Burr-Brown DAC7731 User Manual

Page 1
DAC7731
SBAS249 – DECEMBER 2001
16-Bit, Voltage Output, Serial Input
DIGITAL-TO-ANALOG CONVERTER
DAC7731
FEATURES
LOW POWER: 150mW MAXIMUM
+10V INTERNAL REFERENCE
UNIPOLAR OR BIPOLAR OPERATION
SETTLING TIME: 5µs to ±0.003% FSR
16-BIT MONOTINICITY, –40°C TO +85°C
±10V, ±5V, OR +10V CONFIGURABLE VOLTAGE
OUTPUT
RESET TO ZERO OR MID-SCALE
DOUBLE-BUFFERED DATA INPUT
DAISY-CHAIN FEATURE FOR MULTIPLE
DAC7731s ON A SINGLE BUS
SMALL SSOP-24 PACKAGE
APPLICATIONS
PROCESS CONTROL
ATE PIN ELECTRONICS
CLOSED-LOOP SERVO CONTROL
MOTOR CONTROL
DATA ACQUISITION SYSTEMS
DESCRIPTION
The DAC7731 is a 16-bit Digital-to-Analog Converter (DAC) which provides 16 bits of monotonic performance over the specified operating temperature range and offers a +10V internal reference. Designed for automatic test equipment and industrial process control applications, the DAC7731’s output swing can be configured in a ±10V, ±5V, or +10V range. The flexibility of the output configuration allows the DAC7731 to provide both unipolar and bipolar operation by pin strapping. The DAC7731 includes a high-speed output amplifier with a maximum settling time of 5µs to ±0.003% FSR for a 20V full-scale change and only consumes 100mW (typical) of power.
The DAC7731 features a standard 3-wire, SPI-compatible serial interface with double buffering to allow asynchronous updates of the analog output as well as a serial data output line for daisy-chaining multiple DAC7731’s. A user program­mable reset control forces the DAC output to either min-scale (0000
) or mid-scale (8000H), overriding both the input and
H
DAC register values. The DAC7731 is available in a SSOP-24 package and three performance grades specified to operate from –40°C to +85°C.
V
DDVSSVCC
REFEN
RSTSEL
RST
LDAC
SCLK
CS
SDO
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Enable
SDI
AGND DGND
REFADJ
Control
Logic
Input
Register
REF
+10V
Reference
Register
REF
OUT
DAC
www.ti.com
IN
Buffer
V
DAC
REF
R
OFFSET
RFB2
RFB1
SJ
V
OUT
Copyright © 2001, Texas Instruments Incorporated
Page 2
ABSOLUTE MAXIMUM RATINGS
V
to VSS...........................................................................–0.3V to +32V
CC
V
to AGND ...................................................................... –0.3V to +16V
CC
V
to AGND ...................................................................... –16V to +0.3V
SS
AGND
to DGND................................................................... –0.3V to 0.3V
REF
to AGND .............................................................. 0V to VCC – 1.4V
IN
V
to DGND ........................................................................ –0.3V to +6V
DD
Digital Input Voltage to DGND ................................. –0.3V to V
Digital Output Voltage to DGND .............................. –0.3V to V
Operating Temperature Range ........................................ –40°C to +85°C
Storage Temperature Range ......................................... –65°C to +150°C
Junction Temperature (TJ Max) .................................................... +150°C
NOTE: (1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability.
(1)
ELECTROSTATIC DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru­ments recommends that all integrated circuits be handled with
+ 0.3V
DD
+ 0.3V
DD
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
PRODUCT PACKAGE-LEAD DESIGNATOR
PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT
DAC7731E SSOP-24 DB –40°C to +85°C DAC7731E DAC7731E Rails, 60
(1)
"" " " "DAC7731E/1K Tape and Reel,1000
DAC7731EB SSOP-24 DB –40°C to +85°C DAC7731EB DAC7731EB Rails, 60
"" " " "DAC7731EB/1K Tape and Reel, 1000
DAC7731EC SSOP-24 DB –40°C to +85°C DAC7731EC DAC7731EC Rails, 60
"" " " "DAC7731EC/1K Tape and Reel, 1000
NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com. (2) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /1K indicates 1000 devices per reel). Ordering 1000 pieces of “DAC7731EC/1K” will get a single 1000-piece Tape and Reel.
SPECIFIED
RANGE MARKING NUMBER
(2)
MEDIA, QUANTITY
ELECTRICAL CHARACTERISTICS
All specifications at TA = T
PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX MIN TYP MAX UNITS ACCURACY
Linearity Error (INL) ±6 ±4 ±3LSB
Differential Linearity Error Monotonicity 14 15 16 Bits Offset Error Offset Error Drift Gain Error With Internal REF ±0.4 ±0.25 ±0.15 % of FSR
Gain Error Drift With Internal REF ±15 ±10 ±7 ppm/°C PSRR (V
ANALOG OUTPUT
Voltage Output
Output Current ±5 ✻✻ mA Output Impeadance 0.1 ✻✻ Maximum Load Capacitance 200 ✻✻pF Short-Circuit Current ±15 ✻✻mA Short-Circuit Duration AGND Indefinite ✻✻
REFERENCE
Reference Output 9.96 10 10.04 9.975 10.025 ✻✻✻ V REF REF REF REF REF REFADJ Input Range
REFADJ Input Impedance 50 V
REF
V
REF
or VSS) At Full-Scale 50 200 ✻✻ ✻✻ppm/V
CC
(2)
Impedance 400 ✻✻
OUT
Voltage Drift ±15 ±10 ±7 ppm/°C
OUT
Voltage Adjustment
OUT
Input Range
IN
Input Current 10 ✻✻nA
IN
Output Current –2+2✻✻✻ ✻mA Impedance 1 ✻✻
to T
MIN
(DNL)
(1)
(4)
, VCC = +15V, VSS = –15V, VDD = +5V, Internal refience enabled, unless otherwise noted.
