Atmel AT93C46-10PU, AT93C46-10SU, AT93C46-10TU, AT93C46W-10SU, AT93C46Y1-10YU Schematics

...

Features

Low-voltage and Standard-voltage Operation
– 2.7 (VCC = 2.7V to 5.5V) – 1.8 (V
User-selectable Internal Organization
– 1K: 128 x 8 or 64 x 16
2 MHz Clock Rate (5V)
Self-timed Write Cycle (10 ms max)
High Reliability
– Endurance: 1 Million Write Cycles – Data Retention: 100 Years
Automotive Grade Devices Available
8-lead JEDEC PDIP, 8-lead JEDEC SOIC, 8-lead EIAJ SOIC, 8-lead Ultra Thin mini-MAP
(MLP 2x3), 8-lead TSSOP and 8-ball dBGA2 Packages
= 1.8V to 5.5V)
CC
Three-wire Serial EEPROM

Description

The AT93C46 provides 1024 bits of serial electrically erasable programmable read­only memory (EEPROM), organized as 64 words of 16 bits each (when the ORG pin is connected to VCC), and 128 words of 8 bits each (when the ORG pin is tied to ground). The device is optimized for use in many industrial and commercial applica­tions where low-power and low-voltage operations are essential. The AT93C46 is available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead EIAJ SOIC, 8-lead Ultra Thin mini-MAP (MLP 2x3), 8-lead TSSOP, and 8-lead dBGA2 packages.
The AT93C46 is enabled through the Chip Select pin (CS) and accessed via a three-wire serial interface consisting of Data Input (DI), Data Output (DO), and Shift Clock (SK). Upon receiving a Read instruction at DI, the address is decoded and the data is clocked out serially on the DO pin. The Write cycle is completely self-timed, and no separate Erase cycle is required before Write. The Write cycle is only enabled when the part is in the Erase/Write Enable state. When CS is brought high following the initiation of a Write cycle, the DO pin outputs the Ready/Busy status of the part.
The AT93C46 is available in 2.7V to 5.5V and 1.8V to 5.5V versions.
Table 1. Pin Configurations
Pin Name Function
CS Chip Select
SK Serial Data Clock
DI Serial Data Input
DO Serial Data Output
GND Ground
VCC Power Supply
ORG Internal Organization
DC Don’t Connect
8-lead SOIC
1
CS
2
SK
3
DI
4
DO
8-lead PDIP
1
CS
2
SK
3
DI
4
DO
8-lead Ultra Thin mini-MAP (MLP 2x3)
8
VCC
7
DC
6
ORG
5
GND
Bottom View
VCC
8
DC
7
ORG
6
GND
5
VCC
8
DC
7
ORG
6
GND
5
1
CS
2
SK
3
DI
4
DO
VCC
ORG GND
DC
VCC
CS SK
CS SK
DI
DO
8-lead dBGA2
1
8
2
7
DC
3
6
4
5
Bottom View
8-lead SOIC Rotated (R)
(1K JEDEC Only)
1 2 3 4
8-lead TSSOP
1 2 3 4
CS SK D1 D0
ORG
8
GND
7
DO
6
DI
5
8
VCC
7
DC
6
ORG
5
GND
1K (128 x 8 or 64 x 16)
AT93C46
Note: Not recommended for new
design; please refer to AT93C46D datasheet.
5140B–SEEPR–2/07
1

