AzureWave Technologies CM389NF User Manual

AW-CM389NF

IEEE 802.11 2X2 MIMO a/b/g/n/ac Wireless

LAN + Bluetooth + NFC

NGFF Module

Datasheet

Version 0.9

- 1 -

Document

release

Version0.1 2013/08/13 Initial version

Version0.2 2013/10/08

Date Modification Initials Approved

1. Update Pin Map

2. Update Interface Configuration straps

Kai Wu

Alex Yu

Chihhao

Liao

Chihhao

Liao

1. Update Pin Map

Version0.3 2013/11/07

Version0.4 2013/11/19

Version0.5 2013/12/03 Add “4 Pin Definition’s Notes” Alex Yu

Version0.6 2013/12/05 Update “4 Pin Definition’s Notes” Alex Yu

Version0.7 2013/12/11

Version0.8 2014/03/20

2. Update Pin Definition

3. Update Dimension

1. Update “2 Electrical Characteristic”

2. Update “3-1 SDIO Interface”

3. Update “4 Pin Definition”

4. Update “5 Mechanical Information”

5. Add “2-2.1 The interface pins power supply”

1. Update “1-2 Block Diagram”

2. Update “5-2 Module Footprint”

1. Update “1-4 Bluetooth Standard”

2. Update “5-1 Mechanical Information”

3. Update “2-3 Clock Specification”

4. Update “5-2 Module Footprint”

5. Add “7. Shipping Information”

Alex Yu

Chihhao

Liao

Chihhao

Liao

Chihhao

Liao

Chihhao

Liao

Chihhao

Liao

Chihhao

Liao

Version0.9 2014/04/14

1. Update “1-4 Specifications Table”

2. Update “5-1 Mechanical Information”

Alex Yu

Chihhao

Liao

- 2 -

1. General Description

1-1. Product Overview and Functional Description

AzureWave Technologies, Inc. introduces the IEEE 802.11ac/a/b/g/n 2X2 MIMO WLAN & Bluetooth & NFC NGFF module --- AW-CM389NF. The module is targeted to mobile devices including Notebook, TV, Tablet and Gaming Device which need small package module, low power consumption, multiple

interfaces and OS support. By using AW-CH389, the customers can easily enable the Wi-Fi, and BT embedded applications with the benefits of high design flexibility, short development cycle, and quick time-to-market.

Compliance with the IEEE 802.11ac/a/b/g/n standard, the AW-CM389NF uses Direct Sequence Spread Spectrum (DSSS), Orthogonal Frequency Division Multiplexing (OFDM), DBPSK, DQPSK, CCK and QAM baseband modulation technologies. A high level of integration and full implementation of the power

management functions specified in the IEEE 802.11 standard minimize the system power requirements by using AW-CH389. In addition to the support of WPA/WPA2 and WEP 64-bit and 128-bit encryption, the AW-CM389NF also supports the IEEE 802.11i security standard through the implementation of Advanced Encryption Standard (AES)/Counter Mode CBC-MAC Protocol (CCMP), Wired Equivalent Privacy (WEP) with Temporal Key Integrity Protocol (TKIP), Advanced Encryption Standard (AES)/Cipher-Based Message Authentication Code (CMAC), and WLAN Authentication and Privacy Infrastructure (WAPI) security mechanisms. For the video, voice and multimedia applications the AW-CM389NF support 802.11e Quality of Service (QoS). The device also supports 802.11h Dynamic Frequency Selection (DFS) for detecting radar

pulses when operating in the 5GHz range. For Bluetooth operation, AW-CM389NF is Bluetooth 4.0 (supports Low Energy). AW-CM389NF supports SDIO, PCIE, USB, and high speed UART interfaces for WLAN and Bluetooth

to the host processor.

AW-CM389NF is suitable for multiple mobile processors for different applications with the support cellular phone co-existence.

AW-CM389NF module adopts Marvell’s latest highly-integrated dual-band WLAN & Bluetooth SoC--88W8897. All the other components are implemented by all means to reach the mechanical specification

required.

