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Data Sheet and User Manual
AES-MS-MT3620-M-G Module
Data Sheet and User Manual
Features
Microsoft Azure Sphere SoC based module
solution for advanced end-to-end IOT security
Based on MediaTek MT3620AN Wi-Fi SoC
- 1x 500MHz Arm Cortex A7 application
processor with 4MB SRAM
- 2x 200MHz Arm Cortex M4F cores,
each with 64KB SRAM
- 4MB embedded RAM (shared)
- 16MB QSPI flash memory
- Dual-band 2.4/5GHz 802.11 a/b/g/n Wi-Fi
Module I/O peripheral support
- 3x ISU interfaces, pre-configured for
UART, SPI, I2C
- ADC/GPIO: 3x 12-bit ADC inputs (or GPIOs)
- PWM/GPIO: 9x PWM outputs
(or up to 24 GPIOs)
- RTC (requires VBAT supply)
- Programming & recovery interface
Microsoft Visual Studio IDE for accelerated
application software development & debug
OTA authentication & updates (device lifetime)
Dimensions: 33mm x 22mm x 3.5mm
Onboard dual-band 2.4/5GHz chip antenna
- (Pulse W3006)
Operating temperature:
- -35C to +85°C
(Note: For industrial temperature range,
please use the U.FL version module)
Certifications:
- FCC, IC, CE, MIC, RoHS (pending)
Note: Microsoft Azure Sphere OS support for
some MT3620 features is still being added
Applications
IoT edge devices
Smart home appliances / security
Smart retail
Remote access
Building automation
Factory automation
For more info on Azure Sphere MT3620 modules,
visit: http://avnet.me/mt3620-modules
To purchase an Azure Sphere MT3620 Starter Kit
visit: http://avnet.me/mt3620-kit
AES-MS-MT3620-M-G
Azure Sphere
MT3620 module
(with chip antenna)
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Data Sheet and User Manual
AES-MS-MT3620-M-G Module
Data Sheet and User Manual
Version
Date
Comment
1.0
05/07/2019
Initial release, new document scope, photos, pinout detail and content
1.1
05/07/2019
Added FCC Module Statement (USA)
1.2
05/16/2019
Updated OEM instructions
Part Number
Description
AES-MS-MT3620-M-G
Azure Sphere MT3620 Module (chip antenna)
Product Page: http://avnet.me/mt3620-modules
AES-MS-MT3620-SK-G
Azure Sphere MT3620 Starter Kit
Product Page: http://avnet.me/mt3620-kit
Document Control
Document Version: 1.0
Document Date: 05/07/2019
Document Author: Peter Fenn
Document Classification: Public
Document Distribution: Public
Version History
Ordering Information
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Data Sheet and User Manual
AES-MS-MT3620-M-G Module
Data Sheet and User Manual
Table of Contents
Features ...................................................................................................................... 1
Applications ................................................................................................................. 1
Document Control ....................................................................................................... 2
Ordering Information ................................................................................................... 2
Overview ..................................................................................................................... 6
Module Block Diagram ................................................................................................ 7
Module Application Development and Programming .................................................. 8
Development Computer Software Installation ...................................................................................... 8
Module Interfaces with the Development Computer ............................................................................ 8
Module Integration onto an OEM Board ...................................................................... 9
Module Power Interfaces ..................................................................................................................... 9
Wi-Fi Network Settings ......................................................................................................................... 9
Wi-Fi Subsystem ................................................................................................................................ 10
Wi-Fi Antenna ..................................................................................................................................... 10
A7 Application Processor ................................................................................................................... 10
M4F IO Processors ............................................................................................................................ 10
Flash Memory ..................................................................................................................................... 10
Pluton Security Subsystem ................................................................................................................ 10
Real Time Clock (RTC) ...................................................................................................................... 10
Peripheral Serial Interfaces ................................................................................................................ 10
Other I/O Interfaces ............................................................................................................................ 10
MT3620 Bootstrap Pins ...................................................................................................................... 11
Module Placement and Ground plane requirements ......................................................................... 12
Module Pinout Locations .................................................................................................................... 13
Module Pinout Table .......................................................................................................................... 14
Electrical Specifications ............................................................................................ 16
Absolute Maximum Ratings ............................................................................................................... 16
Recommended Operating Conditions ................................................................................................ 16
DC Characteristics ............................................................................................................................. 16
Current Consumption ......................................................................................................................... 17
RF Characteristics .................................................................................................... 18
Wi-Fi 2.4GHz Band RF Receiver Specifications ................................................................................ 18
Wi-Fi 2.4GHz Band RF Transmitter Specifications ............................................................................ 20
Wi-Fi 5GHz Band RF Receiver Specifications ................................................................................... 21
Wi-Fi 5GHz Band RF Transmitter Specifications ............................................................................... 22
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Data Sheet and User Manual
Wi-Fi RF Receiver Blocking Specifications ........................................................................................ 23
Mechanical Specifications ......................................................................................... 24
Module Dimension Details ................................................................................................................. 24
Tape and Reel Packaging .................................................................................................................. 25
Soldering and Cleaning Recommendations .............................................................. 26
Optimum Soldering Reflow Profile ..................................................................................................... 26
Cleaning ............................................................................................................................................. 26
Certifications and Compliance .................................................................................. 27
RoHS Compliance .............................................................................................................................. 27
Regulatory Compliance ...................................................................................................................... 27
FCC and ISED Regulatory Notices (USA and Canada) .................................................................... 27
Modification statement ................................................................................................................... 27
Interference statement ................................................................................................................... 27
RF Radiation Exposure Statement ................................................................................................. 27
FCC Class B Digital Device Notice (USA) ..................................................................................... 28
FCC Module Statement (USA) ....................................................................................................... 28
CAN ICES-003 (B) ......................................................................................................................... 28
Labeling Requirements for the OEM Host Board ........................................................................... 28
29
FCC Requirements for User Manual of the OEM Host Board: ...................................................... 29
IC Requirements for User Manual of the OEM Host Board: .......................................................... 30
FCC Host 15B and 15C Compliance Statement (USA) ................................................................. 30
CE Statement (Europe) ...................................................................................................................... 30
CE Labeling Requirements (Europe) ............................................................................................. 30
OEM Instructions ................................................................................................................................ 31
Shipping, Handling and Storage ............................................................................... 31
Shipping ............................................................................................................................................. 31
Handling ............................................................................................................................................. 31
Moisture Sensitivity (MSL) ................................................................................................................. 31
Storage ............................................................................................................................................... 32
Contact Information ................................................................................................... 32
Legal Information ................................................................ ................................ ...... 33
Limitations .......................................................................................................................................... 33
Avnet Module License and Product Warranty .................................................................................... 33
Appendix-A: Programming Adaptor Footprint ........................................................... 35
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Table of Figures
Figure 1 – Simplified MT3620 SoC Block Diagram ........................................................................................... 6
Figure 2 – AES-MS-MT3620-M-G Module Block Diagram ............................................................................... 7
Figure 3 – Module with dual-band Chip Antenna ............................................................................................ 10
Figure 4 – OEM board Footprint for AES-MS-MT3620-M-G Module .............................................................. 12
Figure 5 – AES-MS-MT3620-M-G Module Pinout .......................................................................................... 13
Figure 6 – AES-MS-MT3620-M-G Module Mechanical Details ...................................................................... 24
Figure 7 – Tape and Reel Details ................................................................................................................... 25
Figure 8 – Recommended Soldering Profile for Lead-Free Solder ................................................................. 26
Figure 9 – Module Pinout to Recommended Service & Debug Interface Connector ..................................... 36
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AES-MS-MT3620-M-G Module
Data Sheet and User Manual
Overview
The AES-MS-MT3620-M-G is a small form-factor, tri-core Wi-Fi SoC module, intended for use as a secure
Wi-Fi client, in internet-connected IoT applications. Avnet’s production-ready, certified module comes fitted
with a single dual-band chip antenna, for cost-optimized application in 2.4 GHz or 5GHz Wi-Fi networks
Based on the MediaTek MT3620AN SoC, this is a new class of connected SoC IoT device that facilitates
“end-to-end security”. User applications can target it’s 500 MHz ARM Cortex-A7 core as well as two general
purpose 200 MHz ARM Cortex-M4F I/O subsystem cores designed to support real-time requirements. The
on-chip peripherals (GPIO, UART, I2C, SPI, I2S, PWM and ADC) can be mapped to any of these three
user-accessible processor cores.