MAX
DAC7731E DAC7731EB DAC7731EC
TA = 25°C ±5 ±3 ±2LSB
±2 ✻✻ppm/°C
With External REF ±0.25 ±0.1 % of FSR
+11.4/–4.75 0 to 10 ✻✻V +11.4/–11.4 ±10 ✻✻V
+11.4/–6.4 ±5 ✻✻V
(3)
Absolute Max Value that
can be applied is V
±25 ✻✻ mV
4.75 V
010✻✻✻✻V
CC
±4 ±2 ±1LSB
±0.1 ✻✻% of FSR
– 1.4 ✻✻✻✻V
CC
✻✻k
2
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DAC7731
SBAS249
Page 3
ELECTRICAL CHARACTERISTICS (Cont.)
All specifications at TA = T
PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX MIN TYP MAX UNITS DYNAMIC PERFORMANCE
Settling Time to ±0.003% 20V Output Step 3 5 ✻✻ ✻✻ µs
Digital Feedthrough 2 ✻✻nV-s Output Noise Voltage at 10kHz 100 ✻✻nV/Hz
DIGITAL INPUT
V
IH
V
IL
DIGITAL OUTPUT
V
OH
V
OL
POWER SUPPLY
V
DD
V
CC
V
SS
I
DD
I
CC
I
SS
Power
TEMPERATURE RANGE
Specified Performance 40 +85 ✻✻✻ ✻°C
Specifications same as grade to the left.
NOTES: (1)
With minimum VCC/VSS requirements, internal reference enabled. (2) Please refer to the "Theory of Operation" section for more information with respect to output voltage configurations. (3) See Figure 11 for gain and offset adjustment connection diagrams when using the internal reference. (4) The minimum value for REF of V
+14V and +4.75V, where +4.75V is the minimum voltage allowed. (5) Reference low-pass filter values: 100k, 1.0µF (see Figure 14).
SS
to T
MIN
, VCC = +15V, VSS = –15V, VDD = +5V, Internal reference enabled, unless otherwise noted.
MAX
R
= 5k, CL = 200pF,
L
with external REF
to REF
|IH| < 10µA0.7 • V |IL| < 10µA0.3 • V
OUT
(5)
filter
IN
DD
IOH = –0.8mA 3.6 ✻✻ V
IOL = 1.6mA 0.4 ✻✻V
+4.75 +5.0 +5.25 ✻✻✻✻✻✻ V +11.4 +15.75 ✻✻✻✻V
Bipolar Operation –15.75 –11.4 ✻✻✻✻V
Unipolar Opeation –15.75 –4.75 ✻✻✻✻V
Unloaded 4 6 ✻✻ ✻✻ mA
Unloaded –4 2.5 ✻✻ ✻✻ mA No Load, Ext. Reference No Load, Int. Reference 100 150
DAC7731E DAC7731EB DAC7731EC
✻✻ V
DD
✻✻V
100 ✻✻µA
85 ✻✻mW
✻✻ ✻✻mW
must be equal to the greater
IN
PIN CONFIGURATION
Top View SSOP
V
1
CC
REF
REFADJ
R
OFFSET
AGND
OUT
REF
V
REF
RFB2 RFB1
V
OUT
V
SJ
2 3
IN
4 5 6
DAC7731
7 8 9
10
11
12
DD
NOTE: (1) RST, LDAC, SDI, CS and SCK are Schmitt-triggered inputs.
24 23 22 21 20 19 18 17 16 15 14 13
V
SS
REFEN RSTSEL SCLK CS SDO SDI LDAC RST NC TEST DGND
PIN DESCRIPTIONS
PIN NAME DESCRIPTION
1V 2REF 3 REF 4 REFADJ Internal Reference Trim. (Acts as a gain adjustment
5V
6R
OFFSET
7 AGND Analog ground 8 RFB2 Feedback Resistor 2, used to configure DAC output
9 RFB1 Feedback Resistor 1, used to configure DAC output
10 SJ Summing Junction of the Output Amplifier 11 V 12 V 13 DGND Digital Ground 14 TEST Reserved, Connect to DGND 15 NC No Connection 16 RST V
17 LDAC DAC register load control, rising dege triggered. Data
18 SDI Serial Data Input. Data is latched into the input
19 SDO Serial Data Output, delayed 16 SCLK clock cycles. 20 CS Chip Select, Active LOW 21 SCLK Serial Clock Input 22 RSTSEL Reset Select; determines the action of RST. If HIGH,
23 REFEN Enables internal +10V reference (REF
24 V
Positive Analog Power Supply
CC
Internal Reference Output
OUT
Reference Input
IN
input when the internal reference is used.) Buffered Output from REFIN, can be used to drive
REF
external devices. Internally, this pin directly drives the DAC's circuitry. Offsetting Resistor
range.
range.
DAC Voltage Output
OUT
Digital Power Supply
DD
reset; active LOW, depending on the state of
OUT
RSTSEL, the DAC register is either reset to mid­scale or min-scale.
is loaded from the input register to the DAC register.
register on the rising edge of SCLK.
RST will reset the DAC register to mid-scale. If LOW, RST will reset the DAC register to min-scale.
LOW. Negative Analog Power Supply
SS
OUT
), active
DAC7731
SBAS249
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3
Page 4
TIMING CHARACTERISTICS
VCC = +15V, V
PARAMETER DESCRIPTION MIN TYP MAX UNITS
t
WH
t
WL
t
SDI
t
HDI
t
SCS
t
HSC
t
DDO
t
HDO
t
DDOZ
t
WCSH
t
WLDL
t
WLDH
t
SLD
t
DLD
t
SCLK
t
SRS
t
HRS
t
WRL
t
INTERFACE TIMING
= –15V, VDD = 5V; RL = 2k to AGND; CL = 200pF to AGND; all specifications –40°C to +85°C, unless otherwise noted.
