5.2 Backlight Unit .....................................................................................................................................2
6. Signal Interface Characteristic................................................ 2
6.1 Pixel Format Image .............................................................................................................................2
6.2 The Input Data Format ........................................................................................................................2
7. Panel Reliability Test .............................................................. 2
7.1 Vibration Test ......................................................................................................................................2
7.2 Shock Test ...........................................................................................................................................2
1) Since front polarizer is easily damaged, pay attention not to scratch it.
2) Be sure to turn off power supply when inserting or disconnecting from input
connector.
3) Wipe off water drop immediately. Long contact with water may cause discoloration
or spots.
4) When the panel surface is soiled, wipe it with absorbent cotton or other soft cloth.
5) Since the panel is made of glass, it may break or crack if dropped or bumped on
hard surface.
6) Since CMOS LSI is used in this module, take care of static electricity and insure
human earth when handling.
7) Do not open nor modify the Module Assembly.
8) Do not press the reflector sheet at the back of the module to any directions.
9) At the insertion or removal of the Signal Interface Connector, be sure not to rotate
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nor tilt the Interface Connector of the TFT Module.
11) After installation of the TFT Module into an enclosure (Notebook PC Bezel, for
example), do not twist nor bend the TFT Module even momentary. At designing the
enclosure, it should be taken into consideration that no bending/twisting forces are
applied to the TFT Module from outside. Otherwise the TFT Module may be
damaged.
12) Small amount of materials having no flammability grade is used in the LCD module. The
LCD module should be supplied by power complied with requirements of Limited Power
Source (IEC60950 or UL1950), or be applied exemption.
13) Disconnecting power supply before handling LCD modules, it can prevent electric shock,
DO NOT TOUCH the electrode parts, cables, connectors and LED circuit part of TFT
module that a LED light bar build in as a light source of back light unit. It can prevent
electrostic breakdown.
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B133XW04 V0 Document Version : 1.0
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Product Specification
Thickness
2. General Description
B133XW04 V0 is a Color Active Matrix Liquid Crystal Display composed of a TFT LCD panel,
a driver circuit, and LED backlight system. The screen format is intended to support the 16:9
HD, 1366(H) x768(V) screen and 262k colors (RGB 6-bits data driver) with LED backlight
driving circuit. All input signals are LVDS interface compatible.
B133XW04 V0 is designed for a display unit of notebook style personal computer and
industrial machine.
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2.1 General Specification
The following items are characteristics summary on the table at 25 ℃ condition:
Items Unit Specifications
Screen Diagonal [mm]
Active Area [mm]
Pixels H x V
Pixel Pitch [mm]
Pixel Format
Display Mode
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White Luminance (I
(Note: ILED is LED current)
Luminance Uniformity
Contrast Ratio
Response Time [ms]
Nominal Input Voltage VDD [Volt]
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LED
=20mA)
13.3W”(13.25)
293.42 x 164.97
1366 x 3(RGB) x 768
0.2148 x 0.2148
R.G.B. Vertical Stripe
Normally White
[cd/m2]
200 typ. (5 points average)
170 min. (5 points average)
1.25 max. (5 points)
500 typ
8 typ / 16 Max
+3.3 typ.
Power Consumption [Watt]
Weight [Grams]
Physical Size
Include bracket
Electrical Interface
Glass Thickness [mm]
Surface Treatment
Support Color
B133XW04 V0 Document Version : 1.0
[mm]
4.0 max. (Include Logic and Blu power)
350 max.
Min. Typ. Max.
