APDS-9005
Miniature Surface-Mount Ambient Light Photo Sensor
Data Sheet
Description
The APDS-9005 is a low cost analog-output ambient
light photo sensor in miniature chipLED lead-free surface
mount package. It consists of a photo sensor, whose
spectral response is close to the CIE standard photopic
observer, as show in gure 2. The APDS-9005 is ideal for
applications in which the measurement of ambient light
is used to control display backlighting. Mobile appliances such as the mobile phones and PDAs that draw heavy
current from display backlighting will benet from incorporating these photo sensor products in their designs by
reducing power consumption signicantly.
Application Support Information
The Application Engineering Group is available to assist
you with the application design associated with APDS9005 ambient light photo sensor module. You can
contact them through your local sales representatives for
additional details.
Features
• Spectral responsivity close to that of human eye
• Miniature ChipLED Leadfree surface-mount package
Height – 0.55 mm
Width – 1.60 mm
Depth – 1.50 mm
• Low sensitivity variation across various light sources
• Recommended operating temperature : -40°C to 85°C
• Vcc supply 1.8 to 5.5V
• Lead-free package, RoHS compliance
• Output linearity across wide illumination range
Applications
• Detection of ambient light to control display
backlighting
Mobile devices – Mobile phones, PDAs
Computing devices – Notebooks, Webpads
Consumer devices – TVs, Video Cameras, Digital Still
Camera
• Automatic Residential and Commercial Lighting
Management
• Electronic Signs and Signals
1
Ordering Information
Normalized sensor spectral response
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
300 400 500 600 700 800 900 1000 1100
wavelength (nm)
Response (a.u.)
APDS-9005
Eye Response
I/O Pins Conguration Table
Part Number Packaging Type Package Quantity
APDS-9005-020 Tape and Reel 6-pins Chipled package 2500
Typical Application Circuit
Figure 1. Typical application circuit for APDS-9005
Component Recommended Application Circuit Component
RLOAD 1k ohm
Note :
Refer to Figure 11 for General Luminance Vs Typical Output Voltage for
dierent RLOAD values
Pin Symbol Description
1 VCC VCC
2 NC No Connect
3 NC No Connect
4 Nc No Connect
5 NC No Connect
6 Iout Out
Figure 2. Relative Spectral Response Vs Wavelength
CAUTIONS : It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD
Absolute Maximum Ratings
For implementations where case to ambient thermal resistance is ≤ 50 °C /W
Parameter Symbol Min. Max. Units
Storage Temperature T
Operating temperature T
Supply Voltage V
S
A
CC
Recommended Operating Conditions
Parameter Symbol Min. Max. Units Conditions
Supply Voltage V
CC
1.8 5.5 V
2
-40 85 °C
-40 85 °C
0 6 V
Electrical & Optical Specications (Ta=25°C)
sensor-output attains ~95% of
its voltage magnitudecorresponds to the set light level
Tset
VCC Pulse from PG
Sensor Output at Load
Parameter Symbol Min. Typ. Max. Units Conditions
Photo Current (I) I
Photo Current (II) I
Dark Current I
Light Current Ratio I
Rise Time T
Fall Time T
Peak sensitivity wavelength
Settling Time pulsed at Vcc T
Propagation delay T
Storage delay T
_PH1
_PH2
_DARK
_PH3
r
f
l
set
d
s
/ I
_PH2
28 40 52 uA Vcc =1.8V, Lux = 100 (2)