SS
DAC7731
SCLK HIGH Time 25 ns SCLK LOW Time 25 ns Setup Time: Data in valid before rising SCLK 5 ns Hold Time: Data in valid after rising SCLK 20 ns Setup Time: CS falling edge before first rising SCLK 15 ns Hold Time: CS rising edge after 16th rising SCLK 0 ns Delay Time: CS Falling Edge to Data Out valid, CL = 20pF on SDO 50 ns Hold Time: Data Out valid after SCLK rising edge, CL 20pF on SDO 50 ns Delay Time: CS rising edge to SDO = High Impedance 70 ns CS HIGH Time 50 ns LDAC LOW Time 20 ns LDAC HIGH Time 20 ns Setup Time: 16th Rising SCLK Before LDAC Rising Edge 15 ns Delay Time: LDAC rising edge to first SCLK rising edge of next 15 ns transfer cycle. Setup Time: CS High before falling SCLK edge following 16th 5 ns rising SCLK edge Setup Time: RSTSEL Valid Before RST LOW 0 ns Hold Time: RSTSEL valid after RST HIGH 20 ns RST LOW Time 30 ns
S
DAC V
Settling Time 5 µs
OUT
SCLK
SDO
LDAC
V
RESET TIMING
SDI
OUT
CS
t
SCS
t
WH
12 16
t
Word B
Word A
t
SRS
WL
t
t
HDI
HDO
t
SDI
B15 B14 B13 B0
t
DDO
A15 A14 A13 A0
RSTSEL
RST
+FS
(RSTSEL = LOW)
V
OUT
–FS +FS
(RSTSEL = HIGH)
V
OUT
–FS
t
HCS
t
t
HRS
WRL
t
DDOZ
t
WCSH
t
SCLK
C15 C14 C13 C12
Word C
B15 B14 B13 B12
t
t
WLDL
t
SLD
DLD
t
WLDH
±0.003% of FSR
Error Bands
t
S
t
S
Word B
Min-Scale
Mid-Scale
4
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DAC7731
SBAS249
Page 5
TYPICAL CHARACTERISTICS
TA = +25°C (unless otherwise noted).
6 4 2 0
–2
INL (LSB)
Bipolar Configuration: V
–4
T
= 85°C, Internal Reference Enabled
A
–6
2.0
1.5
1.0
0.5
0.0
–0.5
DNL (LSB)
1.01.52.0
0000
H
6 4 2 0
–2
INL (LSB)
Bipolar Configuration: V
–4
T
= –40°C, Internal Reference Enabled
A
–6
2.0
1.5
1.0
0.5
0.0
–0.5
DNL (LSB)
1.01.52.0
0000
H
LINEARITY ERROR AND DIFFERENTIAL
LINEARITY ERROR vs DIGITAL INPUT CODE
= –10V to +10V
OUT
2000H4000H6000H8000
A000
H
C000HE000HFFFF
H
Digital Input Code
LINEARITY ERROR AND DIFFERENTIAL
LINEARITY ERROR vs DIGITAL INPUT CODE
= –10V to +10V
OUT
2000H4000H6000H8000
H
A000
C000HE000HFFFF
H
Digital Input Code
LINEARITY ERROR AND DIFFERENTIAL
6
LINEARITY ERROR vs DIGITAL INPUT CODE
4 2 0
–2
INL (LSB)
Bipolar Configuration: V
–4
T
= 25°C, Internal Reference
A
–6
2.0
1.5
1.0
0.5
0.0
–0.5
DNL (LSB)
1.01.52.0
H
2000H4000H6000H8000
0000
H
= –10V to +10V
OUT
Enabled
A000
H
C000HE000HFFFF
H
H
Digital Input Code
1.00
OFFSET ERROR vs TEMPERATURE
0.75 V
= –10 to +10V
0.50
0.25
V
OUT
= 0 to +10V
OUT
0.00
–0.25
Error (mV)
0.500.751.00
H
–40 –15 10 35 60 85
Temperature (°C)
0.000
0.0100.0200.0300.0400.050
Error (%)
–0.060
Ext. Ref, Unipolar Mode: V
Int. Ref, Unipolar Mode: V
GAIN ERROR vs TEMPERATURE
= 0 to +10V
OUT
Ext. Ref, Bipolar Mode: V
= 0 to +10V
OUT
0.0700.0800.0900.100
Load = 200pF, 2k
Int. Ref, Bipolar Mode: V
–40 –15 10 35 60 85
Temperature (°C)
DAC7731
SBAS249
= –10 to +10V
OUT
= –10 to +10V
OUT
www.ti.com
VCC SUPPLY CURRENT vs DIGITAL INPUT CODE
4.4
4.3
Bipolar Configuration: V Internal Reference Enabled, T
4.2
4.1
(mA)
4.0
CC
I
3.9
3.8
3.7
0000H2000H4000H6000H8000
A000
H
Digital Input Code
= –10V to +10V
OUT
= 25°C
A
C000HE000HFFFF
H
H
5
Page 6
TYPICAL CHARACTERISTICS (Cont.)
TA = +25°C (unless otherwise noted).
