ASMT-QTB0-0AA02
PLCC-4 Surface Mount Tricolor LED
Datasheet
Description
This family of SMT LEDs is packaged in the industry standard
PLCC-4 package with additional heat sinking capability
enabling it to be driven at even higher current. These SMT
LEDs have high brightness and reliability performance and are
designed to work under a wide range of environmental
conditions. This high reliability feature makes them ideally
suited to be used under exterior and interior full color signs
application conditions.
To facilitate easy pick & place assembly, the LEDs are packed
in EIA-compliant tape and reel. Every reel will be shipped in
single intensity and color bin; except red color to provide close
uniformity.
These LEDs are compatible with reflow soldering process.
This super wide viewing angle at 120° together with the built in
reflector pushing up the intensity of the light output makes
these LED suitable to be used in the interior electronics signs.
The black top surface of the LED provides better contrast
enhancement especially in the full color sign application.
CAUTION: LEDs are Class 1C ESD sensitive. Please observe appropriate precautions during handling and
processing. Please refer to Avago Application Note AN-1142 for additional details.
Features
• Industry Standard PLCC-4 package (Plastic Leaded Chip
Carrier) with additional heat sinking capability
• High reliability LED package with silicone encapsulation
• High brightness using AlInGaP and InGaN dice
technologies
• Wide viewing angle at 120°
• Compatible with reflow soldering process
• JEDEC MSL 2a
Applications
• Indoor and outdoor full color display
Revision Date: 25 Jan 2007
Revision: 4.0
Package Dimensions
Notes:
1. All Dimensions are in millimeters
2. Tolerance = ±0.2 mm unless otherwise specified
3. Terminal Finish: Ag plating
Lead Configuration
1 Cathode Red
2 Common Anode
3 Cathode Blue
4 Cathode Green
Figure 1. Package drawing.
Table 1. Device Selection Guide
Part Number Color 1 Color 2 Color 3
ASMT-QTB0-0AA02 AlInGaP Red InGaN Green InGaN Blue
Color 1 Color 2 Color 3
Part Number
ASMT-QTB0-0AA02 U1 450 620 V2 900 1200 S2 224 280
Notes:
1. The luminous intensity IV, is measured at the mechanical axis of the LED package. The actual peak of the spatial radiation pattern may not be aligned with
this axis.
2. Tolerance = ± 12 %
Min. Iv @20mA Typ. Iv @20mA Min. Iv @ 20mA Typ. Iv @ 20mA Min. Iv @ 20mA Typ. Iv @ 20mA
Bin ID (mcd) (mcd) Bin ID (mcd) (mcd) Bin ID (mcd) (mcd)
Revision Date: 25 Jan 2007
Revision: 4.0
Part Numbering System
A S M T –Q T B 0– X1 X2 X3 X4 X5
Table 2. Absolute Maximum Ratings (TA = 25°C)
Packaging Option
Color Bin Selection
Intensity Bin Limit
Intensity Bin Selection
Device Specification Configuration
Parameter Red Green & Blue Unit
DC forward current
Peak forward current
[1]
[2]
100 100 mA
50 30 mA
Power dissipation 120 117 mW
Reverse voltage 4V
Maximum junction temperature T
Operating temperature range
j max
[3]
V
125 °C
- 40 to + 110
[4]
°C
Storage temperature range - 40 to + 110 °C
Note:
1. Derate linearly as shown in Figure 5a & 5b.
2. Duty Factor = 0.5%, Frequency = 500Hz
3. Driving the LED in reverse bias condition is suitable for short term only
4. Refer to Figure 5a and figure 5b for more information
Table 3. Optical Characteristics (TA = 25°C)
Peak
Wavelength,
(nm)
λ
p
Color
Dominant Wavelength,
[1]
(nm)
λ
d
Min Typ. Max Typ. Typ. Typ. Typ. Typ.
Red 618 621 628 629
Green 525 528 535 521
Blue 465 470 475 465
Viewing
Angle 2θ
(Degrees)
[2]
Luminous
Efficacy η
(lm/W)
V
½
[3]
Luminous
Efficiency η
(lm/W)
120 200 43 2.70
120 530 50 2.70
120 70 12 2.70
Total Flux / Luminous
e
Intensity
/ IV (lm/cd)
Φ
V
[4]
Notes:
1. The dominant wavelength is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
is the off axis angle where the luminous intensity is ½ the peak intensity
2. θ
½
3. Radiant intensity, Ie in watts / steradian, may be calculated from the equat ion Ie = I
efficacy in lumens / watt.
is the total luminous flux output as measured with an integrating sphere at mono pulse condition.
4. Φ
V
/ ηV, where IV is the luminous intensity in candelas and ηV is the luminous
V
Revision Date: 25 Jan 2007
Revision: 4.0
Table 4. Electrical Characteristics (TA = 25°C)
g
g
A
Y
A
Color
Forward Voltage,
[1]
V
(V)
F
Reverse Volta
VR @ 100µA
Reverse Volta
e
VR @ 10µA
Thermal Resistance
e
Rθ
J-P
(°C/W)
Min Typ. Max. Min. Min. Typ.
