BBK DL373D SERVICE MANUAL

SERVICE MANUAL

DL373D

CONTENTS

1. SAFETY PRECAUTIONS

2. PREVE NTION OF ELE CTR O STATIC DISCHARGE(ESD)TO ELECTROSTATICALLY SENS ITIVE(ES)DEVICES

3. CONTROL BUTTON LOCATIONS AND E XPLANATIONS

4. PREVE RTION OF STATIC ELE CTRICITY DISCHARGE

5. E LE C TR IC AL C ONFIR MATION

5.1 VIDE O OUTP UT (LUMINANC E S IG NAL) C ONFIR MATION

5.2 VIDE O OUTP UT(C HR OMINANC E S IG NAL) C ONFIR MATION

6. MP E G BOAR D C HE C K WAVE FOR M

7.2 MT1389

2 4

7.3 U214 HY29F800 11

7.4 HY57V641620HG

8. S C HE MATIC & P C B WIR ING DIAG R AM

9. S P AR E P AR TS LIS T 33

1.1 GENERAL GUIDELINES

1. SAFETY PREAUTIONS

2.PREVENTION OF ELECTRO STATIC DISCHARGE(ESD)TO  ELECTROSTATICALLY SENSITIVE(ES)DEVICES

1. When servicing, observe the original lead dress. if a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barrier, insulation papers shields are properly installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed

to shock hazards.

Some semiconductor(solid state)devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive(ES)Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor chip components. The following techniques should be used to help reduce the incidence of component damage caused by electro static discharge(ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially availabel discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices,place the assembly on a conductive surface such as alminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as anti-static (ESD protected)can generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. Caution Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity(ESD).

notice (1885x323x2 tiff)

3.Control Button Locations and Explanations

Color TFT LCD

Speakers

OPEN/CLOSE button

PREV button / LEFT direction arrow

PAUSE button / DOWN direction arrow

Vol-

Adjust the volume of headphone an d speaker.

Vol+

Adjust the volume of headphone and speaker.

Power indicator

IR sensor

Panel/Switch Button

Press once to switch to Direction Buttons function

Press twice to switch to Virtual Keyboard function

PLAY button / SELECT button

NEXT button / RIGHT direction arrow

STOP button / UP direction arrow

SET button

PICTURE button

DVD/AUXIN button

POWER button

MENU button

Browser Button

Control Button Locations and Explanations(Continued)

The laser diode in the traverse unit (optical pickup)may brake down due to static electricity of clothes or human

body. Use due caution to electrostatic breakdown when servicing and handling the laser diode.

Some devices such as the DVD player use the optical pickup(laser diode)and the optical pickup will be damaged

by static electricity in the working environment.Proceed servicing works under the working environment where

1. Put a conductive material(sheet)or iron sheet on the area where the optical pickup is placed,and ground the

3. The flexible cable may be cut off if an excessive force is applied to it.Use caution when handling the cable.

4.PREVENTION OF STATIC ELECTRICITY DISCHARGE

4.1.Grounding for electrostatic breakdown prevention

grounding works is completed.

4.1.1. Worktable grounding

sheet.

4.1.2.Human body grounding

1 Use the anti-static wrist strap to discharge the static electricity from your body.

safety_3 (1577x409x2 tiff)

4.1.3.Handling of optical pickup

1. To keep the good quality of the optical pickup maintenance parts during transportation and before installation, the both ends of the laser diode are short-circuited.After replacing the parts with new ones, remove the short circuit according to the correct procedure. (See this Technical Guide).

2. Do not use a tester to check the laser diode for the optical pickup .Failure to do so willdamage the laser diode due to the power supply in the tester.

4.2. Handling precautions for Traverse Unit (Optical Pickup)

1. Do not give a considerable shock to the traverse unit(optical pickup)as it has an extremely high-precise structure.

2. When replacing the optical pickup, install the flexible cable and cut is short land with a nipper. See the optical pickup replacement procedure in this Technical Guide. Before replacing the traverse unit, remove the short pin for preventingstatic electricity and install a new unit.Connect the connector as short times as possible.

4. The half-fixed resistor for laser power adjustment cannot be adjusted. Do not turn the resistor.

5.1. Video Output (Luminance Signal) Confirmation

5.Electrical Confirmation

DO this confirmation after replacing a P.C.B.

Measurement point

Video output terminal

Measuring equipment,tools

200mV/dir,10 sec/dir

Purpose:To maintain video signal output compatibility.

1.Connect the oscilloscope to the video output terminal and terminate at 75 ohms.