Figure 1 – Simplified MT3620 SoC Block Diagram
Further differentiators of the MT3620 device are its built-in Pluton security subsystem (with dedicated CM4F
core) for secure boot and secure system operation, its dual-band 802.11 a/b/g/n Wi-Fi connectivity, as well
as integration of on-chip PMU, RTC plus FLASH and SRAM memory. Wi-Fi based OTA firmware and user
application updates (using certificate-based authentication) are hosted by Microsoft for the device lifetime
The Cortex-A7 application processor runs Microsoft’s Azure Sphere Secure OS. Custom user applications
are developed in C using Microsoft’s Visual Studio IDE, which includes user-friendly debugging features
such as single-step execution, breakpoints and watch-points (supported via a dedicated service UART)
The module allows easy design migration and end-product enhancements. By integrating all necessary
support and RF front end circuitry onto a small 33 mm x 22 mm module, Avnet has reduced the design time
for implementing Sphere-based solutions. Developers can leverage the module’s wireless regulatory
certifications (pending) for their end product, saving considerable certification costs and testing time.
The Avnet Azure Sphere MT3620 chip module has a 33mm x 22mm form-factor, with 66 pad castellated
“stamp-hole” footprints. It has an on board chip antenna (Pulse W3006) with a 26MHz crystal oscillator.
Microsoft Visual Studio IDE is used for software development of applications that target this Azure Sphere
MT3620 Module. Instructions for installing this Integrated Development Environment, as well as it’s Azure
Sphere SDK companion application and necessary drivers, are detailed (with examples) in the User Guide
for Avnet’s Azure MT3620 Sphere Starter Kit
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Data Sheet and User Manual
Online authentication and firmware updates are supported for the MT3620 device lifetime.
Module Block Diagram
Figure 2 – AES-MS-MT3620-M-G Module Block Diagram
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AES-MS-MT3620-M-G Module
Data Sheet and User Manual
Module Application Development and Programming
Development Computer Software Installation
In depth instructions are provided at the Microsoft Getting started with Azure Sphere webpage:
https://aka.ms/AzureSphereSDK
Microsoft’s Getting Started with Azure Sphere page details the download & install of two software items:
1) Azure Sphere SDK Preview for Visual Studio from the Visual Studio Marketplace
2) Visual Studio 2017 version 15.7 or later (free Community edition is sufficient)
as well as USB driver installation for a wired interface between a development computer and the module
Microsoft’s Azure Sphere SDK provides the following:
The azsphere command-line utility for managing devices, images, and deployments
Libraries for application development
Visual Studio extensions to support Azure Sphere development, debug and flash programming
Microsoft’s Visual Studio IDE provides a sophisticated development environment for editing, building and
debugging custom embedded C applications (a GCC cross-compiler and GDB debugger provide the
underlying build and debug tools)
For application development targeting this module, it is recommended that hardware and software
prototyping be done using the Avnet Azure Sphere MT3620 Starter Kit http://avnet.me/mt3620-kit )
Module Interfaces with the Development Computer
The module is designed to support up to four wired interfaces with the development computer.
Three 4-wire UART interfaces (SERVICE, RECOVERY and DEBUG) dedicated for connection with
the host development computer are pinned-out, each with hardware flow-control.
A 3-wire SWD interface is also pinned-out
RESET and RECOVERY (via DEBUG_RTS during boot) signals determine the module operating
mode
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Data Sheet and User Manual
Interface Pins
Description
Notes
3V3
Main input voltage to the module.
3.3V (+/- 10%)
Powered by an external PMU
or DC/DC convertor
3V3_RTC
Real Time Clock power input to module
Powered by external battery,
or connect this to the 3V3 rail
VREF_ADC
Reference voltage for on-chip A/D
convertor
Powered by external reference
voltage, or connect to the
MT3620 2.5V LDO output
EXT_PMU_EN
MT3630 output to enable / disable
external PMU or DC/DC convertor
May be left unconnected
PMU_EN
MT3630 input to enable / disable the
internal PMU
May be left unconnected
WAKEUP
MT3630 input to wake-up the A7
processor from power-saving sleep mode
May be left unconnected
Module Integration onto an OEM Board
Module Power Interfaces
To power this module, the OEM board must be able to supply a maximum of 2.5 Watts at 3.3V.
Prior to power-up of the module, the following interfaces need to be attended to:
Wi-Fi Network Settings
For Wi-Fi connected user applications, the module’s Wi-Fi network settings need to be configured by one of
the following methods:
a) In the application software (using #define statements), OEM factory-programmed into the module
b) Via a companion nRF52840 BLE device integrated onto the OEM’s end-product board
c) Via the SERVICE UART interface with a Windows-10 development computer running the
azsphere command-line utility (See Appendix-A detail of the suggested PCB footprint to support
temporary attachment of an FTDI FT4232HQ based USB to serial adaptor)
Upon power-up and connection to the designated Wi-Fi network, the module will communicate with the
Microsoft Azure Sphere Security Service, which authenticates and manages one or more of the following
downloads/uploads with the module:
Push of Azure Sphere OS firmware updates to the module
Deployment of custom application software to the module
Reporting of Sphere OS and application versions plus error information to the Azure Sphere Server
The Microsoft Azure Sphere Security Service will also authenticate data transfers between the custom user
application executing on the module and Microsoft Azure (or other) cloud services
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Data Sheet and User Manual
Figure 3 – Module with
dual-band Chip Antenna
Wi-Fi Subsystem
Dual-band 2.4/5GHz 802.11 a/b/g/n Wi-Fi (20 MHz channels only)
Has an N968 Andes 32bit MCU
Uses an external 26 MHz crystal oscillator on the module
Has an integrated 5GHz Balun
Uses external 2.4GHz Balun and Diplexer devices on the module
Wi-Fi Antenna
The module is fitted with an on-board dual-band
chip antenna for 2.4GHz and 5GHz operation
(Pulse Electronics antenna p/n: W3006)
An inline switched RF probe connector
is provided to facilitated RF conducted measurements
A7 Application Processor
1x 500MHz Arm Cortex A7 application processor
core, with 4MB SRAM (shared)
M4F IO Processors
2x 200MHz Arm Cortex M4F IO processor cores,
each with 64KB SRAM
The module pins-out the IO0_TXD and IO1_TXD pins from their dedicated UARTs
SWD interface based debug and programming of M4F IO MCU cores may at later date be enabled
Flash Memory
16MB 100MHz (on-die) QSPI flash memory
Pluton Security Subsystem
1x Cortex M4F MCU, dedicated RAM, ROM and GP timers, system control outputs
Real Time Clock (RTC)
Low-power RTC with timer/time of day control over system power (32KHz crystal oscillator)
Peripheral Serial Interfaces
Three ISU serial interfaces are pinned-out. Their accessible pins are limited to that needed for support of:
ISU0: UART, max rate=3Mbps (4-wire)
ISU1: SPI , max rate=40 MHz (5-wire)
ISU2: I2C , max rate=1MHz (2-wire)
Other I/O Interfaces
All pinned-out I/O pins (including ISU interfaces listed above) can be individually configured as GPIO pins.
