Visual inspection is needed to ensure that the evaluation board is received in good condition. The default connections
of the evaluation board are as follows:
1. A 15 V Zener diode at D1 is provided to allow for a single DC power supply of 21.6 V ~ 30 V to be applied across V
and Vee. A virtual ground Ve (at COM pin of CON2) will be generated, and it acts as the reference point at the emitter
of each IGBT. V
D1.
2. Actual IGBT can be mounted at either Q5 (for TO-220 package) or Q6 (for TO-247 package) or connected to the driver
board through short wire connections from the holes provided at Q5 or Q6.
3. S2 jumper is shorted by default to allow for the driver board to be tested without actual IGBT connection at Q5 or Q6.
Note: Once IGBT is connected at either the Q5 or Q6 location, this S2 jumper must be removed to allow for IGBT Desat
protection to be activated.
4. J1 is shorted by default, assuming that a Desat detection voltage of 8 V is needed. To reduce the Desat detection
voltage by another 1 V, this jumper can be replaced by another piece of D3 diode (BYM26E). To further reduce the
Desat detection voltage, higher VF voltage diodes can be selected to replace both D3 and J1, plus the use of higher
resistance for R4.
5. S1 is shorted by default to ground the IN1– signal. This short can be removed if IN1– cannot be grounded.
Once inspection is done, the evaluation board can be powered up in ve simple steps (see Figure 1), to test either one of
the top and bottom half bridge inverter arms in simulation mode without the need of actual IGBT (or Power MOSFET).
will then stay at 15 V above the virtual ground Ve. R11 is needed to provide the bias current across
cc2
cc2
Testing Either Arm of The Half Bridge Inverter Driver (without IGBT)
1. Solder a 10 nF capacitor across gate and emitter terminals of Q5 (to simulate actual gate capacitance of IGBT/power
MOSFET).
2. Connect a +5 V DC supply (DC supply 1) across +5 V and GND terminals of CON1.
3. Connect another DC supply (DC Supply 2 with voltage range from 21.6 V ~ 30 V) across V
-15 V) terminals of CON2. This can be non-isolated for testing purpose.
4. Supply a 10 kHz 5 V DC pulse (at 50% duty) from a signal generator across IN1+ & IN1– pins of CON1 to simulate
microcontroller output to drive either arm of the half bridge Inverter.
5. Use a multi-channel digital oscilloscope to capture the waveforms at the following points:
a. LED signal at IN1+ pin with reference to (w.r.t.) GND.
b. Fault output for any fault signal appearing at FAULT pin w.r.t. GND.
c. V
d. V
e. V
f. V
g. VgIGBT for the gate driving voltage of Q5/Q6 Gate w.r.t. Ve.
Note: A DESAT fault can be simulated by removing the S2 Jumper.
for the negative output voltage of ACPL-339J at U1 pin 11 w.r.t. Ve (COM pin).
outn
for the positive output voltage of ACPL-339J at U1 pin 12 w.r.t. Ve.
outp
for the gmos output voltage of ACPL-339J at U1 pin 14 w.r.t. Ve.
gmos
for the DESAT voltage of Q5/Q6 Collector w.r.t. Ve.
desat
(+15V) and Vee (-6.6 V ~
cc2
GND
+5V
DC Supply 1
2
5a
IN1+
Signa l Input
IN1–
4
5b
Figure 1. Simple Simulation Test Setup of Evaluation Board
Schematics
5f
5g
10 nF
5d
5c
1
5e
3
21.6 V ~ 30 V
DC Supply 2
Figure 2 shows the schematics of the Evaluation Board.