Length --- 307.6 308.1
Width --- 183.1 183.6
--- --- 5.2
1 channel LVDS
0.5
Glare, Hardness 3H
262K colors ( RGB 6-bit )
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Product Specification
Temperature Range
Operating
Storage (Non-Operating)
RoHS Compliance RoHS Compliance
2.2 Optical Characteristics
The optical characteristics are measured under stable conditions at 25℃ (Room Temperature) :
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[oC]
[oC]
0 to +50
-20 to +60
Item Symbol
White Luminance
I
LED
=20mA
Viewing Angle
Luminance
Uniformity
Contrast Ratio CR
Cross talk %
Response Time TRT Rising + Falling
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Red
Color /
Chromaticity
Coodinates
Green
Blue
White
θθθθR
θθθθL
ψψψψH
ψψψψL
δδδδ5P
Rx
Ry
Gx
Gy
Bx
By
Wx
Wy
Conditions Min. Typ. Max. Unit Note
5 points average
Horizontal (Right)
CR = 10 (Left)
Vertical (Upper)
CR = 10 (Lower)
5 Points
400 500 ---
--- --- 4
CIE 1931
170 200 ---
40
40
10
30
--- --- 1.25
--- 8 16
0.555 0.585 0.615
0.310 0.340 0.370
0.295 0.325 0.355
0.525 0.555 0.585
0.125 0.155 0.185
0.115 0.145 0.175
0.283 0.313 0.343
0.299 0.329 0.359
45
45
15
35
---
---
---
---
cd/m
degree
msec
---
2
1, 4, 5.
4, 9
1, 3, 4
4, 6
4, 7
4, 8
4
NTSC %
B133XW04 V0 Document Version : 1.0
---- 45 ----
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Product Specification
=
Maximum Brightness of thirteen points
Minimum Brightness of thirteen points
Maximum Bright
ness of five
points
=
Minimum Brightness of five points
Note 1: 5 points position (Ref: Active area)
H /4
H /4
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W / 4W /4W / 4W / 4
W
12
H
H /4
H /4
Note 2: 13 points position (Ref: Active area)
W /4
1 0
1 0
H /4
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H /4
H
H /4
1
6
3
4
W
W /4
45
W /4
2
7
5
W /4
1 0
3
8
9
H /4
1 0
1 1
1 2
Note 3: The luminance uniformity of 5 or13 points is defined by dividing the maximum luminance values by the
minimum test point luminance
δ
W5
1 0
1 3
δ
Note 4: Measurement method
The LCD module should be stabilized at given temperature for 30 minutes to avoid abrupt temperature change
during measuring. In order to stabilize the luminance, the measurement should be executed after lighting
B133XW04 V0 Document Version : 1.0
W13
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Product Specification
Field=2
°
Contrast ratio (CR)=
Brightness on the “White” state
Brightness on the “Black” state
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Backlight for 30 minutes in a stable, windless and dark room, and it should be measured in the center of screen.
Photo detector
Note 5: Definition of Average Luminance of White (YL):
Measure the luminance of gray level 63 at 5 points,Y
L (x) is corresponding to the luminance of the point X at Figure in Note (1).
Note 6: Definition of contrast ratio:
Note 7: Definition of Cross Talk (CT)
CT = | YB – YA | / YA × 100 (%)
Where
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Contrast ratio is calculated with the following formula.
= [L (1)+ L (2)+ L (3)+ L (4)+ L (5)] / 5
L
YA = Luminance of measured location without gray level 0 pattern (cd/m2)
YB = Luminance of measured location with gray level 0 pattern (cd/m2)
B133XW04 V0 Document Version : 1.0
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Product Specification
Note 8: Definition of response time:
The output signals of BM-7 or equivalent are measured when the input signals are changed from “Black” to
“White” (falling time) and from “White” to “Black” (rising time), respectively. The response time interval between
the 10% and 90% of amplitudes. Refer to figure as below.
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"Black"
100%
S
i
90%
g
n
a
l
(
R
e
l
a
t
i
v
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e
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v
a
l
u
10%
e
)
0%
Tr
Tf
"White""White"
B133XW04 V0 Document Version : 1.0
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Product Specification
Note 9. Definition of viewing angle
Viewing angle is the measurement of contrast ratio ≧10, at the screen center, over a 180° horizontal and
180° vertical range (off-normal viewing angles). The 180° viewing angle range is broken down as follows; 90°
(θ) horizontal left and right and 90° (Φ) vertical, high (up) and low (down). The measurement direction is
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typically perpendicular to the display surface with the screen rotated about its center to develop the desired
measurement viewing angle.
