ATMEL ATxmega256A3 User Manual

BDTIC www.bdtic.com/ATMEL

Features

High-performance, Low-power AVR 8/16-bit XMEGA Microcontroller
Non-volatile Program and Data Memories
– 64K - 256K Bytes of In-System Self-Programmable Flash – 4K - 8K Boot Code Section with Independent Lock Bits – 2K - 4K Bytes EEPROM – 4K - 16K Bytes Internal SRAM
External Bus Interface for up to 16M bytes SRAM External Bus Interface for up to 128M Bytes SDRAM
Peripheral Features
– Four-channel DMA Controller with support for external requests – Eight-channel Event System – Seven 16-bit Timer/Counters
Four Timer/Counters with 4 Output Compare or Input Capture channels Three Timer/Counters with 2 Output Compare or Input Capture channels High Resolution Extensions on all Timer/Counters Advanced Waveform Extension on one Timer/Counter
– Seven USARTs
IrDA Extension on 1 USART – AES and DES Crypto Engine – Two Two-wire Interfaces with dual address match(I – Three SPI (Serial Peripheral Interfaces) – 16-bit Real Time Counter with Separate Oscillator – Two Eight-channel, 12-bit, 2 Msps Analog to Digital Converters – One Two-channel, 12-bit, 1 Msps Digital to Analog Converter – Four Analog Comparators with Window compare function – External Interrupts on all General Purpose I/O pins – Programmable Watchdog Timer with Separate On-chip Ultra Low Power Oscillator
Special Microcontroller Features
– Power-on Reset and Programmable Brown-out Detection – Internal and External Clock Options with PLL – Programmable Multi-level Interrupt Controller – Sleep Modes: Idle, Power-down, Standby, Power-save, Extended Standby – Advanced Programming, Test and Debugging Interfaces
JTAG (IEEE 1149.1 Compliant) Interface for test, debug and programming
PDI (Program and Debug Interface) for programming, test and debugging
I/O and Packages
– 50 Programmable I/O Lines – 64-lead TQFP – 64-pad MLF
Operating Voltage
– 1.6 – 3.6V
Speed performance
– 0 – 12 MHz @ 1.6 – 3.6V – 0 – 32 MHz @ 2.7 – 3.6V
2
C and SMBus compatible)
8/16-bit XMEGA A3
Microcontroller
ATxmega256A3 ATxmega192A3 ATxmega128A3 ATxmega64A3
Preliminary

Typical Applications

Industrial control Climate control Hand-held battery applications
Factory automation ZigBee Power tools
Building control Motor control HVAC
Board control Networking Metering
White Goods Optical Medical Applications
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1. Ordering Information

XMEGA A3
Ordering Code Flash (B) E2 (B) SRAM (B) Speed (MHz) Power Supply Package
ATxmega256A3-AU 256K + 8K 4K 16K 32 1.8 - 3.6V
ATxmega192A3-AU 192K + 8K 4K 16K 32 1.8 - 3.6V
ATxmega128A3-AU 128K + 8K 2K 8K 32 1.8 - 3.6V
ATxmega64A3-AU 64K + 4K 2K 4K 32 1.8 - 3.6V
ATxmega256A3-MU 256K + 8K 4K 16K 32 1.8 - 3.6V
ATxmega192A3-MU 192K + 8K 4K 16K 32 1.8 - 3.6V
ATxmega128A3-MU 128K + 8K 2K 8K 32 1.8 - 3.6V
ATxmega64A3-MU 64K + 4K 2K 4K 32 1.8 - 3.6V
Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information.
2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green.
3. For packaging information, see ”Packaging information” on page 63.

2. Pinout/Block Diagram

Package Type
64A
64M1
Figure 2-1. Block diagram and TQFP-pinout.
64-lead, 14 x 14 mm Body Size, 1.0 mm Body Thickness, 0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)
64-pad, 9 x 9 x 1.0 mm Body, Lead Pitch 0.50 mm, 5.40 mm Exposed Pad, Micro Lead Frame Package (MLF)
64A
64M1
(1)(2)(3)
Tem p
-40° - 85°C
INDEX CORNER
PA 3 PA 4 PA 5 PA 6
PA 7 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7
GND
VCC
PC0
PR1
PR0
RESET/PDI_CLK
PDI_DATA
PF7
PA 2
PA 1
PA 0
AVCC
GND
PF6
646362616059585756555453525150
1 2 3 4 5 6 7
8
9 10 11 12 13
ADC A
A t
AC A0
Por
AC A1
ADC B
DAC B
B
Por t
AC B0
AC B1
Port R
OSC/CLK
Control
Power
Control
Reset
Control
Watchdog
EVENT ROUTING NETWORK
DATA BU S
VREF
BOD POR
TEMP
RTC
CPU
DMA
Interrupt Controller
Event System ctrl
DATA BU S
14 15 16
T/C0:1
USART0:1
SPI
TWI
USART0:1
T/C0:1
T/C0:1
Port C Port D Port E Port F
USART0:1
SPI
171819202122232425262728293031
PD0
PC1
PC2
PC3
PC4
PC5
PC6
PC7
GND
VCC
PD1
VCC
FLASH
RAM
E2PROM
SPI
TWI
PD2
GND
OCD
PD3
T/C0
PF5
PD4
PF4
USART0
PD5
PF3
49
32
PD6
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
PF2 PF1 PF0 VCC GND PE7 PE6 PE5 PE4 PE3 PE2 PE1 PE0 VCC GND PD7
Note: 1. For full details on pinout and alternate pin functions refer to ”Pinout and Pin Functions” on page 48.
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3. Overview

XMEGA A3
The XMEGA A3 is a family of low power, high performance and peripheral rich CMOS 8/16-bit microcontrollers based on the AVR instructions in a single clock cycle, the XMEGA A3 achieves throughputs approaching 1 Million Instructions Per Second (MIPS) per MHz allowing the system designer to optimize power con­sumption versus processing speed.
The AVR CPU combines a rich instruction set with 32 general purpose working registers. All the 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent registers to be accessed in one single instruction, executed in one clock cycle. The resulting architecture is more code efficient while achieving throughputs many times faster than conven­tional single-accumulator or CISC based microcontrollers.
The XMEGA A3 devices provide the following features: In-System Programmable Flash with Read-While-Write capabilities, Internal EEPROM and SRAM, four-channel DMA Controller, eight-channel Event System, Programmable Multi-level Interrupt Controller, 50 general purpose I/O lines, 16-bit Real Time Counter (RTC), seven flexible 16-bit Timer/Counters with compare modes and PWM, seven USARTs, two Two Wire Serial Interfaces (TWIs), three Serial Periph­eral Interfaces (SPIs), AES and DES crypto engine, two 8-channel 12-bit ADCs with optional differential input with programmable gain, one 2-channel 12-bit DACs, four analog comparators with window mode, programmable Watchdog Timer with separate Internal Oscillator, accurate internal oscillators with PLL and prescaler and programmable Brown-Out Detection.
The Program and Debug Interface (PDI), a fast 2-pin interface for programming and debugging, is available. The devices also have an IEEE std. 1149.1 compliant JTAG test interface, and this can also be used for On-chip Debug and programming.
®
enhanced RISC architecture. By executing powerful
The XMEGA A3 devices have five software selectable power saving modes. The Idle mode stops the CPU while allowing the SRAM, DMA Controller, Event System, Interrupt Controller and all peripherals to continue functioning. The Power-down mode saves the SRAM and register contents but stops the oscillators, disabling all other functions until the next TWI or pin-change interrupt, or Reset. In Power-save mode, the asynchronous Real Time Counter continues to run, allowing the application to maintain a timer base while the rest of the device is sleeping. In Standby mode, the Crystal/Resonator Oscillator is kept running while the rest of the device is sleeping. This allows very fast start-up from external crystal combined with low power consump­tion. In Extended Standby mode, both the main Oscillator and the Asynchronous Timer continue to run. To further reduce power consumption, the peripheral clock for each individual peripheral can optionally be stopped in Active mode and Idle sleep mode.
The device is manufactured using Atmel's high-density nonvolatile memory technology. The pro­gram Flash memory can be reprogrammed in-system through the PDI or JTAG. A Bootloader running in the device can use any interface to download the application program to the Flash memory. The Bootloader software in the Boot Flash section will continue to run while the Appli­cation Flash section is updated, providing true Read-While-Write operation. By combining an 8/16-bit RISC CPU with In-System Self-Programmable Flash, the Atmel XMEGA A3 is a power­ful microcontroller family that provides a highly flexible and cost effective solution for many embedded applications.
The XMEGA A3 devices are supported with a full suite of program and system development tools including: C compilers, macro assemblers, program debugger/simulators, programmers, and evaluation kits.
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3.1 Block Diagram

