Barrot Technology I410E S User Manual

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i410e-s_Datasheet

July 24, 2019

Version 3.0

i410e-s Datasheet

REVISION

AMENDMENT

DATE

AUTHOR

1.0

Initial version

2014-02-19

Wan Zhifu Li Li

1.1

Update Table 6 PIN 25&26

descriptions

2014-05-08

Li Li

1.2

Add Tolerance

2015-04-03

Gong Yong

1.3

Add Package information

2015-07-03

Daming Tang

1.4

Update pin description

2016-03-08

Xiangyang Sun

1.5

Update Bluetooth 4.1 spec

2016-03-23

Rechael

1.6

Change contact info

2016-08-11

Li Li

1.7

Add BQB,Telec certificate

2016-11-24

Yin Tian

1.8

Add Appendix

2016-12-27

Tracy

1.9

Add MOQ

2017-02-28

Tracy

2.0

Modify the certificate

2017-03-21

Tracy

2.1

Add net weight

2017-08-24

mojie

2.2

Update Bluetooth 4.0 spec

2017-12-16

wuting

2.3

Update Bluetooth 4.1 spec Add support for encryption mode.

2018-04-24

Joe

2.4

Update pin 6, 8, 9,10,11,17,21 descriptions

2018-06-29

Joe

2.5

Review

2018-09-20

Joe

2.6

Update block diagram

2019-01-21

Wu Kaiyue

2.7

Update format

2019-03-27

Wu kaiyue

2.8

For SRRC

2019-05-15

Wu Kaiyue

2.9

For FCC Add FCC statements

2019-06-13

Wu Kaiyue

3.0

Update module picture Update Bluetooth specification

2019-07-24

Wu Kaiyue

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VERSION HISTORY

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Contents

1. Block Diagram ......................................................................................................... 6

1.1. Crystal ........................................................................................................... 6

1.2. EEPROM ........................................................................................................ 6

1.3. Low Pass Filter .............................................................................................. 6

1.4. Antenna ........................................................................................................ 7

1.5. Synchronous Serial Interface ........................................................................ 7

1.6. UART ............................................................................................................. 7

1.7. Programmable I/O ........................................................................................ 7

1.8. AIO ................................................................................................................ 7

1.9. WAKE ............................................................................................................ 7

2. Module Characteristics ........................................................................................... 7

2.1. General Characteristics ................................................................................. 7

3. Pin Description ........................................................................................................ 8

4. Electrical Characteristics ....................................................................................... 12

4.1. Absolute Maximum Ratings........................................................................ 12

4.2. Recommended Operating Conditions ........................................................ 12

4.3. Input/output Terminal Characteristics ....................................................... 12

4.3.1. Switch-mode Regulator .................................................................... 12

4.3.2. Digital Terminals ............................................................................... 13

4.3.3. AIO .................................................................................................... 13

4.3.4. ESD Protection ................................................................................. 14

4.4. Current Consumption ................................................................................. 14

4.5. RF Characteristics ....................................................................................... 14

5. Physical Interfaces ................................................................................................. 15

5.1. UART Interface ............................................................................................ 15

5.2. SPI Interface ................................................................................................ 15

6. i410e-s physical Dimensions ................................................................................. 16

6.1. Dimension ................................................................................................... 16

6.2. Recommended PCB layout Footprint ......................................................... 17

7. Package ................................................................................................................. 18

7.1. Net weight .................................................................................................. 18

7.2. Package ....................................................................................................... 18

8. Certification ........................................................................................................... 18

8.1. BQB ............................................................................................................. 18

8.2. TELEC .......................................................................................................... 19

8.3. For FCC ........................................................................................................ 19

8.4. Certificate of Broadcasting and Communication Equipments ................... 21

9. SRRC ...................................................................................................................... 22

10. Company Profile .................................................................................................... 22

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11. Contact Information .............................................................................................. 22

11.1. Beijing ......................................................................................................... 22

11.2. Shenzhen .................................................................................................... 23

11.3. Shanghai ..................................................................................................... 23

12. Copyright ............................................................................................................... 23

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i410e-s Datasheet

 Healthcare  Home entertainment

DESCRIPTION

i410e-s is a Bluetooth 4.1 single-mode module. It provides a Bluetooth Low Energy fully compliant system for data communication with BRT BlueLet stack. It allows your target devices to send and receive data via Bluetooth 4.1 without connecting a serial cable to your computer.

