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Vin rising time
3.3V
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5.1.2 Signal Electrical Characteristics
Input signals shall be low or High-impedance state when VDD is off.
Signal electrical characteristics are as follows;
ParameterCondition Min Max Unit
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V
TH
Differential Input High
Threshold (Vcm=+1.2V)
V
TL
Differential Input Low
Threshold (Vcm=+1.2V)
|VID|
Differential Input
Voltage 100 600 [mV]
V
CM
Note: LVDS Signal Waveform
Differential Input
Common Mode Voltage
-100
1.125
100
[mV]
-
[mV]
1.375
[V]
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5.2 Backlight Unit
LED Parameter guideline for LED driving selection (Ref. Remark 1)
Parameter
LED Forward Voltage VF 3.0 3.2 3.4 [Volt]
LED Forward Current IF 20 [mA]
LED Power
consumption
LED Life-Time
Symbol
P
2.71 2.97
LED
Min Typ Max Units Condition
N/A 12,000- -
[Watt]
Hour
(Ta=25 )к
(Ta=25 )к
(Ta=25 )к
Note 1
(Ta=25 )к
IF=20 mA
Note 2
Output PWM frequency
Duty ratio
Note 1: Calculator value for reference IF×VF× 36/ efficiency (85%) = P (typ.); P (max) estimated with I
tolerance.
Note 2: The LED life-time define as the estimated time to 50% degradation of initial luminous.
FPWM 100 200 20K
-- 1 -- 100
Hz
%
Note 3
F and VF
Note 3: Output PWM frequency< 5K Hz.
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6. Signal Characteristic
6.1 Pixel Format Image
Following figure shows the relationship of the input signals and LCD pixel format.
11280
1st Line
800th Line
R G B R G B
R G B R G B
R G B R G B
R G B R G B
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6.2 The input data format
Signal NameDescription
R5
R4
R3
R2
R1
R0
Red Data 5 (MSB)
Red Data 4
Red Data 3
Red Data 2
Red Data 1
Red Data 0 (LSB)
Red-pixel Data
Each red pixel's brightness data consists of
these 6 bits pixel data.
Red-pixel Data
G5
G4
G3
G2
G1
G0
Green Data 5 (MSB)
Green Data 4
Green Data 3
Green Data 2
Green Data 1
Green Data 0 (LSB)
Green-pixel Data
Each green pixel's brightness data consists of
these 6 bits pixel data.
Green-pixel Data
B5
B4
B3
B2
B1
B0
Blue Data 5 (MSB)
Blue Data 4
Blue Data 3
Blue Data 2
Blue Data 1
Blue Data 0 (LSB)
Blue-pixel Data
Each blue pixel's brightness data consists of
these 6 bits pixel data.
Blue-pixel Data
RxCLKIN Data Clock The typical frequency is 69.3 MHZ. The signal is
used to strobe the pixel data and DE signals. All
pixel data shall be valid at the falling edge when
the DE signal is high.
DE Display Timing This signal is strobed at the falling edge of
RxCLKIN. When the signal is high, the pixel
data shall be valid to be displayed.
VS Vertical Sync The signal is synchronized to RxCLKIN .
HS Horizontal Sync The signal is synchronized to RxCLKIN .
Note: Output signals from any system shall be low or High-impedance state when VDD is off.
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(
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(
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6.3 Signal Description/Pin Assignment
LVDS is a differential signal technology for LCD interface and high speed data transfer device.
Connector PN: FI-XB30SL-HF10
GND
GND
(7~21V)
(7~21V)
(7~21V)
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Note1: Signal Start from right side
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6.4 Interface Timing
6.4.1 Timing Characteristics
Basically, interface timings should match the 1280x800 /60Hz manufacturing guide line timing.
Parameter Symbol Min. Typ. Max. Unit
Frame Rate - - 60 - Hz
Clock frequency 1/ T
Period TV 808 816 1023
Vertical
Active TVD 800 800 800
Section
Blanking T
Period TH 1310 1408 2047
Horizontal
Active THD 1280 1280 1280
Section
Blanking T
Note : DE mode only
50- 69.3 80- MHz
Clock
T
8 16 223
VB
T
Clock
30 128 767
HB
Line
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6.4.2 Timing diagram
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DOTCLK
Input
Data
DE
DE
T
CLOCK
Invaild
Data
T
HB
Input Timing Definition ( DE Mode)
Pixel
1
T
VB
Pixel
2
T
Pixel
3
T
HD
H
T
V
Pixel
N-1
T
VD
Pixel
N
Invaild
Data
Pixel
1
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6.5 Power ON /OFF Sequence
Power on/off sequence is as follows. Interface signals and LED on/off sequence are also shown in
the chart. Signals from any system shall be Hi-Z state or low level when VDD is off
Power Sequence Timing
Value
Parameter
T1 0.5 - 10
T2 0 - 50
T3 200 - -
T4 0 - -
T5 0 - -
T6 0 - 10
T7 150 - -
T8 0 - -
T9 0 - -
T10 0 - -
T11 0 - -
T12 0.5 - -
T13 0 - -
Min. Typ. Max.