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Product Specification
3. Functional Block Diagram
The following diagram shows the functional block of the 13.3 inches wide Color TFT/LCD 40 Pin one
channel Module
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B133XW04 V0 Document Version : 1.0
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Product Specification
4. Absolute Maximum Ratings
An absolute maximum rating of the module is as following:
4.1 Absolute Ratings of TFT LCD Module
Item Symbol Min Max Unit Conditions
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Logic/LCD Drive Voltage
Vin -0.3 +4.0 [Volt] Note 1,2
4.2 Absolute Ratings of Environment
Item Symbol Min Max Unit Conditions
Operating Temperature
Operation Humidity HOP 5 95 [%RH] Note 4
Storage Temperature
Storage Humidity HST
Note 1: At Ta (25℃ )
Note 2: Permanent damage to the device may occur if exceed maximum values
Note 3: LED specification refer to section 5.2
Note 4: For quality performance, please refer to AUO IIS (Incoming Inspection Standard).
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TOP 0 +50 [oC] Note 4
TST -20 +60 [oC] Note 4
5 95
Twb=39°C
[%RH]
Note 4
Operating Range
B133XW04 V0 Document Version : 1.0
Storage Range
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Product Specification
Voltage
-
90%
10%
5. Electrical Characteristics
5.1 TFT LCD Module
5.1.1 Power Specification
Input power specifications are as follows;
The power specification are measured under 25℃ and frame frenquency under 60Hz
Symble Parameter Min Typ Max Units Note
VDD
Logic/LCD Drive
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3.0
3.3 3.6 [Volt]
PDD
IDD
I
Rush
VDDrp
Note 1 : Maximum Measurement Condition:Black Pattern at 3.3V driving voltage. (P
Note 2:Measure Condition
VDD Power
IDD Current
Inrush Current
Allowable
Logic/LCD Drive
Ripple Voltage
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- - 242
- -
- -
- 0.8 [Watt]
[mA] Note 1
[mA]
[mV]
p-p
2000
100
Note 1
Note 2
max=V3.3
x I
black
)
3.3V
0V
0.5ms
Vin rising time
B133XW04 V0 Document Version : 1.0
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Product Specification
5.1.2 Signal Electrical Characteristics
Input signals shall be low or High-impedance state when VDD is off.
Signal electrical characteristics are as follows;
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Parameter
VTH
VTL
|VID|
VCM
Note: LVDS Signal Waveform
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Differential Input High
Threshold (Vcm=+1.2V)
Differential Input Low
Threshold (Vcm=+1.2V)
Differential Input
Voltage
Differential Input
Common Mode Voltage
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Condition Min Max Unit
---
-100
100 600
1.125
100
---
1.375
[mV]
[mV]
[mV]
[V]
B133XW04 V0 Document Version : 1.0
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5.2 Backlight Unit
5.2.1 LED characteristics
Parameter
Product Specification
Symbol
Min Typ Max Units
Condition
Backlight Power
Consumption
LED Life-Time
Note 1: Calculator value for reference P
Note 2: The LED life-time define as the estimated time to 50% degradation of initial luminous.
5.2.2 Backlight input signal characteristics
Parameter
LED Power Supply VLED 6.0 12.0 21.0 [Volt]
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LED Enable Input
High Level
LED Enable Input
Low Level
PWM Logic Input
High Level
PWM Logic Input
Low Level
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PLED - - 2.2
N/A 10,000 - -
= VF (Normal Distribution) * IF (Normal Distribution) / Efficiency
LED
Symbol
VLED_EN
VPWM_EN
Min Typ Max Units Remark
2.5 - 5.5 [Volt]
- - 0.8 [Volt]
2.5 - 5.5
- - 0.8
[Watt]
Hour
(Ta=25℃), Note 1
Vin =12V
(Ta=25℃), Note 2
IF=20 mA
[Volt]
[Volt]
Define as
Connector
Interface
(Ta=25℃)
PWM Input Frequency
PWM Duty Ratio
B133XW04 V0 Document Version : 0.1
FPWM 100 - 20K
Duty 5 -- 100
Hz
%
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Product Specification
6. Signal Interface Characteristic
6.1 Pixel Format Image
Following figure shows the relationship of the input signals and LCD pixel format.