CON1
+5V
IN1+
IN1-
FAULT
GND
Figure 2. Schematics of ACPL-339J Evaluation Board
GND
Vcc1
1
NC
2
C1
220p
270
R1
R2
270
C2
S1
220p
C3
Vcc1
330n
10k
R3
CATHODE
3
ANODE
4
CATHODE
5
V
GND1
6
V
CC1
7
FAULT
8
C4
V
1n
GND1
IC1
ACPL-339J
DESAT
V
GMOS
V
V
V
OUTN
V
V
CC2
OUTP
LED
V
16
E
15
14
13
12
11
10
9
EE
Vcc2
VEE
CON2
15V
BZG03C15TR3
1µ
C5
Tant
+
20V
1µ Tant
20V
+
C7
+
10µ
Tant
C6
35V
D2
DFLS220L
C8
100p
15 (½W)
15 (½W)
R4
100
Si7465DP
R5
R6
Si7848BDP
BYM26E
J1
D3
470
R9
Q1
R7//R7a
10R (½W)
10R (½W)
10R (½W)
10R (½W)
R8 //R8a
Q2
S2
R10
330
Q3
Caution: Please
remove S2
jumpers if
IGBT/Power
Mosfet is
connected to
Q5 (or Q6)
Si2318
1k (½W)
R11
D1
VE
VCC2
21.6V~30V
VEE
G
NM
IGBT (or
VE
Power Mosfet)
(TO-220 & TO-247)
VEE
VE
C
Q5
C
Q6
G
NM
E
E
2
Practical Connections of the Evaluation Board Using IGBT/Power MOSFET for Actual Inverter Test
1. Solder actual IGBTs/Power MOSFETs at Q5 (or Q6) for the top and bottom arms of the Half Bridge Inverter Isolated
Drivers.
2. Connect a +5 V DC isolated supply 1 across +5 V and GND terminals of CON1 for both arms of the Isolated Drivers.
3. Connect another isolated DC supply 2 (voltage range from 21.6 V ~ 30 V) across V
arm.
4. Connect another isolated DC supply 3 (voltage range from 21.6 V ~ 30 V) across V
bottom arm.
5. Connect the signal output (meant to drive the top arm of half-bridge Inverter) from the microcontroller to Signal
Input 1 across pin IN1+ and IN1– of CON1 w.r.t. GND of Top Inverter Arm Isolated Driver.
6. Connect the signal output (meant to drive the bottom arm of half-bridge Inverter) from the microcontroller to Signal
Input 2 across pin IN1+ and IN1– of CON1 w.r.t. GND of Bottom Inverter Arm Isolated Driver.
7. Use a multi-channel Digital Oscilloscope to capture the waveforms at these points:
a. LED signal at IN1+ pin with reference to (w.r.t.) GND for Top Arm
b. LED signal at IN1+ pin w.r.t. GND for Bottom Arm
c. Fault output for any fault signal appearing at FAULT1 w.r.t. GND
d. Fault output for any fault signal appearing at FAULT2 w.r.t. GND
e. V
for the gmos output voltage of ACPL-339J at U1 pin 14 w.r.t. Ve of Top Inverter Arm (dierential probe
gmos
needed)
f. V
for the gmos output voltage of ACPL-339J at U1 pin 14 w.r.t. Ve of Bottom Inverter Arm (dierential probe
gmos
needed)
g. V
h. V
i. V
j. V
for the DESAT voltage of Q5 (or Q6) w.r.t. Ve of Top Inverter Arm (dierential probe needed)
desat
for the DESAT voltage of Q5 (or Q6) w.r.t. Ve of Bottom Inverter Arm (dierential probe needed)
desat
for the gate driving voltage of Q5/Q6 w.r.t. Ve of Top Inverter Arm (dierential probe needed)
gIGBT
for the gate driving voltage of Q5/Q6 w.r.t. Ve of Bottom Inverter Arm (dierential probe needed)
gIGBT
8. Connect the high voltage cable from Top Arm IGBT Emitter pin to the Bottom Arm IGBT Collector pin and then to the
Inverter load.
9. Connect the high voltage cables from Top Arm IGBT Collector to HVDC+ and from Bottom Arm IGBT Emitter to HVDC–
respectively as shown.
