AVAGO HLMP-1301, HLMP-1401, HLMP-1503, HLMP-K401, HLMP-K600 DATA SHEET

HLMP-1301, HLMP-1401, HLMP-1503,
HLMP-K401, HLMP-K600

T-1 (3 mm) Diused LED Lamps

Data Sheet

Description

This family of T-1 lamps is widely used in general purpose
indicator applications. Diusants, tints, and optical design
are balanced to yield superior light output and wide view­ing angles. Several intensity choices are available in each
color for increased design exibility.

Package Dimensions

Features

•   High intensity

•   Choice of 4 bright colors

High Eciency Red

Orange

Yellow

High Performance Green

•   Popular T-1 diameter package

•   Selected minimum intensities

•   Wide viewing angle

•   General purpose leads

•   Reliable and rugged

•   Available on tape and reel

Selection Guide

Luminous Intensity Iv (mcd) at 10 mA

Material Color Part Number

GaAsP on GaP Red HLMP-1301 3.4 –

HLMP-1301-E00xx 3.4 –

HLMP-1301-FG0xx 5.4 17.2

HLMP-1301-G00xx 8.6 –

HLMP-1301-GH0xx 8.6 27.6

Yellow HLMP-1401 2.2 –

HLMP-1401-D00xx 3.6 –

HLMP-1401-E00xx 5.7 –

HLMP-1401-EF0xx 5.7 18.4

HLMP-1401-EFBxx 5.7 18.4

Orange HLMP-K401 2.1 –

HLMP-K401-E00xx 3.4 –

HLMP-K401-EF0xx 3.4 10.8

HLMP-K401-FGDxx 5.4 17.2

GaP Green HLMP-1503 1.0 –

HLMP-1503-C00xx 2.6 –

HLMP-1503-D00xx 4.2 –

HLMP-1503-DE0xx 4.2 13.4

HLMP-1503-DEDxx 4.2 13.4

Emerald Green

Note:

1. Please refer to Application Note 1061 for information comparing standard green and emerald green light output degradation.…

[1]

HLMP-K600 1.0 –

Min. Max.

2

Part Numbering System

HLMP – X X XX - X X X XX

Mechanical Option

00: Bulk
01: Tape & Reel, Crimped Leads
02, Bx: Tape & Reel, Straight Leads
A1: Right Angle Housing, Uneven Leads
A2: Right Angle Housing, Even Leads
Dx, EE: Ammo Pack, Straight Leads
R4: Tape & Reel, Counter Clockwise
Vx: Ammo Pack, Horizontal Leads
FG: Products need inventory control for Customer IDI

Color Bin Options

0: Full Color Bin Distribution
B: Color Bins 2 & 3 only
D: Color Bins 4 & 5 only

Maximum Iv Bin Options

0: Open (no max. limit)
Others: Please refer to the Iv Bin Table

Minimum Iv Bin Options

Please refer to the Iv Bin Table

Color Options

3: GaP HER
4: GaP Yellow (except K4xx Series)
5: GaP Green
6: GaP Emerald Green

Package Options

1: T-1 (3 mm)
K: T-1 (3 mm) Orange (K4xx) or Emerald Green (K6xx)

3

Absolute Maximum Ratings at TA = 25°C

Parameter HER/Orange Yellow Green Units

Peak Forward Current 90 60 90 mA

Average Forward Current

DC Current

[2]

everse Voltage (IR = 100 μA) 5 5 5 V

Transient Forward Current

LED Junction Temperature 110 110 110 °C

Operating Temperature Range -40 to +100 -40 to +100 -20 to +100 °C

Storage Temperature Range -40 to +100 -40 to +100 -40 to +100 °C

Notes:

1. See Figure 5 (HER/Orange), 10 (Yellow), or 15 (Green/Emerald Green) to establish pulsed operating conditions.

2. For Red, Orange, and Green series derate linearly from 50°C at 0.5 mA/°C. For Yellow series derate linearly from 50°C at 0.2 mA/°C.

3. For Red, Orange, and Green series derate power linearly from 25°C at 1.8 mW/°C. For Yellow series derate power linearly from 50°C at 1.6 mW/°C.

4. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and
wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maximum
Ratings.

[1]

25 20 25 mA

30 20 30 A R

[4]

(10 μsec Pulse) 500 500 500 mA

4

Electrical Characteristics at TA = 25°C

Symbol Description Device HLMP- Min. Typ. Max. Units Test Conditions

2θ1/

l

PEAK

l

d

Dl1/

t

s

C Capacitance High Eciency Red 11 pF VF = 0;

Rθ

J-PIN

V

F

V

R

hV Luminous Ecacy High Eciency Red 145 lumens See Note 3

Notes:

1. θ1/2 is the o-axis angle at which the luminous intensity is half the axial luminous intensity.

2. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which denes the color of the
device.

3. Radiant intensity, le, in watts/steradian, may be found from the equation Ie= Iv/hv, where Iv is the luminous intensity in candelas and hv is the
luminous ecacy in lumens/watt.

Included Angle Between Half

2

Luminous Intensity Points

All 60 Deg. IF = 10 mA

See Note 1

Peak Wavelength High Eciency Red 635 nm Measurement at Peak

Orange 600

Yellow 583

Green 565

Emerald Green 558

Dominant Wavelength High Eciency Red 626 nm See Note 2

Orange 602

Yellow 585

Green 569

Emerald Green 560

Spectral Line Halfwidth High Eciency Red 40 nm

2

Yellow 36

Green 28

Emerald Green 24

Speed of Response High Eciency Red 90 ns

Orange 280

Yellow 90

Green 500

Emerald Green 3100

Orange 4 f = 1 MHz

Yellow 15

Green 18

Emerald Green 35

Thermal Resistance All 290 °C/W Junction to Cathode

Lead

Forward Voltage HER/Orange 1.5 1.9 2.4 V IF = 10 mA

Yellow 1.5 2.0 2.4

Green 1.5 2.1 2.7

Emerald Green 2.1 2.7

Reverse Breakdown Voltage All 5.0 V IR = 100 μA

Orange 380 watt

Yellow 500

Green 595

Emerald Green 655

5

Figure 1. Relative intensity vs. wavelength.

ORANGE

HIGH EFFICIENCY RED

WAVELENGTH – nm

RELATIVE INTENSITY

1.0

0.5

0

500 550 600 650 700 750

YELLOW

EMERALD GREEN

HIGH
PERFORMANCE
GREEN

TA = 25° C

AlGaAs RED

T-1 High Eciency Red, Orange Diused Lamps

Figure 2. Forward current vs. forward voltage
characteristics.

Figure 5. Maximum tolerable peak current vs.
pulse duration. (IDC MAX as per MAX ratings).

Figure 3. Relative luminous intensity vs. DC
forward current.

Figure 6. Relative luminous intensity vs. angular displacement.

Figure 4. Relative eciency (luminous intensity
per unit current) vs. peak LED current.

6

T-1 Yellow Diused Lamps

Figure 7. Forward current vs. forward voltage
characteristics.

Figure 10. Maximum tolerable peak current vs.
pulse duration. (IDC MAX as per MAX ratings).

Figure 8. Relative luminous intensity vs. forward
current.

Figure 11. Relative luminous intensity vs. angular displacement.

Figure 9. Relative eciency (luminous intensity
per unit current) vs. peak current.

7

T-1 Green/Emerald Green Diused Lamps

Figure 12. Forward current vs. forward voltage
characteristics.

Figure 15. Maximum tolerable peak current vs.
pulse duration. (IDC MAX as per MAX ratings).

Figure 13. Relative luminous intensity vs.
forward current.

Figure 16. Relative luminous intensity vs. angular displacement.

Figure 14. Relative eciency (luminous inten­sity per unit vurrent) vs. peak LED current.

8

Intensity Bin Limits

Intensity Range (mcd)

Color

Red/Orange

Yellow L 173.2 250.0

Bin Min. Max.

D 2.4 3.8

E 3.8 6.1

F 6.1 9.7

G 9.7 15.5

H 15.5 24.8

I 24.8 39.6

J 39.6 63.4

K 63.4 101.5

L 101.5 162.4

M 162.4 234.6

N 234.6 340.0

O 340.0 540.0

P 540.0 850.0

Q 850.0 1200.0

R 1200.0 1700.0

S 1700.0 2400.0

T 2400.0 3400.0

U 3400.0 4900.0

V 4900.0 7100.0

W 7100.0 10200.0

X 10200.0 14800.0

Y 14800.0 21400.0

Z 21400.0 30900.0

C 2.5 4.0

D 4.0 6.5

E 6.5 10.3

F 10.3 16.6

G 16.6 26.5

H 26.5 42.3

I 42.3 67.7

J 67.7 108.2

K 108.2 173.2

M 250.0 360.0

N 360.0 510.0

O 510.0 800.0

P 800.0 1250.0

Q 1250.0 1800.0

R 1800.0 2900.0

S 2900.0 4700.0

T 4700.0 7200.0

U 7200.0 11700.0

V 11700.0 18000.0

W 18000.0 27000.0

9

Intensity Bin Limits, continued

Intensity Range (mcd)

Color Bin Min. Max.