- 3 -

1-2. Block Diagram

Note: Interface supports and combinations as shown below:

Scenario WLAN BT/NFC BT_AMPS

1 SDIO SDIO SDIO SDIO Serial CON[3:0]=b'0111

2 SDIO SDIO -- SDIO Serial CON[3:0]=b'0001

3 SDIO UART SDIO SDIO or UART Serial CON[3:0]=b'1101

4 SDIO UART SDIO SDIO + UART Parallel CON[3:0]=b'0010

5 SDIO UART -- SDIO or UART Serial CON[3:0]=b'0100

6 USB USB USB USB Serial CON[3:0]=b'0110

7 USB UART USB USB or UART Serial CON[3:0]=b'1010

8 USB UART -- USB + UART Parallel CON[3:0]=b'1000

9 PCIe UART -- PCIe + UART Parallel CON[3:0]=b'1111

10 PCIe UART -- PCIe or UART Serial CON[3:0]=b'1100

11 PCIe USB USB PCIe Serial CON[3:0]=b'1110

Firmware

Download I/F

Firmware

Download Mode

Configuration*

- 4 -

*Configuration pins:

Configuration Pin No Pin Name

CON[3] 13 CONFIG_HOST[3]

CON[2] 10 CONFIG_HOST[2]

CON[1] 9 CONFIG_HOST[1]

CON[0] 8 CONFIG_HOST[0]

1-3. Key feature:

Small footprint: 12mm(L) x 16mm(W) x 1.4 mm(H) SDIO3.0, G-SPI, USB interfaces support for WLAN High speed UART,PCM/Inter-IC Sound(I2S) and SDIO3.0, USB for Bluetooth Bluetooth 4.0 complaint with Bluetooth 2.1 + Enhanced Data Rate (EDR) Audio Codec interface support Cellular phone co-existence support Multiple power saving modes for low power consumption IEEE 802.11i for advanced security Quality of Service (QoS) support for multimedia applications Drip-in WLAN Linux drivers are Android ready and validated on Android based systems. Support for Linux kernel versions up to 2.6.32. Support for BlueZ v4.47 Bluetooth profiles stack used in Android Éclair Simultaneous AP-STA Support China WAPI Lead-free design

- 5 -

1-4. Specifications Table

Model Name AW-CM389NF

Product Description 2x2 MIMO Wireless LAN + Bluetooth + NFC Combo Module

WLAN Standard IEEE 802.11 a/b/g/n/ac, Wi-Fi compliant

Bluetooth Standard Bluetooth 4.0 complaint with Bluetooth 2.1+Enhanced Data Rate (EDR)

NFC Standard

Host Interface USB 2.0 for WLAN and Bluetooth

Major Chipset

Dimension 12mm x 16mm x 1.4mm

Weight TBD

Package LGA

Full protocol support for ISO 14443A/B, ISO 18092, ISO 15693, NFCIP-1, NFC Forum, EMV contactless targets with data rates up to 848 Kbps

Marvell 88W8897

Operating Conditions

Voltage 3.3V+- 10%

Temperature Operating: -20 ~ 70oC ; Storage: -40 ~ 85oC

Electrical Specifications

Frequency Range

Number of Channels

2.4 GHz ISM radio band /

Infrastructure (U-NII) band

802.11a: USA, Taiwan – 12/4 Most European Countries –19 Japan – 4

802.11b: USA, Canada and Taiwan – 11 Most European Countries – 13 France – 4

802.11g: USA, Canada and Taiwan – 11 Most European Countries – 13 Japan – 13

802.11n(HT20): Channel 1~14(2412~2484)

802.11n(HT40): Channel 1~7(2422~2472)

5 GHz Unlicensed National Information

Modulation

Output Power

DSSS, OFDM, DBPSK, DQPSK, CCK, 16-QAM, 64-QAM for WLAN GFSK (1Mbps), /4 DQPSK (2Mbps) and 8DPSK (3Mbps) for Bluetooth

WLAN G band: 11b:16dBm +/- 2dBm(11M) 11g:14dBm +/- 2dBm (54M) 11n:HT20 13dBm +/- 2dBm(MCS7) HT40 11dBm +/- 2dBm(MCS7)

WLAN A band: 11a: 13dBm +/- 2dBm(54M) 11n:HT20 12dBm +/- 2dBm(MCS7) HT40 10dBm +/- 2dBm(MCS7) 11ac: 8dBm +/- 2dBm(MCS9)

Bluetooth: Class 2

- 6 -

Main Connector: WLAN Aux Connector: WLAN + BT WLAN G band :

11b:-83dBm (11M) 11g:-72dBm (54M) 11n:HT20 -68dBm (MCS7) HT40 -65dBm (MCS7)