Figure 3-1. XMEGA A3 Block Diagram
XMEGA A3
PR[0..1]
XTAL1
XTAL2
PA[0..7]
PB[0..7]/
JTAG
PORT A (8)
ACA
ADCA
AREFA
Internal
Reference
AREFB
ADCB
ACB
PORT B (8)
DACB
Event System
Controller
DMA
Controller
BUS
Controller
DES
AES
Oscillator
Circuits/
Clock
PORT R (2)
DATA BUS
SRAM
CPU
NVM Controller
Flash EEPROM
Generation
Prog/Debug
Oscillator
Control
Sleep
Controller
Controller
OCD
Interrupt
Controller
Real Time
Counter
Watchdog Oscillator
Watchdog
Timer
Power Supervision POR/BOD &
RESET
PDI
JTAG
USARTF0
TCF0
PORT B
VCC
GND
RESET/ PDI_CLK
PDI_DATA
PF[0..7]
PORT F (8)
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IRCOM
TCC0:1
USARTC0:1
PORT C (8)
PC[0..7]
DATA BUS
EVENT ROUTING NETWORK
SPIC
TWIC
PORT D (8)
PD[0..7]
SPID
TCD0:1
USARTD0:1
PORT E (8)
TCE0:1
PE[0..6]
SPIE
TWIE
USARTE0:1
To Clock Generator
TOSC1
TOSC2
4

4. Resources

A comprehensive set of development tools, application notes and datasheets are available for download on http://www.atmel.com/avr.

4.1 Recommended reading

• XMEGA A Manual
• XMEGA A Application Notes
This device data sheet only contains part specific information and a short description of each peripheral and module. The XMEGA A Manual describes the modules and peripherals in depth. The XMEGA A application notes contain example code and show applied use of the modules and peripherals.
The XMEGA A Manual and Application Notes are available from http://www.atmel.com/avr.

5. Disclaimer

For devices that are not available yet, typical values contained in this datasheet are based on simulations and characterization of other AVR XMEGA microcontrollers manufactured on the same process technology. Min. and Max values will be available after the device is characterized.
XMEGA A3
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6. AVR CPU

6.1 Features

6.2 Overview

XMEGA A3
8/16-bit high performance AVR RISC Architecture
– 138 instructions – Hardware multiplier
32x8-bit registers directly connected to the ALU
Stack in RAM
Stack Pointer accessible in I/O memory space
Direct addressing of up to 16M bytes of program and data memory
True 16/24-bit access to 16/24-bit I/O registers
Support for 8-, 16- and 32-bit Arithmetic
Configuration Change Protection of system critical features
The XMEGA A3 uses an 8/16-bit AVR CPU. The main function of the AVR CPU is to ensure cor­rect program execution. The CPU must therefore be able to access memories, perform calculations and control peripherals. Interrupt handling is described in a separate section. Figure
6-1 on page 6 shows the CPU block diagram.
Figure 6-1. CPU block diagram
Program
Counter
OCD
STATUS/
CONTROL
Peripheral
Module 1
Peripheral
Module 2
DATA BUS
Flash Program Memory
Instruction
Register
Instruction
Decode
ALU
DATA BUS
32 x 8 General
Purpose
Registers
Multiplier/
DES
EEPROM PMICSRAM
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The AVR uses a Harvard architecture - with separate memories and buses for program and data. Instructions in the program memory are executed with a single level pipeline. While one instruction is being executed, the next instruction is pre-fetched from the program memory.
6
This concept enables instructions to be executed in every clock cycle. The program memory is In-System Re-programmable Flash memory.

6.3 Register File

The fast-access Register File contains 32 x 8-bit general purpose working registers with a single clock cycle access time. This allows single-cycle Arithmetic Logic Unit (ALU) operation. In a typ­ical ALU operation, two operands are output from the Register File, the operation is executed, and the result is stored back in the Register File - in one clock cycle.
Six of the 32 registers can be used as three 16-bit indirect address register pointers for Data Space addressing - enabling efficient address calculations. One of these address pointers can also be used as an address pointer for look up tables in Flash program memory.

6.4 ALU - Arithmetic Logic Unit

The high performance Arithmetic Logic Unit (ALU) supports arithmetic and logic operations between registers or between a constant and a register. Single register operations can also be executed. Within a single clock cycle, arithmetic operations between general purpose registers or between a register and an immediate are executed. After an arithmetic or logic operation, the Status Register is updated to reflect information about the result of the operation.
XMEGA A3

6.5 Program Flow

The ALU operations are divided into three main categories – arithmetic, logical, and bit-func­tions. Both 8- and 16-bit arithmetic is supported, and the instruction set allows for easy implementation of 32-bit arithmetic. The ALU also provides a powerful multiplier supporting both signed and unsigned multiplication and fractional format.
When the device is powered on, the CPU starts to execute instructions from the lowest address in the Flash Program Memory ‘0’. The Program Counter (PC) addresses the next instruction to be fetched. After a reset, the PC is set to location ‘0’.
Program flow is provided by conditional and unconditional jump and call instructions, capable of addressing the whole address space directly. Most AVR instructions use a 16-bit word format, while a limited number uses a 32-bit format.
During interrupts and subroutine calls, the return address PC is stored on the Stack. The Stack is effectively allocated in the general data SRAM, and consequently the Stack size is only limited by the total SRAM size and the usage of the SRAM. After reset the Stack Pointer (SP) points to the highest address in the internal SRAM. The SP is read/write accessible in the I/O memory space, enabling easy implementation of multiple stacks or stack areas. The data SRAM can easily be accessed through the five different addressing modes supported in the AVR CPU.
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7. Memories

