The DAC1220 is a 20-bit digital-to-analog (D/A)
converter offering 20-bit monotonic performance over
the specified temperature range. It utilizes delta-sigma
technology to achieve inherently linear performance
in a small package at very-low power. The resolution
of the device can be programmed to 20 bits for fullscale, settling to 0.003% within 15ms typical, or 16
bits for full-scale, settling to 0.012% within 2ms max.
The output range is two times the external reference
voltage. On-chip calibration circuitry dramatically reduces low offset and gain errors.
X
IN
Clock Generator
Microcontroller
Instruction Register
Command Register
Data Register
Offset Register
Full-Scale Register
X
OUT
V
REF
Second-Order
∆∑
Modulator
The DAC1220 features a synchronous serial interface.
In single-converter applications, the serial interface
can be accomplished with just two wires, allowing
low-cost isolation. For multiple converters, a CS signal
allows for selection of the appropriate D/A converter.
The DAC1220 has been designed for closed-loop
control applications in the industrial process control
market and high-resolution applications in the test and
measurement market. It is also ideal for remote applications, battery-powered instruments, and isolated systems. The DAC1220 is available in a SSOP-16
package.
AVDDAGND
C
First-Order
Switched
Capacitor Filter
Second-Order
Continuous
Time Post Filter
1
V
OUT
C
2
SDIO
SCLK
International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111
Monotonicity16Bits
Monotonicity20-Bit Mode20Bits
Linearity Error±1
Unipolar Offset Error
Unipolar Offset Error Drift
Bipolar Zero Offset Error
Bipolar Zero Offset Drift
Gain Error
Gain Error Drift
Power Supply Rejection Ratioat DC, dB = –20log(∆V
ANALOG OUTPUT
Output Voltage
Output Current0.5mA
Capacitive Load500pF
Short-Circuit Current±20mA
Short-Circuit DurationGND or V
DYNAMIC PERFORMANCE
Settling Time
Output Noise Voltage0.1Hz to 10Hz1µVrms
REFERENCE INPUT
Input Voltage2.252.52.75V
Input Impedance100kΩ
DIGITAL INPUT/OUTPUT
Logic FamilyTTL-Compatible CMOS
Logic Levels (all except X
V
IH
V
IL
V
OH
V
OL
Input-Leakage Current±10µA
XIN Frequency Range (f
Data FormatUser ProgrammableOffset Two’s Complement
POWER SUPPLY REQUIREMENTS
Power Supply Voltage4.755.25V
Supply Current
Analog Current360µA
Digital Current140µA
Analog Current20-Bit Mode460µA
Digital Current20-Bit Mode140µA
Power Dissipation2.53.5mW
TEMPERATURE RANGE
Specified Performance–40+85°C
NOTES: (1) Valid from AGND + 20mV to AV
(4) Ideal output voltage, does not take into account gain and offset error. (5) Valid from AGND +20mV to AV
be twice the value indicated. For 16-bit mode, C
to T
MIN
, AVDD = DVDD = +5V, f
MAX
= 2.5MHz, V
XIN
= +2.5V, and 16-bit mode, unless otherwise noted.
REF
DAC1220E
(1)
(2)
(3)
(2)
(3)
(2)
(3)
(4)
(5)
V
= 20mV±4LSB
OUT
1ppm/°C
V
OUT
= V
REF
±1LSB
1ppm/°C
±10LSB
2ppm/°C
/∆VDD)60dB
OUT
02 • V
DD
Indefinite
REF
To ±0.012%1.82ms
20-Bit Mode, to ±0.003%15ms
)
IN
2.0DVDD +0.3V
–0.30.8V
IOH = –0.8mA3.6V
IOL = 1.6mA0.4V
)0.52.5MHz
XIN
or Straight Binary
20-Bit Mode3.0mW
Sleep Mode0.45mW
– 20mV, in the 16-bit mode. (2) Applies after calibration, in 16-bit mode. (3) Re-calibration can remove these errors.
