Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Electrical Characteristics
Max. Time
Tripped
I
hold
I
trip
To Tr i p
Power
Resistance
Dissipation
Model
Amperes Ohms Amperes Seconds Watts
V max. I max.
at 23 °C at 23 °C at 23 °C at 23 °C at 23 °C
Volts Amps
Hold Trip RMin.
R
1Max. Typ.
MF-MSMF010 60.0 40 0.10 0.30 0.70 15.00 0.5 1.50 0.8
MF-MSMF014 60.0 40 0.14 0.34 0.40 6.50 1.5 0.15 0.8
MF-MSMF020 30.0 80 0.20 0.40 0.40 6.00 6.0 0.06 0.8
MF-MSMF030 30.0 10 0.30 0.60 0.30 3.00 8.0 0.10 0.8
MF-MSMF050 15.0 100 0.50 1.00 0.15 1.00 8.0 0.15 0.8
MF-MSMF075 13.2 100 0.75 1.50 0.11 0.45 8.0 0.20 0.8
MF-MSMF075/24 24.0 40 0.75 1.50 0.11 0.45 8.0 0.20 0.8
MF-MSMF110 6.0 100 1.10 2.20 0.04 0.21 8.0 0.30 0.8
MF-MSMF110/16 16.0 100 1.10 2.20 0.04 0.21 8.0 0.30 0.8
MF-MSMF125 6.0 100 1.25 2.50 0.035 0.14 8.0 0.40 0.8
MF-MSMF150 6.0 100 1.50 3.00 0.03 0.120 8.0 0.5 0.8
MF-MSMF160 8.0 100 1.60 2.80 0.035 0.099 8.0 2.0 0.8
MF-MSMF200 6.0 100 2.00 4.00 0.020 0.100 8.0 3.0 0.8
MF-MSMF250/16 16.0 100 2.50 5.00 0.015 0.100 8.0 5.0 0.8
MF-MSMF260 6.0 100 2.60 5.20 0.015 0.080 8.0 5.0 0.8
Operating Temperature ......................................-40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State ................................................125 °C
Passive Aging......................................................+85 °C, 1000 hours ....................................±5 % typical resistance change
Humidity Aging....................................................+85 °C, 85 % R.H. 1000 hours ..................±5 % typical resistance change
Thermal Shock ....................................................+85 °C to -40 °C, 20 times ........................±10 % typical resistance change
Solvent Resistance ............................................MIL-STD-202, Method 215 ........................No change
Vibration ..............................................................MIL-STD-883C, Method 2007.1, ................No change
Condition A
Environmental Characteristics
Test Test Conditions Accept/Reject Criteria
Visual/Mech.....................................Verify dimensions and materials ....................................Per MF physical description
Resistance ......................................In still air @ 23 °C............................................................Rmin ≤ R ≤ R1max
Time to Trip ....................................At specified current, Vmax, 23 °C ..................................T ≤ max. time to trip (seconds)
Hold Current ..................................30 min. at Ihold ..............................................................No trip
Trip Cycle Life ................................Vmax, Imax, 100 cycles ..................................................No arcing or burning
Trip Endurance................................Vmax, 48 hours ..............................................................No arcing or burning
Solderability ....................................ANSI/J-STD-002 ............................................................95 % min. coverage
UL File Number ..................................E174545
http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545
CSA File Number................................CA110338
http://directories.csa-international.org/ Under “Certification Record” and “File Number” enter 110338-0-000
TÜV Certificate Number......................R 02057213
http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213
Test Procedures And Requirements For Model MF-MSMF Series
MF-MSMF Series - PTC Resettable Fuses
Features
■ 100 % compatible with all previous
generations of 1812 SMT devices
■ Compatible with Pb and Pb-free solder
reflow profiles
■ Surface mount packaging for automated
assembly
■ Agency recognition:
Applications
High Density Circuit Board Applications:
■ Hard disk drives
■ PC motherboards
■ PC peripherals
■ Point-of-sale (POS) equipment
■ PCMCIA cards
■ USB ports