A subset of these can be configured as:
PWM outputs
ADC inputs
EXT INT inputs
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AES-MS-MT3620-M-G Module
Data Sheet and User Manual
Function
Pin Name
Strapping
Recommendation
Normal/Test mode
DEBUG_TXD
Pull-Down
Pull-down resistor is on module
Mode = Normal
Recovery mode
DEBUG_RTS
Pull-Down
Pull-down resistor required on OEM board!
Controlled via PC interface, - if present
RTC mode
RECOVERY_TXD
Pull-Up
Pull-up resistor is on module
RTC oscillator = 32 kHz crystal
26MHz
IO0_RTS
Pull-Up
MT3620 internal pull-up on module
Oscillator frequency = 26 MHz
26MHz
IO0_TXD
Pull-Down
Pull-down resistor is on module
Oscillator frequency = 26 MHz
N9 JTAG
IO1_TXD
Pull-Down
Pull-down resistor is on module
N9 JTAG = OFF
A7 JTAG
RECOVERY_RTS
Pull-Down
Pull-down resistor is on module
A7 JTAG = OFF
See the MT3620 Product Brief at the Mediatek webpage
for more detail on the MT3620AN SoC device…
https://www.mediatek.com/products/azureSphere/mt3620
MT3620 Bootstrap Pins
Note! Six of the seven bootstrap pins are already strapped on the module.
The DEBUG_RTS signal must however be strapped on the OEM board with a 2K2 pull-down resistor, to
ensure that RECOVERY mode remains disabled (This signal gets driven high to select RECOVERY via an
FTDI device based interface with the development computer when a Debug-Programmer cable is attached)
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Data Sheet and User Manual
Module Placement and Ground plane requirements
For optimum antenna performance the Ground plane of the OEM board (on which the module is fitted)
needs to be maximized
The GND pads in the antenna area of the module must be connected to this Ground plane
Placement of the module should be 6 mm or more from any corner of the OEM carrier board
A PCB cutout is recommended in the host carrier board beneath the chip antenna (17mm x 7mm)
Figure 4 – OEM board Footprint for AES-MS-MT3620-M-G Module
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Data Sheet and User Manual
Module Pinout Locations
Figure 5 – AES-MS-MT3620-M-G Module Pinout
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AES-MS-MT3620-M-G Module
Data Sheet and User Manual
Module
Pad
MT3620
Pad
MT3620
Net Name
I/O
Pin Function
Pre-Assigned
Starter Kit Function=BLUE
1 GND
GND
2
2,3
3V3
Power
3
2,3
3V3
Power
4
GND
5
13
GPIO0_PWM0
I/O
GPIO / INT in / PWM out
PWM CLICK1
6
14
GPIO1_PWM1
I/O
GPIO / INT in / PWM out
PWM CLICK2
7
15
GPIO2_PWM2
I/O
GPIO / INT in / PWM out
INT_CLICK
8
17
GPIO4_PWM4
I/O
GPIO / INT in / PWM out
GPIO4_LED_APP
9
18
GPIO5_PWM5
I/O
GPIO / INT in / PWM out
GPIO5_LED_WIFI
10
19
GPIO6_PWM6
I/O
GPIO / INT in / PWM out
INT_LSM6DSO
11
21
GPIO8_PWM8
I/O
GPIO / INT in / PWM out
GPIO8_LED_USER_RED
12
22
GPIO9_PWM9
I/O
GPIO / INT in / PWM out
GPIO9_LED_USER_GRN
13
25
GPIO10_PWM10
I/O
GPIO / INT in / PWM out
GPIO10_LED_USER_BLU
14
27
GPIO12
I/O
GPIO / INT in
GPIO12_SW_A
15
28
GPIO13
I/O
GPIO / INT in
GPIO13_SW_B
16
31
GPIO16
I/O
GPIO / INT in
RST CLICK1
17
32
GPIO17
I/O
GPIO / INT in
RST CLICK2
18
39
GPIO26_SCLK0_TXD0
I/O
GPIO / ISU0
UART TXD
19
40
GPIO27_MOSI0_RTS0_SCL0
I/O
GPIO / ISU0
UART RTS / I2C0
20
42
GPIO28_MISO0_RXD0_SDA0
I/O
GPIO / ISU0
UART RXD / I2C0
21
43
GPIO29_CSA0_CTS0
I/O
GPIO / ISU0
UART CTS
22
46
GPIO31_SCLK1_TXD1
I/O
GPIO / ISU1
SPI SCLK / UART1
23
47
GPIO32_MOSI1_RTS1_SCL1
I/O
GPIO / ISU1
SPI MOSI / UART1 / I2C1
24
48
GPIO33_MISO1_RXD1_SDA1
I/O
GPIO / ISU1
SPI MISO / UART1 / I2C1
25
49
GPIO34_CSA1_CTS1
I/O
GPIO / ISU1
SPI CS #1 / UART1
26
50
GPIO35_CSB1
I/O
GPIO / ISU1
SPI CS #2
27
52
GPIO37_MOSI2_RTS2_SCL2
I/O
GPIO / ISU2
I2C
28
53
GPIO38_MISO2_RXD2_SDA2
I/O
GPIO / ISU2
I2C
29
58
GPIO41_ADC0
I/O
GPIO / ADC in
AMBIENT LIGHT SENSOR
30
59
GPIO42_ADC1
I/O
GPIO / ADC in
AN CLICK1
31
60
GPIO43_ADC2
I/O
GPIO / ADC in
AN CLICK2
32
66
VOUT_2V5
AO
33
67
VREF_ADC
AI min 1.8V, max 2.5V
34
81
PMU_EN
I pull-up on module
35
70
WAKEUP
I
Ext. Wakeup Input
pull-up on module
36
69
EXT_PMU_EN
O
Ext. 3V3 regulator enable
37
GND
GND
Module Pinout Table
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Data Sheet and User Manual
Module
Pad
MT3620
Pad
MT3620
Net Name
I/O
Pin Function
Pre-Assigned
Starter Kit
Function=BLUE
38
GND
GND
39
71
3V3_RTC
Power
min 2.50 V, max 3.63V
40
GND
GND
41
GND
GND
42
88,89
3V3
Power
43
88,89
3V3
Power
44
94
DEBUG_RXD
I
Debug UART
DEBUG_RXD
45
96
DEBUG_RTS
O
Debug UART
(pulled-down / FTDI controlled
strapping state on Starter Kit)
DEBUG_RTS
46
95
DEBUG_TXD
O
Debug UART
(pulled-down on module)
DEBUG_TXD
47
97
DEBUG_CTS
I
Debug UART
DEBUG_CTS
48
98
SWD_DIO
I/O
CM4F SWD
SWD_DIO
49
99
SWD_CLK
I
CM4F SWD
SWD_CLK
50
100
SWO
O
CM4F SWD
SWO
51
125
SYSRST_N
I SYSRST_N
52
127
SERVICE_TXD
O
Service UART
SERVICE_TXD
53
129
SERVICE_RXD
I
Service UART
SERVICE_RXD
54
128
SERVICE_RTS
O
Service UART
SERVICE_RTS
55
130
SERVICE_CTS
I
Service UART
SERVICE_CTS
56
134
RECOVERY_RXD
I
Recovery UART
RECOVERY_RXD
57
135
RECOVERY_TXD
O
Recovery UART
(PU on module)
RECOVERY_TXD
58
136
RECOVERY_RTS
O
Recovery UART
(pulled-down on module)
RECOVERY_RTS
59
137
RECOVERY_CTS
I
Recovery UART
RECOVERY_CTS
60
139
IO0_GPIO86/IO0_TXD
O
IO0_GPIO / IO0_TXD
(pulled-down on module)
IO0_TXD
61
143
IO1_GPIO90/IO1_TXD
O
IO1_GPIO / IO1_TXD
(pulled-down on module)
IO1_TXD
62 - 66
GND
GND
GND pour
67
PADGND
GND
Thermal pad for MT3620
Module Pinout Table (continued)
Note! Azure Sphere OS support for some MT3620 features is still to be released by Microsoft.
