Avnet AVTEG001 Data sheet
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AES-BCM4343W-M1-G Datasheet
802.11 b/g/n WLAN, Bluetooth & BLE SoC Module
Description
Features
The Avnet AES-BCM4343W-M1-G module is
a high performance, Wi-Fi and Bluetooth/BLE
combo module that includes a programmable
ARM® Cortex™ M4 microprocessor for
running user application code. The module is
ideal for low-power Internet of Things (IoT)
enabled sensor and actuator based devices
that need wireless connectivity to cloud
services. The compact 35 x 20mm LGA
package makes the module a perfect fit for
small, embedded applications.
This Avnet SoC Module is pre-certified, thus
minimizing development time and
certification costs. The module combines an
advanced Cypress® 2.4GHz 802.11 b/g/n
and Bluetooth® 4.1 SoC with 8Mb of serial
Flash and a ST Microelectronics STM32F411
ARM® Cortex™ M4 MCU supporting 512KB
Flash and 128KB SRAM. Several of the M4
MCU peripheral functions are made available
on the module I/O, allowing for easy
connection to user specified interfaces.
Advanced security capabilities are available
with an optional authentication chip.
Dual onboard fractal PCB antennas provide
antenna diversity for optimized RF
performance.
• Based on integrated SIP device that includes:
o Combo Wi-Fi & BT/BLE SoC (BCM4343W)
o Host Application Processor (STM32F411)
• BCM4343W WLAN radio:
o 2.4 GHz IEEE 802.11b/g/n(20),
Channels 1-11 for USA and Canada
• BCM4343W Bluetooth radio:
o Bluetooth® v4.1 (LE and Classic modes)
• STM32F411 ARM® Cortex™ M4 microcontroller
features include:
o 512KB Flash and 128KB SRAM
o Multiple peripheral interfaces:
Digital I/O – 6
Analog inputs – 4
I2C Ports – 2
SPI Port – 1
UART Ports - 2
o JTAG programing and debug port
• 8Mb SPI serial flash for storage of firmware
upgrades and user accessible R/W file system
• Antenna Diversity implemented using onboard
dual fractal PCB antennas
• Concurrent WLAN and Bluetooth operation
(coexistence algorithm for shared antennas)
• Comprehensive software development tools:
o Cypress WICED™ SDK
o ZentriOS SDK
• Compact 35 x 20 mm 45-pin LGA package
• Operating temperature: -40° to +85° C
• FCC, IC and CE certifications: currently pending
• BT SIG QDID: coming soon
Applications
• Industrial Automation
• Security & Building Automation
• Smart Home Appliances
• IoT and M2M Connectivity
• Wi-Fi/BLE Gateway
December 2016 Version 2.2
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AES-BCM4343W-M1-G Datasheet
802.11 b/g/n WLAN, Bluetooth & BLE SoC Module
Document Version:
Version 2.2
Document Date:
23 December 2016
Document Author(s):
JB, PF
Document Classification:
Released
Document Distribution:
Public
Prior Version History:
Version:
Date:
Comment:
0.1
5/2/16
Initial release
0.2
5/2/16
Updated Module Features
0.3
5/2/16
Added SPI flash and Antenna details
1.0
6/27/16
Tape & Reel Packaging and Antenna
Options sections updated
2.0
11/16/16
Specs for low-power modes added
References to Broadcom removed
Reference to BT/BLE 4.2 removed
Option of using external antennas removed
2.1
12/19/16
Miscellaneous updates. Wi-Fi and BT
versions and channel detail noted
2.2
12/23/16
256-QAM (TurboQAM) mode removed
Data rate max reduced to 65 Mbps
Regional contact info updated
Comments:
Document Control
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AES-BCM4343W-M1-G Datasheet
802.11 b/g/n WLAN, Bluetooth & BLE SoC Module
1 Table of Contents
2 Table of Figures .................................................................................................... 5
3 Functional Overview.............................................................................................. 6
3.1 Microcontroller .......................................................................................................... 6
3.2 SPI Flash Memory .................................................................................................... 6
3.3 WLAN ...................................................................................................................... 7
3.4 Bluetooth .................................................................................................................. 7
3.5 Antennas .................................................................................................................. 7
4 Block Diagram ....................................................................................................... 8
5 Module Pin Descriptions ....................................................................................... 9
5.1 Pin Descriptions ....................................................................................................... 9
5.2 Pin Definitions ........................................................................................................ 10
6 Electrical Specifications ...................................................................................... 11
6.1 Absolute Maximum Ratings .................................................................................... 11
6.2 Recommended Operating Conditions ..................................................................... 11
6.3 Power Supply Requirements .................................................................................. 11
6.4 WLAN Power Consumption .................................................................................... 12
6.5 Bluetooth Power Consumption ............................................................................... 12
6.6 Bluetooth Low Energy Power Consumption ........................................................... 12
6.7 Low Power Modes Power Consumption ................................................................. 12
7 RF Specifications ................................................................................................ 13
7.1 WLAN RF Characteristics....................................................................................... 13
7.1.1 Transmitter Specification ....................................................................................................14
7.1.2 Receiver Specification ........................................................................................................15
7.2 Bluetooth RF Characteristics .................................................................................. 17
7.2.1 Transmitter Specification ....................................................................................................17
7.2.2 Receiver Specification ........................................................................................................17
7.3 BLE RF Characteristics .......................................................................................... 18