VCC SUPPLY CURRENT vs DIGITAL INPUT CODE
3.4
3.3
Bipolar Configuration: V External Reference, REFEN = 5V, T
= –10V to +10V
OUT
3.2
3.1
(mA)
3.0
CC
I
2.9
2.8
2.7
0000H2000H4000H6000H8000
A000
H
C000HE000HFFFF
H
Digital Input Code
7 6 5
SUPPLY CURRENT vs TEMPERATURE
Load Current Excluded V
= +15V, VSS = –15V
CC
Bipolar V
Configuration: –10V to +10V
OUT
4 3
I
(mA)
SS
, I
CC
I
12
CC
2 1 0
I
SS
3
40 15 10 35 60 85
Temperature (°C)
= 25°C
A
–1.50
VSS SUPPLY CURRENT vs DIGITAL INPUT CODE
1.75
2.00
(mA)
SS
I
2.25
2.50
Bipolar Configuration: V T
= 25°C
–2.75
H
A
0000H2000H4000H6000H8000
= –10V to +10V
OUT
A000
H
C000HE000HFFFF
H
H
Digital Input Code
1800 1600 1400 1200
SUPPLY CURRENT vs LOGIC INPUT VOLTAGE
TA = 25°C, Transition Shown for a Single Input (Applies to CS, SCLK,D inputs)
and LDAC
IN
1000
(µA)
800
DD
I
600 400 200
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 V
(V)
LOGIC
HISTOGRAM OF VCC CURRENT CONSUMPTION
100
Bipolar Output Configuration
90
Internal Reference Enabled Code = 5555
80
H
70 60 50 40
Frequency
30 20 10
0
3.000 3.500 4.000 4.500 5.000 (mA)
I
CC
6
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100
HISTOGRAM OF VSS CURRENT CONSUMPTION
Bipolar Output Configuration
90
Internal Reference Enabled Code = 5555
80
H
70 60 50 40
Frequency
30 20 10
0
–3.50 –3.00 –2.50 –2.00 –1.50
I
(mA)
SS
DAC7731
SBAS249
Page 7
TYPICAL CHARACTERISTICS (Cont.)
10.015
10.010
10.005
10.000
9.995
9.990
9.985
REF
OUT
(V)
–40 –15 10 35 60 85
Temperature (°C)
INTERNAL REFERENCE OUTPUT vs TEMPERATURE
Source
Sink
OUTPUT VOLTAGE vs R
LOAD
12
8
4
0
4
8
12
V
OUT
(V)
0.0 0.1 1.0 10.0 100.0 R
LOAD
(kΩ)
TA = +25°C (unless otherwise noted).
POWER-SUPPY REJECTION RATIO vs FREQUENCY
10
Bipolar Configuration: ±10V V
0
Code 8000
VSS, VCC = 15V + 1Vp-p
10
V
–20
H
= 5V + 0.5Vp-p
DD
(Measured at V
OUT
OUT
)
3040
PSRR (dB)
5060
V
SS
V
CC
–70
V
–80
DD
0.1K 1K 10K 100K 1M 10M Frequency (Hz)
INTERNAL REFERENCE START-UP
15V
(5V/div)
0V
CC
V
POWER-SUPPY REJECTION RATIO vs FREQUENCY
10
Bipolar Configuration: ±10V V
0
–VSS, VCC = 15V + 1Vp-p, VDD = 5V + 0.5Vp-p
(Measured at V
OUT
, Code FFFF
OUT
)
H
10203040
PSRR (dB)
5060
V
SS
V
CC
V
DD
7080
0.01K 0.1K 1K 10K 100K 1M 10M Frequency (Hz)
10V
(2V/div)
OUT
0V
REF
VOLTAGE vs LOAD
REF
11.0
OUT
Loaded to V
10.5
10.0
(V)
OUT
9.5
REF
9.0
8.5 1 10 100 1K
Loaded to AGND
REF
DAC7731
SBAS249
Time (2ms/div)
CC
LOAD(kΩ)
OUT
V
CC
= +15V
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7
Page 8
TYPICAL CHARACTERISTICS (Cont.)
TA = +25°C (unless otherwise noted).
POWER-SUPPY REJECTION RATIO vs FREQUENCY
10
Internal Reference Enabled
0
–V
, VCC = 15V + 1Vp-p,
SS
V
= 5V + 0.5Vp-p
DD
10203040
PSRR (dB)
–50
(Measured at REF
V
SS
)
OUT
V
CC
V
DD
607080
1 10 100 1K 10K 100K 1M 10M
Frequency (Hz)
800
Bipolar Configuration: ±10V, Internal Reference Enabled
OUTPUT NOISE vs FREQUENCY
700 600 500 400 300 200
Output Noise (nV/rtHz)
100
Code 0000
Code 8000
H
H
Code FFFF
H
0
0.01K 0.1K 1K 10K 100K 1M 10M Frequency (Hz)
900
Unipolar Configuration, Internal Reference Enabled
800
OUTPUT NOISE vs FREQUENCY
700 600 500
Code FFFF
H
400 300
Output Noise (nV/Hz)
200
Code 0000
100
H
0
0.01K 0.1K 1K 10K 100K 1M 10M Frequency (Hz)
BROADBAND NOISE
(V, 50µV/div)
OUT
V
Internal Reference Enabled Filtered with 1.6Hz Low-Pass Code FFFF 10kHz Measurement BW
, Bipolar ±10V Configuration
H
Time (100µs/div)
UNIPOLAR FULL-SCALE SETTLING TIME
Large-Signal Output (5V/div)
Small-Signal Error (150µV/div)
Unipolar Configuration: V
Zero-Scale to +Full-Scale Change
= 0 to +10V
OUT
5k, 200pF Load
Time (2µs/div)
8
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BIPOLAR FULL-SCALE SETTLING TIME
Large-Signal Output (5V/div)
Small-Signal Error (300µV/div)
Bipolar Configuration: V
–Full-Scale to +Full-Scale
= –10 to +10V
OUT
5k, 200pF Load
Time (2µs/div)
DAC7731
SBAS249
Page 9
TYPICAL CHARACTERISTICS (Cont.)
TA = +25°C (unless otherwise noted).
UNIPOLAR FULL-SCALE SETTLING TIME
Small-Signal Error (150µV/div)
Large-Signal Output (5V/div)
Unipolar Configuration: V
+Full-Scale to Zero-Scale Change
Time (2µs/div)
MID-SCALE GLITCH
Code 8000H to 7FFF Bipolar Configuration: ±10V V
H
OUT
= 0V to +10V
OUT
5k, 200pF Load
BIPOLAR FULL-SCALE SETTLING TIME
Small-Signal Error (300µV/div)
Large-Signal Output (5V/div)
Bipolar Configuration: V
+Full-Scale to –Full-Scale
Time (2µs/div)
MID-SCALE GLITCH
Code 7FFFH to 8000
Bipolar Configuration: ±10V V
= –10 to +10V
OUT
5k, 200pF Load
H
OUT
(V, 100mV/div)
OUT
V
Time (1µs/div)
(V, 100mV/div)
OUT
V
Time (1µs/div)
DAC7731
SBAS249
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9
Page 10
THEORY OF OPERATION
The DAC7731 is a voltage output, 16-bit DAC with a +10V built-in internal reference. The architecture is an R-2R ladder configuration with the three MSB’s segmented, followed by an operational amplifier that serves as a buffer, as shown in Figure 1. The output buffer is designed to allow user­configurable output adjustments giving the DAC7731 output voltage ranges of 0V to +10V, –5V to +5V, or –10V to +10V. Please refer to Figures 2, 3, and 4 for pin configuration information.