By default, i410e-s module is equipped with powerful and easy-to-use BlueLet firmware. It’s easy-to-use and completely encapsulated. BlueLet enables users to access Bluetooth functionality with simple ASCII commands delivered to the module over serial interface - it's just like a Bluetooth modem.

Therefore, BRT i410e-s provides an ideal solution for developers who want to integrate Bluetooth wireless technology into their design.

FEATURES

 Fully Qualified Bluetooth system

v4.1

 Low energy  Support Master or Slave roles  Integrated layout antenna  Support AES-CCS and AES

Encryption

 Industrial temperature range from

-40℃ to +85℃

 RoHS Compliant

APPLICATIONS

 Office and mobile accessories  Automotive  Commercial  Watches  Human interface devices

Figure 1: i410e-s

 Cable replacement

 Sports and fitness

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1. Block Diagram

i410e-s’s block diagram is illustrated in Figure2 below.

Figure 2: i410e-s Block Diagram

1.1. Crystal

The crystal oscillates include 16MHz and 32.768 KHz. 16MHz is external reference clock source. 32.768 KHz is used during deep sleep and in other low-power modes.

1.2. EEPROM

EEPROM is used for storing the Bluetooth protocol stack, profile and applications.

1.3. Low Pass Filter

The filter is a band pass filter (ISM band).

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Product

BlueLet-series Bluetooth Module

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1.4. Antenna

Default ceramic antenna. If an external antenna is used, the ceramic antenna must be removed

1.5. Synchronous Serial Interface

This is a synchronous serial port interface (SPI) for interfacing with other digital devices. The SPI port can be used for system debugging. It can also be used for programming the Flash memory.

1.6. UART

This is a standard Universal Asynchronous Receiver Transmitter (UART) interface for communicating with other serial devices.

1.7. Programmable I/O

i410e-s has five digital programmable I/O terminals controlled by firmware running on the device.

1.8. AIO

i410e-s has three general-purpose analogue interface pins, AIO[2:0].

1.9. WAKE

Wake up input. It wakes i410e-s from sleep mode.

2. Module Characteristics

2.1. General Characteristics

Table 1：General Characteristics

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model

i410e-s

Bluetooth Specification

Bluetooth V4.1 , Class II

Frequency Band

2.4~2.48GHz

Modulation Method

GFSK

RF Input Impedance

50 ohms

Crystal OSC

16MHz

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Interface UART/SPI/PIO/AIO Operation Range 10 m Sensitivity -89dBm@0.1%BER

Transmit power 0.5dBm Typ.

Connectivity Single point link

Antenna type Ceramic Antenna Dimension

Dimension 9mm×13.3mm×1.75mm(Tolerance:±0.25mm)

Power

Operating voltage 1.8 -3.6V DC Operation Environment Temperature MSL 3

-40℃ to +85℃

3. Pin Description

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NO.

Name

Type

Function

AIO2

Bidirectional analogue

Analogue programmable I/O line. General-purpose analogue interface pins.

AIO1

Bidirectional analogue

Analogue programmable I/O line. General-purpose analogue interface pins.

AIO0

Bidirectional analogue

Analogue programmable I/O line. General-purpose analogue interface pins.

CMOS Output

CMOS output with weak internal pull-up. TXD is used to implement UART data transfer from i410e-s to another device.

CMOS Input

CMOS input with weak internal pull-down. RXD is used to implement UART data transfer from another device to i410e-s.

PIO3

Bidirectional with programmable strength internal

Reset if low,Pull low for minimum 50ms to cause a reset

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Table 2：PIN Description

Figure 3: i410e-s PIN diagram

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pull-up/down

PIO4

Bidirectional with programmable strength internal pull-up/down

Programmable I/O line

PIO5 / SPI_CLK

Bidirectional with programmable strength internal pull-up/down

Programmable I/O line or debug SPI CLK selected by SPI_ SEL #. CMOS input for the SPI clock signal with weak internal pull-down. PIO5 and PIO6 are outputs, used to inform the mode group status. Note：The corresponding states of PIO [5:6] are: [00] idle state, [01] broadcast state, [10] successful connection, data cache area is not full, [11] connection state, and data cache area is full.