- 44 - uA Vcc =1.8V, Lux = 100 (1)
- 300 - nA Vcc = 3V, Lux = 0
- 1.1 - -
- 5 - ms Rl = 1Kohm, Lux = 100
- 5 - ms R1 = 1Kohm, Lux=100
- 500 - nm
- 10 - ms Vcc pulsed = 0V to 3V; Rload = 2.4K ohms; Lux = 100
- 5 - ms Rl = 1Kohm, Lux = 100
- 5 - ms R1 = 1Kohm, Lux=100
Saturation voltage Vsat 1.0 - - V R1 = 150Kohm, Lux = 100
Note :
1) Illuminance by incandescent lamp
2) White LED is used as light source
Light Measurement Circuit and Waveforms
(2)
3
AVG REL-IOUT Vs TEMP at 320LUX/1.8V
0
0.2
0.4
0.6
0.8
1.0
1.2
-40 -20 0 20 40 60 80 100
TEMPERATURE [˚C]
REL I-OUT
ANGULAR RESPONSE
0
0.2
0.4
0.6
0.8
1
1.2
-100 -50 0 50 100
ANGLE in DEGREE[˚]
REL I-OUT
AVG RISE TIME Vs LOAD RESISTANCE at VCC=1.8V
000.0E+0
2.0E-3
4.0E-3
6.0E-3
8.0E-3
10.0E-3
12.0E-3
14.0E-3
16.0E-3
18.0E-3
0 2000 4000 6000 8000 10000 12000
LOAD RESISTANCE [Ohms]
RISE TIME [Seconds]
Avg REL I-Out Vs VCC
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
0 1 2 3 4 5 6
VCC
REL I-OUT
Figure 3. Average Iout Vs Lux (Vcc = 1.8V, T=25°C, White LED source) Figure 4. Average relative Iout Vs Temp (Vcc = 1.8V, T=25°C, 100 Lux)
Average I-Out Vs LUX at VCC=1.8V
000.0E+0
50.0E-6
100.0E-6
150.0E-6
200.0E-6
250.0E-6
300.0E-6
350.0E-6
400.0E-6
450.0E-6
0 100 200 300 400 500 600 700 800 900 1000 1100
LUX
Output Current [A]
AVG REL-IOUT Vs TEMP at 100LUX/1.8V
0
0.2
0.4
0.6
0.8
1
1.2
-40 -20 0 20 40 60 80 100
TEMPERATURE [˚C]
REL I-OUT
Figure 5. Relative Output Current Vs Temp (Vcc = 1.8V, 100 Lux) Figure 6. Relative Output Current Vs Vcc (Ta = 25°C, 100Lux)
Figure 7. Relative Iout Vs Angle (Vcc = 1.8V, Ta = 25°C) Figure 8. Average Rise Time Vs Load Resistance at Vcc = 1.8V
4
Average Vout vs Lux (Vcc = 1.8V, T = 25C, White LED Source)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0 100 200 300 400 500 600 700 800 900 1000
Lux
Average Vout (V)
RL = 1kohm
RL = 1.8kohm
RL = 2.2kohm
RL = 2.7kohm
RL = 3.3kohm
RL = 4.3kohm
RL = 5kohm
RL = 7.5kohm
RL = 12kohm
Figure 9. Average Fall Time Vs Load Resistance at Vcc = 1.8V Figure 10. Dark current Vs temperature
AVG FALL TIME Vs LOAD RESISTANCE at VCC=1.8V
0.00E+00
2.00E-03
4.00E-03
6.00E-03
8.00E-03
1.00E-02
1.20E-02
1.40E-02
1.60E-02
1.80E-02
0 2000 4000 6000 8000 10000 12000
LOAD RESISTANCE [Ohms]
FALL TIME [Seconds]
Average IDark Vs TEMP at VCC=1.8V
000.0E+0
100.0E-9
200.0E-9
300.0E-9
400.0E-9
500.0E-9
600.0E-9
700.0E-9
800.0E-9
900.0E-9
1.0E-6
-40 -20 0 20 40 60 80 100
TEMPERATURE [˚C]
DarkCUrrent[A]
Figure 11. General Luminance vs Typical Output Voltage
(Vcc = 1.8V, T = 25°C, Light Source = White LED)
5
APDS-9005 Package Outline
Top View
Bottom View
6
APDS-9005 Tape and Reel Dimension
7
Moisture Proof Packaging
Units in A Sealed
Mositure-Proof
Package
Package Is
Opened (Unsealed)
Environment
less than 30 deg C, and
less than 60% RH ?
Package Is
Opened less
than 168 hours ?
Perform Recommended
Baking Conditions
No Baking
Is Necessary
No
Yes
No
Yes
All APDS-9005 options are shipped in moisture proof
package. Once opened, moisture absorption begins. This
part is compliant to JEDEC Level 3.
Baking Conditions:
If the parts are not stored in dry conditions, they must be
baked before reow to prevent damage to the parts.
Package Temperature Time
In Reel 60°C 48 hours
In Bulk 100°C 4 hours
Baking should only be done once.