8 Mechanical Specifications ................................................................................... 19
8.1 Mechanical Size ..................................................................................................... 19
8.2 Module PCB Footprint ............................................................................................ 20
8.3 Module Pad Size .................................................................................................... 20
8.4 Recommended Solder Paste Mask ................................ ........................................ 21
8.5 Recommended Solder Mask .................................................................................. 21
8.6 Tape and Reel Packaging ...................................................................................... 22
9 Soldering and Cleaning Recommendations ........................................................ 23
9.1 Optimum Soldering Reflow Profile .......................................................................... 23
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AES-BCM4343W-M1-G Datasheet
802.11 b/g/n WLAN, Bluetooth & BLE SoC Module
9.2 Cleaning ................................................................................................................. 23
10 Antennas ............................................................................................................. 24
11 Certifications ....................................................................................................... 25
11.1 RoHS ..................................................................................................................... 25
11.2 Regulatory Compliance .......................................................................................... 25
11.3 Bluetooth Interoperability Compliance .................................................................... 25
11.4 Regulatory Agency Statements .............................................................................. 25
11.5 OEM Instructions .................................................................................................... 26
11.6 OEM Labeling Requirements ................................................................................. 26
11.7 Limitations ................................................................................................ .............. 26
12 Shipping, Handling and Storage ......................................................................... 27
12.1 Shipping ................................................................................................................. 27
12.2 Handling ................................................................................................................. 27
12.3 Moisture Sensitivity (MSL) ...................................................................................... 27
12.4 Storage .................................................................................................................. 27
13 Ordering Information ........................................................................................... 28
13.1 Module Accessories ................................ ............................................................... 28
14 Contact Information ............................................................................................. 29
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AES-BCM4343W-M1-G Datasheet
802.11 b/g/n WLAN, Bluetooth & BLE SoC Module
2 Table of Figures
Figure 1 – AES-BCM4343W-M1-G Module Block Diagram .................................................................... 8
Figure 2 – AES-BCM4343W-M1-G Module Top View .......................................................................... 19
Figure 3 – AES-BCM4343W-M1-G Module Side View ......................................................................... 19
Figure 4 – AES-BCM4343W-M1-G Module PCB Footprint ................................................................... 20
Figure 5 – AES-BCM4343W-M1-G Module Pad Size ........................................................................... 20
Figure 6 – Recommended Solder Paste Mask Size ............................................................................. 21
Figure 7 – Recommended Solder Mask Size ........................................................................................ 21
Figure 8 – Tape Dimensions ................................................................................................................. 22
Figure 9 – Recommended Soldering Profile for Lead-Free Solder ....................................................... 23
Figure 10 – Dual Fractal PCB Antennas ............................................................................................... 24
Figure 11 – Test Probe Connectors (Murata SWD series) ................................................................... 24
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AES-BCM4343W-M1-G Datasheet
802.11 b/g/n WLAN, Bluetooth & BLE SoC Module
MCU
WICED SDK
SPI1 Signal Name
Pin Name
Pin Name
SPI_FLASH_CS
PA4
WICED_GPIO_5
SPI_FLASH_CLK
PA5
WICED_GPIO_6
SPI_FLASH_MISO
PA6
WICED_GPIO_7
SPI_FLASH_MOSI
PA7
WICED_GPIO_8
3 Functional Overview
This 2.4GHz wireless module provides a complete combo Wi-Fi/BT/BLE and MCU solution for costeffective embedded-wireless IoT applications. Based on latest-generation Cypress BCM4343W
Wireless SoC silicon, this high performance combo module provides a unique solution with Wi-Fi and
Bluetooth radios, ARM Cortex-M4 host processor and expansion SPI Flash memory, plus versatile
dual onboard and dual external antenna capabilities, all in a compact 35 mm x 20 mm, easy to mount
(0.1” pitch LGA) form-factor module, qualified for operation across the full industrial temperature range
3.1 Microcontroller
The AES-BCM4343W-M1-G module includes an on-board microcontroller (MCU) that interfaces with
the Cypress BCM4343W radio for communication and acts as the system controller for user
applications. Based on the ST Microelectronics STM32F411, the MCU supports the following features:
STM32F411 ARM 32-bit Cortex™-M4 (with FPU), @ 100 MHz
On-chip memory: 512 kbytes Flash, 128 Kbytes SRAM
Multiple serial communication interfaces: SPI, USART, PCM
Sensor applications support: ADC, I2C, I2S, GPIO, Timers
Cypress WICED SDK and ZentriOS SDK based cloud connected application examples are
provided (AWS IoT, IBM Bluemix, ThingSpeak and others…)
Debug support: JTAG interface
Application code for the module can be developed using Cypress’s WICED Software Development Kit
(SDK) or Zentri’s ZentriOS SDK.