PIO6 / SPI_CSB

Bidirectional with programmable strength internal pull-up/down

Programmable I/O line or debug SPI CSB selected by SPI_ SEL #. CMOS input with weak internal pull-up. Active low chip select for SPI PIO5 and PIO6 are outputs, used to inform the mode group status. Note：The same as the pio5

PIO7 / SPI_MOS I

Bidirectional with programmable strength internal pull-up/down

Host wake up:Signal from the module to the host,output high level for 50ms ; Debug SPI MOSI selected by SPI_ SEL #.

PIO8 / SPI_MIS O

Bidirectional with programmable strength internal pull-up/down

Bluetooth disconnect（Active low）: Pull down more than 1s and less than 5s：

1. When the module is connected, it could disconnect;

2. When the module is idle, it starts advertising. Pulling down more than 5s：

1. When the module is connected, it could disconnect and clear the pairing information;

2. When the module is idle, it could clear the pairing information and starts advertising. Debug SPI MISO selected by SPI_ SEL #.

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The above version applies to I41Xe.STD.0.20171

117.1 and previous versions.The following versi on refers to the following： Pull down more than 20ms and less than 2s：

1. When the module is connected, it could disconnect;

2. When the module is idle, it starts advertising. Pulling down more than 2s：

1. When the module is connected, it could disconnect and clear the pairing information;

2. When the module is idle, it could clear the pairing information and starts advertising. Debug SPI MISO selected by SPI_SEL#.

PIO9

Bidirectional with programmable strength internal pull-up/down

Programmable I/O line

PIO10

Bidirectional with programmable strength internal pull-up/down

Programmable I/O line

PIO11

Bidirectional with programmable strength internal pull-up/down

Programmable I/O line

GND

Ground

GND

Ground

PIO0/SPI _SEL

Input with strong internal pull-down

This pin foot pulls high to SPI mode, pulled low for programmable I/O port mode. i410e-s internal pull-down

GND

Ground

GND

Ground

VDD_BAT

POWER

+3.3V supply voltage connection. Battery input and regulator enables (active high).

WAKE

Bluetooth device wake-up: Signal from the host to the module, pull high to sleep mode, pull low for wake up mode. NC if not used.

GND

Ground

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GND

Ground

GND

Ground

GND

Ground

EXT_ANT

External antenna

If use the external antenna interface, the on-board antenna needs to be removed.

Rating

Min

Max

Unit

Storage temperature

-40

℃

Battery (VDD_BAT)operation

1.8

3.6

I/O supply voltage

-0.4

3.6

Other terminal voltages

VSS-0.4

VDD+0.4

Min

Typ

Max

Unit

Operating temperature

-40

℃

Battery(VDD_BAT) Operation

1.8

3.6

I/O supply voltage(VDD_PADS)

1.2 - 3.6

Min

Typ.

Max

Unit

Switch-mode Regulator

input voltage

1.8 - 3.6

Output voltage

0.65

1.35

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4. Electrical Characteristics

4.1. Absolute Maximum Ratings

Table 3： Absolute Maximum Ratings

4.2. Recommended Operating Conditions

Table 4：Recommended Operating Conditions

4.3. Input/output Terminal Characteristics

4.3.1. Switch-mode Regulator

Table 5：Switch-mode Regulator

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Temperature coefficient

-200

200

ppm/℃

Normal Operation

Output noise, Frequency range 100Hz to 100KHz

- - 0.4

mV rms

Setting time, setting to within 10% of final value

- - 30

µs

Output current(I

max

)

- - 50

Quiescent current(excluding load, I

load

<1mA)

- - 20

µA

Ultra Low-power Mode

Output current(I

max

)

- - 100

µA

Quiescend current

- - 1

µA

Min

Typ.