Lead Temperature (soldering, 10s) ............................................... +300°C
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
θ
JA
) ..................................... +150°C
JMAX
SCLK
16
SDIO
15
CS
14
AGND
13
V
12
REF
11
V
OUT
C
10
2
9
C
1
(1)
+ 0.3V
DD
+ 0.3V
DD
– TA)/
JMAX
θ
JA
PINNAMEDESCRIPTION
1DV
2X
3X
4DGNDDigital Ground
5AV
6DNCDo Not Connect
7DNCDo Not Connect
8DNCDo Not Connect
9C
10C
11V
12V
13AGNDAnalog Ground
14CSChip Select Input
15SDIOSerial Data Input/Output
16SCLKClock Input for Serial Data Transfer
OUT
IN
OUT
REF
Digital Supply, +5V nominal
DD
System Clock Output (for Crystal)
System Clock Input
Analog Supply, +5V nominal
DD
Filter Capacitor, see text.
1
Filter Capacitor, see text.
2
Analog Output Voltage
Reference Input
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION
MAXIMUM
LINEARITYPACKAGESPECIFICATION
PRODUCT(LSB)PACKAGENUMBERRANGENUMBER
ERRORDRAWINGTEMPERATUREORDERINGTRANSPORT
DAC1220E±1SSOP-16322–40°C to +85°CDAC1220ERails
"""""DAC1220E/2K5Tape and Reel
NOTE: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 2500 pieces
of “DAC1220E/2K5” will get a single 2500-piece Tape and Reel.
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
The DAC1220 is a precision, high dynamic range, selfcalibrating, 20-bit, delta-sigma digital-to-analog converter.
It contains a second-order delta-sigma modulator, a firstorder switched-capacitor filter, a second-order continuoustime post filter, a microcontroller including the Instruction,
Command and Calibration registers, a serial interface, and a
clock generator circuit.
The design topology provides low system noise and good
power-supply rejection. The modulator frequency of the
delta-sigma D/A converter is controlled by the system clock.
The DAC1220 also includes complete onboard calibration
that can correct for internal offset and gain errors.
The calibration registers are fully readable and writable.
This feature allows for system calibration. The various
settings, modes, and registers of the DAC1220 are read or
written via a synchronous serial interface. This interface
operates as an externally clocked interface.
DEFINITION OF TERMS
Differential Nonlinearity Error—The differential
nonlinearity error is the difference between an actual step
width and the ideal value of 1 LSB. If the step width is
exactly 1 LSB, the differential nonlinearity error is zero.
A differential nonlinearity specification of less than 1 LSB
guarantees monotonicity.
Drift—The drift is the change in a parameter over temperature.
Full-Scale Range (FSR)—This is the magnitude of the
typical analog output voltage range which is 2 • V
For example, when the converter is configured with a 2.5V
reference, the full-scale range is 5.0V.
Gain Error—This error represents the difference in the
slope between the actual and ideal transfer functions.
Linearity Error—The linearity error is the deviation of the
actual transfer function from an ideal straight line between
the data end points.
Least Significant Bit (LSB) Weight—This is the ideal
change in voltage that the analog output will change with a
change in the digital input code of 1 LSB.
Monotonicity—Monotonicity assures that the analog output will increase or stay the same for increasing digital input
codes.
Offset Error—The offset error is the difference between
the expected and actual output, when the output is zero. The
value is calculated from measurements made when
V
= 20mV.
OUT
Settling Time—The settling time is the time it takes the
output to settle to its new value after the digital code has
been changed.
f
—The frequency of the crystal oscillator or CMOS-
XIN
compatible input signal at the XIN input of the DAC1220.
REF
ANALOG OPERATION
The system clock is divided down to provide the sample
clock for the modulator. The sample clock is used by the
modulator to convert the multi-bit digital input into a one-bit
digital output stream. The use of a 1-bit DAC provides
inherent linearity. The digital output stream is then converted into an analog signal via the 1-bit DAC and then
filtered by the 1st-order switched capacitor filter.
The output of the switched-capacitor filter feeds into the
continuous time filter. The continuous time filter uses external capacitors connected between the C1, C2, V
V
pins to adjust the settling time. The connections for the
OUT
capacitors are shown in Figure 1 (C1 connects between the
V
and C1 pins, and C2 connects between the V
REF
pins).