WLAN A band: 11a: -67dBm (54M) 11n:HT20 -67dBm (MCS7) HT40 -64dBm(MCS7) 11ac: -54dBm(MCS9)

Bluetooth: DH1:-70dBm 3DH5:-70dBm

CSMA/CA with ACK

WLAN

802.11b: 1, 2, 5.5, 11Mbps

802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54Mbps

802.11n: up to 150Mbps-single

802.11n: up to 300Mbps-2x2 MIMO

802.11ac:up to 192.6Mbps (20MHz channel)

802.11ac:up to 400Mbps (40MHz channel)

802.11ac:up to 866.7Mbps (80MHz channel) Bluetooth Bluetooth 2.1+EDR data rates of 1,2, and 3Mbps NFC NFC data rates up to 848Kbps

TBD

Open Space: ~300m ; Indoor: ~100m for WLAN Minimum 10 m indoor for Bluetooth The transmission speed may vary according to the environment)

WAPI WEP 64-bit and 128-bit encryption with H/W TKIP processing WPA/WPA2 (Wi-Fi Protected Access) AES-CCMP hardware implementation as part of 802.11i security standard

Linux(Android), Windows, More information please contact Azurewave FAE.

Bluetooth and cell phone(GSM/DCS/WCDMA/UMTS/3G) co-existence

- 7 -

2. Electrical Characteristic

2-1. Absolute Maximum Ratings

Symbol Parameter Condition Min Typ Max Units

--

Pin73/ VIO Host I/O power supply

Pin44/ VIO_SD SDIO power supply

Pin5/ 3V3_VBAT LDO VBAT input -- -- 3.3 5.0 V

Pin72/ 3V3_USB LDO USB VBAT input -- -- 3.3 4.0 V

Pin4/ 3V3_RF LDO RF VBAT input -- -- 3.3 4.0 V

--

1.8

2.5

3.3

1.8

3.3

2.2

3.0

4.0

2.2

4.0

2-2. Recommended Operating Conditions

Symbol Parameter Condition Min Typ Max Units

Pin73/ VIO

Pin44/ VIO_SD

1.8V/2.5V/3.3V digital

I/O power supply

1.8V/3.3V digital I/O

SDIO power supply

--

1.62

2.25

2.97

1.62

2.97

1.8

2.5

3.3

1.8

3.3

1.98

2.75

3.63

1.98

3.63

V

Pin5/ 3V3_VBAT LDO VBAT input -- 2.7 3.3 5.0 V

Pin72/ 3V3_USB LDO USB VBAT input -- 2.97 3.3 3.63 V

Pin4/ 3V3_RF LDO RF VBAT input -- 2.97 3.3 3.63 V

2-2.1 The interface pins power supply

The NFC interface pins are powered from the module’s chip LDO 1.8V voltage supply internal.

The SDIO host interface pins are powered from the chip VIO_SD (pin 44) 1.8V/3.3V voltage supply.

- SDIO Defauld Speed, High Speed Modes (3.3V)

- SDR12, SDR25, SDR50 Modes (up to 100MHz) (1.8V)

- SDR104 Mode (208MHz) (1.8V)

The PCI Express host interface pins are powered from the module’s chip LDO 1.8V voltage supply internal.

The USB2.0 host interface pins are powered from the 3V3_USB (pin 72) 3.3V voltage supply.

The UART Tx and Rx pins are powered from the VIO (pin 73) voltage supply.

The GPIO pins are powered from the VIO (pin 73) voltage supply (GPIO [9:8] from 3.3V voltage internal).

The clocked serial pins are powered from the module’s chip LDO 1.8V voltage supply internal.

The audio pins are powered from the chip VIO (pin 73) voltage supply.

- 8 -

2-3. Clock Specifications

2-3.1 External Sleep Clock Timing External Sleep Clock is necessary for two reasons:

1. Auto frequency Detection.

This is where the internal logic will bin the Ref clock source to figure out what is the reference clock

frequency is. This is done so no strapping is needed for telling 8897 what the ref clock input is.

2. Allow low current modes for BT to enter sleep modes such as sniff modes.

The AW-CM389NF external sleep clock pin is powered from the 3.3V voltage supply.

