HSMx-A43x-xxxxx
Surface Mount LED Indicator
Data Sheet
Description
The Power PLCC-4 SMT LED with Lens are high-performance
PLCC-4 package size SMT LEDs targeted mainly in Automotive & Electronics Signs and Signals (ESS) markets. These
top-mount single-chip packages with focused radiation
oer high brightness in beam direction and are excellent
for interior automotive, indoor and outdoor sign and industrial applications. With additional lens in 30q variants, these
products are especially tting to applications for trac
lights, CHMSL and displays.
The PLCC-4 package family is able to dissipate heat better
compared to the PLCC-2 packages. In proportion to this
increase in driving current, this family of LEDs is able to
produce higher light output compared to the conventional
PLCC-2 SMT LEDs.
As an extension of the standard at top PLCC-4 SMT LEDs,
the Power PLCC-4 with Lens device is able to provide focused beams within narrow viewing angles (30q) meeting
the market’s requirements for focused radiation and high
brightness in beam directions.
The Power PLCC-4 SMT LED with 30q is ideal for panel, push
button, or general backlighting in automotive interior
& exterior, sign, oce equipment, industrial equipment
and home appliances applications. This package design
coupled with careful selection of component materials allow the Power PLCC-4 SMT LED with Lens to perform with
higher reliability in a larger temperature range -40qC to
100qC. This high reliability feature is crucial to allow the
Power PLCC-4 SMT LED with Lens to do well in harsh environments such as its target Automotive & ESS markets. The
Power PLCC4 SMT LED with Lens package is also designed
to be compatible with both IR-solder re-ow and throughthe-wave soldering.
Features
x Industry Standard PLCC-4
x High reliability LED package
x High brightness using AllnGaP and InGaN dice tech-
nologies
x High optical eciency
x Narrow Viewing angle at 30°
x Available in 8mm carrier tape on 7-inch reel
x Compatible with both IR and TTW soldering process
Applications
Interior automotive
x Instrument panel backlighting
x Central console backlighting
x Cabin backlighting
x Navigation and audio system
x Dome lighting
x Push button backlighting
Exterior automotive
x Turn signals
x CHMSL
x Rear Combination Lamp
x Side repeaters
Electronic signs and signals
x Interior and exterior full color sign
x Variable message sign
x Garden lighting
Oce automation, home appliances, industrial equipment
x Front panel backlighting
x Push button backlighting
x Display backlighting
CAUTION: HSMN, HSMM-A43x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions
during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
The new Avago Technologies Power PLCC-4 SMT LED with
30° Lens will carry the part number HSMx- A43xxxxxx. The
high brightness AlInGaP and InGaN dice technologies
utilized will provide the product brightness that meets
the Automotive and ESS markets requirements. The Lens
package will complement and complete the existing AlInGap & InGaN color standard Power-PLCC-4 LED that Avago
Technologies oers, providing customers an extra Lens
option from one supplier.
To facilitate easy pick and place assembly, the LEDs are
packed in EIA-compliant tape and reel. Every reel will be
shipped in single intensity and color bin (except for red
color), to provide close uniformity
Package Dimensions
2.8 ± 0.2
2.2
± 0.2
+ve -ve
3.5
± 0.2
3.2
-ve -ve
± 0.1
0.7
Package marking
Note: All dimensions in mm
Electrical connection between all cathodes is recommended
± 0.2
0.8
± 0.3
3.87 max.
0.80
0.5
± 0.10.1 TYP.
± 0.1
2
Device Selection Guide
Color Part Number Min. IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology
Red HSMC-A430-W50M1 1125.00 2300.00 3550.00 50 AlInGaP
HSMC-A431-X90M1 2240.00 4000.00 7150.00 50 AlInGaP
Red Orange HSMJ-A430-W50M1 1125.00 2300.00 3550.00 50 AlInGaP
HSMJ-A431-X90M1 2240.00 4500.00 7150.00 50 AlInGaP
Orange HSML-A431-X90M1 2240.00 4500.00 7150.00 50 AlInGaP
Amber HSMA-A430-W90M1 1400.00 3000.00 4500.00 50 AlInGaP
HSMA-A431-Y00M1 2850.00 5000.00 - 50 AlInGaP
HSMA-A431-X90M1 2240.00 4700.00 7150.00 50 AlInGaP
Green HSMM-A430-X90M2 2240.00 7150.00 30 InGaN
Blue HSMN-A430-V50M2 715.00 2240.00 30 InGaN
Notes:
1. The luminous intensity IV, is measured at the mechanical axis of the lamp package.
The actual peak of the spatial radiation pattern may not be aligned with this axis.
2. Iv tolerance ±12%
Part Numbering System
HSM x1 - A X2 X3 X4 - X5 X6 X7 X8 X
9
Packaging Option
Color Bin Selection
Intensity Bin Select
Device Specific Configuration
Package Type
LED Chip Color
3
Absolute Maximum Ratings (TA=25°C)
Parameters HSMC/A HSMV HSMK/M/N
DC Forward Current
Peak Forward Current
Power Dissipation 180 mW 240 mW 114 mW
Reverse Voltage 5V 5V 4V
Junction Temperature 110 °C
Operating Temperature - 40 °C to + 100 °C
Storage Temperature - 40 °C to + 100 °C
Notes:
1. Derate linearly as shown in Figure 4.
2. Duty factor = 10%, Frequency = 1kHz
[1]
[2]
70 mA 70 mA 30 mA
200 mA 200 mA 90 mA
Optical Characteristics (TA = 25 °C)
Peak
Wavelength
O
(nm)
Dice
Color Part Number
Red HSMC-A43x AlInGaP 635 626 30 150
Red
Orange
Orange HSML-A431 AlInGaP 609 605 30 320
Amber HSMA-A43x AlInGaP 592 590 30 480
Green HSMM-A430 InGaN 518 525 30 500
Blue HSMN-A43X InGaN 468 470 30 75
Cyan HSMK-A43X InGaN 500 502 30 285
Notes:
1. The dominant wavelength, OD, is derived from the CIE Chromaticity Diagram and represents the color of the device.
2. T½ is the o-axis angle where the luminous intensity is ½ the peak intensity.
3. Radiant intensity, Ie in watts / steradian, may be calculated from the equation Ie = I
the luminous ecacy in lumens / watt.
HSMJ-A43x AlInGaP 621 615 30 240
HSMV-A430 AlInGaP 623 617 30 263
Technology
PEAK
Typical Typical Typical Typical
Dominant
Wavelength
[1]
O
(nm)
D
/ KV, where IV is the luminous intensity in candelas and KV is
V
Viewing Angle
[2]
2T
½
(Degrees)
Electrical Characteristics (TA = 25 °C)
Forward Voltage VF (Volts)@IF=50 mA Reverse Voltage VR@100PA Reverse Voltage VR@10PA
Part Number
HSMC/J/L/A 1.7 2.2 2.5 5 -
HSMV 1.7 2.8 3.4 5 -
Minimum Typical Maximum Minimum Minimum
Luminous
Ecacy
[3]
KV
(lm/W)
Forward Voltage V
Part Number
HSMK/M/N 2.7 3.9 4.6 - 5
4
Minimum Typical Maximum Minimum Minimum
(Volts)@IF=30 mA Reverse Voltage VR@100PA Reverse Voltage VR@10PA
F
1
0.8
0.6
InGaN
Blue
0.4
RELATIVE INTENSITY
0.2
0
380 430 480 530 580 630 680 730 780
InGaN
Cyan
InGaN
Green
WAVELENGTH - nm
AlInGaP Amber
AlInGaP Orange
AlInGaP Red Orange
AlInGaP Red
Figure 1. Relative Intensity Vs. Wavelength
80
70
60
HSMC/J/L/A
HSMV
50
40
30
20
FORWARD CURRENT - mA
10
HSMK/M/N
0
0 1 2345
FORWARD VOLTAGE - V
Figure 2. Forward Current Vs. Forward Voltage
1.4
1.2
1.0
0.8
0.6
0.4
(NORMALIZED AT 50 mA)
0.2
RELATIVE LUMINOUS INTENSITY
0
0510 15202530354045505560 657075
DC FORWARD CURRENT - mA
1.2
1.0
0.8
0.6
0.4
(NORMALIZED AT 30 mA)
0.2
RELATIVE LUMINOUS INTENSITY
0
0510 1520253035
DC FORWARD CURRENT - mA
Figure 3a. Relative Intensity Vs. Forward Current (AlInGaP). Figure 3b. Relative Intensity Vs. Forward Current (InGaN).
5
80
70
60
50
40
30
20
10
MAXIMUM FORWARD CURRENT – mA
0
0
350C/W
300C/W
470C/W
20 60 80 120
40
100
AMBIENT TEMPERATURE – C
35
30
25
20
15
10
5
MAXIMUM FORWARD CURRENT – mA
0
0
300C/W
350C/W
470C/W
20 60 80 120
40
100
AMBIENT TEMPERATURE – C
Figure 4a. Maximum Forward Current Vs. Ambient Temperature.
Derated Based on T
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
NORMALIZED INTENSITY
0.2
0.1
0
-90 -60 -30 0 30 60 90
max= 110°C (AlInGaP)
J
ANGULAR DISPLACEMENT - DEGREES
Figure 4b. Maximum Forward Current Vs. Ambient Temperature.
Derated Based on TJmax= 110°C (InGaN)
Figure 5. Radiation Pattern
6
2.60
(0.103)
1.10
(0.043)
X
X
0.40 (0.016)
4.50 (0.178)
1.50 (0.059)
DIMENSIONS IN mm (INCHES).
Figure 6a. Recommended Soldering Pad Pattern (IR Reow).
6.1 (0.240)
2.0 (0.079)
SOLDER RESIST
2.8 (0.110)
0.50
(0.020)
REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
Y
Y
Y
X X
0.5 (0.020)
6.0 (0.236)
2.0 (0.079)
3.0 (0.118)
DIMENSIONS IN mm (INCHES).
Figure 6b. Recommended Soldering Pad Pattern (TTW).
1.0 (0.039)
Y
SOLDER RESIST
REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
7
Vacuum Pick-up Tool
Nozzle Inner Diameter
size: 1.0 to 1.5 mm
Soft Tip
1.25mm
Radius Contour
Figure 7. Soft Tip Vacuum Pick-up Tool for Extracting SMT LED Components from Carrier Tape.
20 SEC. MAX.
217°C
3°C/SEC. MAX.
100-150°C
240°C MAX.
183°C
125°C +/- 25°C
255 °C +5°C
3°C/SEC MAX.
-0°C
10 to 20 SEC.
-6°C/SEC MAX.
TEMPERATURE
3°C/SEC.
MAX.
120 SEC. MAX.
60-150 SEC.
TIME
–6°C/SEC.
MAX.
TEMPERATURE
60-150 SEC.
MAX. 120 SEC.
TIME
Figure 8a. Recommended SnPb Reow Soldering Prole Figure 8b. Recommended Pb-free Reow Soldering Prole.
Note: For detail information on reow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT
LED Indicator Components.
TURBULENT WAVE
250
200
150
FLUXING
TEMPERATURE – C
100
50
30
PREHEAT
LAMINAR WAVE
HOT AIR KNIFE
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150 C (100 C PCB)
SOLDER WAVE T EMPERATURE = 245 C
AIR KNIFE AIR TEMPERATURE = 390 C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE S
COOLED BEFORE EXERTING MECHANICAL FORCE.
UFFICIENTLY
0 1020
30 40 50
TIME – SECONDS
Figure 9. Recommended Wave Soldering Prole.
8
60708090 100
TRAILER COMPONENT LEADER
200 mm MIN. FOR ∅ 180 REEL.
200 mm MIN. FOR ∅ 330 REEL.
Figure 10. Tape Leader and Trailer Dimensions
480 mm MIN. FOR ∅ 180 REEL.
960 mm MIN. FOR ∅ 330 REEL.
C
A
USER FEED DIRECTION
8.00 ± 0.10
4.00 ± 0.10
12.00 + 0.30
- 0.10
1.24
3.00 ± 0.10
Figure 11. Tape Dimensions
USER FEED DIRECTION
32° MAX
8
°
MAX
.388 ± 0.02
3.52 ± 0.10
2.00 ± 0.05
3.70 ± 0.10
Ø 1.50 ± 0.10
32° MAX
8° MAX
1.75 ± 0.10
5.50 ± 0.05
PRINTED LABEL
Figure 12. Reeling Orientation.
9
CATHODE SIDE
Moisture Sensitivity
Intensity Bin Select (X5X6)
This product is qualied as Moisture Sensitive Level 2a per
Jedec J-STD-020. Precautions when handling this moisture
sensitive product is important to ensure the reliability of
the product. Do refer to Avago Application Note AN5305
Handling of Moisture Sensitive Surface Mount Devices for
details.
A. Storage before use
- Unopen moisture barrier bag (MBB) can be stored at
<40°C/90%RH for 12 months. If the actual shelf life has
exceeded 12 months and the HIC indicates that baking
is not required, then it is safe to reow the LEDs per the
original MSL rating.
- It is not recommended to open the MBB prior to assembly (e.g. for IQC).
B. Control after opening the MBB
- The humidity indicator card (HIC) shall be read immediately upon opening of MBB.
- The LEDs must be kept at <30°C / 60%RH at all time and
all high temperature related process including soldering, curing or rework need to be completed within 672
hours.
C. Control for unnished reel
- For any unuse LEDs, they need to be stored in sealed
MBB with desiccant or desiccator at <5%RH.
D. Control of assembled boards
- If the PCB soldered with the LEDs is to be subjected to
other high temperature processes, the PCB need to be
stored in sealed MBB with desiccant or desiccator at
<5%RH to ensure no LEDs have exceeded their oor life
of 672 hours.
E. Baking is required if:
- “10%” is Not blue and “5%” HIC indicator turns pink.
- The LEDs are exposed to condition of >30°C / 60% RH at
any time.
- The LEDs oor life exceeded 672 hours.
Recommended baking condition: 60±5°C for 20 hours.
Individual reel will contain parts from one half bin only
X
5
X
6
0 Full Distribution
2 2 half bins starting from X51
3 3 half bins starting from X
4 4 half bins starting from X51
5 5 half bins starting from X51
6 2 half bins starting from X52
7 3 half bins starting from X
8 4 half bins starting from X
9 5 half bins starting from X52
Min Iv Bin
1
5
2
5
2
5
Intensity Bin Limits
Bin ID Min (mcd) Max (mcd)
U1 450.00 560.00
U2 560.00 715.00
V1 715.00 900.00
V2 900.00 1125.00
W1 1125.00 1400.00
W2 1400.00 1800.00
X1 1800.00 2240.00
X2 2240.00 2850.00
Y1 2850.00 3550.00
Y2 3550.00 4500.00
Z1 4500.00 5600.00
Z2 5600.00 7150.00
11 7150.00 9000.00
12 9000.00 11250.00
21 11250.00 14000.00
22 14000.00 18000.00
Tolerance of each bin limit = ± 12%
10
Color Bin Select (X7)
Individual reel will contain parts from 1 full bin only
X7
0 Full Distribution
Z A and B only
Y B and C only
W C and D only
V D and E only
U E and F only
T F and G only
S G and H only
Q A, B and C only
P B, C and D only
N C, D and E only
M D, E and F only
L E, F and G only
K F, G and H only
1 A, B, C and D only
2 E, F G and H only
Color Bin Limits
Blue Min. (nm) Max. (nm)
A 460.0 465.0
B 465.0 470.0
C 470.0 475.0
D 475.0 480.0
Cyan Min. (nm) Max. (nm)
A 490.0 495.0
B 495.0 500.0
C 500.0 505.0
D 505.0 510.0
Green Min. (nm) Max. (nm)
A 515.0 520.0
B 520.0 525.0
C 525.0 530.0
D 530.0 535.0
Amber Min. (nm) Max. (nm)
A 582.0 584.5
B 584.5 587.0
C 587.0 589.5
D 589.5 592.0
E 592.0 594.5
F 594.5 597.0
Orange Min. (nm) Max. (nm)
A 597.0 600.0
B 600.0 603.0
C 603.0 606.0
D 606.0 609.0
E 609.0 612.0
Red/Orange Min. (nm) Max. (nm)
A 611.0 616.0
B 616.0 620.0
Red Min. (nm) Max. (nm)
Full Distribution
Tolerance of each bin limit = ±1nm
Packaging Option (X8X9)
Option Test Current Package Type Reel Size
M1 50mA Top Mount 13 inch
M2 30mA Top Mount 13 inch
Forward Voltage Bin Table
For HSMV – A43x-xxxxx only
Bin Min. Max.
VA 1.9 2.2
VB 2.2 2.5
VC 2.5 2.8
VD 2.8 3.1
VE 3.1 3.4
Tolerance for each bin limit = ± 0.1V
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved. Obsoletes AV01-0313EN
AV02-0208EN - June 24, 2010
Loading...