DAC1220
FIGURE 1. External Capacitor Connections.
.
CAPACITOR16-BIT MODE20-BIT MODE
C
1
C
2
TABLE I. External Capacitor Values.
CALIBRATION
The DAC1220 offers a self-calibration mode which automatically calibrates the output offset and gain. The calibration is performed once and then normal operation is resumed. In general, calibration is recommended immediately
after power-on and whenever there is a “significant” change
in the operating environment. The amount of change which
should cause a re-calibration is dependent on the application. Where high accuracy is important, re-calibration should
be done on changes in temperature and power supply.
After a calibration has been accomplished, the Offset Calibration Register (OCR) and the Full-Scale Calibration Register (FCR) contain the results of the calibration.
Note that the values in the calibration registers will vary
from configuration-to-configuration and from part to part.
V
12
REF
V
11
OUT
C
10
2
C
9
1
2.2nF10nF
0.22nF3.3nF
C
2
OUT
C
1
REF
and C
, and
2
®
5
Self-Calibration
A self-calibration is performed after the bits “01” have been
written to the Command Register Operation Mode bits
(MD1 through MD0) and a “1” has been written to the
Command Register sample-and-hold bit (SH). This initiates
a self-calibration on the next clock cycle. The offset correction code is determined by a repeated sequence of autozeroing the calibration comparator to the offset reference
and then comparing the DAC output to the offset reference
value. The end result is then averaged, Offset Two’s Complement adjusted, and placed in the OCR. The gain correction
is done in a similar fashion except the correction is done
against V
to eliminate common-mode errors. The FCR
REF
result represents the gain code and is not Offset Two’s
Complement adjusted.
The calibration function takes between 300ms and 500ms to
complete (for f
= 2.5MHz). Once calibration is initiated,
XIN
further writing of register bits is disabled until calibration
completes. The status of calibration can be verified by
reading the status of the Command Register Operation Mode
bits (MD1 through MD0). These bits will return to normal
mode “00” when calibration is complete.
Self-calibration can be done with the output isolated or
connected. This is done by setting (output connected) or
clearing (output isolated) the CALPIN bit in the CMR
register.
Output Mode
The DAC1220 can operate in either 16-bit mode or 20-bit
mode. The mode is determined by setting (20-bit) or clearing
(16-bit) the RES bit in the CMR register.
The output of the DAC1220 can be synchronously reset. By
setting the CLR bit in the CMR, the data input register is
cleared to zero. This will result in an output of 0V when
DF = 1 or V
when DF = 0, assuming no calibration errors.
REF
The settling time is determined by the DISF, RES, and
ADPT bits of the command register. The default state of
DISF = 0 and ADPT = 0 enables fast settling, unless the
output step is small (≈ 40mV). However, the DAC1220 can
be forced to always use fast settling if the ADPT bit is
set to 1. If DISF is set to 1, all fast settling is disabled.
The SH bit of the CMR register determines if C2 is internally
connected to V
nected from V
. By clearing the SH bit, C2 is discon-
REF
.
REF
The CRST bit of the CMR register can be used to reset the
offset and calibration registers. By setting the CRST bit, the
contents of the calibration register are reset to 0.
REFERENCE INPUT
The reference input voltage of 2.5V can be directly connected to V
REF
.
The recommended reference circuit for the DAC1220 is
shown in Figure 2.
2
31
+5V
0.10µF
7
OPA336
4
100Ω
6
+
10µF0.1µF
To V
REF
Pin
+5V
100kΩ
REF1004-2.5
10kΩ
+
10µF0.10µF
FIGURE 2. Recommended External Voltage Reference Circuit for Best Low Noise Operation with the DAC1220.
®
DAC1220
6
DIGITAL OPERATION
SYSTEM CONFIGURATION
The DAC1220 is controlled by 8-bit instruction codes (INSR)
and 16-bit command codes (CMR) via the serial interface,
which is externally clocked.