Additional details on the STM32F411 MCU features, specifications, and programming modes can be
obtained from the STM32F411 datasheet.
3.2 SPI Flash Memory
An 8 Mbit SPI Flash memory (Macronix MX25L800EZUI12G) is included on the module for the storage
of BCM4343W firmware, static webpages, built-in documentation, images, etc. The STM32F411
MCU’s SPI1 peripheral interface, clocked at 50MHz, is used to communicate with this memory.
The SPI1 interface parameters are defined in the BCM94343W_AVN platform files of the Cypress
WICED SDK development environment. When building an application in WICED SDK, adding the
download_apps parameter to the make target command string, ensures that the BCM4343W
firmware is written to- and loaded from this SPI flash
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AES-BCM4343W-M1-G Datasheet
802.11 b/g/n WLAN, Bluetooth & BLE SoC Module
3.3 WLAN
Cypress BCM4343W combo single-chip MAC, Baseband and RF device
(includes ARM Cortex-M3 processor)
Frequency Band: Single-band, 2.4 GHz only
WLAN Network Standards supported: 802.11b, 802.11g, 802.11n (single stream)
Modulation Modes: CCK and OFDM with BPSK, QPSK, 16QAM, 64QAM
Supported Data Rates:
- IEEE 802.11b 1 – 11 Mbps
- IEEE 802.11g 6 – 54 Mbps
- IEEE 802.11n 7.2 – 65 Mbps (2.4 GHz only)
Hardware Encryption
- WEP, WPA / WPA2 Personal
Advanced 1x1 802.11n Features:
- Full/Half Guard Interval
- Frame Aggregation
- Space Time Block Coding (STBC)
- Low Density Parity Check (LDPC) Encoding
SDIO host interface for WLAN subsystem (between BCM4343W and STM32F411 MCU)
Optional WLAN Debug Interfaces:
- WLAN JTAG and WLAN Debug UART interfaces are pinned-out to support special cases
(most application development will not require this)
3.4 Bluetooth
Bluetooth 4.1 (supporting Bluetooth Low Energy) with backward compatibility
Bluetooth Smart Ready (support for Dual-mode Bluetooth Classic and BLE operation)
Advanced Algorithm for support of Bluetooth/BLE and Wi-Fi coexistence
(for concurrent WLAN and Bluetooth operation)
Dedicated high-speed UART for Bluetooth host interface
3.5 Antennas
Onboard dual fractal PCB antennas (Cypress patented PCB trace antennas)
Miniature switched RF connectors. These are for test purposes only!
Transmit and Receive antenna diversity
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AES-BCM4343W-M1-G Datasheet
802.11 b/g/n WLAN, Bluetooth & BLE SoC Module
4 Block Diagram
Figure 1 shows a functional block diagram of the AES-BCM4343W-M1-G module.
Figure 1 – AES-BCM4343W-M1-G Module Block Diagram
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AES-BCM4343W-M1-G Datasheet
802.11 b/g/n WLAN, Bluetooth & BLE SoC Module
MCU WICED SDK
Pin
No.
