BeStar FT-32G-3.2A12-04 User Manual

SPECIFICATION

FOR PIEZO CERAMIC ELEMENT

博 士 達

Customer

Date
Page

Approval:

1.Technical Terms

2.Drawing

3.Characteristics

4.Reliability test

5.Packing

6.History change record

12 Mar. 10

01 of 06

06TOTAL PAGE

www.be-star.com

Model Name

Product No.Customer P/N
Issue No.
Issue Date

FT-32G-3.2A12-04

BS/TEY01.334A

10/03/12

Drawn by

赵 峥 汤浩君 李红元

Checked by

Approved by

Customer approved

BESTAR ELECTRONICS INDUSTRY CO.,LTD

No.199 HuangHe West Road.New district,ChangZhou,JiangSu Province,P.R.China
Tel: [phone] Fax: [phone]

E-mail:[e-mail] http://www.be-star.com

56 4 3

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FT-32G-3.2A12-04

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1.Technical Terms:

G

Item

Unit

Specification

Resonant Frequency K Hz 3.2± 0.3

Resonant Impedance Ω ≤300

Capacitance at 120Hz nF

F

Operating Temperature ℃ -40-+105

180± 30%

Storage Temperature ℃ -40-+105
Input Voltage Vp-p 60max

G

F

2.Drawing

E

Ø31

stainless
steel SUS304

0.64±0.1

0.15±0.02

R2.5

E

D

and shall not be used in whole or in part without its written content

This print and information there in are proprietary to Bestar Electronics Industry Co., Ltd.

C

18

R15.4

the green oil on both
side of the disc surface

ceramic

D

C

32.5±0.5°

Ø31.8

Tolerance：±0.3

B

Date:
Drawn by:

10/03/12

A

A

Rev.

赵 峥

DrawnDate

Note

56

Checked by:

www.be-star.com [e-mail]

4 3

10/03/12

赵峥

汤浩君
李红元Approved by:

FT-32G-3.2A12-04

Piezo Element

DRG NO: BS/TEY01.334A

Page:2 of 6

12

B

A

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FT-32G-3.2A12-04

3.Characteristics:

3.1 Solderability

G

280±10 Temperaure of Merited Solder,1±0.5sec Duration of Dipping.℃

3.2 Lead pull off test
a) Wire to be soldered on ceramic at the edge. It should withstand minimum20N
force applied in 180° .The wire should not come out before this .The ceramic can be either
glued on a surface of can be held in hand.(Fig.2)

F

b) Wire to be soldered on ceramic at the edage&should be pulled up at 90° The element
should be hold on bottom and wire should be pulled up .It should withstand at least for2N
force(Fig.1)

3.3Bend Test

E

The element should be bend on to a pipe of 31±2mm diameter.The bend should be in only

H

G

F

E

one direction. The length of pipe should be at least 1.5 times the diameter of the stainless
steel.

D

and shall not be used in whole or in part without its written content

This print and information there in are proprietary to Bestar Electronics Industry Co., Ltd.

C

Fig.1 Direction of Lead Wire

B

Fig.2 Direction of Lead Wire

D

C

B

Date:
Drawn by:

10/03/12

A

A

Rev.

赵峥

DrawnDate

Note

56

Checked by:
Approved by:

www.be-star.com [e-mail]

4 3

10/03/12

赵峥

汤浩君

李红元

FT-32G-3.2A12-04

Piezo Element

DRG NO: BS/TEY01.334A

2

A

Page:3 of 6

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FT-32G-3.2A12-04

4. Reliability test

4.1 Life test at high temperature
Temperature +105°C

G

F

E

D

and shall not be used in whole or in part without its written content

This print and information there in are proprietary to Bestar Electronics Industry Co., Ltd.

C

Duration 96hrs

4.2 Life test at low temperature
Temperature -40°C
Duration 96hrs

4.3 Temperature cycle test
Cycles 5

4.4 Humidity cycle test
Cycles 5

All these tests above should be measured after leaving normal temperature for 2hrs.

4.5 Vibration Test
Vibration Frequency 10~55Hz
Amplitude 1.53mm
Direction 3(x.y&z)
Duration 2hrs each direction (total 6 hrs)

4.6 Drop test
Height 100cm
(to 10mm thickness woodenboard)
Direction 3(x.y&z)

4.7 Solderability Test
Soldering Temperature 255 C
Duration 3 sec

4.8 Accelerated Life Test (ALT)
Thermal Cycling :
Thermal Cycling consists of temperature ramping components for 30 minutes in the
Testing oven from -40°C to 105°C. The components are then exposed for 1 hour at
The extremes and the cycle is repeated for a total of 15 cycles..
Thermal Soak:
Thermal soak consists of exposing a powered unit to 105°C and 85% relative humidity
for 45 days.

-40℃

25℃90-95% RH

+20℃

H

G

+105℃

+20℃

F

65℃ 90-95% RH

E

D

C

B

A

Notice: All specifications must be satisfied in this condition.

Date:
Drawn by:

A

Rev.

10/03/12

赵峥

DrawnDate

56

Note

Checked by:
Approved by:

4 3

10/03/12

赵峥

汤浩君

李红元

www.be-star.com [e-mail]

FT-32G-3.2A12-04

Piezo Ceramic Element

DRG NO: BS/TEY01.334A

Page:4 of 6

12

B

A

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FT-32G-3.2A12-04

5.Packing

5.1Packing Drawing

G

F

E

products

100PCS

foam tray

foam cover

label info

H

G

F

E

FT-32G-3.2A12-04

Datecode: XX.XX

Quantity:1000pcs

D

D

5.2 packing quantity

and shall not be used in whole or in part without its written content

This print and information there in are proprietary to Bestar Electronics Industry Co., Ltd.

C

B

A

5.2-a 200pcs per foam tray

5.2-b 5 foam trays per carton

5.2-c Total 1000pcs per carton

5.2-d Transducers shall be packaged in suitable low-sulfur .
air tight stacking containers to prevent oxidation of the
metal disc. corrosion of the silver electrode. And damage
during shipment and storage. Cartons shall be stackable
to four feet high without damage to transducers.

Date:
Drawn by:

A

Rev.

10/03/12

赵峥

DrawnDate

56

Note

Checked by:
Approved by:

4 3

10/03/12

赵峥

汤浩君

李红元

www.be-star.com [e-mail]

FT-32G-3.2A12-04

Piezo Ceramic Element

DRG NO: BS/TEY01.334A

C

B

A

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FT-32G-3.2A12-04

6. History change record

G

F

E

version
No.

A

Before After

Change Items

Date

10/03/12

赵 峥

ApprovedDrawn

李红元

H

G

F

E

D

and shall not be used in whole or in part without its written content

This print and information there in are proprietary to Bestar Electronics Industry Co., Ltd.

C

B

Date:
Drawn by:

10/03/12

A

A

Rev.

赵 峥

DrawnDate

Note

56

Checked by:
Approved by:

www.be-star.com [e-mail]

4 3

10/03/12

赵峥

汤浩君

李红元

FT-32G-3.2A12-04

Piezo Ceramic Element

DRG NO: BS/TEY01.334A

Page:6 of 6

12

D

C

B

A