The DAC1220 Microcontroller (MC) consists of an ALU
and a register bank. The MC has three states: power-on reset,
calibration, and normal operation. In the power-on reset
state, the MC resets all the registers to their default states. In
the calibration state, the MC performs offset and gain selfcalibration. In the normal state, the MC performs D/A
conversions.
The DAC1220 has five internal registers, as shown in
Table II. Two of these, the Instruction Register (INSR) and
the Command Register (CMR), control the operation of the
converter. The Instruction register utilizes an 8-bit instruction code to control the serial interface to determine whether
the next operation is either a read or a write, to control the
word length and to select the appropriate register to
read/write. Communication with the DAC1220 is controlled
via the INSR. The INSR is written as the first part of each
serial communication. The instruction that is sent determines
what type of communication will occur next. It is not
possible to read the INSR. The Command register has a 16bit command code to set up the DAC1220 operation mode,
resolution mode, settling mode and data format. The Data
Input Register (DIR) contains the value for the next conversion. The Offset and Full-Scale Calibration Registers (OCR
and FCR) contain data used for correcting the internal
conversion value after it is placed into the DIR. The data in
these two registers may be the result of a calibration routine,
or they may be values which have been written directly via
the serial interface.
Each serial communication starts with the 8 bits of the INSR
being sent to the DAC1220. The read/write bit, the number
of bytes n, and the starting register address are defined, as
shown in Table III. When the n bytes have been transferred,
the instruction is complete. A new communication cycle is
initiated by sending a new INSR (under restrictions outlined
in the Interfacing section).
R/W (Read/Write) Bit—For a write operation to occur, this
bit of the INSR must be 0. For a read, this bit must be 1, as
follows:
R/W
0Write
1Read
MB1, MB0 (Multiple Bytes) Bits—These two bits are used
to control the word length (number of bytes) of the read or
write operation, as follows:
MB1MB0
001 Byte
012 Bytes
103 Bytes
A3 – A0 (Address) Bits—These four bits select the beginning register location that will be read from or written to, as
shown in Table III. Each subsequent byte will be read from
or written to the next higher location (increment address).
If the BD bit in the Command register is set, each subsequent byte will be read from or written to the next lower
location (decrement address). This bit does not affect INSR
register or the write operation for the CMR register. If the
next location is reserved in Table III, the results are unknown. Reading or writing continues until the number of
bytes specified by MB1 and MB0 have been transferred.
The CMR controls all of the functionality of the DAC1220.
The new configuration is latched in on the negative transition of SCLK for the last bit of the last byte of data being
written to the command register. The organization of the
CMR is comprised of 16 bits of information in 2 bytes of 8
bits each.
MSBByte 1
ADPT CALPINSH010CRST0
Byte 0LSB
RESCLRDFDISFBDMSBMD1MD0
NOTE: In order to obtain optimal performance, the default bit states for
the Command Register should be used (refer to Table VI). The only exception is the SH bit—the default bit state is 0, however, the bit should be
set to 1 for optimal performance.
TABLE V. Command Register.
ADPT (Adaptive Filter Disable) Bit—The ADPT bit determines if the adaptive filter is enabled or disabled. When
the Adaptive Filter is enabled, the DAC1220 does fast
settling only when there is an output step of larger than
≈ 40mV. For small changes in the data, fast settling is not
necessary. When ADPT = 1, the Adaptive Filter is disabled
and the DAC1220 will not look at the size of a step to
determine the necessity of using fast settling. In either case,
fast settling can be defeated if DISF = 1.
RES (Resolution) Bit—The Resolution bit selects either
16-bit or 20-bit resolution.
RES
016-BitDefault
120-Bit
CLR (Clear) Bit—The CLR bit synchronously resets the
data input register to zero. The analog output will be based
on the DF bit—if 1, the output will be 0V; if 0, the output
will be V
.