7.1 Features

7.2 Overview

XMEGA A3
Flash Program Memory
– One linear address space – In-System programmable – Self-Programming and Bootloader support – Application Section for application code – Application Table Section for application code or data storage – Boot Section for application code or bootloader code – Separate lock bits and protection for all sections
Data Memory
– One linear address space – Single cycle access from CPU – SRAM – EEPROM
Byte or page accessible Optional memory mapping for direct load and store
– I/O Memory
Configuration and Status register for all peripherals and modules
16-bit accessible General Purpose Register for global variables or flags – External Memory support – Bus arbitration
Safe and deterministic handling of CPU and DMA Controller priority – Separate buses for SRAM, EEPROM, I/O Memory and External Memory access
Simultaneous bus access for CPU and DMA Controller
Calibration Row Memory for factory programmed data
Oscillator calibration bytes
Serial number
Device ID for each device type
User Signature Row
One flash page in size
Can be read and written from software
Data is kept after Chip Erase
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The AVR architecture has two main memory spaces, the Program Memory and the Data Mem­ory. In addition, the XMEGA A3 features an EEPROM Memory for non-volatile data storage. All three memory spaces are linear and require no paging. The available memory size configura­tions are shown in ”Ordering Information” on page 2. In addition each device has a Flash memory signature row for calibration data, device identification, serial number etc.
Non-volatile memory spaces can be locked for further write or read/write operations. This pre­vents unrestricted access to the application software.
8

7.3 In-System Programmable Flash Program Memory

The XMEGA A3 devices contains On-chip In-System Programmable Flash memory for program storage, see Figure 7-1 on page 9. Since all AVR instructions are 16- or 32-bits wide, each Flash address location is 16 bits.
The Program Flash memory space is divided into Application and Boot sections. Both sections have dedicated Lock Bits for setting restrictions on write or read/write operations. The Store Pro­gram Memory (SPM) instruction must reside in the Boot Section when used to write to the Flash memory.
A third section inside the Application section is referred to as the Application Table section which has separate Lock bits for storage of write or read/write protection. The Application Table sec­tion can be used for storing non-volatile data or application software.
Figure 7-1. Flash Program Memory (Hexadecimal address)
Word Address
XMEGA A3
0
1EFFF / 16FFF / EFFF / 77FF
1F000 / 17000 / F000 / 7800
1FFFF / 17FFF / FFFF / 7FFF
20000 / 18000 / 10000 / 8000
20FFF / 18FFF / 10FFF / 87FF
Application Section
(256K/192K/128K/64K)
...
Application Table Section
(8K/8K/8K/4K)
Boot Section
(8K/8K/8K/4K)
The Application Table Section and Boot Section can also be used for general application software.
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9
XMEGA A3

7.4 Data Memory

The Data Memory consist of the I/O Memory, EEPROM and SRAM memories, all within one lin­ear address space, see Figure 7-2 on page 10. To simplify development, the memory map for all devices in the family is identical and with empty, reserved memory space for smaller devices.
Figure 7-2. Data Memory Map (Hexadecimal address)
Byte Address ATxmega192A3 Byte Address ATxmega128A3 Byte Address ATxmega64A3
0
FFF FFF FFF
1000
1FFF
2000
5FFF 3FFF 2FFF
6000
FFFFFF FFFFFF FFFFFF
I/O Registers
(4KB)
EEPROM
(4K)
Internal SRAM
(16K)
External Memory
(0 - 16 MB)
0
1000
17FF 17FF
2000
4000
I/O Registers
(4KB)
EEPROM
(2K)
RESERVED RESERVED
Internal SRAM
(8K)
External Memory
(0 - 16 MB)
Byte Address ATxmega256A3
1000
2000
3000
0
FFF
1000
1FFF
2000
5FFF
6000
FFFFFF
0
I/O Registers
EEPROM
Internal SRAM
External Memory
(0 - 16 MB)
I/O Registers
(4KB)
EEPROM
Internal SRAM
(16K)
External Memory
(0 - 16 MB)
(4KB)
(2K)
(4K)
(4K)
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7.4.1 I/O Memory

All peripherals and modules are addressable through I/O memory locations in the data memory space. All I/O memory locations can be accessed by the Load (LD/LDS/LDD) and Store (ST/STS/STD) instructions, transferring data between the 32 general purpose registers in the CPU and the I/O Memory.
The IN and OUT instructions can address I/O memory locations in the range 0x00 - 0x3F directly.
I/O registers within the address range 0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. The value of single bits can be checked by using the SBIS and SBIC instruc­tions on these registers.
The I/O memory address for all peripherals and modules in XMEGA A3 is shown in the ”Periph-
eral Module Address Map” on page 53.

7.4.2 SRAM Data Memory

The XMEGA A3 devices has internal SRAM memory for data storage.

7.4.3 EEPROM Data Memory

XMEGA A3
The XMEGA A3 devices has internal EEPROM memory for non-volatile data storage. It is addressable either in a separate data space or it can be memory mapped into the normal data memory space. The EEPROM memory supports both byte and page access.
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7.5 Calibration Row

The Calibration Row is a separate memory section for factory programmed data. It contains cal­ibration data for functions such as oscillators, device ID, and a factory programmed serial number that is unique for each device. The device ID for the available XMEGA A3 devices is shown in Table 7-1 on page 12. Some of the calibration values will be automatically loaded to the corresponding module or peripheral unit during reset. The Calibration Row can not be written or erased. It can be read from application software and external programming.
Table 7-1. Device ID bytes for XMEGA A3 devices.

7.6 User Signature Row

XMEGA A3
Device Device ID bytes
Byte 2 Byte 1 Byte 0
ATxmega64A3 42 96 1E
ATxmega128A3 42 97 1E
ATxmega192A3 44 97 1E
ATxmega256A3 42 98 1E
The User Signature Row is a separate memory section that is fully accessible (read and write) from application software and external programming. The User Signature Row is one flash page in size, and is meant for static user parameter storage, such as calibration data, custom serial numbers, random number seeds etc. This section is not erased by Chip Erase, and requires a dedicated erase command. This ensures parameter storage during multiple program/erase ses­sion and On-Chip Debug sessions.
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12
XMEGA A3

7.7 Flash and EEPROM Page Size

The Flash Program Memory and EEPROM data memory is organized in pages. The pages are word accessible for the Flash and byte accessible for the EEPROM.
Table 7-2 on page 13 shows the Flash Program Memory organization. Flash write and erase
operations are performed on one page at the time, while reading the Flash is done one byte at the time. For Flash access the Z-pointer (Z[m:n]) is used for addressing. The most significant bits in the address (FPAGE) gives the page number and the least significant address bits (FWORD) gives the word in the page.
Table 7-2. Number of words and Pages in the Flash.
Devices Flash Page Size FWORD FPAGE Application Boot
Size (Bytes) (words) Size No of Pages Size No of Pages
ATxmega64A3 64K + 4K 128 Z[7:1] Z[16:8] 64K 256 4K 16
ATxmega128A3 128K + 8K 256 Z[8:1] Z[17:9] 128K 256 8K 16
ATxmega192A3 192K + 8K 256 Z[8:1] Z[18:9] 192K 384 8K 16
ATxmega256A3 256K + 8K 256 Z[8:1] Z[18:9] 256K 512 8K 16
Table 7-3 on page 13 shows EEPROM memory organization for the XMEGA A3 devices.
EEEPROM write and erase operations can be performed one page or one byte at the time, while reading the EEPROM is done one byte at the time. For EEPROM access the NVM Address Register (ADDR[m:n] is used for addressing. The most significant bits in the address (E2PAGE) gives the page number and the least significant address bits (E2BYTE) gives the byte in the page.
Table 7-3. Number of bytes and Pages in the EEPROM.
Devices EEPROM Page Size E2BYTE E2PAGE No of Pages
Size (Bytes) (Bytes)
ATxmega64A3 2K 32 ADDR[4:0] ADDR[10:5] 64
ATxmega128A3 2K 32 ADDR[4:0] ADDR[10:5] 64
ATxmega192A3 2K 32 ADDR[4:0] ADDR[10:5] 64
ATxmega256A3 4K 32 ADDR[4:0] ADDR[11:5] 128
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8. DMAC - Direct Memory Access Controller

