BL-R8801MS1 product is designed base on MARVELL 88W8801 chipset .It is a highly integrated
single-band (2.4GHz) IEEE 802.11n 1X1 System-on-Chip (SoC), specifically designed to support High
Throughput data rates for next generation WLAN products. It supports IEEE802.11i safety protocol,
along with IEEE 802.11e standard service quality. It supports the new data encryption on 64/128 bit
WEP and safety mechanism on WPA-PSK/WPA2-PSK, WPA/WPA2. It can implement the wireless
network function on the laptop/desktop/MID and other wireless devices easily .
2. The range of applying
MID, networking camera, STB GPS, E-book, Hard disk player, Network Radios, PSP and other device
which need be supported by wireless networking.
3. Product Specification
2
3.1 Function Block diagram
B-LINK ELECTRONIC CO., LTD in shenzhen
3.2 Electrical and Performance Specification
ItemDescription
Product NameBL-R8801MS1
Major ChipsetMARVELL 88W8801
Host InterfaceSDIO
StandardIEEE 802.11b, IEEE 802.11g,IEEE 802.11n,
Frequency Range
Modulation Type
Working Mode
Data Transfer Rate
Spread Spectrum
Sensitivity @PER
2412MHz~2462MHz
802.11b: CCK, DQPSK, DBPSK
802.11g: 64-QAM,16-QAM, QPSK, BPSK
802.11n: 64-QAM,16-QAM, QPSK, BPSK
Infrastructure,Ad-Hoc
1,2,5.5,6,11,12,18,22,24,30,36,48,54,and maximum of 72.2Mbps
IEEE 802.11g/n:OFDM (Orthogonal Frequency Division
Multiplexing)
1M: -92dBm@8%PER
3
RF Power
B-LINK ELECTRONIC CO., LTD in shenzhen
6M: -88dBm@10%PER
11M:-86dBm@8%PER
54M:-72dBm@10%PER
72.2M:- 68dBm@10%PER
15dBm @802.11b/g/n
Antenna type
Antenna Gain
Dimension(L*W*H)
Power supply3.3V +/-0.2V
Power Consumptionstandby mode 70mA@3.3V ,
Clock source38.4MHz
Working Temperature-20°C to +70°C
Storage temperature-40°C ~ +105°C
Internal Antenna
2.11dBi
13 x 13.5 x 1.46mm (LxWxH) ;Tolerance: +-0.15mm
TX mode 150mA@3.3V
3.3 Product Photo
TOP
BOTTOM
Module TOP
Module BOTTOM
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B-LINK ELECTRONIC CO., LTD in shenzhen
3.4 Mechanical Specification
Module dimension: Typical (W x L x H): 13mmx13.5mmx1.46mm Tolerance : +/-0.15mm
3.5 Product Pin Definition
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B-LINK ELECTRONIC CO., LTD in shenzhen
FunctionDescription
SD _2SDIO data 21
SD _3SDIO data 3 /GSPI chip select
2
SD _CMDSDIO command/GSPI data input3
GND
Ground
4
SD _CLKSDIO clock /GSPI clock5
SD _D0SDIO data 0 /GSPI data output6
SD _D1SDIO data 1 /GSPI data out7
VCC33.3V power supply8
PD_nPower down (active low)9
GND
Ground
10
ANT_RFWLAN RF pad11
GND
Ground
12
WK_INWake/Suspend input control13
WK_OUTWake/Suspend output control14
4. Supported platform
Support Linux platform.
4.1 DC characteristics
TermsContents
Specification : IEEE802.11b
ModeDSSS / CCK
Frequency
Data rate1, 2, 5.5, 11Mbps
DC Characteristics
TX mode
Rx mode
Sleep mode
Specification : IEEE802.11g
Mode
Frequency
2412MHz - 2462MHz
min
140
70
65
OFDM
2412MHz - 2462MHz
Typ.max.unit
151160
7275
6668
mA
mA
mA
Data rate6, 9, 12, 18, 24, 36, 48, 54Mbps
DC CharacteristicsminTyp.max.unit
6
B-LINK ELECTRONIC CO., LTD in shenzhen
TX mode
Rx mode
Sleep mode
Specification : IEEE802.11n
ModeOFDM
Frequency
Data rate6.5, 13, 19.5, 26, 39, 52, 58.5, 72.2Mbps
DC CharacteristicsminTyp.max.unit
TX mode
Rx mode
Sleep mode
2412MHz - 2462MHz
9095150
72
65
7275140
707378
65
7375
6668
6668
mA
mA
mA
mA
mA
mA
4.2 RF Characteristic
ModeRate(Mbps)
11b
11g
11n
HT20
117.0217.3716.85-39.37-37.29-38.79-93-93-93
1116.9817.4116.61-39.49-39.06-39.57-88-88-88
615.9716.0415.71-23.36-20.66-20.34-89-89-89
5415.2815.0714.49-32.51-31.98-32.75-73-73-73
MCS013.8813.6813.16-26.61-24.31-24.90-86-86-86
MCS713.6514.0013.38-34.66-31.8-32.96-70-70-70
Power(dBm)EVM(dB)Sensitivity(dBm)
CH1CH7CH13CH1CH7CH13CH1CH7CH13
7
5. Typical Solder Reflow Profile
B-LINK ELECTRONIC CO., LTD in shenzhen
8
B-LINK ELECTRONIC CO., LTD in shenzhen
6. Precautions for use
1. Pls handle the module under ESD protection.
2. Reflow soldering shall be done according to the solder reflow profile. Peak temperature
245℃.
3.
Products require baking before mounting if humidity indicator cards reads >30% temp <30 degree C,
humidity < 70% RH, over 96 hours.
Baking condition: 125 degree C, 12 hours
Baking times: 1 time
4.
Storage Condition: Moisture barrier bag must be stored under 30 degree C, humidity under 85% RH. The
calculated shelf life for the dry packed product shall be a 12 months from the bag seal date. Humidity
indicator cards must be blue, <30%.
9
FCC Statement:
This equipment has been tested and found to comply with the limits for a Class B
digital device, pursuant to part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference in a residential installation.
This equipment generates uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not
occur in a particular installation. If this equipment does cause harmful interference to
radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one or more of the
following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help.
This device complies with part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) This device may not cause harmful interference, and (2)
this device must accept any interference received, including interference that may
cause undesired operation.
Any Changes or modifications not expressly approved by the party responsible for
compliance could void the user's authority to operate the equipment.
The device complies with RF specifications when the device used at 20cm form your
body.
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