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1st Line
768th Line
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1
R GB R GB
R GB R GB
1366
R GB R GB
R GB R GB
B133XW04 V0 Document Version : 0.1
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Product Specification
Data Clock
6.2 The Input Data Format
Signal Name
R5
R4
R3
R2
R1
R0
Description
Red Data 5 (MSB)
Red Data 4
Red Data 3
Red Data 2
Red Data 1
Red Data 0 (LSB)
Red-pixel Data
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Red-pixel Data
Each red pixel's brightness data consists of
these 6 bits pixel data.
G5
G4
G3
G2
G1
G0
B5
B4
B3
B2
B1
B0
RxCLKIN
DE Display Timing This signal is strobed at the falling edge of
VS Vertical Sync The signal is synchronized to RxCLKIN .
HS Horizontal Sync The signal is synchronized to RxCLKIN .
Note: Output signals from any system shall be low or High-impedance state when VDD is off.
Green Data 5 (MSB)
Green Data 4
Green Data 3
Green Data 2
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Green Data 1
Green Data 0 (LSB)
Green-pixel Data
Blue Data 5 (MSB)
Blue Data 4
Blue Data 3
Blue Data 2
Blue Data 1
Blue Data 0 (LSB)
Blue-pixel Data
Green-pixel Data
Each green pixel's brightness data consists of
these 6 bits pixel data.
Blue-pixel Data
Each blue pixel's brightness data consists of
these 6 bits pixel data.
The signal is used to strobe the pixel data and
DE signals. All pixel data shall be valid at the
falling edge when the DE signal is high.
RxCLKIN. When the signal is high, the pixel
data shall be valid to be displayed.
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Product Specification
6.3 Integration Interface Requirement
6.3.1 Connector Description
Physical interface is described as for the connector on module.
These connectors are capable of accommodating the following signals and will be following
components.
Connector Name / Designation For Signal Connector
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Manufacturer
Type / Part Number
Mating Housing/Part Number
6.3.2 Pin Assignment
LVDS is a differential signal technology for LCD interface and high speed data transfer device.
PIN# Signal Name
1 NC No Connection (Reserve)
2 VDD Power Supply +3.3V
3 VDD Power Supply +3.3V
4 VEDID EDID +3.3V Power
5 NC No Connect (Reserve)
6 CLK_EDID EDID Clock Input
7 DAT_EDID EDID Data Input
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IPEX 20455-040E-12R or Compatible
IPEX 20453-040T-11or Compatible
IPEX or Compatible
Description
8 RxOIN0- -LVDS Differential Data INPUT(Odd R0-R5,G0)
9 RxOIN0+ +LVDS Differential Data INPUT(Odd R0-R5,G0)
10 VSS Ground
11 RxOIN1- -LVDS Differential Data INPUT(Odd G1-G5,B0-B1)
12 RxOIN1+ +LVDS Differential Data INPUT(Odd G1-G5,B0-B1)
13 VSS Ground
14 RxOIN2- -LVDS Differential Data INPUT(Odd B2-B5,HS,VS,DE)
15 RxOIN2+ +LVDS Differential Data INPUT(Odd B2-B5,HS,VS,DE)
16 VSS Ground
17 RxOCKIN- -LVDS Odd Differential Clock INPUT
18 RxOCKIN+ -LVDS Odd Differential Clock INPUT
19 NC No connection
20 NC No connection
21 NC No connection
22 NC No connection
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Product Specification
Connector
VLED
NC
23 NC No connection
24 NC No connection
25 NC No connection
26 NC No connection
27 NC No connection
28 NC No connection
29 NC No connection
30 NC No connection
31 VLED_GND LED Ground
32 VLED_GND LED Ground
33 VLED_GND LED Ground
34 NC No Connection (Reserve)
35 VPWM_EN PWM logic input level
36 VLED_EN LED enable input level
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37 DCR_EN Dynamic Contrast Ratio Input Level
38 VLED LED Power Supply 6V-21V
39 VLED LED Power Supply 6V-21V
40 VLED LED Power Supply 6V-21V
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Pin 40
Note1: Input signals shall be low or High-impedance state when VDD is off.