Max

Unit

Input Voltage Levels

input Logic level low

-0.4 - 0.4

input logic level high

0.7*VDD

VDD+0.4

Tr/Tf - - 25

Output Voltage Levels

VOL output logic level low, IOL = 4.0mA

- - 0.4

VOH output logic level high, IOH=-4.0mA

0.75*VDD

- - V

Tf/Tf - - 5

Input and Tristate Currents

With strong pull-up

-150

-40

-10

µA

I2C with strong pull-up

-250 - -

µA

With strong pull-down

150

µA

With weak pull-up

-5.0

-1.0

-0.33

µA

With weak pull-down

0.33

1.0

5.0

µA

CI input capacitance

1.0 - 5.0

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4.3.2. Digital Terminals

Table 6：Digital Terminals

4.3.3. AIO

Table 7：AIO

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Input Voltage Levels

Min

Typ.

Max

Unit

Input voltage

0 - 1.3

Condition

Max

Unit

Human body model contact discharge per JEDEC EIA/JESD22-A114

2000V(all

pins)

Machine model contact Discharge per JEDEC EIA/JESD22-A115

200V

200V(all

pings)

Charged Device Model Contact Discharge per JEDEC EIA/JESD22-C101

III

500V(all

pins)

Operation

Mode

Description

Average

Dormant

All functions are shutdown. To wake up toggle the wake pin.

5~6uA

Deep Sleep

VDD_PADS=ON, REFCLK=OFF, SLEEPCLK=ON, VDD_BAT=ON, RAM=ON, digital circuits=ON, SMPs=ON(low-power mode), 1ms wake-up time

7~8µA

Connected Standby

~1.2mA

RX/TX active

~ 4mA

Items

contents

Bluetooth specification

Version 4.1

2402 to 2480 MHz

Current Consumption

Min.

Typ.

Max.

unit

(a) DH5 Packet 50% Rx/Tx slot duty cycle

1.35

(b) 2DH5 Packet 50% Rx/Tx slot duty cycle

- - -

Transmitter

Min.

Typ.

Max.

unit

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4.3.4. ESD Protection

Table 8：ESD Handling Maximum Ratings

4.4. Current Consumption

Table 9：Current Consumption

4.5. RF Characteristics

Table 10：RF Characteristics for Bluetooth

Channel frequency

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dBm

Frequency range

2400

2483.5

MHz

Receiver

Min.

Typ.

Max.

unit

Sensitivity (BER<0.1%)

-89

-90

dBm

Parameters

Possible Values

Baud rate Minimum

1200 baud (≤2%Error)

9600 baud (≤1%Error)

Maximum

2Mbaud (≤1%Error)

Flow control

RTS/CTS, none

Parity

None, Odd, Even

Number of stop bits

1 or 2

Bits per channel

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Output Power

0.5

5. Physical Interfaces

5.1. UART Interface

i410e-s Universal Asynchronous Receiver Transmitter (UART) interface provides a simple mechanism for communicating with other serial devices using the RS232 standard. The UART interface of i410e-s uses voltage levels of 0 to VDD and thus external transceiver IC is required to meet the voltage level specifications of UART.

In order to communicate with the UART at its maximum data rate using a standard PC, an accelerated serial port adapter card is required for the PC.

Table 11：Possible UART Settings

NOTE: The maximum baud rate is 9600bps during deep sleep.

5.2. SPI Interface

The synchronous serial port interface (SPI) is for interfacing with other digital devices. The SPI port can be used for system debugging. SPI interface is connected using the MOSI, MISO, CSB and CLK pins. It uses a 16-bit data and 16-bit address programming and debug interface. Transaction occurs when the internal processor is running or is stopped.

data on MISO. Table12 shows the instruction cycle for a SPI transaction.

Table 12：Instruction Cycle for a SPI Transaction

The module operates as a slave and receives commands on MOSI and outputs

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Step

Operation

Description

Reset the SPI interface

Hold CSB high for 2 CLK cycles

Write the command word

Take CSB low and clock in the 8-bit command

Write the address

Clock in the 16-bit address word

Write or read data words

Clock in or out 16-bit data words

Termination

Take CSB high

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With the exception of reset, CSB must be held low during the transaction. Data on MOSI is clocked on the rising edge of the clock line CLK. When reading, i410e-s replies to the master on MISO with the data changing on the falling edge of the CLK. The master provides the clock on CLK. The transaction is terminated by taking CSB high.