2.Confirm that luminance signal(Y+S)level is 1000mVp-p±30mV

PLAY(Title 46):DVDT-S15 PLAY(Title 12):DVDT-S01

Mode Disc

Color bar 75%

Confirmation value

1000mVp-p±30mV

DVDT-S15

DVDT-S01

Do the confirmation after replacing P.C.B.

Screwdriver,Oscilloscope

5.2 Video Output(Chrominance Signal) Confirmation 

Measurement point

Video output terminal

Measuring equipment,tools Confirmation value

200mV/dir,10 sec/dir

Purpose:To maintain video signal output compatibility.

1.Connect the oscilloscope to the video output terminal and terminate at 75 ohme.

2.Confirm that the chrominance signal(C)level is 621 mVp-p±30mV

PLAY(Title 46):DVDT-S15 PLAY(Title 12):DVDT-S01

Mode Disc

Color bar 75%

621mVp-p±30mV

DVDT-S15

DVDT-S01

6.MPEG BOARD CHECK WAVEFORM

6.1 27MHz WAVEFORM 

7.2 MT1389

MT1389

Specifications are subject to change without notice

Progressive-Scan DVD Player SOC

MediaTek MT1389 is a DVD player system-on-chip (SOC) which incorporates advanced features like high

quality TV encoder and state-of-art de-interlace processing. The MT1389 enables consumer electronics manufacturers to build high quality, cost-effective DVD players, portable DVD players or any other home entertainment audio/video devices.

Based on MediaTek’s world-leading DVD player SOC architecture, the MT1389 is the 3 player SOC. It integrates the MediaTek 2 decoder.

The progressive scan of the MT1389 utilized a proprietary advanced motion-adaptive de-interlace algorithm to achieve the best movie/video playback. It can easily detect 3:2/2:2 pull down source and restore the correct original pictures. It also supports a patent-pending edge-preserving algorithm to remove the saw-tooth effect.

generation front-end analog RF amplifier and the Servo/MPEG AV

generation of the DVD

Key Features



RF/Servo/MPEG Integration



High Performance Audio Processor



Motion-Adaptive, Edge-Preserving De-interlace



108MHz/12-bit, 6 CH TV Encoder

DVD PUH

Module

CVBS, Y/C,

Component

SDPIF

MT1389L

Applications

FLASH

Front-panel

Remote

DRAM

Audio DAC



Standard DVD Players



Portable DVD Players

DVD Player System Diagram Using MT1389

PRELIMINARY, SUBJECT TO CHANGE WITHOUT NOTICE MTK CONFIDENTIAL, NO DISCLOSURE

MT1389

General Feature List

 1024-bytes on-chip RAM



Super Integration DVD player single chip

 High performance analog RF amplifier  Servo controller and data channel processing  MPEG-1/MPEG-2/JPEG video  Dolby AC-3/DTS/DVD-Audio  Unified memory architecture

 Versatile video scaling & quality

enhancement

 OSD & Sub-picture  2-D graphic engine  Built-in clock generator  Built-in high quality TV encoder  Built-in progressive video processor  Audio effect post-processor

 Audio input port

 Up to 4M bytes FLASH-programming

interface

 Supports 5/3.3-Volt. FLASH interface  Supports power-down mode  Supports additional serial port



DVD-ROM/CD-ROM Decoding Logic  High-speed ECC logic capable of correcting

one error per each P-codeword or Q-codeword

 Automatic sector Mode and Form detection  Automatic sector Header verification  Decoder Error Notification Interrupt that

signals various decoder errors

 Provide error correction acceleration



High Performance Analog RF Amplifier

 Programmable fc  Dual automatic laser power control  Defect and blank detection  RF level signal generator



Speed Performance on Servo/Channel Decoding

 DVD-ROM up to 4XS  CD-ROM up to 24XS



Channel Data Processor

 Digital data slicer for small jitter capability  Built-in high performance data PLL for

channel data demodulation

 EFM/EFM+ data demodulation  Enhanced channel data frame sync protection

& DVD-ROM sector sync protection



Servo Control and Spindle Motor Control

 Programmable frequency error gain and

phase error gain of spindle PLL to control spindle motor on CLV and CAV mode

 Built-in ADCs and DACs for digital servo

control

 Provide 2 general PWM  Tray control can be PWM output or digital

output



Embedded Micro controller

 Built-in 8032 micro controller  Built-in internal 373 and 8-bit programmable

lower address port



Buffer Memory Controller

 Supports 16Mb/32Mb/64Mb/128Mb SDRAM  Supports 16-bit SDRAM data bus  Provide the self-refresh mode SDRAM  Block-based sector addressing  Support 3.3 Volt. DRAM Interface