Note:
To protect the Inverter and its driver circuitries, it is recommended that you enable the current limiting function of the HV supply supplying the
High Voltage DC Bus during this test.
and Vee terminals of CON2 for top
cc2
and Vee terminals of CON2 for
cc2
3
5
7c
FAULT1
Microcontroller
IN1+
IN1–
Signal Input 1
GND
DC Supply 1
2
+5V
Top Inverter Arm Isolated Driver
Bottom Inverter Arm Isolated Driver
3
21.6 V ~ 30 V
V
e
DC Supply 2
1
IGBT mounted at
Q5 (or Q6)
HVDC+
9
Note: S2 jumper must
be removed before
this connection
Top Arm of Half-Bridge
Inverter Circuit
8
To Load
IN1+
6
Signal Input2
IN1–
FAULT2
7d
Figure 3. Connection of Evaluation Board in Actual Applications
V
e
4DC Supply 3
21.6 V ~ 30 V
1
IGBT mounted at
Q5 (or Q6)
Bottom Arm of
Half- Bridge Inverter Circuit
Note: S2 jumper must
be removed before
this connection
9
HVDC–
4
Application Circuit Description
The ACPL-339J is an advanced isolated gate driver that provides 1.0 A output current, suitable for IGBT and power
MOSFET. It is also designed to drive dierent sizes of MOSFET buer stage that will make the class of IGBT scalable. ACPL339J provides a single isolation solution suitable for both low and high power ratings of motor control and inverter
applications. The input LED is optically coupled to an integrated circuit with two power output stages under nonoverlapping timing protection to prevent cross conduction at external MOSFET buers at Q1 and Q2.
Each of the ACPL-339J evaluation boards (see Figure 4) accommodates an ACPL-339J IC. Two boards are needed to drive
top and bottom arms of the Half-bridge Inverter. It allows the designer to easily test the performance of gate driver in
an actual application under real-life operating conditions. Figure 2 shows the typical de-saturation protected gate drive
circuit that is implemented on the evaluation board. Operation of the evaluation board merely requires the inclusion of
a common 5V DC isolated supply on the input side and two isolated DC supplies (range from 21.6 V ~ 30 V): one for top
arm and one for the bottom arm across V
while the balance of the supplied voltage (21.6 V ~ 30 V minus 15 V) will be built across the 1 kΩ resistor (R11) to set the
negative Vee voltage, all with reference to Ve at each arm.
Note:
As can be seen on the board, the isolation circuitry (at the far left) is easily contained within a small area while maintaining adequate spacing for
good voltage isolation and easy assembly.
and Vee. The V
cc2
voltage will then be xed at +15 V by a Zener diode at D1,
cc2
Figure 4. Top and Bottom Views of ACPL-339J Evaluation Board
5
a) Operations of various outputs
The outputs (V
current), UVLO and DESAT conditions. Once the UVLOP+ and UVLON– signals are not active (V
> V
UVLON+
), V
of the ACPL-339J will be the primary source of IGBT/Power MOSFET protection. DESAT will remain functional until V
VE is decreased below V
of the ACPL-339J work alternatively to ensure constant IGBT/MOSFET protection.
, V
OUTP
is allowed to go low and V
OUTP
, V
OUTN
GMOS
or VE - VEE is decreased below V
UVLOP-
and FAULT) of each ACPL-339J are governed by the combination of IF (the LED
- VE > V
CC2
is allowed to go high. Thereafter, the DESAT (pin 15) detection feature
OUTN
. Therefore, the DESAT detection and UVLO features
UVLON-
UVLOP+
, VE - VEE
CC2
-
Table 1 shows the possible output combinations for Fault, V
outp
, V
outn
and V
under the inuence of dierent UVLO
gmos
and DESAT operating conditions, whether they are active or not.
