Release 1.2
Service Manual
SXG 75
Level 1 - 3
Release Date Department Notes to change
R 1.0 29.11.2005 BenQ Mobile CC S CES New document
R 1.1 22.02.2006 BenQ Mobile CC S CES SWU Process modified
R 1.2 24.05.2006 BenQ Mobile CC S CES Chapter 5 Step 4-5 modified
Technical Documentation
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Company Confidential
2006©BenQ
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Release 1.2
Table of Content
1 Key Features..............................................................................................................................3
2 SXG75 Interface to Accessories ..............................................................................................5
3 Unit Description of SXG75........................................................................................................6
4 Exploded View of SXG75..........................................................................................................7
5 Disassembly of SXG75 .............................................................................................................8
6 Assembly of SXG75 ................................................................................................................18
7 BenQ Service Equipment User Manual.................................................................................27
8 GRT Software: Functionality Configuration........................................................................28
9 GRT Software: Regular Usage ...............................................................................................30
10 JPICS (Java based Product Information Controlling System)............................................35
11 International Mobile Equipment Identity, IMEI......................................................................41
12 General Testing Information...................................................................................................42
13 Introduction of Service Repair Documentation Level 3 – SXG75....................................49
14 List of available level 3 (basic) parts.....................................................................................50
15 Hardware requirements ..........................................................................................................50
16 SXG75 Board layout................................................................................................................51
17 SIM Card Problems .................................................................................................................52
18 IO Connector Problems ..........................................................................................................53
19 B to B connector Problems....................................................................................................55
20 Battery Connector Problems.................................................................................................. 56
21 Camera Connector Problems.................................................................................................57
22 IRDA Problems ........................................................................................................................58
23 Display Problems ....................................................................................................................59
24 MMC Connector Problems......................................................................................................60
Technical Documentation
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1 Key Features
Battery
Stand – by Time
Talk Time
SIM Card
Speech Coder
Temperature Range
Display
3x4 Block Keypad
Function block with
Operator key
Edge Keys
Side keys
• Li – Ion Battery Pack
• Nominal Capacity: 1000 mAh
• GSM Capacity: 980 mAh
• Up to 420h
• GSM: Up to 3,6hr
• WCDMA: Up to 3,1hr
• Small (“Plug In”) 1,8 V or 3 V -SIM card (Phase II)
• Half Rate, Full Rate, Enhanced Full Rate and Adaptive
Multi Rate speech coders are available as standard
• -10°C to + 55°C (Normal operation)
• -30°C to + 85°C (Storage capability)
• Type: Full graphic
• Resolution: 240 x 320 Pixel
• Technology: TFT (Epson)
• No of colours: 256k
• Frame Rate: 15 frames/sec
• Pixel size / mm: 0.141 mm x 0.141 mm
• Active area / mm: 33,84 mm x 45.12 mm
• Illumination: White (4LEDs in series integrated)
• Front side decorated
• Partly bridgeless keypad (i.e. horizontally bridgeless)
• 12 – key – block (o-9,#,*)
• tactile finder on key “5”
• colour adapted to u-shaped aluminium brushed sheet
metal piece
• Four blue LED’s for keypad
• Five – way Navikey
• Chrome plated navi key ring with center push button,
operator logo can be printed on the button which is clipped
on the navi key.
• Four keys, functions: Back, Web access, Left & right soft
key
• All keys except navi have front side decoration
• Four blue LED’s for Navikey
• ON/OFF key combined with the END key; the symbol ¢ (I
inside O) is used as a symbol for ON/OFF.