The digital input is a serial word made up of the DAC code (MSB first) and is loaded into the DAC register using the LDAC input pin. The converter can be powered from ±12V to ±15V dual analog supplies and a +5V logic supply. The device offers a reset function, which immediately sets the DAC output voltage and DAC register to min-scale (code 0000
) or mid-scale (code 8000H). The data I/O and reset
H
functions are discussed in more detail in the following sec­tions.
R
2R2R 2R 2R 2R 2R 2R 2R 2R
FIGURE 1. DAC7731 Architecture.
V
CC
(0V to +10V)
V
DD
1µF0.1µF
1 2 3 4 5 6 7 8
9 10 11 12
DAC7731
V
CC
REF
OUT
REF
IN
REFADJ V
REF
R
OFFSET
AGND RFB2 RFB1 SJ V
OUT
V
DD
REFEN
RSTSEL
SCLK
SDO
LDAC
TEST
DGND
V
CS
SDI
RST
NC
REF
ADJ
REF
OUT
REF
IN
V
REF
R
OFFSET
RFB2
Buffer
R/4
RFB1
+10V Internal
Reference
R/2R/2 R/4
SJ
V
OUT
R/4
V
REF
AGND
V
CC
1 2 3 4 5 6 7 8
9 10 11 12
V
CC
REF
OUT
REF
IN
REFADJ V
REF
R
OFFSET
AGND RFB2 RFB1 SJ V
OUT
V
DD
DAC7731
V
REFEN
RSTSEL
SCLK
CS
SDO
SDI
LDAC
RST
NC
TEST
DGND
24
SS
23 22 21 20
Control/Data
19
Bus
18 17 16 15 14 13
V
24
SS
23 22 21 20
Control/Data
19
Bus
18 17 16 15 14 13
SS
1µF0.1µF
(–5V to +5V)
V
DD
1µF0.1µF
V
SS
1µF0.1µF
1µF0.1µF
FIGURE 2. Basic Operation: V
10
= 0V to +10V.
OUT
FIGURE 3. Basic Operation: V
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1µF0.1µF
= –5V to +5V.
OUT
DAC7731
SBAS249
Page 11
V
CC
1µF0.1µF
(–10V to +10V)
V
DD
REFSEL ACTION
DAC7731
V
1
CC
REF
2
OUT
REF
3
IN
REFADJ
4
V
5
REF
R
6
OFFSET
AGND
7
RFB2
8
RFB1
9
SJ
10
V
11
OUT
V
12
DD
1µF0.1µF
V
REFEN
RSTSEL
SCLK
CS
SDO
SDI
LDAC
RST
NC
TEST
DGND
24
SS
23 22 21 20
Control/Data
19
Bus
18 17 16 15 14 13
V
SS
1µF0.1µF
1 Internal Reference disabled;
0 Internal Reference enabled;
REF
= High Impedance
OUT
REF
OUT
= +10V
TABLE I. REFEN Action.
DIGITAL INTERFACE
Table II shows the input data format for the DAC7731 and Table III illustrates the basic control logic of the device. The serial interface consists of a chip select input (CS), serial data clock input (SCLK), serial data input (SDI), serial data output (SDO), and load control input (LDAC). An asynchronous reset input (RST), which is active LOW, is provided to simplify start­up conditions, periodic resets, or emergency resets to a known state, depending on the status of the reset select (RSTSEL) signal. Please refer to the "DAC Reset" section for additional information regarding the reset operation.
FIGURE 4. Basic Operation: V
= –10V to +10V.
OUT
ANALOG OUTPUTS
The output amplifier can swing to within 1.4V of the supply rails, specified over the –40°C to +85°C temperature range. This allows for a ±10V DAC voltage output operation from ±12V supplies with a typical 5% tolerance.
When the DAC7731 is configured for a unipolar, 0V to 10V output, a negative voltage supply is required. This is due to internal biasing of the output stage. Please refer to the Electrical Characteristics table for more information.
The minimum and maximum voltage output values are de­pendent upon the output configuration implemented and reference voltage applied to the DAC7731. Please note that V
(the negative power supply) must be in the range of
SS
–4.75V to –15.75V for unipolar operation. The voltage on V sets several bias points within the converter and is required in all modes of operation. If V
is not in one of these two
SS
configurations, the bias values may be in error and proper operation of the device is not ensured.
REFERENCE INPUTS
The DAC7731 provides a built-in +10V voltage reference and on-chip buffer to allow external component reference drive. To use the internal reference, REFEN must be LOW, enabling the reference circuitry of the DAC7731 (as shown in Table I) and the REF to the on-chip reference buffer. The buffers output is provided at the V DAC7731 output amplifier into one of three voltage output modes as discussed earlier. V other system components requiring an external reference.
The internal reference of the DAC7731 can be disabled when use of an external reference is desired. When using an external reference, the reference input, REF voltage between 4.75V (or V and V
pin must be connected to REFIN. This is the input
OUT
pin. In this configuration, V
REF
– 1.4V.
