Billion MD1000 User Manual

Billion ZigBee Module

User Manual

(MD1000)

DESCRIPTION

The MD1000 module is a ZigBee™ network solution that integrates a 2.4Ghz, IEEE

802.15.4-compliant transceiver with a 32 bit ARM® Cortex M3microprocessor. It contains
integrated Flash and RAM memory and peripherals of use to designers of ZigBee-based
applications.

The transceiver utilized an efficient architecture in which the integrated receiver channel
filtering allows for co-existence with other communication standards in the 2.4Ghz
spectrum such as Wi-Fi and Bluetooth. An optional high performance radio mode (boost
mode) is software selectable to boost dynamic range by a further 8dB. The highly
integrated antenna, power regulator, and Xtal keep the external component count low. The
internal PCB traced antenna and an external U.FL connector port is user selectable. This is
maximum the flexibility for the designer to minimize the cost or maximize the system
performance.
The EM357 has 192kB of embedded Flash memory and 12kB of integrated RAM for data
and program storage. The EM357 software stack employs an effective wear-leveling
algorithm in order to optimize the lifetime of the embedded Flash.

To support user-defined application, a number of peripherals such as GPIO, UART, SPI,
I2C, ADC, and general purpose timers are integrated. Also, an integrated voltage regulator,
power-on-reset circuitry, sleep timer, and low-power sleep modes are available. The deep
sleep mode draws less than 2uA, allowing products to achieve long battery life. The
equipped internal watch-dog timer allows the system to be reactivated once the system go
into a dead-lock state. This mechanism makes the system more reliable and available.

Target application for the MD1000 includes:

• Home automation and control

• Building automation and control

• Smart energy monitoring and control

• Tele-healthcare

• Asset tracking

The information of this document is subject to change without prior notice.

GENERAL FEATURES



Ember™ EM357 platform



192KB Flash memory, with option read protection



12KB SRAM



32-bit ARM® Cortex M3 microprocessor



24 general purpose I/O ports



DMA-SPI, I2C and UART interfaces



Integrated 12-bit resolution ADC



Designed for EmberZNet ZigBee Pro compliant networks



Miniature footprint: 2cm x 3cm



Integrated PCB trace antenna and U.FL external antenna connector



16 RF channels



Over indoor 30m and outdoor visual contact 100m of range



JTAG interface



AES 128-bit encryption



Low power consumption



Constant RF out power over 2.1~3.6 V voltage range



FCC and NCC certified



RoHS compliant

Product Specification

Chip Set Ember EM357 SoC

Operation Voltage 2.1~3.6V

Network Standard IEEE 802.15.4

Modulation DSSS PHY employing Offset-QPSK

Network Architectures Star or Mesh

Data Rate 250Kbps

Integrated Memory 192KB of Flash, 12KB of SRAM

Power Consumption TX: under 40mA, RX: under 40mA

Deep sleep: under 2uA

Watchdog Internal watchdog timer and power-on-reset circuitry

Encryption Integrated 128-bit AES encryption accelerator

Operating Frequency Band 2.405Ghz ~ 2.480Ghz (16 Channels with 5Mhz wide)

Antenna Type 1. Internal PCB Traced Planar Inverted-F Antenna

2. U.FL Connector for External Antenna

TX Output Power Max. +3dBm (+8dBm in Boost mode) , Min. -43dbm

RX Sensitivity Typical -100dBm(-101dBm in Boost mode) at 1% packet error rate

Operating Temperature (Ambient) -40 °C ~ +85 °C

Humidity (Non-condensing) 0~95% RH

I/O PIN ASSIGNMENT

Pin # Name Direction

Description

1 GND Ground Ground

2 NC NC No connection

3 GND Ground Ground

4 GND Ground Ground

5 GND Ground Ground

6 NC NC No connection

7 VCC Power 3.3V power supply input (2.1V~3.6V)

8 VCC Power 3.3V power supply input (2.1V~3.6V)

9 nReset I Reset input (>26usec, active low)