The auto increment operation on the i410e-s cuts down on the overhead of sending a command word and the address of a register for each read or write, especially when large amounts of data are to be transferred. The auto increment offers increased data transfer efficiency on the i410e-s. To invoke auto increment, CSB is kept low, which auto increments the address, while providing an extra 16 clock cycles for each extra word written or read.

6. i410e-s physical Dimensions

6.1. Dimension

Dimension is 9mm (L) *13.3mm (W)* 1.75mm (H). (Tolerance:±0.25mm)

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Figure 4: i410e-s Footprint

6.2. Recommended PCB layout Footprint

Figure 5: PCB layout Footprint

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7. Package

7.1. Net weight

The module net weight: 0.420.05g

7.2. Package

Tray package: 150pcs (10*15) per tray.

Tray package size: 25.3cm (L) x20.5cm (W)

Each cell size: 13.5cm (L) x10mm (W)

8. Certification

8.1. BQB

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8.2. TELEC

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i410e-s Datasheet

8.3. For FCC

FCC ID: 2AOXV-I410E-S While maintain a distance>20cm: Federal Communication Commission (FCC) Radiation Exposure Statement

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When using the product, maintain a distance of 20cm from the body to ensure

compliance with RF exposure requirements.

FCC statements: This device complies with part 15 of the FCC rules. Operation is subject to the

following two conditions:

(1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that

may cause undesired operation.

NOTE: The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications or changes to this equipment. Such modifications or changes could void the user’s authority to operate the equipment.

NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

‐ Reorient or relocate the receiving antenna.

‐ Increase the separation between the equipment and receiver.

‐Connect the equipment into an outlet on a circuit different from that to which

the receiver is connected.

‐Consult the dealer or an experienced radio/TV technician for help.

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8.4. Certificate of Broadcasting and Communication

Equipments

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9. SRRC

This Datasheet is for SRRC certification.

Equipment label (this part of the label will be reflected on the outer packaging of the product when shipped)

Figure 6: label

10. Company Profile

Barrot Technology – Barrot is a world leading one-stop chipset level solution provider who offers wireless connectivity and audio intelligent hardware solutions featuring with own IPs. The company is an associated member of The Bluetooth SIG, and it is the only one who contributes to Bluetooth specification definition in Greater China. Barrot owns three high-tech IPs: Bluetooth RF, Bluetooth stack and Acoustic algorithms, so Barrot offers most integrated, robust, reliable, and easy-to-use wireless turn-key solutions for IOT, Automotive and Wireless audio applications.

Barrot devotes itself to being the most reliable short distance wireless technologies’ solution provider in the world.

11. Contact Information

11.1. Beijing

Beijing Tel: +86 10 82702580

Fax: +86 10 82898219

Address:C710, Shangdi International Pioneering Park No.2, Shang Di Xin Xi Road,

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Haidian District, Beijing , 100089 P.R. China

Marketing Email: marketing@barrot.com.cn marketing@ivtwireless.com

Support: support@barrot.com.cn support@ivtwireless.com

Web site: www.barrot.com.cn

11.2. Shenzhen

Shenzhen Tel: +86 755 27885822-603

Address:BlockA,2nd Floor, New Deal Industrial Park-B, Xin'an Street, Bao’an Distr ict 71, Shenzhen，518101

Support: support@barrot.com.cn

Web site: www.barrot.com.cn

11.3. Shanghai

Address: 3rd Floor, No. 500, Bibo Road, Zhangjiang Gaoke, Pudong New Area,

Shanghai

Support: support@barrot.com.cn Web site: www.barrot.com.cn

12. Copyright

The Bluetooth trademark is owned by The Bluetooth SIG, and the usage of this

trademark is licensed to Barrot Technology Limited.

Other trademarks included in this document are owned by their respective

owners.