Absolute Maximum Ratings*

Operating Temperature......................................−55°C to +125°C
Storage Temperature .........................................−65°C to +150°C
Voltage on Any Pin
with Respect to Ground........................................ −1.0V to +7.0V
Maximum Operating Voltage .......................................... 6.25V
DC Output Current........................................................ 5.0 mA
Figure 1. Block Diagram
*NOTICE: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent dam­age to the device. This is a stress rating only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability
Note: When the ORG pin is connected to VCC, the “x 16” organization is selected. When it is
connected to ground, the “x 8” organization is selected. If the ORG pin is left uncon­nected and the application does not load the input beyond the capability of the internal 1 Meg ohm pullup, then the “x 16” organization is selected. The feature is not available on the 1.8V devices.
For the AT93C46, if “x 16” organization is the mode of choice and Pin 6 (ORG) is left unconnected, Atmel recommends using the AT93C46A device. For more details, see the AT93C46A datasheet.
2
AT93C46
5140B–SEEPR–2/07
AT93C46
Table 2. Pin Capacitance
(1)
Applicable over recommended operating range from TA = 25°C, f = 1.0 MHz, VCC = +5.0V (unless otherwise noted)
Symbol Test Conditions Max Units Conditions
C
OUT
C
IN
Output Capacitance (DO) 5 pF V
OUT
= 0V
Input Capacitance (CS, SK, DI) 5 pF VIN = 0V
Note: 1. This parameter is characterized and is not 100% tested.
Table 3. DC Characteristics Applicable over recommended operating range from: T
T
= -40°C to +125°C, VCC = +1.8V to +5.5V (unless otherwise noted)
AE
Symbol Parameter Test Condition Min Typ Max Unit
V
CC1
V
CC2
V
CC3
I
CC
I
SB1
I
SB2
I
SB3
I
IL
I
OL
(1)
V
IL1
(1)
V
IH1
(1)
V
IL2
(1)
V
IH2
V
OL1
V
OH1
V
OL2
V
OH2
Note: 1. VIL min and VIH max are reference only and are not tested.
Supply Voltage 1.8 5.5 V
Supply Voltage 2.7 5.5 V
Supply Voltage 4.5 5.5 V
Supply Current VCC = 5.0V
Standby Current VCC = 1.8V CS = 0V 0 0.1 µA
Standby Current VCC = 2.7V CS = 0V 6.0 10.0 µA
Standby Current VCC = 5.0V CS = 0V 17 30 µA
Input Leakage VIN = 0V to VCC 0.1 1.0 µA
Output Leakage VIN = 0V to VCC 0.1 1.0 µA
Input Low Voltage
2.7V VCC 5.5V
Input High Voltage 2.0 VCC + 1
Input Low Voltage
1.8V V
Input High Voltage VCC x 0.7 VCC + 1
Output Low Voltage
Output High Voltage IOH = 0.4 mA 2.4 V
2.7V V
5.5V
CC
Output Low Voltage
Output High Voltage IOH = 100 µAV
1.8V V
2.7V
CC
= −40°C to +85°C, VCC = +1.8V to +5.5V,
AI
READ at 1.0 MHz 0.5 2.0 mA
WRITE at 1.0 MHz 0.5 2.0 mA
0.6 0.8
2.7V
0.6 V
CC
I
= 2.1 mA 0.4 V
OL
I
= 0.15 mA 0.2 V
OL
– 0.2 V
CC
CC
x 0.3
V
V
5140B–SEEPR–2/07
3
Table 4. AC Characteristics
Applicable over recommended operating range from T
= 40°C to + 85°C, VCC = As Specified,
AI
CL = 1 TTL Gate and 100 pF (unless otherwise noted)
Symbol Parameter Test Condition Min Typ Max Units
f
t
t
t
t
t
t
t
SK
SKH
SKL
CS
CSS
DIS
CSH
DIH
SK Clock Frequency
SK High Time
4.5V V
2.7V V
1.8V VCC 5.5V
4.5V V
2.7V V
5.5V
CC
5.5V
CC
5.5V
CC
5.5V
CC
1.8V VCC 5.5V
SK Low Time
4.5V V
2.7V V
5.5V
CC
5.5V
CC
1.8V VCC 5.5V
Minimum CS Low Time
4.5V V
2.7V V
1.8V VCC 5.5V
5.5V
CC
5.5V
CC
CS Setup Time Relative to SK
DI Setup Time Relative to SK
4.5V V
2.7V V
5.5V
CC
5.5V
CC
1.8V VCC 5.5V
4.5V V
2.7V V
5.5V
CC
5.5V
CC
1.8V VCC 5.5V
0 0 0
250 250
1000
250 250
1000
250 250
1000
50 50
200
100 100 400
CS Hold Time Relative to SK 0 ns
DI Hold Time Relative to SK
4.5V VCC 5.5V
2.7V VCC 5.5V
1.8V VCC 5.5V
100 100 400
2 1
0.25
MHz
ns
ns
ns
ns
ns
ns
4.5V V
2.7V VCC 5.5V
1.8V VCC 5.5V
4.5V V
2.7V VCC 5.5V
1.8V V
4.5V V
2.7V V
1.8V VCC 5.5V
4.5V VCC 5.5V
2.7V V
1.8V V
4.5V V
t
PD1
t
PD0
t
SV
t
DF
t
WP
Endurance
Output Delay to “1”
Output Delay to “0”
CS to Status Valid
CS to DO in High Impedance
AC Test
AC Test
AC Test
AC Test CS = V
IL
Write Cycle Time
(1)
5.0V, 25°C 1M Write Cycles
Note: 1. This parameter is characterized and is not 100% tested.
5.5V
CC
250 250
1000
5.5V
CC
250 250
5.5V
CC
5.5V
CC
5.5V
CC
1000
250 250
1000
100
5.5V
CC
5.5V
CC
100 400
10 ms
5.5V 0.1 3 ms
CC
ns
ns
ns
ns
4
AT93C46
5140B–SEEPR–2/07
Table 5. Instruction Set for the AT93C46
AT93C46
Op
Instruction SB
Code
READ 1 10 A6 – A
EWEN 1 00 11XXXXX 11XXXX
ERASE 1 11 A
WRITE 1 01 A6 – A
ERAL 1 00 10XXXXX 10XXXX
WRAL 1 00 01XXXXX 01XXXX D7 – D
Address Data
A5 – A
A5 – A
A5 – A
0
0
0
D7 – D
6
– A
0
0
0
Commentsx 8 x 16 x 8 x 16
Reads data stored in memory, at specified address
Write enable must precede all programming modes
Erases memory location An – A
D
0
15
– D
Writes memory location An – A
0
0
0
Erases all memory locations. Valid only at V
D
0
15
– D
Writes all memory locations. Valid
0
only at VCC = 4.5V to 5.5V
= 4.5V to 5.5V
CC
EWDS 1 00 00XXXXX 00XXXX Disables all programming instructions
Note: The Xs in the address field represent DON’T CARE values and must be clocked.