8.1 Features

Allows High-speed data transfer
– From memory to peripheral – From memory to memory – From peripheral to memory – From peripheral to peripheral
4 Channels
From 1 byte and up to 16 M bytes transfers in a single transaction
Multiple addressing modes for source and destination address
–Increment – Decrement – Static
1, 2, 4, or 8 bytes Burst Transfers
Programmable priority between channels

8.2 Overview

The XMEGA A3 has a Direct Memory Access (DMA) Controller to move data between memories and peripherals in the data space. The DMA controller uses the same data bus as the CPU to transfer data.
XMEGA A3
It has 4 channels that can be configured independently. Each DMA channel can perform data transfers in blocks of configurable size from 1 to 64K bytes. A repeat counter can be used to repeat each block transfer for single transactions up to 16M bytes. Each DMA channel can be configured to access the source and destination memory address with incrementing, decrement­ing or static addressing. The addressing is independent for source and destination address. When the transaction is complete the original source and destination address can automatically be reloaded to be ready for the next transaction.
The DMAC can access all the peripherals through their I/O memory registers, and the DMA may be used for automatic transfer of data to/from communication modules, as well as automatic data retrieval from ADC conversions, data transfer to DAC conversions, or data transfer to or from port pins. A wide range of transfer triggers is available from the peripherals, Event System and software. Each DMA channel has different transfer triggers.
To allow for continuous transfers, two channels can be interlinked so that the second takes over the transfer when the first is finished and vice versa.
The DMA controller can read from memory mapped EEPROM, but it cannot write to the EEPROM or access the Flash.
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9. Event System

9.1 Features

9.2 Overview

Inter-peripheral communication and signalling with minimum latency
CPU and DMA independent operation
8 Event Channels allows for up to 8 signals to be routed at the same time
Events can be generated by
– Timer/Counters (TCxn) – Real Time Counter (RTC) – Analog to Digital Converters (ADCx) – Analog Comparators (ACx) – Ports (PORTx) – System Clock (Clk – Software (CPU)
SYS
)
Events can be used by
– Timer/Counters (TCxn) – Analog to Digital Converters (ADCx) – Digital to Analog Converters (DACx) – Ports (PORTx) – DMA Controller (DMAC) – IR Communication Module (IRCOM)
The same event can be used by multiple peripherals for synchronized timing
Advanced Features
– Manual Event Generation from software (CPU) – Quadrature Decoding – Digital Filtering
Functions in Active and Idle mode
XMEGA A3
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The Event System is a set of features for inter-peripheral communication. It enables the possibil­ity for a change of state in one peripheral to automatically trigger actions in one or more peripherals. What changes in a peripheral that will trigger actions in other peripherals are config­urable by software. It is a simple, but powerful system as it allows for autonomous control of peripherals without any use of interrupts, CPU or DMA resources.
The indication of a change in a peripheral is referred to as an event, and is usually the same as the interrupt conditions for that peripheral. Events are passed between peripherals using a dedi­cated routing network called the Event Routing Network. Figure 9-1 on page 16 shows a basic block diagram of the Event System with the Event Routing Network and the peripherals to which it is connected. This highly flexible system can be used for simple routing of signals, pin func­tions or for sequencing of events.
The maximum latency is two CPU clock cycles from when an event is generated in one periph­eral, until the actions are triggered in one or more other peripherals.
The Event System is functional in both Active and Idle modes.
15
Figure 9-1. Event system block diagram.
XMEGA A3
PORTx
ADCx
ClkSYS
CPU
RTC
Event Routing
Network
DACx
ACx
DMACIRCOM
T/Cxn
The Event Routing Network can directly connect together ADCs, DACs, Analog Comparators (ACx), I/O ports (PORTx), the Real-time Counter (RTC), Timer/Counters (T/C) and the IR Com­munication Module (IRCOM). Events can also be generated from software (CPU).
All events from all peripherals are always routed into the Event Routing Network. This consist of eight multiplexers where each can be configured in software to select which event to be routed into that event channel. All eight event channels are connected to the peripherals that can use events, and each of these peripherals can be configured to use events from one or more event channels to automatically trigger a software selectable action.
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10. System Clock and Clock options

10.1 Features

Fast start-up time
Safe run-time clock switching
Internal Oscillators:
– 32 MHz run-time calibrated RC oscillator – 2 MHz run-time calibrated RC oscillator – 32 kHz calibrated RC oscillator – 32 kHz Ultra Low Power (ULP) oscillator
External clock options
– 0.4 - 16 MHz Crystal Oscillator – 32 kHz Crystal Oscillator – External clock
PLL with internal and external clock options with 2 to 31x multiplication
Clock Prescalers with 2 to 2048x division
Fast peripheral clock running at 2 and 4 times the CPU clock speed
Automatic Run-Time Calibration of internal oscillators
Crystal Oscillator failure detection

10.2 Overview

XMEGA A3
XMEGA A3 has an advanced clock system, supporting a large number of clock sources. It incor­porates both integrated oscillators, external crystal oscillators and resonators. A high frequency Phase Locked Loop (PLL) and clock prescalers can be controlled from software to generate a wide range of clock frequencies from the clock source input.
It is possible to switch between clock sources from software during run-time. After reset the device will always start up running from the 2 Mhz internal oscillator.
A calibration feature is available, and can be used for automatic run-time calibration of the inter­nal 2 MHz and 32 MHz oscillators. This reduce frequency drift over voltage and temperature.
A Crystal Oscillator Failure Monitor can be enabled to issue a Non-Maskable Interrupt and switch to internal oscillator if the external oscillator fails. Figure 10-1 on page 18 shows the prin­cipal clock system in XMEGA A3.
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17
Figure 10-1. Clock system overview
32 kHz ULP
Internal Oscillator
32.768 kHz
Calibrated Internal
Oscillator
clk
clk
XMEGA A3
ULP
WDT/BOD
RTC
RTC
2 MHz
Run-Time Calibrated
Internal Oscillator
CLOCK CONTROL
32 MHz
Run-time Calibrated
Internal Oscillator
UNIT
with PLL and
clk
Prescaler
32.768 KHz
Crystal Oscillator
0.4 - 16 MHz
Crystal Oscillator
clk
External
Clock Input
Each clock source is briefly described in the following sub-sections.
PERIPHERALS
PER
INTERRUPT
NVM MEMORY
CPU
ADC DAC
PORTS
...
DMA
EVSYS
RAM
CPU
FLASH
EEPROM

10.3 Clock Options

10.3.1 32 kHz Ultra Low Power Internal Oscillator

The 32 kHz Ultra Low Power (ULP) Internal Oscillator is a very low power consumption clock source. It is used for the Watchdog Timer, Brown-Out Detection and as an asynchronous clock source for the Real Time Counter. This oscillator cannot be used as the system clock source, and it cannot be directly controlled from software.