eg. GPIO, UART, I2C and SPI peripherals are now supported, but support for the ARM Cortex-M4F cores,
ADC and PWM and functions is at this time still pending.
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Data Sheet and User Manual
Symbol
Parameter
Max
Unit
3V3
3.3V Supply Voltage
-0.3 to 3.63
V
T
STG
Storage Temperature
-40 to +125
°C
V
ESD
ESD protection (human body model)
2000
V
Symbol
Rating
Min
Typ
Max
Unit
3V3
3.3V supply
2.97
3.3
3.63
V
3V3_RTC
RTC supply
2.5
3.3
3.63
V
T
AMBIENT
Ambient Temperature
-35
-
+85
°C
Symbol
Parameter
Conditions
Min
Max
Unit
V
IL
Input Low Voltage
LVTTL
-0.28
0.8
V
V
IH
Input High Voltage
2.0
3.63
V
V
OL
Output Low Voltage
|IOL| = 4 to 16 mA
-0.28
0.4
V
VOH
Output High Voltage
|IOH| = 4 to 16 mA
2.4
VDD33+0.33
V
RPU
Input Pull-Up Resistance
PU=high, PD=low
40
190
kΩ
RPD
Input Pull-Down Resistance
PU=low, PD=high
40
190
kΩ
Electrical Specifications
Note! The electrical characteristics documented here are for the MT3620AN SoC device only, as defined in
the Mediatek MT3620AN Datasheet and Product Brief documents
Absolute Maximum Ratings
Recommended Operating Conditions
DC Characteristics
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Data Sheet and User Manual
Power mode
Description
Details
Typical
current
consumption
Hardware
wake-up
latency
Subsystem
Power
State
RTC mode
Only RTC
domain is on.
Memory is not
retained.
Requires a cold
boot to resume
Pluton CM4 subsystem
Off
0.01mA or
0.02mA (*1)
24ms
(crystal and
PLL lock,
PMU time
CA7 subsystem
Off
CM4F I/O subsystems
Off
Wi-Fi subsystem
Off
Buses/peripherals
Off
Worst case
power
consumption
no Wi-Fi
All subsystems
apart from
Wi-Fi running
at full speed
Pluton CM4 subsystem
On
220mA
Worst case
380mA (*2)
N/A, 650us
WiFi
subsystem
resume
latency
CA7 subsystem
On
IO 0/1 CM4
subsystems
On
Wi-Fi subsystem
Light sleep
Buses/peripherals (*3)
On
Worst case
power
consumption
with Wi-Fi
(*2)
All subsystems
running at full
speed, Wi-Fi
very active
Pluton CM4 subsystem
On
520mA (*4)
Worst case
750mA (*2)
N/A
CA7 subsystem
On
IO 0/1 CM4
subsystems
On
Wi-Fi subsystem
On
Buses/peripherals (*3)
On
RF (A or G Band)
On
Flash (*5)
On
Current Consumption
Note *1: 0.01mA/0.02mA with/without external 3.3v source PMIC control switch respectively.
Note *2: The current values are measured under typical case (TT silicon and 25C/1.15V) and
the TDP (max thermal design power) includes simulation worst case condition
(TT/125C/1.15V/MC99 ,MC99 is PTPX power simulation library).
Note *3: It depends on how busy the peripherals are and how they are configured.
Note *4: This data is based on 100% Wi-Fi transmission on the 5GHz band at 14dBm.
Note *5: It depends on the I/O loading and flash power consumption.
Page 18 of 36
May 16, 2019
Data Sheet and User Manual
AES-MS-MT3620-M-G Module
Data Sheet and User Manual
Parameter
Description
Performance
Min
Typical
Max
Unit
Main
Aux
Frequency range
Center channel frequency
2412
2484
MHz
RX sensitivity
DBPSF, 1 Mbps DSSS
-
-94.6
-97.1
-90.0
dBm
DQPSF, 2 Mbps DSSS
-
-91.6
-94.1
-87.0
dBm
DQPSF, 5.5 Mbps CCK
-
-89.6
-92.1
-85.0
dBm
DQPSF, 11 Mbps CCK
-
-86.6
-89.1
-82.0
dBm
BPSK rate 1/2, 6 Mbps OFDM
-
-91.6
-94.1
-87.0
dBm
BPSK rate 3/4, 9 Mbps OFDM
-
-89.3
-91.8
-86.0
dBm
QPSK rate 1/2, 12 Mbps OFDM
-
-88.5
-91.0
-84.0
dBm
QPSK rate 3/4, 18 Mbps OFDM
-
-86.1
-88.6
-82.0
dBm
16QAM rate 1/2, 24 Mbps OFDM
-
-82.8
-85.3
-81.0
dBm
16QAM rate 3/4, 36 Mbps OFDM
-
-79.4
-81.9
-78.0
dBm
64QAM rate 1/2, 48 Mbps OFDM
-
-75.2
-77.7
-73.0
dBm
64QAM rate 3/4, 54 Mbps OFDM
-
-73.9
-76.4
-71.0
dBm
RX sensitivity
BW=20MHz, Mixed mode
800ns guard interval, Non-STBC
MCS 0, BPSK rate 1/2
-
-90.9
-93.4
-87.0
dBm
Maximum Receive Level
MCS 1, QPSK rate 1/2
-
-87.7
-90.2
-86.0
dBm
MCS 2, QPSK rate 3/4
-
-85.3
-87.8
-84.0
dBm
MCS 3, 16QAM rate 1/2
-
-82.3
-84.8
-81.0
dBm
MCS 4, 16QAM rate 3/4
-
-78.8
-81.3
-77.0
dBm
MCS 5, 64QAM rate 2/3
-
-74.4
-76.9
-74.0
dBm
MCS 6, 64QAM rate 3/4
-
-73.0
-75.5
-71.0
dBm
MCS 7, 64QAM rate 5/6
-
-71.8
-74.3
-69.0
dBm
1 Mbps DSSS
-20
-10
-
dBm
11 Mbps CCK
-20
-10
-
dBm
6 Mbps OFDM
-20
-10
-
dBm
54 Mbps OFDM
-20
-10
-
dBm
HT20 MCS0
-20
-10
-
dBm
HT20 MCS7
-20
-20
-
dBm
RF Characteristics
Wi-Fi 2.4GHz Band RF Receiver Specifications
The specification in table below is measured at the antenna port, which includes the front-end loss.