Red 1.80 2.10 2.40 4 - 95
Green
2.80 3.20 3.90 - 4 70
Blue 2.80 3.20 3.90 - 4 60
Note:
1. Tolerance ± 0.1V.
1.0
InGaN Bl u e
0.8
0.6
lInGaP RedInGaN Green
0.4
RELATIVE INTENSI T
0.2
0.0
380 430 480 530 580 630 680 730 780
WAVELENGTH - nm
Figure 2. Relative intensity vs. wavelength
50
45
40
35
30
25
20
15
FORW ARD CURRENT - mA
10
5
0
01234
AlInGaP
InGaN
FORWARD VOLTAG E - V
Figure 3. Forward current vs. forward voltage
3.00
2.50
lInGaP
2.00
1.50
InGaN
1.00
(NORMALIZATION AT 20 mA)
RELATIVE LUMINOUS INTENSITY
0.50
0.00
0 102030405060
DC F ORWARD CURRENT - mA
Figure 4. Relative Intensity vs. forward current
Revision Date: 25 Jan 2007
Revision: 4.0
A
A
Y
T
60
AlInGaP
50
60
AlInGaP
50
40
InGaN
30
20
10
MAX. ALLOWABLE DC CURRENT (m
0
0 20 40 60 80 100 120
AMBIENT TEMPERATURE (°C)
Figure 5a. Maximum forward current vs. ambient
temperature. Derated based on T
MAX = 125°C.(3 chips)
J
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
NORMALIZED INTENSIT
0.2
0.1
0
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEM ENT - DEGREES
Figure 6. Radiation pattern.
40
InGaN
30
20
10
MAX. ALLOWABLE DC CURRENT (m
0
0 20406080100120
AMB IENT TEMP ERATURE (°C)
Figure 5b. Maximum forward current vs. ambient temperature.
Derated based on T
MAX = 125°C. (single chip)
J
7
6
5
4
3
2
1
0
0 1020304050
-1
(NORMA LIZED AT 20 m A) - nm
DOMINA NT W A VE L ENGT H SHI F
-2
-3
Green
Blue
Red
FORWA RD CURRENT - mA
Figure 7. Dominant wavelength shift (normalized at 20mA) vs.
forward current
Revision Date: 25 Jan 2007
Revision: 4.0
Figure 8. Recommended soldering land pattern.
Figure 9. Recommended leaded reflow soldering profile.
Figure 10. Recommended Pb-free reflow soldering profile.
Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface
Mounting SMT LED Indicator Components
Revision Date: 25 Jan 2007
Revision: 4.0
Figure 11. Carrier Tape Dimension
Figure 12. Reel Dimension.
Revision Date: 25 Jan 2007
Revision: 4.0
Figure 13. Reeling Orientation.
Intensity Bin Select (X
, X3)
2
Individual reel will contain parts from 1 half bin only
X
2
Min Iv Bin (Minimum Intensity Bin)
Red Green Blue
0 0 0 0
A U1 V2 S2
X
3
Number of Half bin from X
2
Red Green Blue
0 0 0 0
A 4 4 4
Note: 0 represents no maximum bin limit
Color Bin Select (X4)
Individual Reel will contain part from 1 full bin only
X
4
Color Bin Combinations
Red Green Blue
0 Full
C & D B & C
distribution
Intensity Bin Limits
Bin ID Min (mcd) Max (mcd)
S2 224.0 285.0
T1 285.0 355.0
T2 355.0 450.0
U1 450.0 560.0
U2 560.0 715.0
V1 715.0 900.0
V2 900.0 1125.0
W1 1125.0 1400.0
W2 1400.0 1800.0
X1 1800.0 2240.0
Tolerance of each bin limit ± 12%
Color Bin Limits
Red Min (nm) Max (nm)
Full distribution 618.0 628.0
Green Min (nm) Max (nm)
C 525.0 530.0
D 530.0 535.0
Blue Min (nm) Max (nm)
B 465.0 470.0
C 470.0 475.0
Tolerance of each bin limit is ± 1 nm
Revision Date: 25 Jan 2007
Revision: 4.0
Packaging Option (X
)
5
Option Test Current Package Type
2 20mA Top mount 7 inch
Reel Size
Revision Date: 25 Jan 2007
Revision: 4.0
Handling Precaution
The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do
not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During
assembly of handling, the unit should be held on the body only. Please refer to Avago Application Note AN 5288 for detail information.
Moisture Sensitivity
This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive product
is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface
Mount Devices for details.
A. Storage before use
- Unopen moisture barrier bag (MBB) can be stored at <40°C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and
the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating.
- It is not recommended to open the MBB prior to assembly (e.g. for IQC).
B. Control after opening the MBB
- The humidity indicator card (HIC) shall be read immediately upon opening of MBB.
- The LEDs must be kept at <30°C / 60%RH at all time and all high temperature related process including soldering, curing or rework
need to be completed within 672 hours.
C. Control for unfinished reel
- For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH.
D. Control of assembled boards
- If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB
with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 672 hours
E. Baking is required if:
- “10%” or “15%” HIC indicator turns pink
- The LEDs are exposed to condition of >30°C / 60% RH at any time.
- The Led floor life exceeded 672hrs.
Recommended baking condition: 60±5ºC for 20hrs
Revision Date: 25 Jan 2007
Revision: 4.0
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