A 1.1 1.8

B 1.8 2.9

C 2.9 4.7

D 4.7 7.6

E 7.6 12.0

F 12.0 19.1

G 19.1 30.7

H 30.7 49.1

I 49.1 78.5

J 78.5 125.7

Green/ K 125.7 201.1

Emerald Green L 201.1 289.0

M 289.0 417.0

N 417.0 680.0

O 680.0 1100.0

P 1100.0 1800.0

Q 1800.0 2700.0

R 2700.0 4300.0

S 4300.0 6800.0

T 6800.0 10800.0

U 10800.0 16000.0

V 16000.0 25000.0

W 25000.0 40000.0

Maximum tolerance for each bin limit is ± 18%.

10

Color Categories

Lambda (nm)

C olor Category # Min. Max.

9 522.5 555.5

Emerald Green 8 555.5 558.5

7 558.5 561.5

6 561.5 564.5

6 561.5 564.5

5 564.5 567.5

Green 4 567.5 570.5

3 570.5 573.5

2 573.5 576.5

1 582.0 584.5

3 584.5 587.0

Yellow 2 587.0 589.5

4 589.5 592.0

5 592.0 593.0

1 597.0 599.5

2 599.5 602.0

3 602.0 604.5

Orange 4 604.5 607.5

5 607.5 610.5

6 610.5 613.5

7 613.5 616.5

8 616.5 619.5

Tolerance for each bin limit is ± 0.5 nm.

11

Mechanical Option Matrix

Mechanical Option Code Denition

00 Bulk Packaging, minimum increment 500 pcs/bag

01 Tape & Reel, crimped leads, minimum increment 1800 pcs/bag

02 Tape & Reel, straight leads, minimum increment 1800 pcs/bag

A1 Right Angle Housing, uneven leads, minimum increment 500 pcs/bag

A2 Right Angle Housing, even leads, minimum increment 500 pcs/bag

BG Tape & Reel, straight leads in 2K increment

BJ Tape & Reel, straight leads in 2K increment

DD Ammo Pack, straight leads in 2K increment

DJ Ammo Pack, straight leads in 2K increment

EE Ammo Pack, straight leads in 5K increment

R4 Tape & Reel, straight leads, counter clockwise, anode lead leaving the reel rst

VA Ammo Pack, horizontal leads in 2K increment

VB Ammo Pack, horizontal leads in 2K increment

FG Inventory Control for Customer IDI

Note: All categories are established for classication of products. Products may not be available in all categories. Please contact your local Avago
representative for further clarication/information.

12

Precautions

LAMINAR WAVE

BOTTOM SIDE
OF PC BOARD

HOT AIR KNIFE

TURBULENT WAVE

FLUXING

PREHEAT

0 10 20

30

50

100

150

200

250

30 40 50

TIME – SECONDS

TEMPERATURE – C

60 70 80 90 100

TOP SIDE OF
PC BOARD

CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150C (100C PCB)
SOLDER WAVE TEMPERATURE = 245C
AIR KNIFE AIR TEMPERATURE = 390C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA

NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.

Lead Forming

• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.

• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of LED
to length after soldering process at room temperature.
The solder joint formed will absorb the mechanical
stress of the lead cutting from traveling to the LED chip
die attach and wirebond.

• It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.

Soldering Conditions

• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.

• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without stando.

• Recommended soldering conditions:

Manual Solder

Wave Soldering

Pre-heat Temperature 105 °C Max. –

Pre-heat Time 30 sec Max. –

Peak Temperature 250 °C Max. 260 °C Max.

Dwell Time 3 sec Max. 5 sec Max.

Dipping

• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering prole to ensure
the soldering prole used is always conforming to
recommended soldering condition.

• If necessary, use xture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.

• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool to
room temperature, 25°C, before handling.

• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.

• Recommended PC board plated through hole sizes for
LED component leads:

LED Component
Lead Size Diagonal

0.457 x 0.457 mm
(0.018 x 0.018 inch)

0.508 x 0.508 mm
(0.020x 0.020 inch)

Note:
Refer to application note AN1027 for more information on
soldering LED components.

0.646 mm
(0.025 inch)

0.718 mm
(0.028 inch)

Plated Through
Hole Diameter

0.976 to 1.078 mm
(0.038 to 0.042 inch)

1.049 to 1.150 mm
(0.041 to 0.045 inch)

Figure 17. Recommended wave soldering prole.

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Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-4252EN
AV02-1555EN - October 13, 2008