10 PC5 I/O GPIO

11 PC6 I/O GPIO

12 PC7 O ZigBee status LED output (current: 4mA)

13 PA7 I/O GPIO

14 PB3 I UART CTS input

15 GND Ground Ground

16 GND Ground Ground

17 PB4 O UART RTS output

18 PA0 O SC2MOSI (OTA)

19 PA1 I SC2MISO (OTA)

20 PA2 O SC2SCLK (OTA)

21 PA3 O SC2nSSEL (OTA)

22 PA4 I/O GPIO

23 PA5 I/O GPIO

24 PA6 I/O GPIO

25 PB1 O UART TXD output

26 PB2 I UART RXD input

27 JTCK I JTAG JTCK

28 JTDO-PC2 O JTAG JTDO

29 JTDI-PC3 I JTAG JTDI

30 GND Ground Ground

31 GND Ground Ground

32 JTMS-PC4 I JTAG JTMS

33 PB0 I/O GPIO

34 PC1 I/O GPIO

35 JRST-PC0 I JTAG JRST

36 NC NC No connection

37 PB6 I ZigBee WPS input

38 VCC Power 3.3V power supply input

39 ANT_0 I

Internal Antenna: ANT_0 = High, ANT_1 = Low input (default)
External Antenna: ANT_0 = Low, ANT_1 = High input

Pin # Name Direction Description

40 ANT_1 I

Internal Antenna: ANT_0 = High, ANT_1 = Low input (default)
External Antenna: ANT_0 = Low, ANT_1 = High input

41 GND Ground Ground

42 GND Ground Ground

43 GND Ground Ground

44 NC NC No connection

45 GND Ground Ground

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings

Parameter

Min. Typ. Max. Unit

Power supply voltage -0.3

3.6 V

Voltage on any digital pin -0.3

VCC + 0.3

Max 3.6

V

Operation temperature range -40

85 °C

Storage temperature range -40

125 °C

Note: Exceeding the maximum ratings may cause permanent damage to the module or devices.

Operating Conditions

Paramete

r Min. Typ. Max. Unit

Power supply voltage 2.1

3.6 V

Input current for logic 0

-0.5 µA

Input current for logic 1

0.5 µA

Input voltage for logic 0 0

20% VCC

V

Input voltage for logic 1 80% VCC

VCC V

Output voltage for logic 0 0

18% VCC

V

Output voltage for logic 1 82% VCC

VCC

V

Input pull-up resistor value 24

29 34

KΩ

Input pull-down resistor value 24

29 34

KΩ

Output source current (standard current pad)

4

mA

Output sink current (standard current pad)

4

mA

Output source current
high current pad: PA6,PA7,PB6,PB7,PC0

8

mA

Output sink current
high current pad: PA6,PA7,PB6,PB7,PC0

8

mA

Ambient temperature range -40 25 +85 °C

DC Characteristics

Parameter

Min. Typ. Max. Unit

Active Current (TX)

TX, Normal Mode, +3 dBm

31 mA

TX, Boost Mode, +8 dBm

39 mA

TX, Normal Mode, 0 dBm

28.5 mA

Active Current (RX)

RX, Normal Mode, +3 dBm

26 mA

RX, Boost Mode, +8 dBm

27 mA

summarizes the DC characteristics at 25°C and VDD of 3V of the EM35x Module.

RF Characteristics (@25°C, VCC=3.3V)

Parameter

Min. Typ. Max. Unit

Frequency Range

2405 2480 MHz

Channel Spacing

5 MHz

RX Sensitivity (1% PER, 20-byte packet)

Normal Mode

-100 -94 dBm

Boost Mode

-101 -95 dBm

Adjacent Channel Rejection

High Side

35 dB

Low Side

35 dB

2nd High Side

43 dB

2nd Low Side

43 dB

All other channels

40 dB

TX Power (Maximum)

dB

Boost Mode

8 dBm

Normal Mode

3 dBm

Error Vector Magnitude (Offset EVM) (per IEEE 802.15.4-2003)

5 15 %

PCB COPPER PATTERN LAYOUT

DIMENSIONS

Placement Guideline

It is recommended that MD1000 be placed on the corner of the main board and near

the edge as shown below.

Federal Communication Commission Interference Statement

This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions,
may cause harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one or more of the following
measures:

 Reorient or relocate the receiving antenna.

 Increase the separation between the equipment and receiver.

 Connect the equipment into an outlet on a circuit different from that to which the receiver is

connected.

 Consult the dealer or an experienced radio/TV technician for help.

FCC Caution:

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions:

(1) This device may not cause harmful interference

(2) This device must accept any interference received, including interference that may cause
undesired operation.

Any changes or modifications not expressly approved by the party responsible for compliance could
void the user's authority to operate this equipment. . This device and its antenna(s) must not be co­located or operating in conjunction with any other antenna or transmitter.

Co-location statement

This device and its antenna(s) must not be co-located or operating in conjunction with any other
antenna or transmitter.

FCC Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20cm
between the radiator & your body.

This module is intended for OEM integrator. The OEM integrator is responsible for the compliance to
all the rules that apply to the product into which this certified RF module is integrated. Additional
testing and certification may be necessary when multiple modules are used.