Recommended Storage Conditions:
Storage Temperature 10 °C to 30 °C
Relative Humidity below 60% RH
Time from unsealing to soldering:
After removal from the bag, the parts should be soldered
within 7 days and if stored at the recommended storage
conditions. If times longer than 7 days are needed, the
parts must be stored in a dry box.
8
Recommended Reow Prole
50
100 150 200 250 300
t-TIME
(SECONDS)
25
80
120
150
180
200
230
255
0
T - TEMPERATURE (˚C)
R1
R2
R3
R4
R5
217
MAX 260˚C
60 sec to 90 sec
Above 217˚C
P1
HEAT
UP
P2
SOLDER PASTE DRY
P3
SOLDER
REFLOW
P4
COOL DOWN
Process Zone Symbol DT
Heat Up P1, R1 25°C to 150°C 3°C/s
Solder Paste Dry P2, R2 150°C to 200°C 100s to 180s
Solder Reow P3, R3 200°C to 255°C 3°C/s
Cool Down P4, R5 200°C to 25°C -6°C/s
Time maintained above 217°C > 217°C 60s to 90s
Peak Temperature 260°C
Time within 5°C of actual Peak Temperature > 255°C 20s to 40s
Time 25°C to Peak Temperature 25°C to 260°C 8mins
Maximum DT/Dtime
or Duration
P3, R4 255°C to 200°C -6°C/s
The reow prole is a straight-line representation of a nominal temperature prole for a convective reow solder
process. The temperature prole is divided into four process zones, each with dierent DT/Dtime temperature change
rates or duration. The DT/Dtime rates or duration are detailed in the above table. The temperatures are measured at
the component to printed circuit board connections.
Process zone P1, the PC board and APDS-9005 pins are heated to a temperature of 150°C to activate the ux in the
solder paste. The temperature ramp up rate, R1, is limited to 3°C per second to allow for even heating of both the PC
board and APDS-9005 pins.
Process zone P2 should be of sucient time duration (100 to 180 seconds) to dry the solder paste. The temperature is
raised to a level just below the liquidus point of the solder, usually 200°C (392°F).
Process zone P3 is the solder reow zone. In zone P3, the temperature is quickly raised above the liquidus point of
solder to 255°C (491°F) for optimum results. The dwell time above the liquidus point of solder should be between 20
and 40 seconds. It usually takes about 20 seconds to assure proper coalescing of the solder balls into liquid solder and
the formation of good solder connections. Beyond a dwell time of 40 seconds, the intermetallic growth within the
solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200°C (392°F), to allow the
solder within the connections to freeze solid.
Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to
25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and APDS9005 pins to change dimensions evenly, putting minimal stresses on the APDS-9005.
It is recommended to perform reow soldering no more than twice.
9
Appendix A: SMT Assembly Application Note
0.4
0.4
0.2
0.9
0.3
C
L
0.45
0.4
Metal Stencil For
Solder Paste
Printing
Stencil
Aperture
Solder
Mask
Land
Pattern
PCBA
Mounting
Center
Unit: mm
0.2 MIN.
2.7
2.6
1.7
0.11
1.6
Unit: mm
Aperture
Opening
1.0 Solder Pad, Mask and Metal Stencil Aperture
Figure A1. Stencil and PCBA
1.1 Recommended Land Pattern
1.2 Recommended Metal Solder Stencil Aperture
It is recommended that a 0.11 mm (0.004 inches) thick
stencil be used for solder paste printing. Aperture
opening for shield pad is 0.4mm x 0.4mm and 0.2mm x
0.4mm (as per land pattern). This is to ensure adequate
printed solder paste volume and no shorting.
Figure A3. Solder Stencil Aperture
1.3 Adjacent Land Keepout and Solder Mask Areas
Adjacent land keep-out is the maximum space occupied
by the unit relative to the land pattern. There should be
no other SMD components within this area.
The minimum solder resist strip width required to avoid
solder bridging adjacent pads is 0.2 mm.
Note: Wet/Liquid Photo-Imageable solder resist/mask is recommended.
Figure A2. Recommended Land Pattern
10
Figure A4 Adjacent Land Keepout and Solder Mask Areas
Appendix B: Optical Window Design for APDS-9005
Z
L
T
D1
WD
Top View
D2 D1
APDS-9005
Light Receving Area
2.0 Optical Window Dimensions
To ensure that the performance of the APDS-9005 will not
be aected by improper window design, there are some
constraints on the dimensions and design of the window.
