5.2 Backlight Unit ...................................................................................................................................15
6. Signal Characteristic ............................................................. 16
6.1 Pixel Format Image ...........................................................................................................................16
6.2 The input data format ........................................................................................................................17
6.3 Integration Interface and Pin Assignment..........................................................................................18
9. Vibration and Shock Test ...................................................... 27
9.1 Vibration Test ....................................................................................................................................27
9.2 Shock Test Spec:................................................................................................................................27
1) Since front polarizer is easily damaged, pay attention not to scratch it.
2) Be sure to turn off power supply when inserting or disconnecting from input
connector.
3) Wipe off water drop immediately. Long contact with water may cause discoloration
or spots.
4) When the panel surface is soiled, wipe it with absorbent cotton or other soft cloth.
5) Since the panel is made of glass, it may break or crack if dropped or bumped on
hard surface.
6) Since CMOS LSI is used in this module, take care of static electricity and insure
human earth when handling.
7) Do not open nor modify the Module Assembly.
8) Do not press the reflector sheet at the back of the module to any directions.
9) At the insertion or removal of the Signal Interface Connector, be sure not to rotate
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nor tilt the Interface Connector of the TFT Module.
11) After installation of the TFT Module into an enclosure (Notebook PC Bezel, for
example), do not twist nor bend the TFT Module even momentary. At designing the
enclosure, it should be taken into consideration that no bending/twisting forces are
applied to the TFT Module from outside. Otherwise the TFT Module may be
damaged.
12) Small amount of materials having no flammability grade is used in the LCD module. The
LCD module should be supplied by power complied with requirements of Limited Power
Source (IEC60950 or UL1950), or be applied exemption.
13) Disconnecting power supply before handling LCD modules, it can prevent electric shock,
DO NOT TOUCH the electrode parts, cables, connectors and LED circuit part of TFT
module that a LED light bar build in as a light source of back light unit. It can prevent
electronic breakdown.
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Product Specification
Thickness
2. General Description
B173RW01 V0 is a Color Active Matrix Liquid Crystal Display composed of a TFT LCD
panel, a driver circuit, and LED backlight system. The screen format is intended to support
the HD+ (1600(H) x 900(V)) screen and 262k colors (RGB 6-bits data driver) with LED
backlight driving circuit. All input signals are LVDS interface compatible.
B173RW01 V0 is designed for a display unit of notebook style personal computer and
industrial machine.
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2.1 General Specification
The following items are characteristics summary on the table at 25 ℃ condition:
Items Unit Specifications
Screen Diagonal [mm] 438.38(17.3W”)
Active Area [mm] 382.08 X 214.92
Pixels H x V 1600 x 3(RGB) x 900
Pixel Pitch [mm] 0.2388X0.2388
Pixel Format R.G.B. Vertical Stripe
Display Mode Normally White
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White Luminance (I
(Note: ILED is LED current)
Luminance Uniformity 1.25 max. (5 points)
Contrast Ratio 500 typ
Response Time [ms] 8 typ / 16 Max
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LED
=20mA)
[cd/m2] 220 typ. (5 points average)
187 min. (5 points average)
Nominal Input Voltage VDD [Volt] +3.3 typ.
Power Consumption [Watt] TBD max. (Include Logic and Blu power)
Input signals shall be low or High-impedance state when VDD is off.
It is recommended to refer the specifications of THC63LVDF84A (Thine Electronics Inc.) in
detail.
Signal electrical characteristics are as follows;
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Parameter
Vth
Vtl
Vcm
Note: LVDS Signal Waveform
V
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t
Differential Input High
Threshold (Vcm=+1.2V)
Differential Input Low
Threshold (Vcm=+1.2V)
Differential Input
Common Mode Voltage
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Condition Min Max Unit
Vcm
-
-100
1.125
100
-
1.375
[mV]
[mV]
[V]
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Product Specification
5.2 Backlight Unit
LED Parameter guideline for LED driving selection (Ref. Remark 1)
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Parameter
LED Forward Voltage VF 3.0 3.2 3.4 [Volt]
LED Forward Current IF 20 30 [mA]
LED Power
consumption
LED Life-Time
Output PWM frequency
Duty ratio
Note 1: Calculator value for reference IF×VF =P
Note 2: The LED life-time define as the estimated time to 50% degradation of initial luminous.
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Symbol
P
4.35
LED
N/A 10,000
F
PWM
-- 20 -- 100
Min Typ Max
- -
180 200 220
Units Condition
[Watt]
Hour
Hz
%
(Ta=25℃)
(Ta=25℃)
(Ta=25℃)
Note 1
(Ta=25℃)
IF=20 mA
Note 2
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Product Specification
6. Signal Characteristic
6.1 Pixel Format Image
Following figure shows the relationship of the input signals and LCD pixel format.