CC
REF
+ 14V, whichever is greater)
SS
is used to setup the
REF
can also be used to drive
, can be any
IN
SS
ANALOG OUTPUT
DIGITAL INPUT Unipolar Configuration Bipolar Configuration
Unipolar Straight Binary Bipolar Offset Binary 0x0000 Zero (0V) 0x0001 Zero + 1LSB –Full-Scale + 1LSB
:: : 0x8000 1/2 Full-Scale Bipolar Zero 0x8001 1/2 Full-Scale + 1LSB Bipolar Zero + 1LSB
:: :
0xFFFF Full-Scale (V
– 1LSB) +Full-Scale (+V
REF
–Full-Scale (–V
or +V
REF
or –V
REF
– 1LSB
REF
/2 – 1LSB)
REF
/2)
TABLE II. DAC7731 Data Format.
CONTROL STATUS COMMAND
CS RST RSTSEL LDAC SCLK ACTION
H H X X X Shift Register is disabled on the serial bus.
L H X X X enables shift operation and I/O bus
LH X X Serial Data Shifted into Input Register H X X L Serial Data Shifted into Input Register XH X X X L H X X Resets Input and DAC Registers to mid-scale. X L L X X Resets Input and DAC Registers to min-scale.
NOTE: (1) In order to avoid unwanted shifting of the input register by an additional bit, care must be taken that a rising edge on CS only occurs when SCLK is HIGH.
Enable SDO pin from High Impedance;
(SCLK, SDI, SDO).
(1)
Data in Input Register is Loaded into DAC Register.
TABLE III. DAC7731 Logic Truth Table.
The DAC code is provided via a 16-bit serial interface, as shown in Table II. The digital input word makes up the digital code to be loaded into the data input register of the device. A typical data transfer and DAC output update takes place as follows: Once CS is active (LOW), the DAC7731 is enabled on the serial bus and the 16-bit serial data transfer can begin. The serial data is shifted into the device on each rising SCLK edge until all 16 bits are transferred (1 bit per 1 rising SCLK edge). Once received, the data in the input register is loaded into the DAC register upon reception of a rising edge on the LDAC input (load command). This action updates the analog output, V
OUT
, to the
desired voltage specified by the digital input word. A rising edge
DAC7731
SBAS249
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11
Page 12
on LDAC is completely asynchronous to the serial interface of the device and can occur at any time. Care must be taken to ensure that the entire 16 bits of data are loaded into the input register before issuing a LDAC active edge. Additional load commands will have no effect on the DAC output if the data in the input register is unchanged between rising LDAC edges. When CS is returned HIGH, the rising edge on CS must occur when SCLK is HIGH. Application of a rising CS edge when SCLK is LOW will cause one additional shift in the serial input shift register, corrupting the desired input data.
TIMING CONSIDERATIONS
The flexible interface of the DAC7731 can operate under a number of different scenarios as is required by a host controller. Critical timing for a 16-bit data transfer cycle is shown in the Interface Timing section of the Timing Charac­teristics. While this is the most common method of writing to the DAC7731, the device accepts two additional modes of data transfer from the host. These are byte transfer mode and continuous transfer mode.
CS
Most Significant Byte Least Significant Byte
Byte transfer mode is especially useful when an 8-bit host is communicating with the DAC. Data transfer can occur with­out requiring an additional general purpose I/O pin to control the CS input of the DAC in cycles of 16 clocks. A HIGH state on CS stops data from coming into and out of the internal shift register. This provides byte-wide support for 8-bit host processors. Figure 5 is an example of the timing cycle of such a data transfer.
The remaining data transfer mode accepted by the DAC7731 is continuous transfer. The CS of the DAC7731 can be tied LOW or held LOW by the controller for an indefinite number of serial clock cycles. Each clock cycle will transfer data into the DAC via SDI and out of the DAC on SDO. Care must be taken that the LDAC signal to the DAC(s) is timed correctly so that valid data is transferred into the DAC register on each rising LDAC edge. ("Valid data" refers to the serial data latched on each of the 16 rising SCLK edges prior to the occurrence of a rising LDAC signal.) The rising edge of LDAC must occur before the first rising SCLK edge of the following 16-bit
transfer. Figure 6 shows continuous transfer timing.
16-Bit Data Word
SCLK
SDI
SDO
LDAC
12 8 910
B15
B14 B13 B8 B7 B6 B0
Byte 1, Word N
A15 A14 A13 A8
Byte 1, Word N – 1
FIGURE 5. Byte-Wide Data Write Cycle.
CS
SCLK
SDI
1 2 16 1 2 16 1 2
B15 B14 B1 B0 C15 C14 C1 C0 D15 D14
16
Byte 2, Word N
A7
A6
Byte 2, Word N – 1
Word N Word N + 1 Word N + 2
A0
SDO
Word N – 1 Word N Word N + 1
LDAC
FIGURE 6. Continuous Transfer Control.
12
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C14C15B0B1B14B15A0A1A14A15
DAC7731
SBAS249
Page 13
DAISY-CHAINING USING SDO
Multiple DAC7731s can be connected to a single serial port by attaching each of their control inputs in parallel and daisy­chaining the SDO and SDI I/O's of each device. The SDO output of the DAC7731 is active when CS is LOW and can be left unconnected when not required for use in a daisy­chain configuration.
Once a data transfer cycle begins, new data is shifted into SDI and data currently residing in the shift register (from previous cycle, power-up, or reset command) is presented on SDO, MSB first. One data transfer cycle for each DAC7731 is required to update all devices in the chain. The first data cycle written into the chain will arrive at the last DAC7731 on the final cycle of the data transfer. Upon completion of the required number of data transfer cycles (one cycle per device), each DAC voltage output is updated with a rising edge on the LDAC inputs. Figure 8 shows the required timing to properly update two
From Host
Controller
DAC7731s in a daisy-chained configuration, as shown in Figure 7.
DAC RESET
The RST and RSTSEL inputs control the reset of the analog output. The reset command is level triggered by a low signal on RST. Once RST is LOW, the DAC output will begin settling to the mid-scale or min-scale code depending on the state of the RSTSEL input. A HIGH value on RSTSEL will cause V reset to the mid-scale code (8000 V
to min-scale (8000H). A change in the state of the RSTSEL
OUT
) and a LOW value will reset
H
input while RST is LOW will cause a corresponding change in the reset command selected internally and consequently change the output value of V
of the DAC. Note that a valid reset
OUT
signal also resets the input register of the DAC to the value specified by the state of RSTSEL.