Symbol Parameter Min Typ Max Units

CLK Clock Frequency Range

T

Clock high time 40 -- -- ns

HIGH

T

Clock low time 40 -- -- ns

LOW

T

Clock rise time -- -- 5 ns

RISE

T

Clock fall time -- -- 5 ns

FALL

32 or 32.768 -

32 or 32.768 32 or 32.768 +50ppm KHz

50ppm

2-4. Reset Configuration

The AW-CM389NF is reset to its default operating state under the following conditions:

Power-on reset (POR)

Software/Firmware reset

External pin reset (RESETn)

2-4-1. Internal Reset

The AW-CM389NF device is reset, and the internal CPU begins the boot sequence when any of the following

internal reset events occur:

Device receives power and VDDL supplies rise (triggers internal POR circuit)

External pin (PDn) assertion will generate POR

2-4-2.

The AW-CM389NF is reset when PDn pin is asserted low and the internal CPU begins the boot sequence when

the PDn pin transitions from low to high.

External Reset

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2-5. Power up Timing Sequence

- 10 -

3. Host Interfaces

3-1. SDIO Interface

The AW-CM389NF supports a SDIO device interface that conforms to the industry standard SDIO Full-Speed card

specification and allows a host controller using the SDIO bus protocol to access the Wireless module device.

The AW-CM389NF acts as the device on the SDIO bus. The host unit can access registers of the SDIO interface

directly and can access shared memory in the device through the use of BARs and a DMA engine.

The SDIO device interface main features include:

Supports SDIO 3.0 Standard

On-chip memory used for CIS

Supports SPI, 1-bit SDIO, and 4-bit SDIO transfer modes

Special interrupt register for information exchange

Allows card to interrupt host

3-1-1. SDIO Interface Signal Description

Signal

Pin Name

SD_CLK CLK I/O SDIO 1-bit mode: Clock

SD_CMD CMD I/O SDIO 1-bit mode: Command line

SD_DAT[3] DAT3 I/O SDIO 4-bit mode: Data line bit [3]

SD_DAT[2] DAT2 I/O SDIO 4-bit mode: Data line bit [2] or Read Wait (optional)

SD_DAT[1] DAT1 I/O SDIO 4-bit mode: Data line bit [1]

SD_DAT[0] DAT0 I/O SDIO 4-bit mode: Data line bit [0]

Name

Type

Description

SDIO SPI mode: Clock

SDIO SPI mode: Data input

SDIO 1-bit mode: Not used

SDIO SPI mode: Chip select (active low)

SDIO 1-bit mode: Read Wait (optional)

SDIO SPII mode: Reserved

SDIO 1-bit mode: Interrupt

SDIO SPI mode: Interrupt

SDIO 1-bit mode: Data line

SDIO SPI mode: Data output

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3-1-2. Default Speed, High Speed Modes (3.3V)

SDIO Protocol Timing Diagram – Default Speed Mode (3.3V)

SDIO Protocol Timing Diagram – HighSpeed Mode (3.3V)

Table shows SDIO Timing Data—Default Speed, High Speed Modes (3.3V)

NOTE: Over full range of values specified in the Recommended Operating Conditions unless otherwise specified.

- 12 -

- 13 -

3-1-3. SDR12, SDR25, SDR50 Modes (up to 100MHz) (1.8V)

SDIO Protocol Timing Diagram – SDR12,SDR25,SDR50 Modes (up to 100MHz) (1.8V)

Table shows SDIO Timing Data—SDR12,SDR25,SDR50 Modes (up to 100MHz) (1.8V)

- 14 -

3-1-4. SDR104 Modes (208MHz) (1.8V)

SDIO Protocol Timing Diagram –SDR104 Mode (208MHz)

Table shows SDIO Timing Data—SDR104 Mode (208MHz)

- 15 -

3-2. PCI Express Interface 3-2-1 Differential Tx Output Electricals

- 16 -

3-2-2 Differential Rx Output Electricals

3-3. USB Interface

The USB device interface is compliant with the Universal Serial Bus Specification, Revision 2.0, April 27, 2000. A

USB host uses the USB cable bus and the USB 2.0 device interface to communicate with the chip.

The main features of the USB device interface include:

High/full speed operation (480/12 Mbps)

Suspend/host resume/device resume (remote wake-up)

Built-in DMA engine that reduces interrupt loads on the embedded processor and reduces the system bus

bandwidth requirement for serving the USB device operation

The USB 2.0 device interface is designed with 3.3V signal level pads.

- 17 -

3-3-1. USB 2.0 Device Interface Description

Table shows the signal mapping between the AW-CM389NF and the USB Specification, Revision 2.0.