1
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1600
1st Line
900th Line
R GB R GB
R GB R GB
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R GB R GB
R GB R GB
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Product Specification
Data Clock
6.2 The input data format
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Odd PAIR (1st pixel input)
Even PAIR (2nd pixel input)
Signal Name
R5
R4
R3
R2
R1
R0
Red Data 5 (MSB)
Red Data 4
Red Data 3
Red Data 2
Red Data 1
Red Data 0 (LSB)
Red-pixel Data
Description
Red-pixel Data
Each red pixel's brightness data consists of
these 6 bits pixel data.
G5
G4
G3
G2
G1
G0
B5
B4
B3
B2
B1
B0
RxCLKIN
DE Display Timing This signal is strobed at the falling edge of
VS Vertical Sync The signal is synchronized to RxCLKIN .
HS Horizontal Sync The signal is synchronized to RxCLKIN .
Note: Output signals from any system shall be low or High-impedance state when VDD is off.
Green Data 5 (MSB)
Green Data 4
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Green Data 3
Green Data 2
Green Data 1
Green Data 0 (LSB)
Green-pixel Data
Blue Data 5 (MSB)
Blue Data 4
Blue Data 3
Blue Data 2
Blue Data 1
Blue Data 0 (LSB)
Blue-pixel Data
Green-pixel Data
Each green pixel's brightness data consists of
these 6 bits pixel data.
Blue-pixel Data
Each blue pixel's brightness data consists of
these 6 bits pixel data.
The signal is used to strobe the pixel data and
DE signals. All pixel data shall be valid at the
falling edge when the DE signal is high.
RxCLKIN. When the signal is high, the pixel
data shall be valid to be displayed.
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Product Specification
6.3 Integration Interface and Pin Assignment
LVDS is a differential signal technology for LCD interface and high speed data transfer device.
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PIN# Signal Name
1 NC No Connection
2 VDD Power Supply +3.3V
3 VDD Power Supply +3.3V
4 VEDID EDID +3.3V Power
5 NC No Connect (Reserve for M1 aging)
6
7
8 RxOIN0- -LVDS Differential Data INPUT(Odd R0-R5,G0)
9 RxOIN0+ +LVDS Differential Data INPUT(Odd R0-R5,G0)
10 VSS Ground
11 RxOIN1- -LVDS Differential Data INPUT(Odd G1-G5,B0-B1)
12 RxOIN1+ +LVDS Differential Data INPUT(Odd G1-G5,B0-B1)
13 VSS Ground
14 RxOIN2- -LVDS Differential Data INPUT(Odd B2-B5,HS,VS,DE)
15 RxOIN2+ +LVDS Differential Data INPUT(Odd B2-B5,HS,VS,DE)
CLK
DATA
EDID
EDID EDID Data Input
EDID Clock Input
Description
16 VSS Ground
17 RxOCKIN- -LVDS Odd Differential Clock INPUT
18 RxOCKIN+ +LVDS Odd Differential Clock INPUT
19 VSS Ground
20 RxEIN0- -LVDS Differential Data INPUT(Even R0-R5,G0)
21 RxEIN0- +LVDS Differential Data INPUT(Even R0-R5,G0)
22 VSS Ground
23 RxEIN1- -LVDS Differential Data INPUT(Even G1-G5,B0-B1)
24 RxEIN1+ +LVDS Differential Data INPUT(Even G1-G5,B0-B1)
25 VSS Ground
26 RxEIN2- -LVDS Differential Data INPUT(Even B2-B5,HS,VS,DE)
27 RxEIN2+ +LVDS Differential Data INPUT(Even B2-B5,HS,VS,DE)
28 VSS Ground
29 RxECKIN- -LVDS Even Differential Clock INPUT
30 RxECKIN+ +LVDS Even Differential Clock INPUT
31 VLED_GND LED Ground
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32 VLED_GND LED Ground
33 VLED_GND LED Ground
34 NC No Connection
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Product Specification
35 S_PWMIN System PWM signal Input
36 LED_EN LED Enable Pin(+3V Input)
37 NC No Connection
38 VLED LED Power Supply 7V-21V
39 VLED LED Power Supply 7V-21V
40 VLED LED Power Supply 7V-21V
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1
Note1: Start from right side
Product Specification
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Note2: Input signals shall be low or High-impedance state when VDD is off.
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40
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Product Specification
12
internal circuit of LVDS inputs are as following.
The module uses a 100ohm resistor between positive and negative data lines of each receiver input
Signal Input
Pin No .