OUT
To next DAC7731
to
DAC7731
V
1
CC
REF
2
OUT
REF
3
IN
REFADJ
4
V
5
REF
R
6
OFFSET
AGND
7
RFB2
8
RFB1
9
SJ
10
V
11
OUT
V
12
DD
First Device in Chain Second Device in Chain
V
REFEN
RSTSEL
SCLK
CS
SDO
SDI
LDAC
RST
NC
TEST
DGND
24
SS
23 22 21 20 19 18 17 16 15 14 13
FIGURE 7. DAC7731 Daisy-Chain Schematic.
SCLK
12 1216 16
DAC7731
V
1
CC
REF
2
OUT
REF
3
IN
REFADJ
4
V
5
REF
R
6
OFFSET
AGND
7
RFB2
8
RFB1
9
SJ
10
V
11
OUT
V
12
DD
LSBs latched LSBs latched
V
REFEN
RSTSEL
SCLK
CS
SDO
SDI
LDAC
RST
NC
TEST
DGND
24
SS
23 22 21 20 19 18 17 16 15 14 13
Both DAC V
are updated
OUT
's
CS
LDAC
First Data Transfer Cycle
SDI A15 A14 A0
Previous cycle word from host
(to DAC7731 B SDI)
SDO
XX X
FIGURE 8. DAC7731 Daisy-Chain Timing for Figure 7.
DAC7731
SBAS249
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B15 B14 B1 B0
A15 A14 A1 A0
13
Page 14
APPLICATIONS
REFADJ
V
REF
R
OFFSET
AGND
RFB2
RFB1
SJ
4
5
6
7
8
9
10
DAC7731
Optional Gain
Adjust
Optional Offset
Adjust
R
1
R
POT2
R
POT1
R
S
V
OADJ
(Other Connections Omitted
for Clarity)
+
I
SJ
GAIN AND OFFSET CALIBRATION
The architecture of the DAC7731 is designed in such a way as to allow for easily configurable offset and gain calibration using a minimum of external components. The DAC7731 has built-in feedback resistors and output amplifier summing points brought out of the package in order to make the absolute calibration possible. Figures 9 and 10 illustrate the relationship of offset and gain adjustments for the DAC7731 in a unipolar configuration and in a bipolar configuration,
respectively.
(+V
)
REF
+ Full Scale
1LSB
Gain Adjust
Rotates the Line
should be at +10V – 1LSB for the 0V to +10V or ±10V output range and +5V – 1LSB for the ±5V output range. Figure 11 shows the generalized external offset and gain adjustment circuitry using potentiometers.
Analog Output
Zero Scale
(AGND)
Offset Adjust Translates the Line
FIGURE 9. Relationship of Offset and Gain Adjustments for
+ Full Scale
Input =
0000
H
Analog Output
FIGURE 10. Relationship of Offset and Gain Adjustments for
When calibrating the DACs output, offset should be adjusted first to avoid first order interaction of adjustments. In unipolar mode, the DAC7731s offset is adjusted from code 0000 and for either bipolar mode, offset adjustments are made at code 8000 FFFF
H
for each configuration, where the output of the DAC
H
14
Input =
Full Scale Range
0000
H
Digital Input
V
= 0V to +10V Output Configuration.
OUT
(+V
or +V
REF
Input = 8000
– Full-Scale (–V
REF
OUT
/2)
Gain
Adjust
Rotates
the Line
Input =
FFFF
H
OR –V
REF
= –5V to +5V.)
REF
1LSB
Range
Full Scale
Digital Input
V
= –10V to +10V Output Configuration. (Same
OUT
Theory Applies for V
. Gain adjustment can then be made at code
H
/2)
Input = FFFF
H
Offset Adjust Translates the Line
FIGURE 11. Generalized External Calibration Circuitry for
OFFSET ADJUSTMENT
Offset adjustment is accomplished by introducing a small current into the summing junction (SJ) of the DAC7731. The voltage at SJ, or V tion of the DAC7731. See Table IV for the required pin strapping for a given configuration and the nominal values of
V
TABLE IV. Nominal VSJ versus V
The current level required to adjust the DAC7731s offset can be created by using a potentiometer divider as shown in Figure 11 Another alternative is to use a unipolar DAC in order to apply a voltage, V range applied to SJ will ensure offset adjustment coverage of the ±0.1% maximum offset specification of the DAC7731.
When in a unipolar configuration (V resistor, R a 0V to 10V V configurations, V
H
(±5V range), and circuit values chosen to match those given in Table V will provide symmetrical offset adjust. Please refer
to Figure 11 for component configuration.
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Gain and Symmetrical Offset Adjustment.
, is dependent on the output configura-
SJ
for each output range.
SJ
REFERENCE OUTPUT PIN STRAPPING V CONFIGURATION
Internal 0V to +10V to V Reference –10V to +10V NC NC to V
External 0V to V Reference –V
NOTE: (1) Voltage measured at V
CONFIGURATION R
–5V to +5V to AGND to V
REF
to V
REF
–V
/2 to V
REF
OFFSET
to V
REF REF
NC NC to V
/2 to AGND to V
for a given configuration.
SJ
OUT
RFB1 RFB2
to V
to V
OUT
OUT OUT
OUT
to V
OUT OUT
to V
OUT
to V
OUTVREF OUTVREF
to V
OUTVREF
+3.333V +1.666V
REF
REF
and Reference Configu-
ration.
