layout should be as small as possible.
• Use a low-impedance ground plane on the component side to ensure that low-impedance ground is available through­out the layout. Grounded traces between the input traces are essential to achieve high interchannel crosstalk rejec­tion. Refer to the suggested layout shown in Figure 6.
• Do not extend the ground plane under high-impedance nodes sensitive to stray capacitances, such as the buffer’s input terminals.
• Sockets are not recommended because they add signifi­cant inductance and parasitic capacitance. If sockets are required, use zero-profile solderless sockets.
• Use low-inductance and surface-mounted components to achieve the best AC-performance.
• A resistor (100 to 200) in series with the input of the buffers may help to reduce peaking. Place the resistor as close as possible to the pin.
• Plug-in prototype boards and wire-wrap boards will not function well. A clean layout using RF techniques is essential.
(13)
SEL
SEL
1
(14)
IN
1
DB1
(1)
GND
(2)
2
IN
2
(3)
DB2
GND
GND
(4) IN
3
(5)
(6) IN
4
(7)
SEL
(9)
DB3
SEL
(8)
DB4
+V
= +5V
CC
(10)
V
OUT
(11)
(12)
–V
= –5V
3
1
CC
FIGURE 2. Simplified Circuit Diagram.
®
MPC100
NOTE: DB = Diamond Buffer
10
150
10
0 –10 –20 –30 –40 –50 –60 –70 –80
Crosstalk (dB)
–90
MPC100AU
MPC100AP
Frequency (Hz)
10M 100M 300M1M
10
0 –10 –20 –30 –40 –50 –60 –70 –80
Frequency (Hz)
Crosstalk (dB)
10M 100M 300M
–90
MPC100AU
MPC100AP
1M
DB1
IN
50
VI = 1.4Vp-p
1
GND
150
V
I
50
150
IN
2
DB2
GND
IN
3
DB3
GND
DB4
IN
4
MPC100
SEL1
0
SEL2
0
SEL3
1
SEL4
0
15 180
22pF
BUF601
is connected to GND
IN
3
FIGURE 3. Channel Crosstalk—Grounded Input.
150
DB1
IN
50
VI = 1.4Vp-p
1
GND
150
V
I
50
200
150
IN
2
DB2
GND
IN
3
DB3
GND
DB4
IN
4
MPC100
SEL1
0
SEL2
0
SEL3
1
SEL4
0
15 180
22pF
is connected with 150+ 50to GND
IN
3
BUF601
50
V
O
Crosstalk = 20log
50
V
O
Crosstalk = 20log
50
V
O
V
I
50
V
O
V
I
FIGURE 4. Channel Crosstalk—150 Input Resistor.
150
DB1
IN
50
VI = 1.4Vp-p
1
GND
150
V
I
50
150
150
GND
GND
IN
2
DB2
IN
3
DB3
DB4
IN
4
MPC100
180
SEL1 SEL2 SEL3 SEL4
0 0 0 0
BUF601
V
Crosstalk = 20log
FIGURE 5. Off Isolation.
10
0 –10 –20 –30
50
50
O
V
O
V
I
–40 –50
Crosstalk (dB)
–60 –70 –80
–90
MPC100AU
MPC100AP
10M 100M 300M1M
Frequency (Hz)
®
11
MPC100
2.2µ
470p
IN13
IN16
IN13
IN16
IN13
IN16
150
75
75
75
75
75
75
75
75
75
75
75
75
1
2
150
3
4
150
5
6
150
7
MPC100
150
1
2
150
3
4
150
5
6
150
7
MPC100
150
1
2
150
3
4
150
5
6
150
7
MPC100
–5V
14
13
12
22
11
10
9
8
2.2µ
470p
2.2µ
470p
14
13
12
22
11
10
9
8
2.2µ
470p
2.2µ
470p
14
13
12
22
11
10
9
8
2.2µ
470p
2.2µ
470p
+5V
0.1µF
16
V
CC
15
14
13
12
11
10
15
14
13
12
11
10
1
Y
A
0
Y
A
1
Y
A
2
74HC
237
Y
CS1
3
Y
CS2
4
Y
5
9
Y
6
7
Y
LE
7
GND
+5V
0.1µF
16
V
CC
Y
A
0
Y
A
1
Y
A
2
74HC
237
Y
CS2
3
Y
CS1
4
Y
5
9
Y
6
7
Y
LE
7
GND
A
0
1
3
0
1
2
0
2
A
1
3
A
3
6
CS
5
+5V
4
1
2
3
5
6
4
FIGURE 6. Video Distribution Field.