Video Decode  Decodes MPEG1 video and MPEG2 main level,

main profile video (720/480 and 720x576)

 Smooth digest view function with I, P and B

picture decoding

 Baseline, extended-sequential and

progressive JPEG image decoding

 Support CD-G titles



Video/OSD/SPU/HLI Processor  Arbitrary ratio vertical/horizontal scaling of

video, from 0.25X to 256X

 65535/256/16/4/2-color bitmap format OSD,  256/16 color RLC format OSD  Automatic scrolling of OSD image  Slide show transition as DVD-Audio

Specification



2-D Graphic Engine

 Support decode Text and Bitmap  Support line, rectangle and gradient fill  Support bitblt  Chroma key copy operation  Clip mask

PRELIMINARY, SUBJECT TO CHANGE WITHOUT NOTICE MTK CONFIDENTIAL, NO DISCLOSURE

MT1389



Audio Effect Processing

 Dolby Digital (AC-3)/EX decoding  DTS/DTS-ES decoding  MLP decoding for DVD-Audio  MPEG-1 layer 1/layer 2 audio decoding  MPEG-2 layer1/layer2 2-channel audio  High Definition Compatible Digital (HDCD)  Windows Media Audio (WMA)  Advanced Audio Coding (AAC)  Dolby ProLogic II  Concurrent multi-channel and downmix out  IEC 60958/61937 output

- PCM / bit stream / mute mode

- Custom IEC latency up to 2 frames

 Pink noise and white noise generator  Karaoke functions

- Microphone echo

- Microphone tone control

- Vocal mute/vocal assistant

- Key shift up to +/- 8 keys

- Chorus/Flanger/Harmony/Reverb

 Channel equalizer  3D surround processing include virtual

surround and speaker separation



TV Encoder

 Six 108MHz/12bit DACs  Support NTSC, PAL-BDGHINM, PAL-60  Support 525p, 625p progressive TV format  Automatically turn off unconnected channels  Support PC monitor (VGA)  Support Macrovision 7.1 L1, Macrovision

525P and 625P

 CGMS-A/WSS  Closed Caption



Progressive Output

 Automatic detect film or video source  3:2 pull down source detection  Advanced Motion adaptive de-interlace  Edge Preserving  Minimum external memory requirement



Audio Input  Line-in/SPDIF-in for versatile audio

processing



Outline

 256-pin LQFP package  3.3/1.8-Volt. Dual operating voltages

KEY FEATURES

IC BLOCK DIAGRAM & DESCRIPTION

7.3 U214 HY29F800

n 5 Volt Read, Program, and Erase

– Minimizes system-level power requirements

n High Performance

– Access times as fast as 55 ns

n Low Power Consumption

– 20 mA typical active read current in byte

mode, 28 mA typical in word mode – 35 mA typical program/erase current – 5 µA maximum CMOS standby current

n Compatible with JEDEC Standards

– Package, pinout and command-set

compatible with the single-supply Flash

device standard – Provides superior inadvertent write

protection

n Sector Erase Architecture

– Boot sector architecture with top and

bottom boot block options available – One 16 Kbyte, two 8 Kbyte, one 32 Kbyte

and fifteen 64 Kbyte sectors in byte mode – One 8 Kword, two 4 Kword, one 16 Kword

and fifteen 32 Kword sectors in word mode – A command can erase any combination of

sectors – Supports full chip erase

n Erase Suspend/Resume

– Temporarily suspends a sector erase

operation to allow data to be read from, or

programmed into, any sector not being

erased

n Sector Protection

– Any combination of sectors may be

locked to prevent program or erase operations within those sectors

n Temporary Sector Unprotect

– Allows changes in locked sectors

(requires high voltage on RESET# pin)

n Internal Erase Algorithm

– Automatically erases a sector, any

combination of sectors, or the entire chip

n Internal Programming Algorithm

– Automatically programs and verifies data

at a specified address

n Fast Program and Erase Times

– Byte programming time: 7 µs typical – Sector erase time: 1.0 sec typical – Chip erase time: 19 sec typical

n Data# Polling and Toggle Status Bits

– Provide software confirmation of

completion of program or erase operations

n Ready/Busy# Output (RY/BY#)

– Provides hardware confirmation of

completion of program and erase operations

n Minimum 100,000 Program/Erase Cycles n Space Efficient Packaging

– Available in industry-standard 44-pin

PSOP and 48-pin TSOP and reverse TSOP packages

A[18:0]

CE#

OE#

WE#

RESET#

BYTE#

DQ[7:0]

DQ[14:8]

DQ[15]/A-1

RY/BY#

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