B133XW04 V0 Document Version : 0.1
Pin 1
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Product Specification
6.4 Interface Timing
6.4.1 Timing Characteristics
Basically, interface timings should match the 1366x768 /60Hz manufacturing guide line timing.
Parameter Symbol Min. Typ. Max. Unit
Frame Rate - --- 60 --- Hz
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Clock frequency 1/ T
Vertical
Section
Horizontal
Section
Note : DE mode only
6.4.2 Timing diagram
T
CLOCK
DOTCLK
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Input
Data
DE
DE
65 69.3 80 MHz
Clock
Period TV 776 800 1000
Active TVD 768
Blanking TVB 8 32 323
Period TH 1426 1562 2000
Active THD 1366
Blanking THB 60 196 634
Input Timing Definition ( DE Mode)
Invaild
Data
T
HB
Pixel
1
T
VB
Pixel
2
T
Pixel
3
T
HD
H
T
V
Pixel
N-1
T
Pixel
N
VD
T
Line
T
Clock
Invaild
Data
Pixel
1
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Product Specification
6.5 Power ON/OFF Sequence
Power on/off sequence is as follows. Interface signals and LED on/off sequence are also shown in
the chart. Signals from any system shall be Hi-Z state or low level when VDD is off
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Power Sequence Timing
Value
Parameter
T1
T2
T3
T4
T5
T6
T7
T8
T9
T10
T11
T12
Min. Max.
0.5 10
0 50
200 -
200 -
0 50
0 10
500 -
10 -
0 180
0 180
10 -
0.5 10
Units
ms
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7. Panel Reliability Test
7.1 Vibration Test
Test Spec:
Test method: Non-Operation
Acceleration: 1.5 G
Frequency: 10 - 500Hz Random
Sweep: 30 Minutes each Axis (X, Y, Z)
7.2 Shock Test
Test Spec:
Test method: Non-Operation
Acceleration: 220 G , Half sine wave
Product Specification
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Active time: 2 ms
Pulse: X,Y,Z .one time for each side
7.3 Reliability Test
Items
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Temperature
Humidity Bias
High Temperature
Operation
Low Temperature
Operation
High Temperature
Storage
Low Temperature
Storage
Thermal Shock
Test
Required Condition Note
Ta= 40℃℃℃℃, 90%RH, 300h
Ta= 50℃℃℃℃, Dry, 300h
Ta= 0℃℃℃℃, 300h
Ta= 60℃℃℃℃, 35%RH, 300h
Ta= -20℃℃℃℃, 50%RH, 250h
Ta=-20℃℃℃℃to 60℃℃℃℃, Duration at 30 min, 100 cycles
ESD
Note1: According to EN 61000-4-2 , ESD class B: Some performance degradation allowed. Self-recoverable.
No data lost, No hardware failures.
Remark: MTBF (Excluding the LED): 30,000 hours with a confidence level 90%
B133XW04 V0 Document Version : 0.1
Contact : ±8 KV
Air : ±15 KV
Note 1
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Product Specification
8. Mechanical Characteristics
8.1 LCM Outline Dimension
8.1.1 Standard Front View
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Product Specification
8.1.2 Standard Rear View & Key components remark and remind
Prevention damage the IC, connector, Capacitor…., we recommend your design (Ex: cable, rib, hardness parts) far away those section those have
remarked at this drawing.
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Note: Prevention IC damage, IC positions not allowed any overlap over these areas.
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Product Specification
8.2 Screw Hole Depth and Center Position
Maximum Screw penetration from side surface is 2.6± 0.3 mm
The center of screw hole center location is 3.1 ± 0.2 mm from front surface
Screw Torque: Maximum 2.5 kgf-cm
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Product Specification
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9. Shipping and Package
9.1 Shipping Label Format
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Product Specification
9.2 Carton Package
The outside dimension of carton is 437 (L) mm x 359 (W) mm x 285 (H) mm