REF
CLR
0OFFDefault
1ON
DF (Data Format) Bit—The DF bit controls the format of
the input data, shown in hexadecimal (either Offset Two’s
Complement or Straight Binary), as shown:
Input Code
Offset Two'sStraight
ComplementBinaryV
DF = 0DF = 1
(default)
800000000
00008000V
7FFFFFFF2 • V
OUT
REF
REF
ADPT
0Enabled (default)
1Disabled
CALPIN (Calibration Pin) Bit—The Calibration Pin bit
determines if the output is isolated or connected during
calibration.
CALPIN
0Output IsolatedDefault
1Output Connected
SH (Sample/Hold) Bit —The Sample-and-Hold bit determines if C2 is internally connected to V
. For best perfor-
REF
mance, it is recommended to set this bit to 1.
SH
0DisconnectedDefault
1ConnectedRecommended
CRST (Calibration Reset) Bit—The CRST bit resets the
offset and full-scale calibration registers.
CRST
0OFFDefault
1Reset
DISF (Disable Fast Settling) Bit—The DISF bit disables
the fast settling option. If this bit is zero, the fast settling
performance is determined by the ADPT bit, the RES bit,
and the ADPT bit.
DISF
0Fast Settling (default)
1Disable Fast Settling
BD (Byte Order) Bit—The BD bit controls the order in
which bytes of data are transferred (either most significant
byte first (MSBF) or least significant byte first (LSBF)), as
shown:
Care must be observed in reading the Command Register if
the state of the BD bit is unknown. If a two byte read is
started at address 0100 with BD = 0, it will read the contents
at address 0100, then 0101. However, if BD = 1, it will read
from 0100, then 0011. If the BD bit is unknown, all reads of
the command register are best performed as read commands
of one byte.
®
DAC1220
8
MSB (Bit Order) Bit—The MSB bit controls the order in
which bits within a byte of data are read or written (either
most significant bit first or least significant bit first) as
follows:
MSB
0MSB-FirstDefault
1LSB-First
MD1 - MD0 (Operating Mode) Bits—The Operating Mode
bits control the calibration functions of the DAC1220. The
Normal mode is used to perform conversions. The SelfCalibration mode is a one-step calibration sequence that
calibrates both the offset and full scale.
MD1MD0
00Normal Mode
01Self-Cal
10Sleep
11X
Offset Calibration Register (OCR)
The OCR is a 24-bit register containing the offset correction
factor that is used to apply a correction to the digital input
before it is transferred to the modulator. The results of the
self-calibration process will be written to this register.
The OCR is both readable and writable via the serial interface. For applications requiring a more accurate calibration,
a calibration can be performed, the results averaged, and a
more precise offset calibration value written back to the
OCR.
The actual OCR value after calibration will change from part
to part and with
configuration, temperature, and power supply.
In addition, be aware that the contents of the OCR are not
used to directly correct the digital input. Rather, the correction is a function of the OCR value. This function is linear
and two known points can be used as a basis for interpolating intermediate values for the OCR.
The results of calibration are averaged, Offset Two's Complement adjusted, and placed in the OCR.
Full-Scale Calibration Register (FCR)
The FCR is a 24-bit register which contains the full-scale
correction factor that is applied to the digital input before it
is transferred to the modulator.
The contents of this register
will be the result of a self-calibration, or written to by the
user.
The FCR is both readable and writable via the serial interface. For applications requiring an accurate system calibration, a system calibration can be performed, the results
averaged, and a more precise value written back to the FCR.
The actual FCR value after calibration will change from part
to part and with configuration, temperature, and power
supply.
In addition, be aware that the contents of the FCR are not
used to directly correct the digital input. Rather, the correction is a function of the FCR value. This function is linear
and two known points can be used as a basis for interpolating intermediate values for the FCR. The contents of the
FCR are in unsigned binary format. This is not affected by
the DF bit in the Command register.
MSBByte 2
FCR23 FCR22 FCR21 FCR20 FCR19 FCR18 FCR17 FCR16
Byte 1
FCR15 FCR14 FCR13 FCR12 FCR11 FCR10 FCR9FCR8
Byte 0LSB
FCR7FCR6FCR5FCR4FCR3FCR2FCR1FCR0
TABLE VII. Full-Scale Calibration Register.