Page 19 of 36
May 16, 2019
Data Sheet and User Manual
AES-MS-MT3620-M-G Module
Data Sheet and User Manual
Parameter
Description
Performance
Min
Typical
Max
Unit
Main
Aux
Receive adjacent channel
rejection
BPSK rate 1/2, 6 Mbps OFDM
16
34
-
dBm
BPSK rate 3/4, 9 Mbps OFDM
15
31
-
dBm
QPSK rate 1/2, 12 Mbps OFDM
13
30
-
dBm
QPSK rate 3/4, 18 Mbps OFDM
11
27
-
dBm
16QAM rate 1/2, 24 Mbps
OFDM
8
25
-
dBm
16QAM rate 3/4, 36 Mbps
OFDM
4
23
-
dBm
64QAM rate 1/2, 48 Mbps
OFDM
0
22
-
dBm
64QAM rate 3/4, 54 Mbps
OFDM
-1
22
-
dBm
MCS 0, BPSK rate 1/2
16
33
-
dBm
MCS 1, QPSK rate 1/2
13
29
-
dBm
MCS 2, QPSK rate 3/4
11
26
-
dBm
MCS 3, 16QAM rate 1/2
8
24
-
dBm
MCS 4, 16QAM rate 3/4
4
20
-
dBm
MCS 5, 64QAM rate 2/3
0
18
-
dBm
MCS 6, 64QAM rate 3/4
-1
17
-
dBm
MCS 7, 64QAM rate 5/6
-2
15
-
dBm
Receiver residual PER
All rates, -50dBm input power
- - 0.005
%
Wi-Fi 2.4GHz Band RF Receiver Specifications (continued)
Page 20 of 36
May 16, 2019
Data Sheet and User Manual
AES-MS-MT3620-M-G Module
Data Sheet and User Manual
Parameter
Description
Performance
Min
Typical
Max
Unit
Frequency range
Center channel frequency
2412
-
2484
MHz
Output power with
spectral mask and EVM
compliance
1 Mbps DSSS
- x
16(1)
-
dBm
11 Mbps CCK
-
16(1)
-
dBm
6 Mbps OFDM
-
16(1)
-
dBm
54 Mbps OFDM
-
16(1)
-
dBm
HT20 MCS 0
-
16(1)
-
dBm
HT20 MCS 7
-
16(1)
-
dBm
Output power with
spectral mask and EVM
compliance
(at -40◦C and 85◦C)
1 Mbps DSSS
-
15(1)
-
dBm
11 Mbps CCK
-
15(1)
-
dBm
6 Mbps OFDM
-
15(1)
-
dBm
54 Mbps OFDM
-
15(1)
-
dBm
HT20 MCS 0
-
15(1)
-
dBm
HT20 MCS 7
-
15(1)
-
dBm
TX EVM
1 Mbps DSSS
-
-
-10
dB
11 Mbps CCK
-
-
-10
dB
6 Mbps OFDM
-
-
-5
dB
54 Mbps OFDM
-
-
-25
dB
HT20 MCS 0
-
-
-5
dB
HT20 MCS 7
-
-
-28
dB
Output power
variation(2)
TSSI closed-loop control across all
temperature range
and channels and VSWR ≦ 1.5:1.
-1.5
-
1.5
dB
Carrier suppression
-
- - -30
dBc
Harmonic output
power
2nd Harmonic
-
-45
-43
dBm/MHz
3rd Harmonic
-
-45
-43
dBm/MHz
Wi-Fi 2.4GHz Band RF Transmitter Specifications
The specification in table below is measured at the antenna port, which includes the front-end loss.
Note 1: Low power PA.
Note 2: VDD33 voltage is within ±5% of typical value.
Page 21 of 36
May 16, 2019
Data Sheet and User Manual
AES-MS-MT3620-M-G Module
Data Sheet and User Manual
Parameter
Description
Performance
Min
Typical
Max
Unit
Main
Aux
Frequency range
Center channel frequency
5180
- 5825
MHz
RX sensitivity
BPSK rate 1/2, 6 Mbps OFDM
-
-90.0
-91.5
-86.0
dBm
BPSK rate 3/4, 9 Mbps OFDM
-
-87.7
-89.2
-85.0
dBm
QPSK rate 1/2, 12 Mbps OFDM
-
-87.0
-88.5
-83.0
dBm
QPSK rate 3/4, 18 Mbps OFDM
-
-84.5
-86.0
-81.0
dBm
16QAM rate 1/2, 24 Mbps OFDM
-
-81.3
-82.8
-75.0
dBm
16QAM rate 3/4, 36 Mbps OFDM
-
-78.0
-79.5
-72.0
dBm
64QAM rate 1/2, 48 Mbps OFDM
-
-73.6
-75.1
-70.0
dBm
64QAM rate 3/4, 54 Mbps OFDM
-
-72.2
-73.7
-68.0
dBm
RX sensitivity
BW=20MHz HT
Mixed mode
800ns guard interval
non-STBC
MCS 0, BPSK rate 1/2
-
-89.3
-90.8
-86.0
dBm
MCS 1, QPSK rate 1/2
-
-86.3
-87.8
-84.0
dBm
MCS 2, QPSK rate 3/4
-
-83.8
-85.3
-82.0
dBm
MCS 3, 16QAM rate 1/2
-
-80.8
-82.3
-76.0
dBm
MCS 4, 16QAM rate 3/4
-
-77.3
-78.8
-74.0
dBm
MCS 5, 64QAM rate 2/3
-
-72.8
-74.3
-72.0
dBm
MCS 6, 64QAM rate 3/4
-
-71.4
-72.9
-70.0
dBm
MCS 7, 64QAM rate 5/6
-
-70.2
-71.7
-66.0
dBm
Maximum receive level
6 Mbps OFDM
-30
-10
-
dBm
54 Mbps OFDM
-30
-20
-
dBm
MCS0
-30
-15
-
dBm
MCS7
-30
-20
-
dBm
Receive adjacent
channel rejection
BPSK rate 1/2, 6 Mbps OFDM
16
24
-
dBm
BPSK rate 3/4, 9 Mbps OFDM
15
23
-
dBm
QPSK rate 1/2, 12 Mbps OFDM
13
21
-
dBm
QPSK rate 3/4, 18 Mbps OFDM
11
19
-
dBm
16QAM rate 1/2, 24 Mbps OFDM
8
15
-
dBm
16QAM rate 3/4, 36 Mbps OFDM
4
10
-
dBm
64QAM rate 1/2, 48 Mbps OFDM
0 5 -
dBm
64QAM rate 3/4, 54 Mbps OFDM
-1 3 -
dBm
MCS 0, BPSK rate 1/2
16
24
-
dBm
MCS 1, QPSK rate 1/2
13
21
-
dBm
MCS 2, QPSK rate 3/4
11
19
-
dBm
MCS 3, 16QAM rate 1/2
8
16
-
dBm
Wi-Fi 5GHz Band RF Receiver Specifications
Specifications in the table below are measured at the antenna port, which includes the front-end loss.