10.3.2 32.768 kHz Calibrated Internal Oscillator

The 32.768 kHz Calibrated Internal Oscillator is a high accuracy clock source that can be used as the system clock source or as an asynchronous clock source for the Real Time Counter. It is calibrated during protection to provide a default frequency which is close to its nominal frequency.
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10.3.3 32.768 kHz Crystal Oscillator

The 32.768 kHz Crystal Oscillator is a low power driver for an external watch crystal. It can be used as system clock source or as asynchronous clock source for the Real Time Counter.

10.3.4 0.4 - 16 MHz Crystal Oscillator

The 0.4 - 16 MHz Crystal Oscillator is a driver intended for driving both external resonators and crystals ranging from 400 kHz to 16 MHz.

10.3.5 2 MHz Run-time Calibrated Internal Oscillator

The 2 MHz Run-time Calibrated Internal Oscillator is a high frequency oscillator. It is calibrated during protection to provide a default frequency which is close to its nominal frequency. The oscillator can use the 32 kHz Calibrated Internal Oscillator or the 32 kHz Crystal Oscillator as a source for calibrating the frequency run-time to compensate for temperature and voltage drift hereby optimizing the accuracy of the oscillator.

10.3.6 32 MHz Run-time Calibrated Internal Oscillator

The 32 MHz Run-time Calibrated Internal Oscillator is a high frequency oscillator. It is calibrated during protection to provide a default frequency which is close to its nominal frequency. The oscillator can use the 32 kHz Calibrated Internal Oscillator or the 32 kHz Crystal Oscillator as a source for calibrating the frequency run-time to compensate for temperature and voltage drift hereby optimizing the accuracy of the oscillator.
XMEGA A3

10.3.7 External Clock input

The external clock input gives the possibility to connect a clock from an external source.

10.3.8 PLL with Multiplication factor 2 - 31x

The PLL provides the possibility of multiplying a frequency by any number from 2 to 31. In com­bination with the prescalers, this gives a wide range of output frequencies from all clock sources.
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11. Power Management and Sleep Modes

11.1 Features

5 sleep modes
–Idle – Power-down –Power-save –Standby – Extended standby
Power Reduction registers to disable clocks to unused peripherals

11.2 Overview

The XMEGA A3 provides various sleep modes tailored to reduce power consumption to a mini­mum. All sleep modes are available and can be entered from Active mode. In Active mode the CPU is executing application code. The application code decides when and what sleep mode to enter. Interrupts from enabled peripherals and all enabled reset sources can restore the micro­controller from sleep to Active mode.
In addition, Power Reduction registers provide a method to stop the clock to individual peripher­als from software. When this is done, the current state of the peripheral is frozen and there is no power consumption from that peripheral. This reduces the power consumption in Active mode and Idle sleep mode.
XMEGA A3

11.3 Sleep Modes

11.3.1 Idle Mode

In Idle mode the CPU and Non-Volatile Memory are stopped, but all peripherals including the Interrupt Controller, Event System and DMA Controller are kept running. Interrupt requests from all enabled interrupts will wake the device.

11.3.2 Power-down Mode

In Power-down mode all system clock sources, and the asynchronous Real Time Counter (RTC) clock source, are stopped. This allows operation of asynchronous modules only. The only inter­rupts that can wake up the MCU are the Two Wire Interface address match interrupts, and asynchronous port interrupts, e.g pin change.

11.3.3 Power-save Mode

Power-save mode is identical to Power-down, with one exception: If the RTC is enabled, it will keep running during sleep and the device can also wake up from RTC interrupts.

11.3.4 Standby Mode

Standby mode is identical to Power-down with the exception that all enabled system clock sources are kept running, while the CPU, Peripheral and RTC clocks are stopped. This reduces the wake-up time when external crystals or resonators are used.
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11.3.5 Extended Standby Mode

Extended Standby mode is identical to Power-save mode with the exception that all enabled system clock sources are kept running while the CPU and Peripheral clocks are stopped. This reduces the wake-up time when external crystals or resonators are used.
XMEGA A3
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12. System Control and Reset

12.1 Features

Multiple reset sources for safe operation and device reset
– Power-On Reset – External Reset – Watchdog Reset
The Watchdog Timer runs from separate, dedicated oscillator – Brown-Out Reset
Accurate, programmable Brown-Out levels – JTAG Reset – PDI reset – Software reset
Asynchronous reset
– No running clock in the device is required for reset
Reset status register

12.2 Resetting the AVR

During reset, all I/O registers are set to their initial values. The SRAM content is not reset. Appli­cation execution starts from the Reset Vector. The instruction placed at the Reset Vector should be an Absolute Jump (JMP) instruction to the reset handling routine. By default the Reset Vector address is the lowest Flash program memory address, ‘0’, but it is possible to move the Reset Vector to the first address in the Boot Section.
XMEGA A3
The I/O ports of the AVR are immediately tri-stated when a reset source goes active.
The reset functionality is asynchronous, so no running clock is required to reset the device.
After the device is reset, the reset source can be determined by the application by reading the Reset Status Register.

12.3 Reset Sources

12.3.1 Power-On Reset

The MCU is reset when the supply voltage VCC is below the Power-on Reset threshold voltage.

12.3.2 External Reset

The MCU is reset when a low level is present on the RESET pin.

12.3.3 Watchdog Reset

The MCU is reset when the Watchdog Timer period expires and the Watchdog Reset is enabled. The Watchdog Timer runs from a dedicated oscillator independent of the System Clock. For more details see WDT - Watchdog Timer” on page 23.

12.3.4 Brown-Out Reset

The MCU is reset when the supply voltage VCC is below the Brown-Out Reset threshold voltage and the Brown-out Detector is enabled. The Brown-out threshold voltage is programmable.
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12.3.5 JTAG reset

The MCU is reset as long as there is a logic one in the Reset Register in one of the scan chains of the JTAG system. Refer to IEEE 1149.1 (JTAG) Boundary-scan for details.

12.3.6 PDI reset

The MCU can be reset through the Program and Debug Interface (PDI).

12.3.7 Software reset

The MCU can be reset by the CPU writing to a special I/O register through a timed sequence.