There is a constraint on the minimum size of the window,
which is placed in front of the photo light sensor, so that
it will not aect the angular response of the APDS-9005.
This minimum dimension that is recommended will
ensure at least a ±35° light reception cone.
If a smaller window is required, a light pipe or light guide
can be used. A light pipe or light guide is a cylindrical
piece of transparent plastic, which makes use of total
internal reection to focus the light.
The thickness of the window should be kept as minimum
as possible because there is a loss of power in every
optical window of about 8% due to reection (4% on
each side) and an additional loss of energy in the plastic
material.
Figure B1 and B2 illustrate the two types of window
that we have recommended which could either be a at
window or a at window with light pipe.
Table 1 and Figure B3 below show the recommended
dimensions of the window. These dimension values are
based on a window thickness of 1.0mm with a refractive
index 1.585.
Figure B3. Recommended Window Dimensions
WD: Working Distance between window front panel
& APDS-9005
D1: Window Diameter
T: Thickness
L: Length of Light Pipe
D2: Light Pipe Diameter
Z: Distance between window rear panel and
APDS-9005
Table 1. Recommended minimum dimension for optical window
Figure B1. Window Size Determination for Flat Window
Figure B2. Window Design of Flat Window with Light Guide
WD
(T+L+Z)
Flat Window
(L=0.0)
Z D1 D1/D2 T/L/Z
Flat window
with Light Pipe
1.5 0.5 2.05 - -
2.0 1.0 2.75 - -
2.5 1.5 3.45 - -
3.0 2.0 4.15 2.0/1.2 1.0/1.5/0.5
All dimensions are in mm
The window should be placed directly on top of the light
receiving area (active area) of the photo sensor to achieve
better performance and if a at window with a light pipe
is used, dimension D2 should be 1.2mm to optimize the
performance of APDS-9005.
The recommended minimum window dimension is based
on the assumption that the center of the window and the
center of the light receiving of the photo sensor are the
same. It is recommended that the tolerance for assembly
be considered as well. The recommended minimum
window size which will take into account of the assembly
tolerance is dened as:
D1 (min + assembly tolerance) = D1min + 2*(assembly
tolerance) (Dimensions are in mm)
D2 (min + assembly tolerance) = D2min + 2*(assembly
tolerance) (Dimensions are in mm)
11
APDS-9005
A/D
micro-
controller
1
2,3,4,5
6
Vcc
NC
Vout
R L
Light
C
Source
2.1 Optical Window Material
The material of the window is recommended to be polycarbonate. The surface nish of the plastic should be
smooth, without any texture.
The recommended plastic material for use as a window is
available from Bayer AG and Bayer Antwerp N. V. (Europe),
Bayer Corp.(USA) and Bayer Polymers Co., Ltd. (Thailand),
as shown in Table 2.
Table 2. Recommended Plastic Materials
Visible
Material number
Makrolon LQ2647 87% 1.587
Makrolon LQ3147 87% 1.587
Makrolon LQ3187 85% 1.587
light transmission Refractive index
Appendix C : General Application Guide for APDS-9005
The APDS-9005 is a low cost analog-output ambient light
photo sensor whose spectral response closely emulates
the human eyes. APDS-9005 consists of a photo sensor
that is able to produce a high gain photo current to a
sucient level that can be converted to voltage with a
standard value of external resistor. APDS-9005 can easily
be integrated into systems that use ADC input which is
available for sampling of the external source, as shown in
gure C1 below.
The amount of converted voltage, Vout, is mainly
dependant proportionally on the photo current which
generated by the brightness of the light shone on the
photo sensor and the load resistor used, RL. Increasing
the brightness of the light or/and the load resistor will
increase the output voltage.
Brightness is measured as “LUX” unit, which describes how
intense a light source that our eyes perceive. LUX meter
is the equipment for “LUX” measurement. Light sources
with the same LUX level appear at the same brightness to
the human eyes.
Selection of the load resistor RL will determine the
amount of current-to-voltage conversion in the circuit.
Light source e.g. uorescent light consists of ac noise
frequency of about 100Hz. A capacitor of 10uF, which
act as a low-pass lter, is recommended to add in parallel
with the load resistor to reduce the ripples.
Figure C1. Conguration of APDS-9005
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0598EN
AV02-0080EN - January 16, 2007
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