3-3-2. USB 2.0 Device Functional Description

The device controller uses internal Scatter/Gather DMA engine to transfer the transmit packet from internal SRAM

to USB and the receive packet from USB to internal SRAM. The Device IN Endpoint DMA (DIEPDMAn) and Device

OUT Endpoint DMA (DOEPDMAn) registers are used by the DMA engine to access the base descriptor. The

application is interrupted after the programmed transfer size extracted from the descriptors is transmitted or

received. By using registers, interrupts, and special data structures, the device controller can communicate with the

device controller driver (application/software) about bus states, host request, and data transfer status. The device

controller driver also has all of the routines to respond to the device framework commands issued by a USB host,

so it controls the attachment, configuration, operation, and detachment of the device.

3-4. High-Speed UART Interface

The AW-CH389 supports a high-speed Universal Asynchronous Receiver/Transmitter (UART) interface, compliant

to the industry standard 16550 specification. High-speed baud rates are supported to provide the physical transport

between the device and the host for exchanging Bluetooth data. Table shows the rates supported.

The UART interface features include:

FIFO mode permanently selected for transmit and receive operations

Two pins for transmit and receive operations

Two flow control pins

Interrupt triggers for low-power, high throughput operation

The UART interface operation includes:

Upload boot code to the internal CPU (for debug purposes)

Support diagnostic tests

Support data input/output operations for peripheral devices connected through a standard UART interface

- 18 -

3-4-1. UART Interface Signal Description

Table shows the standard UART signal names on the device.

3-4-2. UART Interface Functional Description

3-3-2-1. Booting from UART

When booting from the UART, the AW-CH389 device has the following requirements:

- 19 -

3-4-2-2. UART as Test Port

Test diagnostic programs may be uploaded to the CPU through the UART interface. During execution, the

diagnostic program transmits performance and status information through the UART by performing a write to the

PBU address space designated to the UART.

3-5. PCM Interface 3-5-1. PCM Timing Specification – Master Mode

- 20 -

3-5-2. PCM Timing Specification – Slave Mode

- 21 -

4. Pin Definition

Pin No Definition Basic Description Type

1 TMS

2 TCK JTAG test clock

3 TDI JTAG test data(input) I

4 3V3_RF

5 3V3_VBAT

6 GND

7 TDO JTAG test data(output) O

8 CONFIG_HOST[0] Configuration: CONFIG_HOST[0]

9 CONFIG_HOST[1]

10 CONFIG_HOST[2]

11 GPIO[1]/LTE_SOUT

12 GPIO[2]/LTE_SIN

13 CONFIG_HOST[3] Configuration: CONFIG_HOST[3]

GPIO[10]/NFC_NOT_ALLO

14

15 NFC_WI_IN SE I/O for NFC-WI or DCLB, depending on the configuration

WED(I)

JTAG controller select

3.3V Analog RF Power Supply

3.3V VBAT system power supply input

System Ground Pin

Configuration: CONFIG_HOST[1]

Configuration: CONFIG_HOST[2]

UART_LTE_SOUT (output)

UART_LTE_SIN (input)

GPIO[10] (input/output)

I

I/O

16 NFC_SW1_VDDIN

17 GND

18 NFC_SWP2_IO

19 NFC_SWP1_IO UICC Single Wire Protocol I/O CSP only I/O

20 GND

21

22 NFC_SWP2_Vout

23 GND

24 NFC_ANTN

25 NFC_ANTP

26 GND

27 SLP_CLK

NFC_SWP1_Vout Supply to UICC from device thru integrated power switch CSP only. I/O

Supply from device to UICC thru integrated power switch CSP only

System Ground Pin

SE I/O for SWP, NFC-WI, or DCLB, depending on the configuration

System Ground Pin

Supply from NFC to embedded SE CSP only.

System Ground Pin

Antenna Interface, negative input/output

Antenna Interface, positive input/output

System Ground Pin

Sleep Clock Input Used for WLAN and Bluetooth lowpower modes. External sleep clock of 32.768 KHz must be used for auto reference clock calibration and for WLAN/Bluetooth low power operation.