12.4 WDT - Watchdog Timer

12.4.1 Features

11 selectable timeout periods, from 8 ms to 8s.
Two operation modes
– Standard mode – Window mode
Runs from the 1 kHz output of the 32 kHz Ultra Low Power oscillator
Configuration lock to prevent unwanted changes

12.4.2 Overview

XMEGA A3
The XMEGA A3 has a Watchdog Timer (WDT). The WDT will run continuously when turned on and if the Watchdog Timer is not reset within a software configurable time-out period, the micro­controller will be reset. The Watchdog Reset (WDR) instruction must be run by software to reset the WDT, and prevent microcontroller reset.
The WDT has a Window mode. In this mode the WDR instruction must be run within a specified period called a window. Application software can set the minimum and maximum limits for this window. If the WDR instruction is not executed inside the window limits, the microcontroller will be reset.
A protection mechanism using a timed write sequence is implemented in order to prevent unwanted enabling, disabling or change of WDT settings.
For maximum safety, the WDT also has an Always-on mode. This mode is enabled by program­ming a fuse. In Always-on mode, application software can not disable the WDT.
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13. PMIC - Programmable Multi-level Interrupt Controller

13.1 Features

Separate interrupt vector for each interrupt
Short, predictable interrupt response time
Programmable Multi-level Interrupt Controller
– 3 programmable interrupt levels – Selectable priority scheme within low level interrupts (round-robin or fixed) – Non-Maskable Interrupts (NMI)
Interrupt vectors can be moved to the start of the Boot Section

13.2 Overview

XMEGA A3 has a Programmable Multi-level Interrupt Controller (PMIC). All peripherals can define three different priority levels for interrupts; high, medium or low. Medium level interrupts may interrupt low level interrupt service routines. High level interrupts may interrupt both low­and medium level interrupt service routines. Low level interrupts have an optional round robin scheme to make sure all interrupts are serviced within a certain amount of time.
The built in oscillator failure detection mechanism can issue a Non-Maskable Interrupt (NMI).
XMEGA A3

13.3 Interrupt vectors

When an interrupt is serviced, the program counter will jump to the interrupt vector address. The interrupt vector is the sum of the peripheral’s base interrupt address and the offset address for specific interrupts in each peripheral. The base addresses for the XMEGA A3 devices are shown in Table 13-1. Offset addresses for each interrupt available in the peripheral are described for each peripheral in the XMEGA A manual. For peripherals or modules that have only one inter­rupt, the interrupt vector is shown in Table 13-1. The program address is the word address.
Table 13-1. Reset and Interrupt Vectors
Program Address
(Base Address) Source Interrupt Description
0x000 RESET
0x002 OSCF_INT_vect Crystal Oscillator Failure Interrupt vector (NMI)
0x004 PORTC_INT_base Port C Interrupt base
0x008 PORTR_INT_base Port R Interrupt base
0x00C DMAC_INT_base DMA Controller Interrupt base
0x014 RTC_INT_base Real Time Counter Interrupt base
0x018 TWIC_INT_base Two-Wire Interface on Port C Interrupt base
0x01C TIMERC0_INT_base Timer/Counter 0 on port C Interrupt base
0x028 TIMERC1_INT_base Timer/Counter 1 on port C Interrupt base
0x030 SPIC_INT_vect SPI on port C Interrupt vector
0x032 USARTC0_INT_base USART 0 on port C Interrupt base
0x03D USARTC1_INT_base USART 1 on port C Interrupt base
0x03E AES_INT_vect AES Interrupt vector
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Table 13-1. Reset and Interrupt Vectors (Continued)
Program Address
(Base Address) Source Interrupt Description
0x040 NVM_INT_base Non-Volatile Memory Interrupt base
0x044 PORTB_INT_base Port B Interrupt base
0x048 ACB_INT_base Analog Comparator on Port B Interrupt base
0x04E ADCB_INT_base Analog to Digital Converter on Port B Interrupt base
0x056 PORTE_INT_base Port E INT base
0x05A TWIE_INT_base Two-Wire Interface on Port E Interrupt base
0x05E TIMERE0_INT_base Timer/Counter 0 on port E Interrupt base
0x06A TIMERE1_INT_base Timer/Counter 1 on port E Interrupt base
0x072 SPIE_INT_vect SPI on port E Interrupt vector
0x074 USARTE0_INT_base USART 0 on port E Interrupt base
0x07A USARTE1_INT_base USART 1 on port E Interrupt base
0x080 PORTD_INT_base Port D Interrupt base
0x084 PORTA_INT_base Port A Interrupt base
0x088 ACA_INT_base Analog Comparator on Port A Interrupt base
0x08E ADCA_INT_base Analog to Digital Converter on Port A Interrupt base
XMEGA A3
0x09A TIMERD0_INT_base Timer/Counter 0 on port D Interrupt base
0x0A6 TIMERD1_INT_base Timer/Counter 1 on port D Interrupt base
0x0AE SPID_INT_vector SPI D Interrupt vector
0x0B0 USARTD0_INT_base USART 0 on port D Interrupt base
0x0B6 USARTD1_INT_base USART 1 on port D Interrupt base
0x0D0 PORTF_INT_base Port F Interrupt base
0x0D8 TIMERF0_INT_base Timer/Counter 0 on port F Interrupt base
0x0EE USARTF0_INT_base USART 0 on port F Interrupt base
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14. I/O Ports

14.1 Features

14.2 Overview

XMEGA A3
Selectable input and output configuration for each pin individually
Flexible pin configuration through dedicated Pin Configuration Register
Synchronous and/or asynchronous input sensing with port interrupts and events
– Sense both edges – Sense rising edges – Sense falling edges – Sense low level
Asynchronous wake-up from all input sensing configurations
Two port interrupts with flexible pin masking
Highly configurable output driver and pull settings:
– Totem-pole – Pull-up/-down – Wired-AND – Wired-OR – Bus-keeper – Inverted I/O
Optional Slew rate control
Configuration of multiple pins in a single operation
Read-Modify-Write (RMW) support
Toggle/clear/set registers for Output and Direction registers
Clock output on port pin
Event Channel 7 output on port pin
Mapping of port registers (virtual ports) into bit accessible I/O memory space
The XMEGA A3 devices have flexible General Purpose I/O Ports. A port consists of up to 8 pins, ranging from pin 0 to pin 7. The ports implement several functions, including synchronous/asyn­chronous input sensing, pin change interrupts and configurable output settings. All functions are individual per pin, but several pins may be configured in a single operation.

14.3 I/O configuration

All port pins (Pn) have programmable output configuration. In addition, all port pins have an inverted I/O function. For an input, this means inverting the signal between the port pin and the pin register. For an output, this means inverting the output signal between the port register and the port pin. The inverted I/O function can be used also when the pin is used for alternate func­tions. The port pins also have configurable slew rate limitation to reduce electromagnetic emission.
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14.3.1 Push-pull

XMEGA A3
Figure 14-1. I/O configuration - Totem-pole
DIRn

14.3.2 Pull-down

14.3.3 Pull-up

OUTn
INn
Figure 14-2. I/O configuration - Totem-pole with pull-down (on input)
DIRn
OUTn
INn
Pn
Pn

14.3.4 Bus-keeper

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Figure 14-3. I/O configuration - Totem-pole with pull-up (on input)
DIRn
OUTn
Pn
INn
The bus-keeper’s weak output produces the same logical level as the last output level. It acts as a pull-up if the last level was ‘1’, and pull-down if the last level was ‘0’.
27
Figure 14-4. I/O configuration - Totem-pole with bus-keeper
DIRn
XMEGA A3

14.3.5 Others

OUTn
INn
Figure 14-5. Output configuration - Wired-OR with optional pull-down
OUTn
INn
Figure 14-6. I/O configuration - Wired-AND with optional pull-up
Pn
Pn
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INn
Pn
OUTn
28

14.4 Input sensing

XMEGA A3
Sense both edges
Sense rising edges
Sense falling edges
Sense low level
Input sensing is synchronous or asynchronous depending on the enabled clock for the ports, and the configuration is shown in Figure 14-7 on page 29.
Figure 14-7. Input sensing system overview
Asynchronous sen sing
Pn
IN V ERT E D I/O
When a pin is configured with inverted I/O the pin value is inverted before the input sensing.