Page 22 of 36
May 16, 2019
Data Sheet and User Manual
AES-MS-MT3620-M-G Module
Data Sheet and User Manual
Parameter
Description
Performance
Min
Typical
Max
Unit
Main
Aux
MCS 4, 16QAM rate 3/4
4
12
-
dBm
MCS 5, 64QAM rate 2/3
0
7
-
dBm
MCS 6, 64QAM rate 3/4
-1
5
-
dBm
Receiver residual PER
MCS 7, 64QAM rate 5/6
-2
3
-
dBm
Parameter
Description
Performance
Min
Typical
Max
Unit
Frequency range
Center channel frequency
5180
-
5825
MHz
Output power with
spectral mask and
EVM
compliance
6 Mbps OFDM
-
14(1)
-
dBm
54 Mbps OFDM
-
14(1)
-
dBm
HT20 MCS 0
-
14(1)
-
dBm
HT20 MCS 7
-
14(1)
-
dBm
Output power with
spectral mask and
EVM
compliance (at -40◦C
and 85◦C)
6 Mbps OFDM
-
13(1)
-
dBm
54 Mbps OFDM
-
13(1)
-
dBm
HT20 MCS 0
-
13(1)
-
dBm
HT20 MCS 7
-
13(1)
-
dBm
TX EVM
6 Mbps OFDM
-
-
-5
dB
54 Mbps OFDM
-
-
-25
dB
HT20 MCS 0
-
-
-5
dB
HT20 MCS 7
-
-
-28
dB
Output power
variation(2)
TSSI closed-loop control across all
temperature range
and channels and VSWR ≦ 1.5:1.
-1.5
-
1.5
dB
Carrier suppression
- - -30
dBc
Harmonic output
power
2nd Harmonic
-
-45
-43
dBm/MHz
3rd Harmonic
-
-45
-43
dBm/MHz
Wi-Fi 2.4GHz Band RF Receiver Specifications (continued)
Wi-Fi 5GHz Band RF Transmitter Specifications
The specification in table below is measured at the antenna port, which includes the front-end loss.
Note 1: Low power PA
Note2: VDD33 voltage is within ±5% of typical value.
Page 23 of 36
May 16, 2019
Data Sheet and User Manual
AES-MS-MT3620-M-G Module
Data Sheet and User Manual
Parameter
Description
Performance
Min
Typical
Max
Unit
Receiver in-band blocking(1)
CW and BT interferers
2.4 GHz CW and BT interfering signal
@ ±20MHz offset
-47
-
-
dBm
2.4 GHz CW and BT interfering signal
@ ±25MHz offset
-40
-
-
dBm
5 GHz CW interfering signal
@ ±20MHz offset
-35
-
-
dBm
Receiver out-band
blocking(1)
CW interferer
25 ≤ f < 2300 MHz
-28
-
-
dBm
2300 ≤ f < 2395 MHz
-40
-
-
dBm
2483.5 < f ≤ 2583.5 MHz
-45
-
-
dBm
Receiver out-band blocking(1)
CDMA, GSM, DCS and
PCS interferers(2)
CDMA UL: 824 – 849 MHz
-20
-
-
dBm
CDMA DL: 869 – 894 MHz
-10
-
-
dBm
GSM UL: 880 – 915 MHz
-10
-
-
dBm
GSM DL: 925 – 960 MHz
-10
-
-
dBm
DCS UL: 1710 – 1785 MHz
-13
-
-
dBm
DCS DL: 1805 – 1880 MHz
-20
-
-
dBm
PCS UL: 1850 – 1910 MHz
-20
-
-
dBm
PCS DL: 1930 – 1990 MHz
-20
-
-
dBm
Receiver out-band blocking(1)
WiFi interferers
5G receiver only, interfering signal:
2400 < f ≤ 2483.5 MHz
-20
-
-
dBm
2G receiver only, interfering signal:
5125 < f ≤ 5850 MHz
-20
-
-
dBm
Wi-Fi RF Receiver Blocking Specifications
The specifications in table below are measured at the antenna port, which includes the front-end loss.
Note 1: The desired signal's strength is 3 dB above the Maximum RX sensitivity. PER ≤ 10%.
Note 2: Except harmonic mixing.
Page 24 of 36
May 16, 2019
Data Sheet and User Manual
AES-MS-MT3620-M-G Module
Data Sheet and User Manual
Mechanical Specifications
Module Dimension Details
Figure 6 – AES-MS-MT3620-M-G Module Mechanical Details
Page 25 of 36
May 16, 2019
Data Sheet and User Manual
AES-MS-MT3620-M-G Module
Data Sheet and User Manual
Tape and Reel Packaging
AES-MS-MT3620 Azure Sphere Modules are available in tape and reel packaging at quantities of 600 units.
The reel dimensions are 13 inches (reel diameter) x 56 mm (tape-width).
The 56 mm tape-width conforms to the Electronic Components Association Standard EIA-481-D.
Figure 7 – Tape and Reel Details
Page 26 of 36
May 16, 2019
Data Sheet and User Manual
AES-MS-MT3620-M-G Module
Data Sheet and User Manual
Soldering and Cleaning Recommendations
Optimum Soldering Reflow Profile
Figure 8 – Recommended Soldering Profile for Lead-Free Solder
Solder joint quality between the AES-MS-MT3620 Azure Sphere Module’s surface mount pads and
their bonding with the host board should meet the appropriate IPC Specification.
(See IPC-A-610-D Acceptability of Electronic Assemblies, section 8.2.1 “Bottom Only Terminations”)
It is recommended that only a single reflow soldering process be permitted for the host board
Any attempts at reworking the module will invalidate warrantee coverage and regulatory certifications
Cleaning
Cleaning of the populated module is not recommended!
Residuals under the module cannot be easily removed by any cleaning process
(Water / Solvents / Ultrasonic)
Page 27 of 36
May 16, 2019
Data Sheet and User Manual
AES-MS-MT3620-M-G Module
Data Sheet and User Manual
Region
Regulatory Body
Status
United States
FCC
2AF62-AVT3620U (Pending)
2AF62-AVT3620C (Pending)
Canada
ISED (IC)
21571-AVT3620U (Pending)
21571-AVT3620C (Pending)
Europe
CE
EN 60950-1, EN 300 328, EN 301 489 (Pending)
Japan
MIC
Still to be submitted
All
RoHS
Compliant
Certifications and Compliance
RoHS Compliance
AES-MS-MT3620 Azure Sphere Modules are lead-free and RoHS compliant.