Data Input Register (DIR)
The DIR is a 24-bit register which contains the digital input
value (see Table VIII). The register is latched on the falling
edge of the last bit of the last byte sent. The contents of the
DIR are then loaded into the modulator. This means that the
DIR register can be updated after sending 1, 2, or 3 bytes,
which is determined by the MB1 and MB0 bits in the
Instruction Register. The contents of the DIR can be Offset
Two’s Complement or Straight Binary.
MSBByte 2
OCR23 OCR22 OCR21 OCR20 OCR19 OCR18 OCR17 OCR16
Byte 1
OCR15 OCR14 OCR13 OCR12 OCR11 OCR10 OCR9OCR8
Byte 0
OCR7OCR6OCR5OCR4OCR3OCR2OCR1OCR0
LSB
TABLE VI. Offset Calibration Register.
MSBByte 2
DIR23DIR22 DIR21 DIR20 DIR19 DIR18DIR17 DIR16
Byte 1
DIR15DIR14 DIR13 DIR12 DIR11 DIR10DIR9DIR8
Byte 0LSB
DIR7DIR6DIR5DIR4DIR3DIR2DIR1DIR0
TABLE VIII. Data Input Register.
®
9
SLEEP MODE
The Sleep Mode is entered after the bit combination 10 has
been written to the CMR Operation Mode bits (MD1 and
MD0). This mode ends when these bits are changed to a
value other than 10.
Communication with the DAC1220 can continue during
Sleep Mode. When a new mode (other than Sleep) has been
entered, the DAC1220 will execute a very brief internal
power-up sequence of the analog and digital circuitry. In
addition, the settling of the external V
and other circuitry
REF
must be taken into account to determine the amount of time
required to resume normal operation.
The output is turned off in sleep mode.
SERIAL INTERFACE
The DAC1220 includes a flexible serial interface which can
be connected to microcontrollers and digital signal processors in a variety of ways. Along with this flexibility, there is
also a good deal of complexity. This section describes the
trade-offs between the different types of interfacing methods
in a top-down approach—starting with the overall flow and
control of serial data, moving to specific interface examples,
and then providing information on various issues related to
the serial interface.
Reset, Power-On Reset and Brown-Out
The DAC1220 contains an internal power-on reset circuit. If
the power supply ramp rate is greater than 50mV/ms, this
circuit will be adequate to ensure the device powers up
correctly. Due to oscillator settling considerations, communication to and from the DAC1220 should not occur for at
least 25ms after power is stable.
If this requirement cannot be met or if the circuit has brownout considerations, the timing diagram of Figure 3 can be
used to reset the DAC1220. This accomplishes the reset by
controlling the duty cycle of the SCLK input.
Sleep mode is the default state after power on or reset. The
output is high impedance during sleep mode.
I/O Recovery
If serial communication stops during an instruction or data
transfer for longer than 100ms (for f
= 2.5MHz), the
XIN
DAC1220 will reset its serial interface. This will not affect
the internal registers. The main controller must not continue
the transfer after this event, but must restart the transfer from
the beginning. This feature is very useful if the main controller can be reset at any point. After reset, simply wait 200ms
(for f
= 2.5MHz) before starting serial communication.
XIN
Isolation
The serial interface of the DAC1220 provides for simple
isolation methods. An example of an isolated two-wire
interface is shown in Figure 4.
t
2
SCLK
t
1
FIGURE 3. Resetting the DAC1220.