14.5 Port Interrupt

Each ports have two interrupts with separate priority and interrupt vector. All pins on the port can be individually selected as source for each of the interrupts. The interrupts are then triggered according to the input sense configuration for each pin configured as source for the interrupt.

14.6 Alternate Port Functions

In addition to the input/output functions on all port pins, most pins have alternate functions. This means that other modules or peripherals connected to the port can use the port pins for their functions, such as communication or pulse-width modulation. ”Pinout and Pin Functions” on
page 48 shows which modules on peripherals that enables alternate functions on a pin, and
what alternate functions that is available on a pin.
Synchronizer
INn
Q
Q
D
D
R
R
EDGE
DETECT
Synchronous sen sing
EDGE
DETECT
Interrupt
Control
IR E Q
Event
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15. T/C - 16-bits Timer/Counter with PWM

15.1 Features

Seven 16-bit Timer/Counters
– Four Timer/Counters of type 0 – Three Timer/Counters of type 1
Four Compare or Capture (CC) Channels in Timer/Counter 0
Two Compare or Capture (CC) Channels in Timer/Counter 1
Double Buffered Timer Period Setting
Double Buffered Compare or Capture Channels
Waveform Generation:
– Single Slope Pulse Width Modulation – Dual Slope Pulse Width Modulation – Frequency Generation
Input Capture:
– Input Capture with Noise Cancelling – Frequency capture – Pulse width capture – 32-bit input capture
Event Counter with Direction Control
Timer Overflow and Timer Error Interrupts and Events
One Compare Match or Capture Interrupt and Event per CC Channel
Supports DMA Operation
Hi-Resolution Extension (Hi-Res)
Advanced Waveform Extension (AWEX)
XMEGA A3

15.2 Overview

XMEGA A3 has eight Timer/Counters, four Timer/Counter 0 and four Timer/Counter 1. The dif­ference between them is that Timer/Counter 0 has four Compare/Capture channels, while Timer/Counter 1 has two Compare/Capture channels.
The Timer/Counters (T/C) are 16-bit and can count any clock, event or external input in the microcontroller. A programmable prescaler is available to get a useful T/C resolution. Updates of Timer and Compare registers are double buffered to ensure glitch free operation. Single slope PWM, dual slope PWM and frequency generation waveforms can be generated using the Com­pare Channels.
Through the Event System, any input pin or event in the microcontroller can be used to trigger input capture, hence no dedicated pins is required for this. The input capture has a noise cancel­ler to avoid incorrect capture of the T/C, and can be used to do frequency and pulse width measurements.
A wide range of interrupt or event sources are available, including T/C Overflow, Compare match and Capture for each Compare/Capture channel in the T/C.
PORTC, PORTD and PORTE each has one Timer/Counter 0 and one Timer/Counter1. PORTF has one Timer/Counter 0. Notation of these are TCC0 (Time/Counter C0), TCC1, TCD0, TCD1, TCE0, TCE1 and TCF0, respectively.
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XMEGA A3
Figure 15-1. Overview of a Timer/Counter and closely related peripherals
Timer/Counter
Base Counter
Timer Period
Counter
Control Logic
Compare/Capture Channel D
Compare/Capture Channel C
Compare/Capture Channel B
Compare/Capture Channel A
Comparator
Buffer
Capture Control
Waveform
Generation
The Hi-Resolution Extension can be enabled to increase the waveform generation resolution by 2 bits (4x). This is available for all Timer/Counters. See ”Hi-Res - High Resolution Extension” on
page 33 for more details.
Prescaler
Event
System
AWeX
DTI
Dead-Time
Insertion
clk
PER
Generation
Protection
Pattern
Fault
clk
PER4
Hi-Res
PORT
The Advanced Waveform Extension can be enabled to provide extra and more advanced fea­tures for the Timer/Counter. This are only available for Timer/Counter 0. See ”AWEX - Advanced
Waveform Extension” on page 32 for more details.
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16. AWEX - Advanced Waveform Extension

16.1 Features

Output with complementary output from each Capture channel
Four Dead Time Insertion (DTI) Units, one for each Capture channel
8-bit DTI Resolution
Separate High and Low Side Dead-Time Setting
Double Buffered Dead-Time
Event Controlled Fault Protection
Single Channel Multiple Output Operation (for BLDC motor control)
Double Buffered Pattern Generation

16.2 Overview

The Advanced Waveform Extension (AWEX) provides extra features to the Timer/Counter in Waveform Generation (WG) modes. The AWEX enables easy and safe implementation of for
example, advanced motor control (AC, BLDC, SR, and Stepper) and power control applications.
Any WG output from a Timer/Counter 0 is split into a complimentary pair of outputs when any AWEX feature is enabled. These output pairs go through a Dead-Time Insertion (DTI) unit that enables generation of the non-inverted Low Side (LS) and inverted High Side (HS) of the WG output with dead time insertion between LS and HS switching. The DTI output will override the normal port value according to the port override setting. Optionally the final output can be inverted by using the invert I/O setting for the port pin.
XMEGA A3
The Pattern Generation unit can be used to generate a synchronized bit pattern on the port it is connected to. In addition, the waveform generator output from Compare Channel A can be dis­tributed to, and override all port pins. W hen the Pattern Generator unit is enabled, the DTI unit is bypassed.
The Fault Protection unit is connected to the Event System. This enables any event to trigger a fault condition that will disable the AWEX output. Several event channels can be used to trigger fault on several different conditions.
The AWEX is available for TCC0. The notation of this is AWEXC.
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17. Hi-Res - High Resolution Extension

17.1 Features

Increases Waveform Generator resolution by 2-bits (4x)
Supports Frequency, single- and dual-slope PWM operation
Supports the AWEX when this is enabled and used for the same Timer/Counter

17.2 Overview

The Hi-Resolution (Hi-Res) Extension is able to increase the resolution of the waveform genera­tion output by a factor of 4. When enabled for a Timer/Counter, the Fast Peripheral clock running at four times the CPU clock speed will be as input to the Timer/Counter.
The High Resolution Extension can also be used when an AWEX is enabled and used with a Timer/Counter.
XMEGA A3 devices have four Hi-Res Extensions that each can be enabled for each Timer/Counters pair on PORTC, PORTD, PORTE and PORTF. The notation of these are HIRESC, HIRESD, HIRESE and HIRESF, respectively.
XMEGA A3
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18. RTC - Real-Time Counter

18.1 Features

16-bit Timer
Flexible Tick resolution ranging from 1 Hz to 32.768 kHz
One Compare register
One Period register
Clear timer on Overflow or Compare Match
Overflow or Compare Match event and interrupt generation

18.2 Overview

The XMEGA A3 includes a 16-bit Real-time Counter (RTC). The RTC can be clocked from an accurate 32.768 kHz Crystal Oscillator, the 32.768 kHz Calibrated Internal Oscillator, or from the 32 kHz Ultra Low Power Internal Oscillator. The RTC includes both a Period and a Compare register. For details, see Figure 18-1.
A wide range of Resolution and Time-out periods can be configured using the RTC. With a max­imum resolution of 30.5 µs, time-out periods range up to 2000 seconds. With a resolution of 1 second, the maximum time-out period is over 18 hours (65536 seconds).
XMEGA A3
Figure 18-1. Real-time Counter overview
32 kHz
10-bit
prescaler
1 kHz
Period
Overflow
=
Counter
=
Compare Match
Compare
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19. TWI - Two Wire Interface