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Drying under 125℃

Drying under 90℃，≤5%RH

Drying under 40℃，≤5%RH

Over floor

life >72

hours

Over floor

life≤72

hours

Over floor

life >72

hours

Over floor

life≤72 hours

Over floor

life >72

hours

Over floor

life≤72 hours

9 hours

7 hours

33 hours

23 hours

13 days

9 days

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Appendix

1. Storage Requirements

1.1 Temperature: 22~28℃；

1.2 Humidity: <70%（RH）；

Vacuum packed and sealed in good condition to ensure 12 months of welding.

2. Humidity Sensitive Characteristic

2.1 MSL: 3 level

2.2 Once opened, SMT within 168 hours in the condition of temperature: 22~28

℃ and humidity<60%（RH）. Once production line stops, modules should either be stored in the drying box or be vacuum packed. If it fails to meet above storage conditions, Bluetooth modules need drying. Drying parameters refer to Table 2-1.

2.3 Handling, storage, and processing should follow IPC/JEDECJ-STD-033

Table 2-1： Mounted or un-mounted SMD package drying reference condition

（User drying：Shop life starts after drying，Time=0）

3. PCB Design Instruction

3.1 PCB Pad Surface Treatment

ENIG（Chemistry Ni/Au）、 OSP are recommended for PCB surface treatment. ENIG

（Chemistry Ni/Au）is preferred.

3.2 PCB Pad Design

3.2.1 In order to ensure high production efficiency and high reliability of solder joints, PCB pad design refers to recommended PCB pad size in the corresponding product specification.

3.2.2 Even only part of PINs are used, it is recommended to do full pad design, symmetric pad design, or asymmetric pad design(refer to Figure 3-1). During reflow, if the pad paste melts, the module is vulnerable to non-balanced force pull. It may lead to PIN short circuit if the module deflects under the action of torque.

Figure 3-1:Asymmetric Pad Design

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3.3.3 Layout Requirements

a. For PCB double sided layout, it is recommended to process on 2nd side.

b. The layout of other elements should be avoided on the outermost end 1mm area of module pad. In order to increase repair space, other elements layouts should be as far away from the module as possible. The minimum distance between the module pad and PCB board edge is 1.5mm.

3.3.4 Compatible Design Considerations

To prevent any hidden risks, module placement area（See the red rectangle in Figure 3-2 below） shouldn’t include any pad design which intends to be compatible with other elements.

Figure 3-2 :Module Placement Area Example

4. SMT Notes

4.1 All Bluetooth modules of our company are lead free. It is suggested to use lead free process technique when SMT processing to prevent the reduction of the reliability of module welding technique which may be caused by the usage of lead production process technique.

Note：the lead BGA solder ball has low melting point（183℃）， the lead-free BGA

solder ball has high melting point（217℃-221℃）。 When the temperature rises to 183

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℃, the solder paste is melting; When the temperature rises to 220℃, lead free BGA solder ball starts to melt, and it is in the state of coexistence of solid and liquid. If lead technology is used and the furnace starts cooling, the original welding surface structure of BGA elements is damaged, and a new alloyed layer of the welding surface cannot be formed. This may lead to lead free BGA solder joint failure during reflow, which results in pseudo solder joints and other reliability issues in further.

4.2 SMT stencil Design

Ladder stencil is recommended. Stencil opening design requirements are as

follows:

4.2.1 The module PIN foot area is suggested to be thickened to 0.18-0.25mm; this thickened area should be kept at least 1mm spacing with other elements;

4.2.2 Opening width: 55%-65% of PCB PIN foot pad Pitch (centre-to-centre spacing)

(Since the actual width of the motherboard pad is not ensured, the opening

width is determined by pitch.)

4.2.3 Opening length: based on PCB PIN foot, cutting 0.1-0.2mm towards inside, and extending 0.5-0.8mm towards outside. Outer extension pads maintain at least

0.25mm safety spacing with other elements. Cutting module pad opening if not enough space is left. Opening should be round corners.

4.3 Reflow Profile

4.3.1When making the furnace temperature curve，it should add temperature measuring circuit under Bluetooth module’s BGA to measure its real time temperature.