Table 1
I
F
XActiveNot ActiveHighHighLowV
ONNot ActiveActive (with DESAT fault)HighHighLowV
ONNot ActiveActive (no DESAT fault)LowLowHighV
OFFNot ActiveNot ActiveLowHighLowV
Note:
Normal operating condition is highlighted in blue in the table; X denotes Don’t Care; Logic output of V
UVLOP and UVLONDESAT FunctionPin 7 (FAULT) OutputV
UVLON is active. This will ensure that MN3 is turned on to shut down the IGBT/SiC FET when insucient power supply VE-VEE is applied.
OUTP
GMOS
V
OUTN
will be changed from VEE to VE when
V
GMOS
E
E
EE
EE
b) Soft-shutdowns from DESAT and UVLO faults
The DESAT pin of each device monitors its IGBT Vce voltage. The internal DESAT fault detection circuitry must remain
disabled for a short time period following the turn-on of the IGBT to allow the collector voltage to fall below the DESAT
threshold. This time period, called the DESAT blanking time, is controlled by the internal DESAT charge current, the
DESAT voltage threshold, and the external DESAT blanking capacitor (C8, at 100 pF). The nominal blanking time is
calculated in terms of external capacitance (C
as T
BLANK
= C
BLANK
× V
DESAT
/ I
. The nominal blanking time with the recommended 100 pF capacitor is 100 pF * 8 V /
CHG
250 µA = 3.2 µsec. This nominal blanking time also represents the longest time it will take for each ACPL-339J to respond
to a DESAT fault condition. After T
Q2 MOSFETs and V
switches from Low to High, turning on an external Q3 pull-down MOSFET, to ‘softly’ turn o the
GMOS
time, both V
BLANK
IGBT. Also activated is an internal feedback channel that brings the isolated FAULT output from Low to High to notify the
microcontroller of the fault condition.
), FAULT threshold voltage (V
BLANK
and V
OUTP
OUTN
), and DESAT charge current (I
DESAT
CHG
outputs will turn o the respective external Q1 and
)
Once fault is detected, the output will be muted for T
time. All input LED signals will be ignored during the mute
MUTE
period to allow the driver to completely do a soft shutdown of the IGBT. The fault is auto-reset upon the 1 ms (typical)
mute time (T
) timeout or upon the change in IN1 status from High to Low transition, whichever is later. In this way
MUTE
there is a minimum timeout, yet there is still exibility of lengthening the timeout.
When a DESAT fault is detected, its device’s V
output switches from Low to High, turning on the external Q3 MOSFET
GMOS
pull-down device. Q3 slowly discharges the IGBT gate voltage at a decay rate corresponding to the RC constant of RS
and CIN (the IGBT input capacitance). Based on a RS of 330 Ω (as in R10) and CIN of 10 nF(from the external connected
capacitor at Q5 or Q6), the entire soft shut down will decay in 4.8 * 330 Ω * 10 nF = 15.8 µs. Soft shutdown prevents fast
changes of the collector current that could cause damaging voltage spikes due to lead and wire inductance. Similarly,
when under voltage operation occurs during normal operation, its device’s V
output switches from Low to High,
GMOS
turning on the external Q3 MOSFET pull-down device. Q3 slowly discharges the IGBT gate voltage at a decay rate
corresponding to the RC constant of RS and CIN (the IGBT input capacitance). The entire soft shutdown will decay in 15.8
µs to prevent fast changes in the collector current.
6
Using the Board
It is easy to prepare the evaluation board for use. Only minor preparations (just by soldering cables for DC supplies,
proper cables for HVDC+/HVDC– high voltage bus, and load connections) are required. The evaluation board has a
default setup (as shown in Table 2) when it is shipped to the customer. The customer is free to select dierent settings
for J1, S1 and S2 for his dierent needs.
Table 2
Recommended PWM frequency V
Default Setup
J1 is provided to let customer to adjust the DESAT fault detection voltage to 7 V by replacing it with another BYM26E.
S1 jumper is shorted to ground the IN1-. This can be open if dierential signal is used across IN1+ & IN1– to drive the LED.