Signal Name Type
Pin
Name
Pin
Name Description*
1 GND SIG - - Ground
2 MICRO_I2C2_SCL I/O PB10 WICED_GPIO_20 I2C #2 SCL
3 MICRO_I2C2_SDA I/O PB11 WICED_GPIO_21 I2C #2 SDA
4 MICRO_SPI2_SCK I/O PB13 WICED_GPIO_23 SPI #2 SCK
5 MICRO_SPI2_SSN I/O PB12 WICED_GPIO_22 SPI #2 SSN
6 MICRO_SPI2_MISO I/O PB14 WICED_GPIO_24 SPI #2 MISO
7 MICRO_SPI2_MOSI I/O PB15 WICED_GPIO_25 SPI #2 MOSI
8 USART6_TX_I2S2_MCK I/O PC6 WICED_GPIO_13 USART #6 TX
9 USART6_RX_I2S2_CK I/O PC7 WICED_GPIO_14 USART #6 RX
10 MICRO_UART_TX I/O PA9 WICED_GPIO_9 USART #1 TX
11 MICRO_UART_RX I/O PA10 WICED_GPIO_10 USART #1 RX
12 MICRO_UART_CTS I/O PA11 WICED_GPIO_15 USART #1 CTS
13 MICRO_UART_RTS I/O PA12 WICED_GPIO_16 USART #1 RTS
14 WIFI_GPIO_1 I/O PD13 -
WLAN Tx/Rx Activty (Driven by GPIO_1 of BCM4343W device)
15 GND SIG - - Ground
16 VDD_3V3_SIP SIG - - 3.3V
17 GND SIG - - Ground
18 WL_JTAG_TDI N/C - - No Connect (requires hardware modification for connection)
19 WL_JTAG_TDO N/C - - No Connect (requires hardware modification for connection)
20 MICRO_JTAG_TMS I/O PA13 - JTAG TMS
21 MICRO_JTAG_TCK I/O PA14 - JTAG TCK
22 MICRO_JTAG_TDI I/O PA15 - JTAG TDI
23 MICRO_JTAG_TDO I/O PB3 - JTAG TDO
24 MICRO_JTAG_TRSTN I/O PB4 - JTAG RESETN
25 GND SIG - - Ground
26 VBAT_SIP SIG - - Power supply for backup when VDD_3V3_SIP is not present
27 GND SIG - - Ground
28 MICRO_I2C1_SCL I/O PB6 WICED_GPIO_11 I2C #1 SCL
29 MICRO_I2C1_SDA I/O PB7 WICED_GPIO_12 I2C #1 SDA
30 MICRO_GPIO_3 I/O PC1 WICED_GPIO_27 GPIO 3
31 MICRO_GPIO_2 I/O PC0 WICED_GPIO_26 GPIO 2
32 MICRO_GPIO_4 I/O PC2 WICED_GPIO_28 GPIO 4
33 MICRO_GPIO_5 I/O PC3 WICED_GPIO_17 GPIO 5
34 MICRO_GPIO_6 I/O PB9 WICED_GPIO_19 GPIO 6
35 MICRO_GPIO_1 I/O PB8 WICED_GPIO_18 GPIO 1
36 MICRO_RST_N I/O NRST RESET_N
37 MICRO_ADC_IN1 I/O PA1 WICED_GPIO_2 ADC INPUT #1
38 MICRO_WKUP I/O PA0 WICED_GPIO_1 MCU WAKEUP
39 GND SIG - - Ground
40 MICRO_ADC_IN2 I/O PA2 WICED_GPIO_3 ADC INPUT #2
41 MICRO_ADC_IN3 I/O PA3 WICED_GPIO_4 ADC INPUT #3
42 MICRO_GPIO_0 I/O PB0 WICED_GPIO_29 GPIO 0
43 MICRO_ADC_IN15 I/O PC5 WICED_GPIO_30 ADC INPUT #15
44 GND SIG - - Ground
45 GND SIG - - Ground
Module
- Denotes 5V tolerant I/O
- Standard 3.3V I/O
- Bidirection reset pin with embedded weak pullup
* Note the pin descriptions shown are arbitrary for most MCU connected signals
5 Module Pin Descriptions
5.1 Pin Descriptions
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AES-BCM4343W-M1-G Datasheet
802.11 b/g/n WLAN, Bluetooth & BLE SoC Module
5.2 Pin Definitions
Of the 44 pads located along 3 edges of the module, 8 connect to GND and 2 are power connections
Most of the remaining module pads are internally connected to the STM32F411 MCU. For this reason,
the signal definition of these pins is somewhat arbitrary given that the pin modes can be configured via
software.
The signal names provided in the Pin Description table shown in section 4.1 align with the names
provided in the Cypress WICED SDK platform.h file. Users have the ability to modify these
configurations and definitions as explained in the STM32F411 datasheet.
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