Units
ms
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7. Connector Description
Physical interface is described as for the connector on module.
These connectors are capable of accommodating the following signals and will be following
components.
7.1 TFT LCD Module
Connector Name / Designation For Signal Connector
Manufacturer
Type / Part Number
Mating Housing/Part Number
Japan Aviation Electronics Industry, LTD
FI-XB30SL-HF10
FI-XB30SRL-HF11
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8. 8. LED Driving Specification
8.1 Connector Description
It is a intergrative interface and comibe into LVDS connector. The type and mating refer to
section 7.
8.2 Pin Assignment
Ref. to 6.3
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9. Vibration and Shock Test
9.1 Vibration Test
Test Spec:
Test method: Non-Operation
Acceleration: 1.5 G
Frequency: 10 - 500Hz Random
Sweep: 30 Minutes each Axis (X, Y, Z)
9.2 Shock Test Spec:
Test Spec:
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Test method: Non-Operation
Acceleration: 220 G , Half sine wave
Active time: 2 ms
Pulse: X,Y,Z .one time for each side
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10. Reliability
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Items
Temperature
Humidity Bias
Ta= 40кккк, 90%RH, 300h
High Temperature
Operation
Ta= 50кккк, Dry, 300h
Low Temperature
Operation
Ta= 0кккк, 300h
High Temperature
Storage
Ta= 60кккк, 300h
Low Temperature
Storage
Ta= -20кккк, 300h
Thermal Shock
Test
ESD
Ta=-20ккккto 60кккк, Duration at 30 min, 100 cycles
Contact : ±8 KV
Air : ±15 KV
Note1:
According to EN 61000-4-2 , ESD class B: Some performance degradation allowed. No data lost
. Self-recoverable. No hardware failures.
Required Condition Note
Note 1
Remark:
MTBF (Excluding the LED): 30,000 hours with a confidence level 90%
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11. Mechanical Characteristics
11.1 LCM Outline Dimension
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11.2 Screw Hole Depth and Center Position
Screw hole minimum depth, from side surface = 1.8 mm (See drawing)
Screw hole center location, from front surface = 2.8mm (See drawing)
Screw Torque:
2.3 ~ 2.5 kgf-cm Max (Rework 6 times)
3.0 kgf-cm max Max (Rework 3 times)
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12. Shipping and Package
12.1 Shipping Label Format
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Product Specification
AU OPTRONICS CORPORATION
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12.2 Carton package
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12.3 Shipping package of palletizing sequence
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13. Appendix: EDID description
Byte# Byte#ValueValueValue Value
Field Name and Comments
(decimal) (HEX)
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AU OPTRONICS CORPORATION
Remarks
(HEX)
(Hex)(Decimal)(Binary)
0 00 Header
1 01 Header
2 02 Header
3 03 Header
4 04 Header
5 05 Header
6 06 Header
7 07 Header
8 08
9 09
10 0A
11 0B
12 0C
13 0D
14 0E
15 0F
16 10 Week of Manufacture ʳʳ01 1 00000001
ID Manufacturer Name
ID Product Code
ID Serial Number (32-bit
serial number)
00 EDID VESA Spec Fixed
FF EDID VESA Spec Fixed
FF EDID VESA Spec Fixed
FF EDID VESA Spec Fixed
FF EDID VESA Spec Fixed
FF EDID VESA Spec Fixed
FF EDID VESA Spec Fixed
00 EDID VESA Spec Fixed
30
AE
11
12" 16:10 WXGA 1280x800
40
00 not used
00 not used
00 not used
00 not used
LEN
LED B/L
00 0 00000000
FF 255 11111111
FF 255 11111111
FF 255 11111111
FF 255 11111111
FF 255 11111111
FF 255 11111111
00 0 00000000
30 48 00110000
AE 174 10101110
11 17 00010001
40 64 01000000
00 0 00000000
00 0 00000000
00 0 00000000
00 0 00000000
17 11 Year of Manufacture ʳʳ13 19 00010011
18 12 EDID Structure version 01 01 1 00000001
19 13 EDID Revision 03
20 14 Video Input Definition
21 15
22 16
23 17
24 18 Feature support(DPMS)
25 19 Red/Green Low Bits ʳʳ65 101 01100101
26 1A Blue/White Low Bits ʳʳ85 133 10000101
27 1B Red x ʳʳ8F 143 10001111
28 1C Red y ʳʳ59 89 01011001
29 1D Green x ʳʳ58 88 01011000
30 1E Green y ʳʳ8F 143 10001111
31 1F Blue x ʳʳ26 38 00100110
32 20 Blue y ʳʳ1B 27 00011011
Max H Image Size(с)
Max V Image Size(с)
Display gamma (gamma x
100)-100
80 Digital
ʳʳ1A 26 00011010
ʳʳ10 16 00010000
78 2.2
EA Lenovo Spec fixed
Ver. 1.3
03 3 00000011
80 128 10000000
78 120 01111000
EA 234 11101010
33 21 White x ʳʳ50 80 01010000
34 22 White y ʳʳ54 84 01010100
35 23 Established Timing 1
36 24 Established Timing 2
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00 Lenovo Spec fixed
00 Lenovo Spec fixed
00 0 00000000
00 0 00000000
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3.3V
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5.1.2 Signal Electrical Characteristics
Input signals shall be low or High-impedance state when VDD is off.
Signal electrical characteristics are as follows;
ParameterCondition Min Max Unit
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V
TH
Differential Input High
Threshold (Vcm=+1.2V)
V
TL
Differential Input Low
Threshold (Vcm=+1.2V)
|VID|
Differential Input
Voltage 100 600 [mV]
V
CM
Note: LVDS Signal Waveform
Differential Input
Common Mode Voltage
-100
1.125
100
[mV]
-
[mV]
1.375
[V]
5.2 Backlight Unit
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LED Parameter guideline for LED driving selection (Ref. Remark 1)
Parameter
LED Forward Voltage VF 2.95 3.15 3.35[Volt]
LED Forward Current IF 20 30 [mA]
LED Power
consumption
LED Life-Time
Symbol
3.78
P
LED
Min Typ Max Units Condition
N/A 12,000- -
[Watt]
Hour
(Ta=25 )к
(Ta=25 )к
(Ta=25 )к
Note 1
(Ta=25 )к
IF=20 mA
Note 2
Output PWM frequency
Duty ratio
Note 1: Calculator value for reference IF×VF× 42/ efficiency(85%)=P(typ.)
Note 2: The LED life-time define as the estimated time to 50% degradation of initial luminous.
FPWM - 200 20K
-- 5 -- 100
Hz
%
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6. Signal Characteristic
6.1 Pixel Format Image
Following figure shows the relationship of the input signals and LCD pixel format.
0112781279
1st Line
800th Line
R G B R G B
R G B R G B
R G B R G B
R G B R G B
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6.2 The input data format
Signal NameDescription
R5
R4
R3
R2
R1
R0
Red Data 5 (MSB)
Red Data 4
Red Data 3
Red Data 2
Red Data 1
Red Data 0 (LSB)
Red-pixel Data
Each red pixel's brightness data consists of
these 6 bits pixel data.
Red-pixel Data
G5
G4
G3
G2
G1
G0
Green Data 5 (MSB)
Green Data 4
Green Data 3
Green Data 2
Green Data 1
Green Data 0 (LSB)
Green-pixel Data
Each green pixel's brightness data consists of
these 6 bits pixel data.
Green-pixel Data
B5
B4
B3
B2
B1
B0
Blue Data 5 (MSB)
Blue Data 4
Blue Data 3
Blue Data 2
Blue Data 1
Blue Data 0 (LSB)
Blue-pixel Data
Each blue pixel's brightness data consists of
these 6 bits pixel data.
Blue-pixel Data
RxCLKIN Data Clock The typical frequency is 69.3 MHZ. The signal is
used to strobe the pixel data and DE signals. All
pixel data shall be valid at the falling edge when
the DE signal is high.
DE Display Timing This signal is strobed at the falling edge of
RxCLKIN. When the signal is high, the pixel
data shall be valid to be displayed.
VS Vertical Sync The signal is synchronized to RxCLKIN .
