The AT93C46 provides 1024 bits of serial electrically erasable programmable readonly memory (EEPROM), organized as 64 words of 16 bits each (when the ORG pin is
connected to VCC), and 128 words of 8 bits each (when the ORG pin is tied to
ground). The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operations are essential. The AT93C46 is
available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead EIAJ SOIC, 8-lead
Ultra Thin mini-MAP (MLP 2x3), 8-lead TSSOP, and 8-lead dBGA2 packages.
The AT93C46 is enabled through the Chip Select pin (CS) and accessed via a
three-wire serial interface consisting of Data Input (DI), Data Output (DO), and Shift
Clock (SK). Upon receiving a Read instruction at DI, the address is decoded and the
data is clocked out serially on the DO pin. The Write cycle is completely self-timed,
and no separate Erase cycle is required before Write. The Write cycle is only enabled
when the part is in the Erase/Write Enable state. When CS is brought high following
the initiation of a Write cycle, the DO pin outputs the Ready/Busy status of the part.
The AT93C46 is available in 2.7V to 5.5V and 1.8V to 5.5V versions.
Table 1. Pin Configurations
Pin NameFunction
CSChip Select
SKSerial Data Clock
DISerial Data Input
DOSerial Data Output
GNDGround
VCCPower Supply
ORGInternal Organization
DCDon’t Connect
8-lead SOIC
1
CS
2
SK
3
DI
4
DO
8-lead PDIP
1
CS
2
SK
3
DI
4
DO
8-lead Ultra Thin mini-MAP (MLP 2x3)
8
VCC
7
DC
6
ORG
5
GND
Bottom View
VCC
8
DC
7
ORG
6
GND
5
VCC
8
DC
7
ORG
6
GND
5
1
CS
2
SK
3
DI
4
DO
VCC
ORG
GND
DC
VCC
CS
SK
CS
SK
DI
DO
8-lead dBGA2
1
8
2
7
DC
3
6
4
5
Bottom View
8-lead SOIC
Rotated (R)
(1K JEDEC Only)
1
2
3
4
8-lead TSSOP
1
2
3
4
CSSK
D1
D0
ORG
8
GND
7
DO
6
DI
5
8
VCC
7
DC
6
ORG
5
GND
1K (128 x 8 or 64 x 16)
AT93C46
Note: Not recommended for new
design; please refer to
AT93C46D datasheet.
5140B–SEEPR–2/07
1
Absolute Maximum Ratings*
Operating Temperature......................................−55°C to +125°C
Storage Temperature .........................................−65°C to +150°C
Voltage on Any Pin
with Respect to Ground........................................ −1.0V to +7.0V
Maximum Operating Voltage .......................................... 6.25V
DC Output Current........................................................ 5.0 mA
Figure 1. Block Diagram
*NOTICE:Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability
Note:When the ORG pin is connected to VCC, the “x 16” organization is selected. When it is
connected to ground, the “x 8” organization is selected. If the ORG pin is left unconnected and the application does not load the input beyond the capability of the internal 1
Meg ohm pullup, then the “x 16” organization is selected. The feature is not available on
the 1.8V devices.
For the AT93C46, if “x 16” organization is the mode of choice and Pin 6 (ORG) is left
unconnected, Atmel recommends using the AT93C46A device. For more details, see the
AT93C46A datasheet.
2
AT93C46
5140B–SEEPR–2/07
AT93C46
Table 2. Pin Capacitance
(1)
Applicable over recommended operating range from TA = 25°C, f = 1.0 MHz, VCC = +5.0V (unless otherwise noted)
SymbolTest ConditionsMaxUnitsConditions
C
OUT
C
IN
Output Capacitance (DO)5pFV
OUT
= 0V
Input Capacitance (CS, SK, DI)5pFVIN = 0V
Note:1. This parameter is characterized and is not 100% tested.
Table 3. DC Characteristics
Applicable over recommended operating range from: T
T
= -40°C to +125°C, VCC = +1.8V to +5.5V (unless otherwise noted)
AE
SymbolParameterTest ConditionMinTypMaxUnit
V
CC1
V
CC2
V
CC3
I
CC
I
SB1
I
SB2
I
SB3
I
IL
I
OL
(1)
V
IL1
(1)
V
IH1
(1)
V
IL2
(1)
V
IH2
V
OL1
V
OH1
V
OL2
V
OH2
Note:1. VIL min and VIH max are reference only and are not tested.
Supply Voltage1.85.5V
Supply Voltage2.75.5V
Supply Voltage4.55.5V
Supply CurrentVCC = 5.0V
Standby CurrentVCC = 1.8VCS = 0V00.1µA
Standby CurrentVCC = 2.7VCS = 0V6.010.0µA
Standby CurrentVCC = 5.0VCS = 0V1730µA
Input LeakageVIN = 0V to VCC 0.11.0µA
Output LeakageVIN = 0V to VCC 0.11.0µA
Input Low Voltage
2.7V ≤ VCC ≤ 5.5V
Input High Voltage2.0VCC + 1
Input Low Voltage
1.8V ≤ V
Input High VoltageVCC x 0.7VCC + 1
Output Low Voltage
Output High VoltageIOH = −0.4 mA2.4V
2.7V ≤ V
≤ 5.5V
CC
Output Low Voltage
Output High VoltageIOH = −100 µAV
1.8V ≤ V
≤ 2.7V
CC
= −40°C to +85°C, VCC = +1.8V to +5.5V,
AI
READ at 1.0 MHz0.52.0mA
WRITE at 1.0 MHz0.52.0mA
−0.60.8
≤ 2.7V
−0.6V
CC
I
= 2.1 mA0.4V
OL
I
= 0.15 mA0.2V
OL
– 0.2V
CC
CC
x 0.3
V
V
5140B–SEEPR–2/07
3
Table 4. AC Characteristics
Applicable over recommended operating range from T
Note:1. This parameter is characterized and is not 100% tested.