DV
DD
C
1
12pF
XTAL
C
2
12pF
AV
DD
V
REF
t1: > 512 • t
t2: > 10 • t
t3: > 1024 • t
t4: ≥ 2048 • t
P1.1
P1.0
Reset On
t
2
t
3
DAC1220
DV
1
DD
X
2
OUT
X
3
IN
4
DGND
5
AV
DD
6
DNC
7
DNC
8
DNC
SCLK
SDIO
CS
AGND
V
REF
V
OUT
C
2
C
1
t
4
16
15
14
13
12
11
10
9
Falling Edge
C
2
Isolated
Power
Opto
Coupler
Opto
Coupler
V
OUT
C
1
< 800 • t
< 1800 • t
< 2400 • t
8051
= Isolated
= DGND
= AGND
XIN
XIN
XIN
XIN
XIN
XIN
XIN
FIGURE 4. Isolation for Two-Wire Interface
®
DAC1220
10
Using CS
The serial interface may make use of the CS signal, or this
input may simply be tied LOW. There are several issues
associated with choosing to do one or the other. The CS
signal does not directly control the tri-state condition of the
SDIO output. These signals are normally in the tri-state
condition. They only become active when serial data is
being transmitted from the DAC1220. If the DAC1220 is in
the middle of a serial transfer and the SDIO is an output,
TIMING
The maximum serial clock frequency cannot exceed the
DAC1220 XIN frequency divided by 10. Table IX and
Figures 5 through 9 define the basic digital timing characteristics of the DAC1220. Figure 5 and the associated timing
symbols apply to the XIN input signal. Figures 6 through 9
and associated timing symbols apply to the serial interface
signals (SCLK, SDIO, and CS). The serial interface is
discussed in detail in the Serial Interface section.
taking CS HIGH will not tri-state the output signal.
If there are multiple serial peripherals utilizing the same
serial I/O lines and communication may occur with any
peripheral at any time, the CS signal must be used. The CS
signal is then used to enable communication with the
DAC1220.
SYMBOLDESCRIPTIONMINNOMMAXUNITS
f
XIN
t
XIN
t
1
t
2
t
3
t
4
t
5
t
6
t
7
t
8
t
9
t
10
t
11
t
12
t
13
t
14
t
15
NOTE: (1) With 10pF load.
Data In Valid to SCLK Falling Edge (Setup)40ns
SCLK Falling Edge to Data In Not Valid (Hold)20ns
Data Out Valid After Rising Edge of SCLK (Hold)0ns
SCLK Rising Edge to New Data Out Valid (Delay)
Falling Edge of Last SCLK for INSR to Rising Edge of First13 • t
Falling Edge of CS to Rising Edge of SCLK11 • t
Falling Edge of Last SCLK for INSR to SDIO as Output8 • t
SDIO as Output to Rising Edge of First SCLK for Register Data4 • t
Falling Edge of Last SCLK for Register Data to SDIO Tri-State4 • t
Falling Edge of Last SCLK for Register Data to Rising Edge41 • t
of First SCLK of next INSR (CS Tied LOW)
Rising Edge of CS to Falling Edge of CS (Using CS)22 • t
XIN Clock Frequency12.5MHz
XIN Clock Period4001000ns
XIN Clock High0.4 • t
XIN Clock LOW0.4 • t
SCLK HIGH5 • t
SCLK LOW5 • t
(1)
SCLK for Register Datans
XIN
XIN
XIN
XIN
XIN
XIN
XIN
XIN
XIN
XIN
XIN
50ns
10 • t
XIN
6 • t
XIN
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
TABLE IX. Digital Timing Characteristics.
®
11
t
3
t
t
XIN
t
t
1
2
X
IN
SCLK
SDIO
4
t
5
t
6
t
7
t
8
FIGURE 5. XIN Clock Timing.
SCLK
SDIO
SDIO
FIGURE 7. Serial Interface Timing (CS LOW).
CS
SCLK
SDIO
t
10
t
9
Write Register Data
Read Register Data
t
9
Write Register Data
FIGURE 6. Serial Input/Output Timing.
t
14
IN7IN0IN1INMIN1IN0IN7
IN7OUT0OUT1OUTMIN1IN0IN7
t
15
t
10
IN7IN0IN1IN0IN1IN7INM
SDIO
Read Register Data
FIGURE 8. Serial Interface Timing (using CS).
CS
t
SCLK
SDIO
10
IN7
SDIO is an inputSDIO is an output
FIGURE 9. SDIO Input to Output Transition Timing.
IN0
IN7OUT0OUT1IN0IN1IN7OUTM
t
t
11
12
t
13
OUT MSBOUT0
t
9
®
DAC1220
12
From Read
flowchart
To Write
flowchart
Start
Writing
CS
state
LOW
External device
generates 8
serial clock cycles
and transmits
instruction register
data via SDIO
External device
generates n
serial clock cycles
and transmits
specified
register data
via SDIO
More
instructions?