HS Horizontal Sync The signal is synchronized to RxCLKIN .
Note: Output signals from any system shall be low or High-impedance state when VDD is off.
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6.3 Signal Description/Pin Assignment
LVDS is a differential signal technology for LCD interface and high speed data transfer device.
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Pin40
Connector: FI-NXB40SL-HF10
Pin1
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6.4 Interface Timing
6.4.1 Timing Characteristics
Basically, interface timings should match the 1280x800 /60Hz manufacturing guide line timing.
Parameter Symbol Min. Typ. Max. Unit
Frame Rate - - 60 - Hz
Clock frequency 1/ T
Period TV 803 816 1023
Vertical
Active TVD 800 800 800
Section
Blanking T
Period TH 1303 1416 2047
Horizontal
Active THD 1280 1280 1280
Section
Blanking T
Note : DE mode only
50- 69.3 80- MHz
Clock
T
3 16 223
VB
T
Clock
23 136 767
HB
Line
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6.4.2 Timing diagram
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DOTCLK
Input
Data
DE
DE
T
CLOCK
Invaild
Data
T
HB
Input Timing Definition ( DE Mode)
Pixel
1
T
VB
Pixel
2
T
Pixel
3
T
HD
H
T
V
Pixel
N-1
T
VD
Pixel
N
Invaild
Data
Pixel
1
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6.5 Power ON /OFF Sequence
Power on/off sequence is as follows. Interface signals and LED on/off sequence are also shown in
the chart. Signals from any system shall be Hi-Z state or low level when VDD is off
Power Sequence Timing
Value
Parameter
T1 0.5 - 10
T2 0 - 50
T3 200 - -
T4 0.5 - 10
T5 10 - -
T6 10 - -
T7 0 - -
T8 10 - -
T9 0 - 10
T10 200 - -
T11 0.5 - 50
T12 0 - 10
T13 400 - -
Min. Typ. Max.
Units
ms
Note:If T3,T5,T6 couldn’t match above specifications, must request T3+T5+T6 > 200ms at least
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7. Connector Description
Physical interface is described as for the connector on module.
These connectors are capable of accommodating the following signals and will be following
components.
7.1 TFT LCD Module
Connector Name / Designation For Signal Connector
Manufacturer
Type / Part Number
Mating Housing/Part Number
Japan Aviation Electronics Industry, LTD
FI-NXB40SL-HF10 or compatible
FI-NX40CL or compatible
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8. 8. LED Driving Specification
8.1 Connector Description
It is a intergrative interface and comibe into LVDS connector. The type and mating refer to
section 7.
8.2 Pin Assignment
Ref. to 6.3
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9. Vibration and Shock Test
9.1 Vibration Test
Test Spec:
Test method: Non-Operation
Acceleration: 1.5 G
Frequency: 10 - 500Hz Random
Sweep: 30 Minutes each Axis (X, Y, Z)
9.2 Shock Test Spec:
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Test Spec:
Test method: Non-Operation
Acceleration: 220 G , Half sine wave
Active time: 2 ms
Pulse: X,Y,Z .one time for each side
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10. Reliability
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Items
Temperature
Humidity Bias
Ta= 40кккк, 90%RH, 300h
High Temperature
Operation
Ta= 50кккк, Dry, 300h
Low Temperature
Operation
Ta= 0кккк, 300h
High Temperature
Storage
Ta= 60кккк, 300h
Low Temperature
Storage
Ta= -20кккк, 300h
Thermal Shock
Test
ESD
Ta=-20ккккto 60кккк, Duration at 30 min, 100 cycles
Contact : ±8 KV
Air : ±15 KV
Note1:
According to EN 61000-4-2 , ESD class B: Some performance degradation allowed. No data lost
. Self-recoverable. No hardware failures.
Required Condition Note
Note 1
Remark:
MTBF (Excluding the LED): 30,000 hours with a confidence level 90%
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11. Mechanical Characteristics
11.1 LCM Outline Dimension
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11.2 Screw Hole Depth and Center Position
Screw hole minimum depth, from side surface = 2.2 mm (See drawing)
Screw hole center location, from front surface = 2.8 ± 0.3mm (See drawing)
Screw Torque: Maximum 2.5 kgf-cm
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12. Shipping and Package
12.1 Shipping Label Format
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12.2 Carton package
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AU OPTRONICS CORPORATION
12.3 Shipping package of palletizing sequence
document version 1.4 .
One step solution for LCD / PDP / OLED panel application: Datasheet, inventory and accessory!