8
RxIN0-
9
RxIN0+
11
RxIN1-
RxIN1+
14
RxIN2-
15
RxIN2+
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LVDS Receiver
R
R
R
17
18
RxCLK IN-
RxCLKIN+
R
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Product Specification
6.4 Interface Timing
6.4.1 Timing Characteristics
Basically, interface timings should match the 1600x900 /60Hz manufacturing guide line timing.
Parameter Symbol Min. Typ. Max. Unit
Frame Rate - 60 - Hz
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Clock frequency 1/ T
Vertical
Section
Horizontal
Section
Note : DE mode only
6.4.2 Timing diagram
T
CLOCK
DOTCLK
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Input
Data
DE
DE
52.8 MHz
Clock
Period TV 912
Active TVD 900
Blanking TVB 12
Period TH 1930
Active THD 1600
Blanking THB 330
Input Timing Definition ( DE Mode)
Invaild
Data
T
HB
Pixel
1
T
VB
Pixel
2
T
Pixel
3
T
HD
H
T
V
Pixel
N-1
T
VD
Pixel
N
T
Line
T
Clock
Invaild
Data
Pixel
1
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Product Specification
6.5 Power ON/OFF Sequence
VDD power on/off sequence is as follows. Interface signals are also shown in the chart. Signals
from any system shall be Hi-Z state or low level when VDD is off
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Power Sequence Timing
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Parameter
T1 0.5 - 10
T2 0 - 50
T3 0 - 50
T4 400 - -
T5 200 - -
T6 200 - -
T7 0 - 10
Min. Typ. Max.
Value
Units
ms
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Product Specification
LED on/off sequence is as follows. Interface signals are also shown in the chart.
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Values
Symbol
T1
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Note: The duty of LED dimming signal should be more than 20% in T2 and T3.
T2
T3
T4
T5
Min Typ Max
10 --- ---
10 --- ---
50 --- ---
0 --- ---
10 --- ---
Unit
ms
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Product Specification
7. Connector Description
Physical interface is described as for the connector on module.
These connectors are capable of accommodating the following signals and will be following
components.
7.1 TFT LCD Module
Connector Name / Designation For Signal Connector
Manufacturer IPEX
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Type / Part Number
Mating Housing/Part Number Starconn 089N14-000R00-G2-R
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IPEX 20455-040E-12
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Product Specification
8. LED Driving Specification
8.1 Connector Description
It is a intergrative interface and comibe into LVDS connector. The type and mating refer to
section 7.
8.2 Pin Assignment
Ref. to 6.3
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Product Specification
9. Vibration and Shock Test
9.1 Vibration Test
Test Spec:
Test method: Non-Operation
Acceleration: 1.5 G
Frequency: 10 - 500Hz Random
Sweep: 30 Minutes each Axis (X, Y, Z)
9.2 Shock Test Spec:
Test Spec:
Test method: Non-Operation
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Acceleration: TBD G , Half sine wave
Active time: 2 ms
Pulse: X,Y,Z .one time for each side
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10. Reliability
Items
Temperature
Humidity Bias
High Temperature
Operation
Low Temperature
Operation
High Temperature
Storage
Low Temperature
Storage
Thermal Shock
Test
Product Specification
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Required Condition Note
Ta= 40℃℃℃℃, 90%RH, 300h
Ta= 50℃℃℃℃, Dry, 300h
Ta= 0℃℃℃℃, 300h
Ta= 60℃℃℃℃, 35%RH, 300h
Ta= -20℃℃℃℃, 50%RH, 250h
Ta=-20℃℃℃℃to 60℃℃℃℃, Duration at 30 min, 100 cycles
ESD
Note1: According to EN 61000-4-2 , ESD class B: Some performance degradation allowed. No data lost
. Self-recoverable. No hardware failures.
Remark: MTBF (Excluding the LED): 30,000 hours with a confidence level 90%
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Contact : ±8 KV
Air : ±15 KV
Note 1
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Product Specification
11. Mechanical Characteristics
11.1 LCM Outline Dimension
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Note: Prevention IC damage, IC positions not allowed any overlap over these areas.
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Product Specification
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Product Specification
11.2 Screw Hole Depth and Center Position
Screw hole minimum depth, from side surface = 2.5 mm (See drawing)
Screw hole center location, from front surface = 3.1 ± 0.3mm (See drawing)
Screw Torque: Maximum 2.5 kgf-cm
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Product Specification
Week code
Model name
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12. Shipping and Package
12.1 Shipping Label Format
H/W
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Product Specification
12.2 Carton package
The outside dimension of carton is 480 (L)mm x 373 (W)mm x 311 (H)mm