S2 jumper can be shorted when IGBT/Power MOSFET are not connected to Q5 (or Q6) to stop the DESAT fault from occurring. It
has to be open, however, when IGBT/Power MOSFET are connected to activate the DESAT fault protection.
1 kHz to 50 kHz (0 ~ 5 V)+5Vdc21.6 V ~ 30 VShorted ShortedShorted
cc1
V
w.r.t. VeeJ1S1S2
cc2
Output Measurement
Figure 5 and Figure 6 show a sample of Input LED and various output waveforms that have been captured. The soft
shutdown waveform are shown clearly in V
LED ON
I
F
V
DESAT
V
GMOS
V
G(IGBT)
8 V
Soft
Shutdown
gIGBT
waveform.
LED OFF
V
OUTN
V
OUTP
Ext PMOS ON
FAULT
Figure 5. Input LED (tON < t
Ext NMOS OFF
Ext PMOS OFF
) and various output voltage waveforms
MUTE
Ext NMOS ON
7
V
V
V
I
V
OUTN
F
DESAT
GMOS
G(IGBT)
LED ON
8 V
LED OFF
Soft
Shutdown
Ext NMOS ON
Ext NMOS OFF
V
OUTP
Ext PMOS ON
FAULT
Figure 6. Input LED (tON > t
Figure 5 and Figure 6 also show that, once DESAT fault is detected, the output (V
Ext PMOS OFF
) and various output voltage waveforms
MUTE
) will be muted for T
gIGBT
MUTE
time
where input LED signals will be ignored during the mute period to allow for the driver to completely perform a soft
shutdown of the IGBT. The fault is auto-reset upon the 1 ms (typical) mute time (T
) timeout or upon LED Input ‘High’
MUTE
to ‘Low’ transition, whichever is later. In this way there is a minimum timeout, yet there is still exibility of lengthening
the timeout, as in Figure 6.
Performing OR on the Fault Circuits
During normal operation of the circuit under ‘no fault’ condition, LED2 of U1 (IC1) are activated and normally ‘On’,
to pull their respective pin 7 ‘Low’. To improve on the operating eciencies, and at the same time to allow for easy
bootstrapping, the LEDs are made to operate at 50% duty cycle at a frequency of 5 MHz through internal oscillator
circuits. This, however, causes the open collector Fault output at pin 7 of U1 to toggle at undesirable ‘High’ and ‘Low’
levels if only pull-up resistors are connected. To lter away the unwanted oscillating outputs and to keep it at a Low
level, an RC network each is connected (see Figure 7) for both ICs (IC1 and IC2) in the Top and Bottom Arms of the HalfBridge Inverter Drivers. Corner frequencies of both networks are set at around 15 ~ 16 kHz to have eective ltering.
During an actual fault condition, however, pin 7 will be pulled ‘High’. Due to this positive (or ‘High’) logic, the Fault pins
cannot be tied together to achieve a common Fault level if one and only one of the Inverter Arms experiences a fault.
Tying the Fault pins together causes the voltage level of both Fault pins to stay Low when only one of the ICs experiences
a fault—this is undesirable.
To overcome such a problem and to allow the circuit to correctly report a common Fault level to the microcontroller, a
circuit that performs the OR function consists of an NPN transistor and a base resistor can each be connected to the Fault
pin of their respective IC. As shown in Figure 7, the collector outputs can then be tied (perform an OR) together before a
pull-up resistor and the point on which the OR is performed represents a common Fault signal, albeit in a reversed logic.
8
+5V
FAULT
47k
2N3904
47k
47k
R
10k
1 nF
R
10k
+5V
C
+5V
V
CC1
FAULT
GND1
V
CC1
FAULT
5,8
IC1
6
7
LED2
SHIELD
ACPL-339J
IC2
6
7
LED2
2N3904
C
1 nF
5,8
SHIELD
GND1
ACPL-339J
Figure 7. Performing an OR on the Fault Outputs Of IC1 (Top Arm) and IC2 (Bottom Arm)
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