I/O

I

- 22 -

Pin No Definition Basic Description Type

28

29 PCIE_WAKEn

30 PCIE_CLKREQn

31

32 GND

33 PCIE_RCLK_N PCI Express Differential Clock Input—Negative

34 PCIE_RCLK_P PCI Express Differential Clock Input—Positive I

35 GND System Ground Pin

36 PCIE_TX_N PCI Express Transmit Data—Negative

37 PCIE_TX_P

38 GND System Ground Pin

39 PCIE_RX_N

40 PCIE_RX_P

41 GND System Ground Pin

GPIO[13]/NFC/BT IRQ(O) GPIO[13] (input/output)

PCIe wake signal (output) (active low)

PCIe clock request (input/output) (active low)

GPIO[12]/PCIE_PERSTn

PCIe host indication to reset the device (input) (active low)

System Ground Pin

PCI Express Transmit Data—Positive

PCI Express Receive Data—Negative

PCI Express Receive Data—Positive

I/O

O

I

O

I

42

43

44 VIO_SD

45 PDn Full Power Down (input) (active low) I

46 GPIO[3]/WLAN IRQ(O)

47 SD_DAT[3]

48 SD_DAT[2]

49 SD_DAT[1]

50 SD_DAT[0]

51 SD_CMD

52 SD_CLK

53 NC No Connect

54 GPIO[6]

55 GPIO[4]

GPIO[0]/CLK_REQ

GPIO[11]/NFC_ACTIVE(O)

GPIO[0] (input/output)

GPIO[11] (input/output)

1.8V/3.3V Digital I/O SDIO Power Supply

GPIO[3] (input/output)

SDIO Data line Bit[3]

SDIO Data line Bit[2]

SDIO Data line Bit[1]

SDIO Data line Bit[0]

SDIO Command/response (input/output)

SDIO Clock input

UART_CTSn (input)

UART_SOUT (output)

I/O

O

I

O

56 GPIO[5]

57 GPIO[7]

58

GPIO[22]/PCM_SYNC

UART_SIN (input)

UART_RTSn (output)

GPIO[22] (input/output)

- 23 -

I

O

I/O

Pin No Definition Basic Description Type

59 GPIO[19]/PCM_IN

60

61 GPIO[21]/PCM_CLK

62 GND

63 GPIO[14]

64 GPIO[8]/WLAN_LED

65 GPIO[9]/BT_LED

66 NFC_SDA

67 NFC_CLK

68 GND

69 USB_DM

70 USB_DP

71 GND

72 3V3_USB

GPIO[20]/PCM_OUT

GPIO[19] (input/output)

GPIO[20] (input/output)

GPIO[21] (input/output)

System Ground Pin

GPIO[14] (input/output)

LED_OUT_WLAN (output)

LED_OUT_BT (output)

I/O for external EEPROM using 2-wire protocol CSP only.

Serial clock for external EEPROM using 2-wire protocol CSP only.

System Ground Pin

USB Serial Differential Data Negative

USB Serial Differential Data Positive

System Ground Pin

3.3V Power Supply

I

O

I/O

O

I/O

I

73 VIO

74 GND

75 GND

76 GND

77 GND

78 GND

79 GND

80 GND

81 GND

82 GND

83 GND

84 GND

85 GND

86 GND

Digital I/O Power Supply

System Ground Pin

I

87 GND

88 GND

89 GND

System Ground Pin

- 24 -

Pin No Definition Basic Description Type

90 GND

91 GND

92 GND

93 GND

94 GND

95 GND

96 GND

G1 GND

G2 GND

G3 GND

G4 GND

G5 GND

G6 GND

G7 GND

System Ground Pin

G8 GND

G9 GND

G10 GND

G11 GND

G12 GND

G13 GND

G14 GND

G15 GND

G16 GND

G17 GND

G18 GND

G19 GND

G20 GND

G21 GND

System Ground Pin

G22 GND

G23 GND

G24 GND

System Ground Pin

- 25 -

Pin No Definition Basic Description Type

G25 GND

G26 GND

G27 GND

G28 GND

G29 GND

G30 GND

G31 GND

G32 GND

G33 GND

G34 GND

G35 GND

G36 GND

System Ground Pin

Notes:

1. SDIO signals should have 50 ohm impedances.

2. For SDIO interface, 33ohm inline resistor may be needed to help with signal integrity.

3. For GPIO[8] ,it's internal pull up to VIO-RF(3.3V).

4. For GPIO[9] ,it's internal pull up to VIO-RF(3.3V).

5. For PDn pin ,please pull up resistor(51k ohm) to hots or VBAT(3V3).

6. For SDIO interface, the pull up value is between 10K to 100K ohm according to the SDIO v3.0 SPEC.

7. PCIE Impedance targets: Single-ended Z of 60 ohms +- 15% . Differential Impedance of ~100 ohm +- 20%.

8. USB Impedance targets: D+/D- are differential and should have 90ohms impedance.

9. For NFC _SWP1_VDDIN ,please reserve a bypass capacitor(0.1 uF 0402) on the main board.

10. For GPIO[3] pin ,please pull up resistor(10k ohm) to VIO.

- 26 -

4-1 Pin Map

AW-CM389NF Top View Pin Map

- 27 -

5. Mechanical Information

5-1. Package Outline Drawing

- 28 -

5-2. Module Footprint

AW-CM389NF PCB Layout Footprint

- 29 -

6. Package Information

6-1. Recommended Reflow Profile

Reflow Soldering Profile

No Item Temperature(ɗɗɗɗ) Time(sec)

1 Reflow Time Time of above 220ɗ 35~55sec 2 Peak-Temp 260ɗ max

Note:

1. Recommend to supply N

for reflow oven

2

2. N

atmosphere during reflow (O2<300ppm)

2

- 30 -

7. Shipping Information

X

7-1

1 UNIT DESICCANT

AFFI

PACKING LABEL

7-2

AFFI

PACKING LABEL

䓇ṏ㞯䬦

HUMIDITY INDICATOR CARD

䓇ṏ㞯䬦

AFFI

PACKING LABEL

- 31 -

7-3

7-4

PINK BUBBLE WRAP

䓇ṏ㞯䬦

AFFIX PACKING LABEL

7-5

1 Carton= 5 Boxes

AFFIXPACKING LABEL

TRANSPARENT SEALING TAPE

- 32 -

7-6

↢峏㞯䬦

䓇ṏ㞯䬦

1

2

3

4

5

AFFIX PACKING LABEL

Note: 1 tape reel = 1 box = 1,500pcs 1 carton = 5 boxes = 5 * 1,500pcs=7,500pcs

- 33 -

Federal Communication Commission Interference Statement

f

A

5. Demo board schematic

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 o the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help.

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.

This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

Operations in the 5.15-5.25GHz band are restricted to indoor usage only.

Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.

This device is intended only for OEM integrators under the following conditions:

1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and

2) The transmitter module may not be co-located with any other transmitter or antenna.

s long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still

responsible for testing their end-product for any additional compliance requirements required with this module installed

IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or colocation with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.

End Product Labeling

This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains FCC ID: TLZ-AM691NF”. The grantee's FCC ID can be used only when all FCC compliance requirements are met.

Manual Information To the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user's manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

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Industry Canada statement:

This device complies with RSS-210 of the Industry Canada Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Ce dispositif est conforme à la norme CNR-210 d'Industrie Canada applicable aux appareils radio exempts de licence. Son fonctionnement est sujet aux deux conditions suivantes: (1) le dispositif ne doit pas produire de brouillage préjudiciable, et (2) ce dispositif doit accepter tout brouillage reçu, y compris un brouillage susceptible de provoquer un fonctionnement indésirable.

Radiation Exposure Statement:

This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.

Déclaration d'exposition aux radiations:

Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps.

This device is intended only for OEM integrators under the following conditions: (For module device use)

1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and

2) The transmitter module may not be co-located with any other transmitter or antenna. s long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still

responsible for testing their end-product for any additional compliance requirements required with this module installed.

Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositif module)

1) L'antenne doit être installée de telle sorte qu'une distance de 20 cm est respectée entre l'antenne et les utilisateurs,

et

2) Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.

Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformité supplémentaires requis pour ce module installé.

IMPORTANT NOTE:

In the event that these conditions can not be met (for example certain laptop configurations or co-location with anothe transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization.

NOTE IMPORTANTE:

Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une autorisation distincte au Canada.

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End Product Labeling

This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains IC: 6100A-AM691NF”.

Plaque signalétique du produit final

Ce module émetteur est autorisé uniquement pour une utilisation dans un dispositif où l'antenne peut être installée de telle sorte qu'une distance de 20cm peut être maintenue entre l'antenne et les utilisateurs. Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: "Contient des IC: 6100A-AM691NF".

Manual Information To the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user's manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

Manuel d'information à l'utilisateur final

L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la façon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements comme indiqué dans ce manuel.

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AzureWave Technologies CM389NF User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual