AVAGO HSMR-CL25 DATA SHEET
HSMR-CL25
0.25mm Blue Leadframe-Based Surface Mount ChipLED
Data Sheet
Description
The HSMR-CL25 series of parts is designed with an ultra
small form factor to allow this miniaturization. The HSMRCL25 series is the thinnest available top emitting package
in the market with high brightness InGaN die technology.
The leadframe construction of this package allows the
part to transfer heat from the package, thus it is able to
survive temperature conditions of -40°C to 85°C despite its
small size.
The target applications are Keypad backlighting, Push
button backlighting and Status indicators.
The target markets are Mobile Handsets, Communications,
Oce Automation, Industrial and Commercial
automations, Home Market appliances, Networking,
Medical Instruments, and Mobile Computing. This product
is competitively priced, and production is geared towards
short lead times and ample capacity.
Features
• Small size top ring
• Small 1.6 (L) x 0.8 (W) x 0.25 (H) mm package
• Compatible with IR Reow
• High brightness using InGaN die technology
• Available in 8mm Tape on 7” (178 mm) Diameter Reels
Advantages
• High package thermal dissipation capability due to the
superior package leadframe design
• Small footprint to overcome space count
• Low thickness to overcome space constrains
• Short lead times and competitive pricing
CAUTION: HSMR-CL25 LEDs are Class 1B ESD sensitive per JESD22-A114C.01. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
1
Package Dimensions
Notes:
1. All dimensions are in millimeters.
2. Tolerance is ±0.1mm unless otherwise specied.
Device Selection Guide
Package Dimension (mm) Die Technology Colors Testing Current (mA) Parts per Reel Package Description
1.6 (L) x 0.8 (W) x 0.25 (H) InGaN Blue 5 4000 Untinted, Non-Diused
Absolute Maximum Ratings at TA = 25°C
Parameter HSMR-CL25 Units
DC Forward Current
Power Dissipation 39 mW
Reverse Voltage (IR = 100mA)
LED Junction Temperature 95 °C
Operating Temperature Range -40 to +85 °C
Storage Temperature Range -40 to +85 °C
Soldering Temperature See reow soldering prole
Notes:
1. Derate linearly as shown in Figure 4.
[1]
10 mA
5 V
(Refer to Figures 7 & 8 )
2
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