CS taken HIGH
for t
periods
15
minimum
(or CS tied LOW)
HIGH
CS
state
LOW
YesNo
Is next
instruction
a read?
HIGH
Start
Reading
CS
state
HIGH
LOW
External device
generates 8 serial
clock cycles and
transmits instruction
register data
via SDIO
SDIO input to
output transition
External device
generates n serial
clock cycles and
receives specified
register data via SDIO
SDIO transitions to
tri-state condition
CS taken HIGH
periods
for t
15
minimum
(or CS tied LOW)
CS
state
LOW
HIGH
No
End
Yes
To Read
flowchart
FIGURE 10. Flowchart for Writing and Reading Register Data.
More
instructions?
No
End
YesNo
Is next
instruction
a Write?
Yes
To Write
flowchart
13
®
LAYOUT
POWER SUPPLIES
The DAC1220 requires the digital supply (DVDD) to be no
greater than the analog supply (AVDD) +0.3V. In the majority of systems, this means that the analog supply must come
up first, followed by the digital supply and V
observe this condition could cause permanent damage to the
DAC1220.
Inputs to the DAC1220, such as SDIO or V
be present before the analog and digital supplies are on.
Violating this condition could cause latch-up. If these signals are present before the supplies are on, series resistors
should be used to limit the input current.
The best scheme is to power the analog section of the design
and AVDD of the DAC1220 from one +5V supply, and the
digital section (and DVDD) from a separate +5V supply. The
analog supply should come up first. This will ensure that
SCLK, SDIO, CS and V
do not exceed AVDD, that the
REF
digital inputs are present only after AVDD has been established, and that they do not exceed DVDD.
The analog supply should be well regulated and low noise.
For designs requiring very high resolution from the DAC1220,
power supply rejection will be a concern. See the “PSRR vs
Frequency” curve in the Typical Performance Curves section of this data sheet for more information.
The requirements for the digital supply are not as strict.
However, high frequency noise on DVDD can capacitively
couple into the analog portion of the DAC1220. This noise
can originate from switching power supplies, very fast
microprocessors, or digital signal processors.
If one supply must be used to power the DAC1220, the
AVDD supply should be used to power DVDD. This connection can be made via a 10Ω resistor which, along with the
decoupling capacitors, will provide some filtering between
DVDD and AVDD. In some systems, a direct connection can
be made. Experimentation may be the best way to determine
the appropriate connection between AVDD and DVDD.
. Failure to
REF
, should not
REF
GROUNDING
The analog and digital sections of the design should be
carefully and cleanly partitioned. Each section should have
its own ground plane with no overlap between them. AGND
should be connected to the analog ground plane, as well as
all other analog grounds. DGND should be connected to the
digital ground plane, and all digital signals referenced to this
plane.
The DAC1220 pinout is such that the converter is cleanly
separated into an analog and digital portion. This should
allow simple layout of the analog and digital sections of the
design.
For a single converter system, AGND and DGND of the
DAC1220 should be connected together, underneath the
converter. Do not join the ground planes. Instead, connect
the two with a moderate signal trace. For multiple converters, connect the two ground planes at one location, as central
to all of the converters as possible. In some cases, experimentation may be required to find the best point to connect
the two planes together. The printed circuit board can be
designed to provide different analog/digital ground connections via short jumpers. The initial prototype can be used to
establish which connection works best.
DECOUPLING
Good decoupling practices should be used for the DAC1220
and for all components in the design. All decoupling capacitors, and specifically the 0.1µF ceramic capacitors, should
be placed as close as possible to the pin being decoupled. A
1µF to 10µF capacitor, in parallel with a 0.1µF ceramic
capacitor, should be used to decouple AVDD to AGND. At
a minimum, a 0.1µF ceramic capacitor should be used to
decouple DVDD to DGND, as well as for the digital supply
on each digital component.
®
DAC1220
14
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