Regulatory Compliance
FCC, IC and CE certifications are currently pending
(Once the certification process has been concluded, this note will be removed from the datasheet)
AES-MS-MT3620 Azure Sphere Module certification applies to operation in various regulatory domains.
This section outlines certification information specific to the following countries and regions:
Should regulatory certification be required in a specific country or region not already covered, please contact
your local Avnet sales office or create a support request at http://avnet.me/mt3620-forums
FCC and ISED Regulatory Notices (USA and Canada)
Modification statement
Avnet has not approved any changes or modifications to this device by the user.
Any changes or modifications could void the user's authority to operate the equipment!
Interference statement
This device complies with Part 15 of the FCC Rules and Industry Canada's license-exempt RSS standards.
Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this
device must accept any interference, including interference that may cause undesired operation of the device.
RF Radiation Exposure Statement
This equipment complies with FCC and ISED radiation exposure limits set forth for an uncontrolled
environment. The antenna should be installed and operated with minimum distance of 20 cm between the
radiator and your body. This transmitter must not be co-located or operating in conjunction with any other
antenna or transmitter.
Page 28 of 36
May 16, 2019
Data Sheet and User Manual
AES-MS-MT3620-M-G Module
Data Sheet and User Manual
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one of the following measures:
▪ Reorient or relocate the receiving antenna.
▪ Increase the separation between the equipment and receiver.
▪ Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
▪ Consult the dealer or an experienced radio/TV technician for help.
FCC Class B Digital Device Notice (USA)
FCC Module Statement (USA)
The single-modular transmitter is a self-contained, physically delineated, component for which compliance
can be demonstrated independent of the host operating conditions, and which complies with all eight
requirements of § 15.212(a)(1) as summarized below.
1) The radio elements have the radio frequency circuitry shielded.
2) The module has buffered modulation/data inputs to ensure that the device will comply with Part 15
requirements with any type of input signal.
3) The module contains power supply regulation on the module.
4) The module contains a permanently attached antenna.
5) The module demonstrates compliance in a stand-alone configuration.
6) The module is labelled with its permanently affixed FCC ID label
7) The module complies with all specific rules applicable to the transmitter, including all the conditions
provided in the integration instructions by the grantee.
8) The module complies with RF exposure requirements.
CAN ICES-003 (B)
This Class B digital apparatus complies with Canadian standard ICES-003.
Labeling Requirements for the OEM Host Board
The host device shall be properly labelled to identify the modules within the host device. The certification label
of the module shall be clearly visible at all times when installed in the host device, otherwise the host device
must be labelled to display the FCC ID and IC of the module, preceded by the words "Contains transmitter
module", or the word "Contains", or similar wording expressing the same meaning, as follows:
Contains FCC ID: 2AF62-AVT3620C
Contains IC: 21571-AVT3620C
Page 29 of 36
May 16, 2019
Data Sheet and User Manual
AES-MS-MT3620-M-G Module
Data Sheet and User Manual
“WARNING: To satisfy FCC RF exposure requirements for mobile transmitting devices, a separation
distance of 20cm or more should be maintained between the antenna of this device and persons during
operation. To ensure compliance, operations at closer distances than this are not recommended”
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause
undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates, uses and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions, may
cause harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one of the following measures:
▪ Reorient or relocate the receiving antenna.
▪ Increase the separation between the equipment and receiver.
▪ Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
▪ Consult the dealer or an experienced radio/TV technician for help.
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received,
including interference that may cause undesired operation.
FCC Requirements for User Manual of the OEM Host Board:
The OEM integrator may not provide any information to the end user on how to install or remove this RF
module or change RF related parameters in the user manual of the end product.
The following statement must be included as a CAUTION statement in manuals for the OEM products, to
alert users of FCC RF exposure compliance:
The user manual for the final end product should include the following statement:
Page 30 of 36
May 16, 2019
Data Sheet and User Manual
AES-MS-MT3620-M-G Module
Data Sheet and User Manual
Certification
Standard
Report Number
Test Lab
Safety
EN 60950-1:2006, A11:2009,
A1:2010, A12:2011, A2:2013
Pending
F2 Labs,
Middlefield OH, USA
EMF
EN 62311:2008
EN 62479:2010
Pending
F2 Labs,
Middlefield OH, USA
EMC
EN 301 489-1 V1.9.2
EN 301 489-17 V2.2.1
Pending
F2 Labs,
Middlefield OH, USA
Radio
EN 300 328 V1.9.1
Pending
F2 Labs,
Middlefield OH, USA
Industry Canada Statements
This Device complies with Industry Canada License-exempt RSS standard(s). Operation is subject to
the following two conditions: (1) this device may not cause interference, and (2) this device must accept
any interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts
de licence. L'exploitation est autorisée aux deux onditions suivantes: (1) l'appareil ne doit pas produire
de brouillage, et (2) l'utilisateur de l'appa-reil doit accepter tout brouillage radioélectrique subi, meme si
le brouillage est susceptible d'en com-promettre le fonctionnement.
IC Requirements for User Manual of the OEM Host Board:
The user manual for the final end product shall display the following Industry Canada notices in a
conspicuous location:
FCC Host 15B and 15C Compliance Statement (USA)
The OEM integrator is responsible for testing their end-product for any additional compliance requirements
needed with this module installed (eg. digital device emissions, PC peripheral requirements, etc).
Additionally, investigative measurements and spot checking are strongly recommended to verify that full
system compliance is maintained when the module is integrated, in accordance with the "Host Product
Testing Guidance" in FCC's KDB 996369 D04 Module Integration Guide V01
CE Statement (Europe)
Avnet AES-MS-MT3620 Azure Sphere Modules have been tested and certified for use in the European Union.
Summary of European Compliance Tests:
When integrating this module into an end product, the OEM has responsibility to verify compliance of the final
product to the EU standards.
A Declaration of Conformity (DOC) must be issued and kept on file as described in Annex II of the Radio and
Telecommunications Terminal Equipment (R&TTE) Directive.
CE Labeling Requirements (Europe)
The ‘CE’ mark must be placed on the OEM product per the labelling requirements of the R&TTE Directive.
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OEM Instructions
This module is certified for installation into OEM end-products under the following conditions:
1) The intended use of this AES-MS-MT3620-M-G module is for indoor locations. If the end product
using this module is able to operate in the band 5150-5250 MHz within Canada, it is only allowed to
be used indoors (to reduce potential harmful interference to co-channel mobile satellite systems)
The label of the end product in this case must include the text “For indoor use only”
2) It’s intended use is as a Wi-Fi client only (not a Wi-Fi access point or used in point-to-point mode)
3) The AES-MS-MT3620-M-G module is for (OEM) installation only.
The requirement for software security of UNII devices, is fully met by Microsoft Azure Sphere's advanced
security. Software updates require certificate-based authentication using hardware-based root of trust.