, to the resistor RS. A ±2uA current
OADJ
= 5V), only a single
, is needed for symmetrical offset adjustment with
S
range. When in one of the two bipolar
OADJ
is either +3.333V (±10V range) or +1.666V
SJ
SJ
DAC7731
SBAS249
SJ
+5V
(1)
/2 /3 /6
Page 15
V
CC
REF
OUT
REF
IN
REFADJ V
REF
R
OFFSET
AGND RFB2 RFB1 SJ V
OUT
V
DD
V
SS
REFEN
RSTSEL
SCLK
CS
SDO
SDI
LDAC
RST
NC
TEST
DGND
1 2 3 4 5 6 7 8
9 10 11 12
24 23 22 21 20 19 18 17 16 15 14 13
DAC7731
100k
1.0µF
(Other connections omitted for clarity.)
Low-Pass Reference Filter
OUTPUT R CONFIGURATION RANGE OFFSET
0V to +10V 10K 0 2.5M ±2µA ±25mV
10V to +10V 10K 5K 1.5M ±2.2µA ±55mV5V to +5V 10K 20K 1M ±1.7µA ±21mV
POT2R1
R
I
S
SJ
NOMINAL
ADJUSTMENT
TABLE V. Recommended External Component Values for
Symmetrical Offset Adjustment (V
REF
= 10V).
Figure 12 illustrates the typical minimum offset adjustment ranges provided by forcing a current at SJ for a given output voltage configuration.
50
(mV)
25
OUT
typ
0
min (75% of typ) 0V to 10V and –5V to +5V
–25
V
OUT
Offset Adjustment at V
Configuration
OFFSET ADJUST RANGE
–10V to +10V V
typ
Configuration
min (75% of typ)
OUT
REF
ADJUST RANGE
40 30 20 10
Minimum REF
0
Adjustment (mV)
OUT
REF
Adjustment Range
10203040
0246810
OUT
Typical REF
Adjustment Range
OUT
OUT
REFADJ (V)
FIGURE 13. Internal Reference Adjustment Transfer Charac-
teristic.
VOLTAGE AT REFADJ REF
REFADJ = 0V 10V + 25mV (min)
REFADJ = 5V or NC
REFADJ = 10V 10V – 25mV (max)
NOTE: "NC" is "Not Connected"
(1)
VOLTAGE
OUT
10V
TABLE VI. Minimum Internal Reference Adjustment Range.
FIGURE 12. Offset Adjustment Transfer Characteristic.
GAIN ADJUSTMENT
When using the internal reference of the DAC7731, gain adjustment is performed by adjusting the devices internal reference voltage via the reference adjust pin, REFADJ. The effect of a reference voltage change on the gain of the DAC output can be seen in the generic equation (for unipolar configuration):
Where N is represented in decimal format and ranges from 0 to 65535.
REFADJ can be driven by a low impedance voltage source such as a unipolar, 0V to +10V DAC or a potentiometer (less than 100k), see Figure 11. Since the input impedance of REFADJ is typically 50k, the smaller the resistance of the potentiometer, the more linear the adjustment will be. A 10k potentiometer is suggested if linearity of the reference adjust­ment is of concern.
When the DAC7731s internal reference is not used, gain adjustments can be made via trimming the external refer­ence applied to the DAC at REF through using a potentiometer, unipolar DAC, or other means of precision voltage adjustment to control the voltage pre­sented to the DAC7731 by the external reference. Figure 13 and Table VI summarize the range of adjustment of the internal reference via REFADJ.
DAC7731
50
22011
ISJ (µA)
V
SBAS249
OUT
= V
REFIN
(N/65536)
. This can be accomplished
IN
NOISE PERFORMANCE
Increased noise performance of the DAC output can be achieved by filtering the voltage reference input to the DAC7731. Figure 14 shows a typical internal reference filter schematic. A low-pass filter applied between the REF increase noise immunity at the DAC and output amplifier. The REF taken in order to avoid overloading the internal reference output.
FIGURE 14. Filtering the Internal Reference.
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and REFIN pins can
OUT
pin can source a maximum of 50µA so care should be
OUT
15
Page 16
LAYOUT
A precision analog component requires careful layout, adequate bypassing, and clean, well-regulated power supplies. The DAC7731 offers separate digital and analog supplies, as it will often be used in close proximity with digital logic, microcontrollers, microprocessors, and digital signal processors. The more digital logic present in the design and the higher the switching speed, the more important it will become to separate the analog and digital ground and supply planes at the device.
Since the DAC7731 has both analog and digital ground pins, return currents can be better controlled and have less effect on the DAC output error. Ideally, AGND would be connected directly to an analog ground plane and DGND to the digital ground plane. The analog ground plane would be separate from the ground connection for the digital components until they were connected at the power-entry point of the system.
The voltages applied to V and low noise. Switching power supplies and DC/DC convert­ers will often have high-frequency glitches or spikes riding on the output voltage. In addition, digital components can create similar high-frequency spikes as their internal logic switches states. This noise can easily couple into the DAC output voltage through various paths between the power connec­tions and analog output.
In addition, a 1µF to 10µF bypass capacitor in parallel with a
0.1µF bypass capacitor is strongly recommended for each supply input. In some situations, additional bypassing may be required, such as a 100µF electrolytic capacitor or even a "Pi" filter made up of inductors and capacitors–all designed to essentially low-pass filter the analog supplies, removing any high frequency noise components.
and VSS should be well regulated
CC
16
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DAC7731
SBAS249
Page 17
PACKAGE DRAWING
MSSO002D – JANUARY 1995 – REVISED SEPTEMBER 2000
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,65
28
1
2,00 MAX
0,38 0,22
15
14
A
0,05 MIN
0,15
5,60 5,00
M
8,20 7,40
Seating Plane
0,10
0,15 NOM
Gage Plane
0°–8°
0,25
0,95 0,55
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150
14
6,50
6,50
5,905,90
2016
7,50
6,90
24
8,50
28
10,50
9,907,90
30
10,50
9,90
38
12,90
12,30
4040065 /D 09/00
DAC7731
SBAS249
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17
Page 18
IMPORTANT NOTICE
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty . Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty . Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third–party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party , or a license from TI under the patents or other intellectual property of TI.
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Copyright 2001, Texas Instruments Incorporated
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