≤ 5.5V
CC
250
250
1000
≤ 5.5V
CC
250
250
≤ 5.5V
CC
≤ 5.5V
CC
≤ 5.5V
CC
1000
250
250
1000
100
≤ 5.5V
CC
≤ 5.5V
CC
100
400
10ms
≤ 5.5V0.13ms
CC
ns
ns
ns
ns
4
AT93C46
5140B–SEEPR–2/07
Table 5. Instruction Set for the AT93C46
AT93C46
Op
InstructionSB
Code
READ110A6 – A
EWEN10011XXXXX11XXXX
ERASE111A
WRITE101A6 – A
ERAL10010XXXXX10XXXX
WRAL10001XXXXX01XXXXD7 – D
AddressData
A5 – A
A5 – A
A5 – A
0
0
0
D7 – D
6
– A
0
0
0
Commentsx 8x 16x 8x 16
Reads data stored in memory, at
specified address
Write enable must precede all
programming modes
Erases memory location An – A
D
0
15
– D
Writes memory location An – A
0
0
0
Erases all memory locations. Valid
only at V
D
0
15
– D
Writes all memory locations. Valid
0
only at VCC = 4.5V to 5.5V
= 4.5V to 5.5V
CC
EWDS10000XXXXX00XXXXDisables all programming instructions
Note:The Xs in the address field represent DON’T CARE values and must be clocked.
Functional
Description
The AT93C46 is accessed via a simple and versatile three-wire serial communication
interface. Device operation is controlled by seven instructions issued by the host processor. A valid instruction starts with a rising edge of CS and consists of a start bit (logic
“1”) followed by the appropriate op code and the desired memory address location.
READ (READ): The Read (READ) instruction contains the address code for the memory location to be read. After the instruction and address are decoded, data from the
selected memory location is available at the serial output pin DO. Output data changes
are synchronized with the rising edges of serial clock SK. It should be noted that a
dummy bit (logic “0”) precedes the 8- or 16-bit data output string.
ERASE/WRITE ENABLE (EWEN): To assure data integrity, the part automatically goes
into the Erase/Write Disable (EWDS) state when power is first applied. An Erase/Write
Enable (EWEN) instruction must be executed first before any programming instructions
can be carried out. Please note that once in the EWEN state, programming remains
enabled until an EWDS instruction is executed or V
power is removed from the part.
CC
ERASE (ERASE): The Erase (ERASE) instruction programs all bits in the specified
memory location to the logical “1” state. The self-timed erase cycle starts once the
Erase instruction and address are decoded. The DO pin outputs the Ready/Busy status
of the part if CS is brought high after being kept low for a minimum of 250 ns (t
CS
). A
logic “1” at pin DO indicates that the selected memory location has been erased and the
part is ready for another instruction.
WRITE (WRITE): The Write (WRITE) instruction contains the 8 or 16 bits of data to be
written into the specified memory location. The self-timed programming cycle t
WP
starts
after the last bit of data is received at serial data input pin DI. The DO pin outputs the
Read/Busy status of the part if CS is brought high after being kept low for a minimum of
250 ns (t
). A logic “0” at DO indicates that programming is still in progress. A logic “1”
CS
indicates that the memory location at the specified address has been written with the
data pattern contained in the instruction and the part is ready for further instructions. A
Ready/Busy status cannot be obtained if the CS is brought high after the end of the selftimed programming cycle tWP.
5140B–SEEPR–2/07
5
ERASE ALL (ERAL): The Erase All (ERAL) instruction programs every bit in the mem-
ory array to the logic “1” state and is primarily used for testing purposes. The DO pin
outputs the Ready/Busy status of the part if CS is brought high after being kept low for a
minimum of 250 ns (t
WRITE ALL (WRAL): The Write All (WRAL) instruction programs all memory locations
with the data patterns specified in the instruction. The DO pin outputs the Ready/Busy
status of the part if CS is brought high after being kept low for a minimum of 250 ns (t
The WRAL instruction is valid only at V
ERASE/WRITE DISABLE (EWDS): To protect against accidental data disturb, the
Erase/Write Disable (EWDS) instruction disables all programming modes and should be
executed after all programming operations. The operation of the Read instruction is
independent of both the EWEN and EWDS instructions and can be executed at any
time.
Timing Diagrams
Figure 2. Synchronous Data Timing
). The ERAL instruction is valid only at VCC = 5.0V ± 10%.
CS
= 5.0V ± 10%.
CC
µs
CS
).
Note:1. This is the minimum SK period.
Table 6. Organization Key for Timing Diagrams
6
AT93C46
I/O
A
D
AT93C46 (1K)
x 8x 16
N
N
A
6
D
7
A
5
D
15
5140B–SEEPR–2/07
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