• Viedeo telephony key
• Task key
• Two LED’s for edge keys, one red, one green
• Front side decorated
• No illumination
• Three side keys, functions: PoC, Volume, Camera
• Side keys galvanized
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Acoustics
Antenna
Receiver
Sensitivity
Transmitter Power
• Combined handsfree/ringer speaker at rear side of phone,
next to camera
• Dedicated ear piece speaker, allowing small dimensions
as not needed as handfree speaker
• Uni - directional microphone
• Poliphonic ringer tones (parallel to GPRS data transfer: 16
voices; all other Use Cases: 40 voices)
• Hands free mode
• Different selectable volume levels for handsfree, handset
and ringer mode (for the amount see SW product
description)
• Integrated Quad band antenna
• Compliant with 3GPP specification TS34.121, Rel.99
• Compliant with 3GPP specification TS34.121, Rel.99
The transmitter output power is compliant to following
Power classes:
UMTS: nominal 0,25W -> power class 4
GSM 900: nominal 2W -> power class 4
GSM 1800/GSM 1900: nominal 1W -> power class 1
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2 SXG75 Interface to Accessories
The phone has the following compatible interfaces to accessories:
- electrically by the Lumberg I/O connector (Lumberg slim)
- antenna connection by courtesy of RF connector
- IR and Bluetooth interface is implemented
- Slot wit reader for additional reduced size MultiMediaCard (exchangeable) is
available
- car holder interface is implemented
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3 Unit Description of SXG75
The SXG75 is a brick phone with 2 integrated cameras for video telephony and photo
applications. The phone has two different acoustic modules one for receiver mode on the
topside and one for sound ringer and hands free mode with separate hole on the bottom
side. Additional speciality is a slot for exchangeable RS MultiMediaCard at the side of the
phone.
The keypad is new for a Siemens brick phone and has beside the usual navigation and
number key block beneath the display and the 2 side keys on both side surfaces further 4
edge keys (2 on each side) beside the LCD module for extended UMTS related
functionality. Special design element on the rear side is a prominent area with a grid of
holes for the loudspeaker.
There will be one colour variant, white/silver.
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4 Exploded View of SXG75
Side - Keys
-
UMTS - Camera
MMC - Holder
Disassembled Camera Cover
Screws
Rear Cover
Upper Case
Keypad
Flexible PCB
Display - Module
PCB
Microphone
Battery
Battery Cover
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Release 1.2
5 Disassembly of SXG75
All repairs as well as disassembling and assembling have to be carried out in an ESD
protected environment and with ESD protected equipment/tools. For all activities the
international ESD regulations have to be considered.
For more details please check information in c – market
https://market.benqmobile.com/SO/welcome.lookup.asp
There you can find the document “ESD Guideline”.
Step 1
Remove Battery Cover and Battery.
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Step 2
Step 3
Remove Rear Cover by pushing it with
both thumbs forwards.
Remove screws with Torque - Screwdriver.
Screws size: T5+
Step 4
Remove Upper Case by using Alternative
Opening Tool carefully.
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Step 5
Step 6
Step 7
Disconnect Flex Cable from PCB by using
Tweezers carefully.
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Step 8
Step 9
Remove MMC Holder by pushing it with
Alternative Opening Tool outside the frame.
Use Alternative Opening Tool to remove
PCB from Lower Case carefully.
Step 10
To avoid scratches it is mandatory to place
a Protection Foil onto the Display.
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Step 11
Step 12
Remove Flexible PCB with Alternative
Opening Tool carefully.
The Loudspeaker is not removable.
Step 13
Remove Side keys by using Tweezers.
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Step 14
Step 15
Step 16
Use Tweezers to remove Keypad.
Remove Microphone by using Tweezers
carefully.
Be careful with the spring contacts of the
Microphone!
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Step 17
Step 18
Remove Vibramotor by using Tweezers
carefully.
Remove Earphone by using Tweezers
carefully.
Step 19
Use Alternative Opening Tool to remove
Camera Cover carefully.
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Step 20
Step 21
Step 22
Disconnect Flex Cable from PCB with
Tweezers.
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Step 23
Step 24
Remove Display from PCB by using
Alternative Opening Tool very carefully.
Put the Camera Ejector Jig professional
through the four edges between the Camera
and the Camera Connector. Now push the
Ejector Jig and pull out the Camera
Step 25
carefully.
Remove UMTS Camera Cover by using
Tweezers carefully.
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Step 26
Step 27
Remove UMTS Camera with Alternative
Opening Tool very carefully.
Overview Lower Parts Overview Upper Parts
Lower Case
Battery
Rear Cover
Upper Case
Microphone
Vibramotor
PCB
Flexible PCB
Dis
Ke
ad
s
Battery cover
Disassembled
Camera Cove
Sideke
Ear
hone
Camera Cover
UMTS - Camera
Camera
MMC - Holder
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6 Assembly of SXG75
Step 1
Step 2
Assemble UMTS - Camera by using
Tweezers.
Connect the UMTS – Camera with PCB by
using Tweezers.
Step 3
Use Tweezers to assemble Camera Cover.
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