®
MPC100
IN13
IN16
150
75
75
75
75
1
2
150
3
4
150
5
6
150
7
MPC100
14
13
12
22
11
10
9
8
2.2µ
470p
+5V
+5V
2.2µ
10n
150
3
7
+
75
6
OPA623
2
220
220
Out
4
–5V
10n
2.2µ
12
+5V
2.2µ
+5V
0.1µ
470p
BUF600
+5V
In
180
75
1
84
+1
5
–5V
150
150
75
150
75
R-2R
Ladder
Network
150
150
75
75
150
10
Y
15
14
1
DB1
2
3
DB2
4
5
DB3
13
14
Y
9
13
Y
12
8
Y
150
11
6
7
DB4
GND
LE CS2
0
1
74HC
237
2
3
3
+
OPA623
2
390
390
584
1
A
0
2
A
1
3
A
2
5
CS1
+5V
7
Out
75
6
4
–5V
MPC100
12
–5V
2.2µ
470p
CS
0 0 0 0 1
1
0 0 1 1 X
A
GAINA
0
02 11
0.5
0
0.25
1
0
X
SEL
4
3
2
1
00
0
1 0
1
00
0
0
0
0
0
0
1 0 0
0 1 0
FIGURE 7. Digital Gain Control.
In1
In2
In3
In4
50
50
50
50
150
150
150
150
+5V
0.1µ
GND
LE CS2
12 Bit
10MHz
ADS804
584
1
A
0
2
A
1
3
A
2
5
CS1
+5V
–5V
16
V
CC
Y
15
0
Y
14
1
Y
13
2
12
Y
3
A/D Converter
7
6
Signal Input
4
+5V
2.2µ
470p
10
14
1
DB1
2
3
DB2
4
5
DB3
6
7
DB4
MPC100
12
2.2µ
13
9
8
150
11
3
+
OPA620
2
220
220
FIGURE 8. High Speed Data Acquisition System.
–5V
470p
13
®
MPC100
CH1 G
CH2 G
CH3 G
CH4 G
150
150
150
150
150
150
150
150
150
150
150
150
1
DB1
2
3
DB2
4
5
DB3
6
7
DB4
MPC100
9101314
1
DB1
2
3
DB2
4
5
DB3
6
7
DB4
MPC100
9 10 13 14
9101314
1
DB1
2
3
DB2
4
5
DB3
6
7
DB4
MPC100
–5V
2.2µ
470p
12
2.2µ
470p
2.2µ
470p
2.2µ
470p
2.2µ
470p
2.2µ
470p
150
150
150
15
14
13
12
11
10
+5V
–5V
12
11
10
+5V
–5V
12
11
10
+5V
Y
Y
Y
Y
3
2
390
3
2
390
0
1
2
3
3
2
390
+
OPA623
390
+
OPA623
390
CS1
74HC
237
CS2 GND
+
OPA623
390
+5V
2.2µ
10n
7
6
4
–5V
+5V
2.2µ
10n
7
6
4
–5V
5
V
CC
LE
58
+5V
2.2µ
10n
7
6
4
–5V
75
R
2.2µ
10n
75
G
2.2µ
10n
+5V
16
CS
1
A
0
A
0
2
A
1
A
1
3
A
9
4
75
B
2.2µ
10n
R
B
75
R
B
75
R
B
75
R
B
75
FIGURE 9. Distribution Field for High Resolution Graphic Cards, Cameras.
®
MPC100
14
50
V
In
RIN =
50
50
Pulse Generator
FIGURE 10. Test Circuit Pulse Response.
Out
R
R
I
150
I
DB1
DUT
to DB4
R
OUT
O1
R
O1
+1
C
OUT
BUF601
R
B
51
V
O
B
OUT
50
400MHz Scope
RIN =
50
MPC100
V
75
Generator
IN
DUT
RIN = 75
75 10k
DB1 to DB4
4.43MHz
VDC
FIGURE 11. Test Circuit Differential Gain and Phase.
R
I
Generator
RIN =
50
50
In
50
150
V
I
DB1
DUT
to DB4
150150
4
+
3
75
8
75
390
Video Analyzer
RIN = 75
390
Out
R
OPA623
O1
R
OUT
R
O1
+1
C
OUT
BUF601
R
B
51
V
O
B
OUT
50
Spectrum
Analyzer
RIN =
50
FIGURE 12. Test Circuit Frequency Response.
7
HC4094
MPC100
SEL Inputs 1143135127
SER
Out
11
2
3
31 15
SER In
Clock
STR
OE
MPC100
SEL Inputs 1435567
2
D
Parallel Out
31 15
FIGURE 13. Serial Bus-Controlled Distribution Field.
MPC100
SEL Inputs
MPC100
SEL Inputs
143556771143135127
Parallel Out
HC4094
SER
Out
15
MPC100
SEL Inputs
MPC100
SEL Inputs
143556771143135127
11
• • •
2
Parallel Out
HC4094
SER
Out
11
33
31 15
®
MPC100
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