Recommended temperature parameters：

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Increasing slope（℃/SEC）： 1~2

Descending slope（℃/SEC）： -4~-1

Reflow time（S）： 40~70

Peak teamperature（℃）： 240-248

The actual furnace temperature curve for Bluetooth modules production:

4.4 Reflow Soldering

4.4.1 When PCBA which is mounted with Bluetooth module and it enters reflow, please strictly ensure PCBA boards to pass through furnace via track path. Passing through furnace via the net cover of reflow oven is prohibited.

Since Bluetooth contains BGA elements, the net cover vibration may lead to high

rates of BGA solder welding defects.

4.4.2 During reflow, if it is not double-side board, it shouldn’t place the side which is mounted Bluetooth as the first side to proceed. Mounting Bluetooth on the second sid is suggested. Note: During reflow, since BGA type components are downwards, BGA solder joints are stretched. This may lead to the vulnerability of solder joints. It may eventually result in the brokenness of solder joints and other hidden dangers under the influence of external forces.

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4.4.3 Interference Design which may lead to offset of module’s elements should

be avoided during reflow soldering technique design (i.e. designing furnace jig).

4.4.4 No need to add red glue or other adhesive on the lower part of module. Module recommended pad design can ensure the good solder ability of module PIN foot. Even for any special reason, modules are designed on the first side and need to be reflowed.

4.5 Wave soldering of PCBA after module is mounted

4.5.1 If process requirements require PCBA which is mounted with modules do wave soldering, please ensure special protection to the module in order to prevent its elements from soldering shortcut or other unpredictable hidden risks which may be caused by splash or other abnormity during wave soldering.

4.5.2 Wave soldering on PCBA which is mounted with module is not recommended. Pls wave soldering PCBA at the first and then manually soldering module on it.

4.6 Manual welding of other elements after module is mounted on PCBA

4.6.1 If some elements needs to be manually soldered onto PCBA after PCBA is mounted with module, such as welding wires, please protect the module with the cover during manual welding process, especially when the manual welding area is close to the module.

4.6.2 PCBA should be placed in the upper part of the manual welding bench, or quickly flows to the next bench. It is not suggested to place it in the lower part of welding bench, such as under welding bench.

5. Repair Instructions

5.1 The process of rework depends on the condition of repair.

The recommended repair method in this document is not the only method. The selection of repair operations depends on the actual hardware, and it should follow the basic technique requirements during repair.

5.2 Repair Technique Instruction

5.2.1 No matter it is disassembly or welding, repairing requires for the condition

of the temperature ascension requirement ≤3℃/sec，highest temperature≤260℃

5.2.2 If repair elements exceed the storage period, it needs drying (refers to

Table 2-1) before repairing

5.3 Module Disassembly

5.3.1 When disassembly, melting and reflowing soldering flux by proving fast,

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controllable and even heating. It ensures all solder joints melt at the same time. When disassembly, it should avoid any thermal or mechanical damage to modules, PCB, adjacent elements, and their solder joints.

5.3.2 It is recommended to adopt infrared heating or hot air heating method; It is

recommended to design & use special jig for module disassembly or pickup

5.4 Module Welding/Replacement

5.4.1 Preparation Before Welding：

5.4.1.1 Using irons and woven materials which are able to moisten soldering flux

to remove the old soldering flux on soldering pad.

5.4.1.2 Cleaning pad & remove flux residues

5.4.1.3 Soldering flux pre-fill：Before module is installed into the board, using the

appropriate way to add soldering tin on solder pads, it ensures the closeness of the height of solder paste after it melts and re-solidifies.

5.4.1.4 It is suggested to make jig or small printed tin steel mesh to repair solder

paste printing

5.4.2 Installing modules into solder pads and ensure the correction of its direction. In order to ensure the temperature of each assembly element stays same during reflow, it is suggested to preheat modules. After heating soldering flux, it reflows to ensure reliable connection. When the solder joint maintains the appropriate reflow time at a predetermined temperature, it forms better IMC.

5.4.3 When the module is installed into the pad after printing, it is suggested to use special jig to pick it up.

5.4.4 Special repair equipment is recommended to be either selected or designed for repairing.

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Specifications and Main Features

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User Manual