Functional Description

The AT93C46 is accessed via a simple and versatile three-wire serial communication interface. Device operation is controlled by seven instructions issued by the host pro­cessor. A valid instruction starts with a rising edge of CS and consists of a start bit (logic “1”) followed by the appropriate op code and the desired memory address location.
READ (READ): The Read (READ) instruction contains the address code for the mem­ory location to be read. After the instruction and address are decoded, data from the selected memory location is available at the serial output pin DO. Output data changes are synchronized with the rising edges of serial clock SK. It should be noted that a dummy bit (logic “0”) precedes the 8- or 16-bit data output string.
ERASE/WRITE ENABLE (EWEN): To assure data integrity, the part automatically goes into the Erase/Write Disable (EWDS) state when power is first applied. An Erase/Write Enable (EWEN) instruction must be executed first before any programming instructions can be carried out. Please note that once in the EWEN state, programming remains enabled until an EWDS instruction is executed or V
power is removed from the part.
CC
ERASE (ERASE): The Erase (ERASE) instruction programs all bits in the specified memory location to the logical “1” state. The self-timed erase cycle starts once the Erase instruction and address are decoded. The DO pin outputs the Ready/Busy status of the part if CS is brought high after being kept low for a minimum of 250 ns (t
CS
). A logic “1” at pin DO indicates that the selected memory location has been erased and the part is ready for another instruction.
WRITE (WRITE): The Write (WRITE) instruction contains the 8 or 16 bits of data to be written into the specified memory location. The self-timed programming cycle t
WP
starts after the last bit of data is received at serial data input pin DI. The DO pin outputs the Read/Busy status of the part if CS is brought high after being kept low for a minimum of 250 ns (t
). A logic “0” at DO indicates that programming is still in progress. A logic “1”
CS
indicates that the memory location at the specified address has been written with the data pattern contained in the instruction and the part is ready for further instructions. A
Ready/Busy status cannot be obtained if the CS is brought high after the end of the self­timed programming cycle tWP.
5140B–SEEPR–2/07
5
ERASE ALL (ERAL): The Erase All (ERAL) instruction programs every bit in the mem-
ory array to the logic “1” state and is primarily used for testing purposes. The DO pin outputs the Ready/Busy status of the part if CS is brought high after being kept low for a minimum of 250 ns (t
WRITE ALL (WRAL): The Write All (WRAL) instruction programs all memory locations with the data patterns specified in the instruction. The DO pin outputs the Ready/Busy status of the part if CS is brought high after being kept low for a minimum of 250 ns (t The WRAL instruction is valid only at V
ERASE/WRITE DISABLE (EWDS): To protect against accidental data disturb, the Erase/Write Disable (EWDS) instruction disables all programming modes and should be executed after all programming operations. The operation of the Read instruction is independent of both the EWEN and EWDS instructions and can be executed at any time.

Timing Diagrams

Figure 2. Synchronous Data Timing
). The ERAL instruction is valid only at VCC = 5.0V ± 10%.
CS
= 5.0V ± 10%.
CC
µs
CS
).
Note: 1. This is the minimum SK period.
Table 6. Organization Key for Timing Diagrams
6
AT93C46
I/O
A
D
AT93C46 (1K)
x 8 x 16
N
N
A
6
D
7
A
5
D
15
5140B–SEEPR–2/07
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