HSMx-A4xx-xxxxx
SMT LED Surface Mount LED Indicator
Data Sheet
Description
Avago Power PLCC-4 is an extension of our PLCC-2
SMT LEDs. The package can be driven at higher
current due to its superior package design. The
product is able to dissipate heat more efficiently
compared to the conventional PLCC-2 SMT LEDs. In
proportion to the increase in driving current, this
family of LEDs is able to produce higher light output
compared to the conventional PLCC-2 SMT LEDs.
These SMT LEDs have higher reliability and better
performance and are designed to work under a wide
range of environmental conditions. This higher
reliability makes them suitable for use under harsh
environment and conditions like automotive. In
addition, they are also suitable to be used in electronic
signs and signals.
To facilitate easy pick and place assembly, the LEDs
are packed in EIA-compliant tape and reel. Every reel
will be shipped in single intensity and color bin (except
for red color), to provide close uniformity.
These LEDs are compatible with IR solder reflow
process. Due to the high reliability feature of these
products, they also can be mounted using through-thewave soldering process.
There are a variety of colors and various viewing
angles (30°, 60° and 120°) available in these SMT
LEDs. Ideally, the 30° parts are suitable for light piping
where focused intensities are required. As for the 60°
and 120°, they are most suitable for automotive interior
and exterior lighting and electronic signs applications.
Features
• Industry standard PLCC-4
• High reliability LED package
• High brightness using AlInGaP and InGaN dice
technologies
• High optical efficiency
• Higher ambient temperature at the same current possible
compared to PLCC-2
• Available in full selection of colors
• Super wide viewing angle at 120˚
• Available in 8mm carrier tape on 7-inch reel
• Compatible with both IR and TTW soldering process
JEDEC MSL 2a
Applications
• Interior automotive
– Instrument panel backlighting
– Central console backlighting
– Cabin backlighting
– Navigation and audio system
– Dome lighting
– Push button backlighting
• Exterior automotive
– Turn signals
– CHMSL
– Rear combination lamp
– Puddle light
• Electronic signs and signals
– Interior full color sign
– Variable message sign
• Office automation, home appliances, industrial equipment
– Front panel backlighting
– Push button backlighting
– Display backlighting
CAUTION: HSMN-, HSMK-, HSMM-A40x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate
precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
Package Dimensions
2.8 ± 0.2
2.2 ± 0.2
AC
3.2 ± 0.2
CC
0.7 ± 0.1
CATHODE MARKING
NOTES:
ALL DIMENSIONS IN mm.
ELECTRICAL CONNECTION BETWEEN ALL CATHODES IS RECOMMENDED.
3.5 ± 0.2
0.1 TYP. 0.8 ± 0.1
0.8 ± 0.3
1.9 ± 0.2
0.5 ± 0.1
Device Selection Guide
Color Part Number Min. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology
Red HSMC-A400-S30M1 180.00 355.00 50 AlInGaP
HSMC-A401-T40M1 285.00 715.00 50 AlInGaP
HSMC-A401-T80M1 355.00 900.00 50 AlInGaP
HSMZ-A400-U80M1 560.00 1400.00 50 AlInGaP
Red Orange HSMJ-A401-T40M1 285.00 715.00 50 AlInGaP
HSMJ-A401-U40M1 450.00 1125.00 50 AlInGaP
HSMV-A400-U80M1 560.00 1400.00 50 AlInGaP
Orange HSML-A401-U40M1 450.00 1125.00 50 AlInGaP
Amber HSMA-A400-T35M1 285.00 560.00 50 AlInGaP
HSMA-A401-U45M1 450.00 1125.00 50 AlInGaP
HSMU-A400-U85M1 560.00 1400.00 50 AlInGaP
Emerald Green HSME-A401-P4PM1 45.00 112.50 50 AlInGaP
Green HSMM-A401-R7YM2 140.00 285.00 30 InGaN
HSMM-A401-S4YM2 180.00 450.00 30 InGaN
HSMM-A401-S7YM2 224.00 450.00 30 InGaN
HSMM-A400-T8YM2 355.00 900.00 30 InGaN
Cyan HSMK-A401-R40M2 112.50 285.00 30 InGaN
HSMK-A400-T80M2 355.00 900.00 30 InGaN
Blue HSMN-A401-P4QM2 45.00 112.50 30 InGaN
HSMN-A401-P7QM2 56.00 112.50 30 InGaN
HSMN-A400-Q8QM2 90.00 224.00 30 InGaN
Notes:
1. The luminous intensity IV, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be
aligned with this axis.
2. IV tolerance = ±12 %.
2
Part Numbering System
HSM x1 – A x2 x3x4 – x5x6 x7 x8x
9
Packaging Option
Color Bin Selection
Intensity Bin Select
Device Specific Configuration
Package Type
LED Chip Color
Absolute Maximum Ratings (TA = 25°C)
Parameters HSMC/J/L/A/E HSMZ/V/U HSMM/K/N
DC Forward Current
[1]
Peak Forward Current
[2]
70 mA
[3,4]
70 mA
[3,4]
30 mA
200 mA 200 mA 90 mA
Power Dissipation 180 mW 240 mW 114 mW
Reverse Voltage 5 V
Junction Temperature 110°C
Operating Temperature –40°C to +100°C
Storage Temperature –40°C to +100°C
Notes:
1. Derate linearly as shown in figure 5.
2. Duty factor = 10%, Frequency = 1 kHz.
3. Drive current between 10 mA and 70 mA is recommended for best long-term performance.
4. Operation at currents below 5 mA is not recommended.
3
Optical Characteristics (TA = 25°C)
Peak Dominant Luminous Luminous Intensity/
[3]
v
Total Flux
Part λ
Wavelength Wavelength Viewing Angle Efficacy η
PEAK
(nm) λ
[1]
(nm) 2θ
D
[2]
(Degrees) (lm/W) Iv (mcd)/Φv (mlm)
1/2
Color Number Typ. Typ. Typ. Typ. Typ.
Red HSMC 635 626 120 150 0.45
HSMZ 639 630 120 155 0.45
Red Orange HSMJ 621 615 120 240 0.45
HSMV 623 617 120 263 0.45
Orange HSML 609 605 120 320 0.45
Amber HSMA 592 590 120 480 0.45
HSMU 594 592 120 500 0.45
Yellow Green HSME 576 575 120 560 0.45
Emerald Green HSME 568 567 120 610 0.45
Green HSMM 518 525 120 500 0.45
Cyan HSMK 502 505 120 300 0.45
Blue HSMN 468 470 120 75 0.45
Notes:
1. The dominant wavelength, λD, is derived from the CIE Chromaticity Diagram and represents the color of the device.
2. θ
is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
1/2
3. Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv is
the luminous efficacy in lumens/watt.
Electrical Characteristics (TA = 25°C)
Forward Voltage Reverse Voltage
VF (Volts) @ IF = 50 mA VR @ 100 µA
Part Number Typ. Max. Min.
HSMC/J/L/A/E 2.2 2.5 5
HSMZ/V/U 2.8 3.4 5
Forward Voltage Reverse Voltage
VF (Volts) @ IF = 30 mA VR @ 10 µA
Part Number Typ. Max. Min.
HSMM/K/N 3.8 4.6 5
1.0
BLUE
0.9
CYAN
0.8
GREEN
0.7
0.6
0.5
0.4
0.3
RELATIVE INTENSITY
0.2
0.1
0
380 480 580 680 730 780
WAVELENGTH – nm
630530430
EMERALD GREEN
YELLOW GREEN
AMBER
ORANGE
RED ORANGE
RED
Figure 1. Relative Intensity Vs. Wavelength.
4
80
70
60
HSMC/J/L/A/E
50
40
30
20
FORWARD CURRENT – mA
10
0
03
12 45
FORWARD VOLTAGE – V
HSMZ/V/U
HSMM/K/N
1.4
1.2
1.0
0.8
0.6
0.4
RELATIVE INTENSITY
(NORMALIZED AT 50 mA)
0.2
0
20
040
FORWARD CURRENT – mA
1.2
1.0
0.8
0.6
0.4
0.2
(NORMALIZED AT 30 mA)
RELATIVE LUMINOUS INTENSITY
0
6010 30 70
50
80
020
10
FORWARD CURRENT – mA
25
30515
35
Figure 2. Forward Current Vs. Forward Voltage. Figure 3. Relative Intensity Vs. Forward
Current (AlInGaP).
80
70
60
350°C/W
50
40
470°C/W
30
20
10
0
MAXIMUM FORWARD CURRENT – mA
0
20 60 80 120
40
AMBIENT TEMPERATURE – °C
300°C/W
100
Figure 5a. Maximum Forward Current Vs.
Ambient Temperature, Derated Based On
TJmax = 110°C (AlInGaP).
35
30
25
350°C/W
20
470°C/W
15
10
5
MAXIMUM FORWARD CURRENT – mA
0020 60 80 120
40
AMBIENT TEMPERATURE – °C
300°C/W
100
Figure 5b. Maximum Forward Current Vs.
Ambient Temperature, Derated Based On
TJmax = 110°C (InGaN).
Figure 4. Relative Intensity Vs. Forward
Current (InGaN).
540
530
520
510
500
490
480
470
DOMINANT WAVELENGTH – nm
460
020
10
515 30
CURRENT – mA
InGaN GREEN
InGaN CYAN
InGaN BLUE
25
Figure 6. Dominant Wavelength Vs. Forward
Current – InGaN Devices.
35
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
RELATIVE INTENSITY
0.2
0.1
0
-70 -50
Figure 7. Radiation Pattern.
5
-30 30 50 70 90-90 -10 10
ANGLE – DEGREES
4.50 (0.178)
2.60
(0.103)
1.10
(0.043)
X
X
0.40 (0.016)
0.50
(0.020)
Y
1.50 (0.059)
DIMENSIONS IN mm (INCHES).
SOLDER RESIST
Figure 8a. Recommended Soldering Pad Pattern.
6.1 (0.240)
2.8 (0.110)
2.0 (0.079)
6.0 (0.236)
3.0 (0.118)
DIMENSIONS IN mm (INCHES).
2.0 (0.079)
Thermal Resistance Solder Pad Area (xy)
300°C /W >16 mm
350°C /W >12 mm
470°C /W >8 mm
Figure 8b. Recommended Soldering Pad Pattern (TTW).
20 SEC. MAX.
240°C MAX.
3°C/SEC. MAX.
100-150°C
3°C/SEC.
TEMPERATURE
MAX.
120 SEC. MAX.
TIME
60-150 SEC.
2
2
2
183°C
–6°C/SEC.
MAX.
Y
REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
Y
1.0 (0.039)
Y
REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
TEMPERATURE
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
X X
217 °C
3 °C/SEC. MAX.
125 °C ± 25 °C
MAX. 120 SEC.
0.5 (0.020)
255 °C
+5 °C
-0 °C
TIME
10 to 20 SEC.
6 °C/SEC. MAX.
60 to 150 SEC.
Figure 9a. Recommended SnPb Reflow Soldering Profile.
250
200
150
100
TEMPERATURE – °C
50
30
01020
TURBULENT WA VE
FLUXING
PREHEAT
30 40 50
TIME – SECONDS
LAMINAR WA VE
HOT AIR KNIFE
60 70 80 90 100
Figure 10. Recommended Wave Soldering Profile.
6
Figure 9b. Recommended Pb-free Reflow Soldering Profile.
Note: For detailed information on reflow soldering of Avago surface
mount LEDs, refer to Avago Application Note AN 1060 Surface
Mounting SMT LED Indicator Components.
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
TRAILER COMPONENT LEADER
200 mm MIN. FOR ∅180 REEL.
200 mm MIN. FOR ∅330 REEL.
Figure 11. Tape Leader and Trailer Dimensions.
480 mm MIN. FOR ∅180 REEL.
960 mm MIN. FOR ∅330 REEL.
C
A
USER FEED DIRECTION
+0.1
∅1.5
–0
Figure 12. Tape Dimensions.
4 ± 0.1
8 ± 0.1
VIEW A-A
USER FEED DIRECTION
2 ± 0.05
+0.1
∅1
–0
B
B
3.45 ± 0.1
1.75 ± 0.1
5.5 ± 0.05
AA
+0.3
12
–0.1
VIEW B-B
ALL DIMENSIONS IN mm.
3.6 ± 0.1
3.8 ± 0.1
0.229 ± 0.01
C
C
A
C
PRINTED LABEL
Figure 13. Reeling Orientation.
7
CATHODE SIDE
Intensity Bin Select (X5X6)
Individual reel will contain parts from
one half bin only.
X
X
5
6
Min. Iv Bin
0 Full Distribution
3 3 half bins starting from X51
4 4 half bins starting from X51
5 5 half bins starting from X51
7 3 half bins starting from X52
8 4 half bins starting from X52
9 5 half bins starting from X52
Intensity Bin Limits
Bin ID Min. (mcd) Max. (mcd)
N1 28.50 35.50
N2 35.50 45.00
P1 45.00 56.00
P2 56.00 71.50
Q1 71.50 90.00
Q2 90.00 112.50
R1 112.50 140.00
R2 140.00 180.00
S1 180.00 224.00
S2 224.00 285.00
T1 285.00 355.00
T2 355.00 450.00
U1 450.00 560.00
U2 560.00 715.00
V1 715.00 900.00
V2 900.00 1125.00
W1 1125.00 1400.00
W2 1400.00 1800.00
Tolerance of each bin limit = ± 12%
Color Bin Select (X7)
Individual reel will contain parts from
one full bin only.
X
7
0 Full Distribution
Z A and B only
Y B and C only
W C and D only
V D and E only
U E and F only
T F and G only
S G and H only
Q A, B and C only
P B, C and D only
N C, D and E only
M D, E and F only
L E, F and G only
K F, G and H only
1 A, B, C and D only
2 E, F, G and H only
3 B, C, D and E only
4 C, D, E and F only
5 A, B, C, D and E only
6 B, C, D, E and F only
Color Bin Limits
Blue Min. (nm) Max. (nm)
A 460.0 465.0
B 465.0 470.0
C 470.0 475.0
D 475.0 480.0
Cyan Min. (nm) Max. (nm)
A 490.0 495.0
B 495.0 500.0
C 500.0 505.0
D 505.0 510.0
Color Bin Limits
Emerald
Green Min. (nm) Max. (nm)
A 552.5 555.5
B 555.5 558.5
C 558.5 561.5
D 561.5 564.5
Yellow
Green Min. (nm) Max. (nm)
E 564.5 567.5
F 567.5 570.5
G 570.5 573.5
H 573.5 576.5
Amber/
Yellow Min. (nm) Max. (nm)
A 582.0 584.5
B 584.5 587.0
C 587.0 589.5
D 589.5 592.0
E 592.0 594.5
F 594.5 597.0
Orange Min. (nm) Max. (nm)
A 597.0 600.0
B 600.0 603.0
C 603.0 606.0
D 606.0 609.0
E 609.0 612.0
Red
Orange Min. (nm) Max. (nm)
A 611.0 616.0
B 616.0 620.0
Red Min. (nm) Max. (nm)
Full Distribution
Tolerance of each bin limit = ± 1 nm
Green Min. (nm) Max. (nm)
A 515.0 520.0
B 520.0 525.0
C 525.0 530.0
D 530.0 535.0
Packaging Option (X8X9)
Test Package Reel
Option Current Type Size
M1 50 mA Top Mount 7 inch
M2 30 mA Top Mount 7 inch
8
Forward Voltage Bin Table
For HSMZ/V/U – A4xx-xxxxx only
BIN MIN. MAX.
VA 1.9 2.2
VB 2.2 2.5
VC 2.5 2.8
VD 2.8 3.1
VE 3.1 3.4
Tolerance of each bin limit = ± 0.05
This product is qualified as Moisture Sensitive Level 2a per JEDEC JSTD-020. Precaution when handling this moisture sensitive product is
important to ensure the reliability of the product. Refer to Avago
Application Note AN 5305 Handling of Moisture Sensitive Surface
Mount Devices for details.
A. Storage before use
– Unopen moisture barrier bag (MBB) can be stored at <40°C/90% RH
for 12 months. If the actual shelf life has exceeded 12 months and the
HIC indicates that baking is not required, then it is safe to reflow the
LEDs per the original MSL rating.
– It is not recommended to open the MBB prior to assembly
(e.g., for IQC).
B. Control after opening the MBB
– The humidity indicator card (HIC) shall be read immediately upon
opening of MBB.
– The LEDs must be kept at <30°C/60% RH at all times and all high
temperature related processes, including soldering, curing or rework,
need to be completed within 672 hours.
C. Control of unfinished reel
– Unused LEDs need to be stored in sealed MBB with desiccant or in
desiccator at <5% RH.
D. Control of assembled boards
– If the PCB soldered with the LEDs is to be subjected to other high
temperature processes, the PCB needs to be stored in sealed MBB
with desiccant or in desiccator at <5% RH to ensure no LEDs have
exceeded their floor life of 672 hours.
E. Baking is required if:
– “10%” or “15%” HIC indicator turns pink.
– The LEDs are exposed to conditions of >30°C/60% RH at any time.
– The LEDs' floor life exceeds 672 hours.
Recommended baking conditions: 60±5°C for 20 hours.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0312EN
AV02-0479EN June 20, 2007
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