The device is set to “AllComplete” to permanently disable any access to any RF-related software changes.
https://docs.microsoft.com/en-us/azure-sphere/hardware/factory-floor-tasks#set-the-device-manufacturingstate-to-manufacturing-complete
Shipping, Handling and Storage
Shipping
Bulk orders of Avnet AES-MS-MT3620 Azure Sphere Modules are delivered in reels of 600.
(See detail under the section on Tape & Reel Packaging)
Handling
AES-MS-MT3620 Azure Sphere Modules contain sensitive electronic circuitry that require proper ESD
protection when handling. Failure to follow these ESD procedures may result in permanent damage to the
module.
The module should not be subjected to excessive mechanical shock.
Moisture Sensitivity (MSL)
Modules that have been exposed to moisture and environmental conditions exceeding the prescribed
packaging and storage conditions detailed in J-STD-020 (eg. not continuously in a sealed bag with a
desiccant pack) MUST be baked before mounting! (Failure to meet the packaging and storage conditions
described, will result in irreparable damage to modules during solder reflow soldering).
For devices that are packaged in a Moisture Barrier Bag with a desiccant pack and HIC (Humidity Indicator
Card), the HIC card should be referenced and J-STD-033 consulted to determine if baking is required prior
to reflow soldering.
In cases where baking is required, refer to J-STD-033 for details of the bake procedure.
“Broken reel” module quantities (under 600 units) typically require baking before reflow soldering
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Region
Organization
Email
Address & Phone
North America
Avnet Americas
eval.kits@avnet.com
AVNET - Americas
2211 South 47th Street
Phoenix, AZ 85034
USA
Phone: 1-800-585-1602
Europe
Avnet Silica
Microsoft@silica.com
Avnet Silica
Gruber Str. 60c
85586 Poing, Germany
Phone: +49-8121-77702
Storage
Per J-STD-033, the shelf life of devices in a Moisture Barrier Bag is 12 months at <40ºC and <90% room
humidity (RH).
Do not store in salty air or an environment where there is a high concentration of corrosive gas, such as Cl2,
H2S, NH3, SO2, or NOX.
Do not store in direct sunlight.
Contact Information
For further details, contact your local Avnet representative or e-mail us at:
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Legal Information
Limitations
This product is not intended for use in safety-critical applications (such as life support or automotive) where
a failure of the Avnet product could be expected to cause severe personal injury or death.
Please refer to the final section of this document for additional restrictions to Avnet’s legal liability
Avnet Module License and Product Warranty
THIS AVNET MODULE (OR “PRODUCT”) AND ANY SUPPORTING DOCUMENTATION IS SUBJECT TO THIS
LICENSE AGREEMENT. USE OF THIS PRODUCT OR DOCUMENTATION SIGNIFIES ACCEPTANCE OF THE
TERMS AND CONDITIONS OF THIS LICENSE.
THE TERMS OF THIS LICENSE AGREEMENT ARE IN ADDITION TO THE AVNET CUSTOMER TERMS AND
CONDITIONS, WHICH CAN BE VIEWED AT www.em.avnet.com
THE TERMS OF THIS LICENSE AGREEMENT WILL CONTROL IN THE EVENT OF A CONFLICT
1. Limited License. Avnet grants You, the Customer, (“You” “Your” or “Customer”) a limited, non-exclusive, non-
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Customer site; (c) make, use and sell the Product in a single production unit. No other rights are granted and
Avnet and any other Product licensor reserves all rights not specifically granted in this License Agreement. Except
as expressly permitted in this License, neither the Module, Documentation, nor any portion may be reverse
engineered, disassembled, decompiled, sold, donated, shared, leased, assigned, sublicensed or otherwise
transferred by Customer. The term of this License is in effect until terminated. Customer may terminate this
license at any time by destroying the Product and all copies of the Product Documentation.
2. Changes. Avnet may make changes to the Product or Product Documentation at any time without notice. Avnet
makes no commitment to update or upgrade the Product or Product Documentation and Avnet reserves the right
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Data Sheet and User Manual
OR LIFE SUPPORT EQUIPMENT NOR IN APPLICATIONS WHERE FAILURE OR MALFUNCTION OF THE
PRODUCTS CAN REASONABLY BE EXPECTED TO RESULT IN A PERSONAL INJURY, DEATH OR SEVERE
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ANY DAMAGES RESULTING FROM SUCH INCLUSION OR USE.
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AND HOLD AVNET HARMLESS FROM ANY CLAIMS BASED ON AVNET’S COMPLIANCE WITH
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BY PARTIES OTHER THAN AVNET, OR USE IN COMBINATION WITH OTHER PRODUCTS.
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#
Use Case
MT3620 Interface
1
Wi-Fi network settings are missing
or incorrectly configured
SERVICE UART
(4 pins)
2
A7 DEBUG UART access is
required
DEBUG UART
(2 of 4 pins)
3
M4 IO0 and IO1 TXD output are
needed (eg. for debug of M4 code)
M4F IO0 and IO1 TXD pins
(2 pins)
Appendix-A: Programming Adaptor Footprint
A key aspect of the operation of the MT3620 device are the Over-the-Air (OTA) updates of the Azure Sphere
OS firmware and the application software. There are however specific use cases where wired device
interfaces are needed (see table below). It is therefore recommended that a 10-pin connector footprint be
added to the OEM host board to interface with the module signals tabled below:
Notes:
1) There is currently a need to facilitate the configuration of the Wi-Fi network settings via the
SERVICE UART interface (the need for this will be reduced when Microsoft at later date adds
support for configuration of Wi-Fi settings via Wi-Fi A/P mode)
2) Once Wi-Fi has been configured, the Sphere OS can be “recovered” to latest version OTA via Wi-Fi
3) Access to the DEBUG UART output (of the A7 core) provides valued log-file status information that
can prove useful during software development debugging.
4) Access to the M4 TXD outputs can likewise provide status information to the software developer
To support these interfaces, an FTDI-based USB to serial adaptor is to be available for purchase from
Avnet, with 2x5 pin header connectors to support two different footprint options on the OEM host board:
a) “Tag-Connect” connector-less footprint (2x5 pads, 1.27mm pitch)
http://www.tag-connect.com/TC2050-IDC or
b) Dual-row header pins (2x5 pins, 1.27mm pitch)
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#
MT3620
Net Name
Module
Pad
I/O
#
MT3620
Net Name
Module
Pad
I/O
1
GND
63
- 2 GND
62
- 3 IO0_TXD
60
O 4 SERVICE_CTS
55
I 5 SERVICE_RTS
54
O 6 SERVICE_RXD
53
I 7 SERVICE_TXD
52
O 8 SYSRST_N
51
I 9 DEBUG_TXD
46
O
10
DEBUG_RTS
45
O
The pinout of the 2x5 pin footprint chosen for inclusion on the OEM board, should be as tabled below:
DEBUG_RTS is driven high by the PC during SYSRST_N of the MT3620 to initiate Sphere OS RECOVERY
The corresponding pads of these UART interfaces are located on same edge of the module for easy routing
to the selected 2x5 pin connector footprint on the OEM host board
Figure 9 – Module Pinout to Recommended Service & Debug Interface Connector
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