19.1 Features

Two Identical TWI peripherals
Simple yet Powerful and Flexible Communication Interface
Both Master and Slave Operation Supported
Device can Operate as Transmitter or Receiver
7-bit Address Space Allows up to 128 Different Slave Addresses
Multi-master Arbitration Support
Up to 400 kHz Data Transfer Speed
Slew-rate Limited Output Drivers
Noise Suppression Circuitry Rejects Spikes on Bus Lines
Fully Programmable Slave Address with General Call Support
Address Recognition Causes Wake-up when in Sleep Mode
2
I
C and System Management Bus (SMBus) compatible

19.2 Overview

The Two-Wire Interface (TWI) is a bi-directional wired-AND bus with only two lines, the clock (SCL) line and the data (SDA) line. The protocol makes it possible to interconnect up to 128 indi­vidually addressable devices. Since it is a multi-master bus, one or more devices capable of taking control of the bus can be connected.
XMEGA A3
The only external hardware needed to implement the bus is a single pull-up resistor for each of the TWI bus lines. Mechanisms for resolving bus contention are inherent in the TWI protocol.
PORTC and PORTE each has one TWI. Notation of these peripherals are TWIC and TWIE.
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20. SPI - Serial Peripheral Interface

20.1 Features

Three Identical SPI peripherals
Full-duplex, Three-wire Synchronous Data Transfer
Master or Slave Operation
LSB First or MSB First Data Transfer
Seven Programmable Bit Rates
End of Transmission Interrupt Flag
Write Collision Flag Protection
Wake-up from Idle Mode
Double Speed (CK/2) Master SPI Mode

20.2 Overview

The Serial Peripheral Interface (SPI) allows high-speed full-duplex, synchronous data transfer between different devices. Devices can communicate using a master-slave scheme, and data is transferred both to and from the devices simultaneously.
PORTC, PORTD, and PORTE each has one SPI. Notation of these peripherals are SPIC, SPID, and SPIE respectively.
XMEGA A3
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21. USART

21.1 Features

21.2 Overview

XMEGA A3
Seven Identical USART peripherals
Full Duplex Operation (Independent Serial Receive and Transmit Registers)
Asynchronous or Synchronous Operation
Master or Slave Clocked Synchronous Operation
High-resolution Arithmetic Baud Rate Generator
Supports Serial Frames with 5, 6, 7, 8, or 9 Data Bits and 1 or 2 Stop Bits
Odd or Even Parity Generation and Parity Check Supported by Hardware
Data OverRun Detection
Framing Error Detection
Noise Filtering Includes False Start Bit Detection and Digital Low Pass Filter
Three Separate Interrupts on TX Complete, TX Data Register Empty and RX Complete
Multi-processor Communication Mode
Double Speed Asynchronous Communication Mode
Master SPI mode for SPI communication
IrDA support through the IRCOM module
The Universal Synchronous and Asynchronous serial Receiver and Transmitter (USART) is a highly flexible serial communication module. The USART supports full duplex communication, and both asynchronous and clocked synchronous operation. The USART can also be set in Master SPI mode to be used for SPI communication.
Communication is frame based, and the frame format can be customized to support a wide range of standards. The USART is buffered in both direction, enabling continued data transmis­sion without any delay between frames. There are separate interrupt vectors for receive and transmit complete, enabling fully interrupt driven communication. Frame error and buffer over­flow are detected in hardware and indicated with separate status flags. Even or odd parity generation and parity check can also be enabled.
One USART can use the IRCOM module to support IrDA 1.4 physical compliant pulse modula­tion and demodulation for baud rates up to 115.2 kbps.
PORTC, PORTD, and PORTE each has two USARTs, while PORTF has one USART only. Notation of these peripherals are USARTC0, USARTC1, USARTD0, USARTD1, USARTE0, USARTE1 and USARTF0, respectively.
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22. IRCOM - IR Communication Module

22.1 Features

Pulse modulation/demodulation for infrared communication
Compatible to IrDA 1.4 physical for baud rates up to 115.2 kbps
Selectable pulse modulation scheme
– 3/16 of baud rate period – Fixed pulse period, 8-bit programmable – Pulse modulation disabled
Built in filtering
Can be connected to and used by one USART at the time

22.2 Overview

XMEGA contains an Infrared Communication Module (IRCOM) for IrDA communication with baud rates up to 115.2 kbps. This supports three modulation schemes: 3/16 of baud rate period, fixed programmable pulse time based on the Peripheral Clock speed, or pulse modulation dis­abled. There is one IRCOM available which can be connected to any USART to enable infrared pulse coding/decoding for that USART.
XMEGA A3
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23. Crypto Engine

23.1 Features

23.2 Overview

XMEGA A3
Data Encryption Standard (DES) CPU instruction
Advanced Encryption Standard (AES) Crypto module
DES Instruction
– Encryption and Decryption – Single-cycle DES instruction – Encryption/Decryption in 16 clock cycles per 8-byte block
AES Crypto Module
– Encryption and Decryption – Support 128-bit keys – Support XOR data load mode to the State memory for Cipher Block Chaining – Encryption/Decryption in 375 clock cycles per 16-byte block
The Advanced Encryption Standard (AES) and Data Encryption Standard (DES) are two com­monly used encryption standards. These are supported through an AES peripheral module and a DES CPU instruction. All communication interfaces and the CPU can optionally use AES and DES encrypted communication and data storage.
DES is supported by a DES instruction in the AVR XMEGA CPU. The 8-byte key and 8-byte data blocks must be loaded into the Register file, and then DES must be executed 16 times to encrypt/decrypt the data block.
The AES Crypto Module encrypts and decrypts 128-bit data blocks with the use of a 128-bit key. The key and data must be loaded into the key and state memory in the module before encryp­tion/decryption is started. It takes 375 peripheral clock cycles before the encryption/decryption is done and decrypted/encrypted data can be read out, and an optional interrupt can be generated. The AES Crypto Module also has DMA support with transfer triggers when encryption/decryp­tion is done and optional auto-start of encryption/decryption when the state memory is fully loaded.
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39

24. ADC - 12-bit Analog to Digital Converter

24.1 Features

Two ADCs with 12-bit resolution
2 Msps sample rate for each ADC
Signed and Unsigned conversions
4 result registers with individual input channel control for each ADC
8 single ended inputs for each ADC
8x4 differential inputs for each ADC
Software selectable gain of 2, 4, 8, 16, 32 or 64
Software selectable resolution of 8- or 12-bit.
Internal or External Reference selection
Event triggered conversion for accurate timing
DMA transfer of conversion results
Interrupt/Event on compare result

24.2 Overview

XMEGA A3 devices have two Analog to Digital Converters (ADC), see Figure 24-1 on page 41. The two ADC modules can be operated simultaneously, individually or synchronized.
XMEGA A3
The ADC converts analog voltages to digital values. The ADC has 12-bit resolution and is capa­ble of converting up to 2 million samples per second. The input selection is flexible, and both single-ended and differential measurements can be performed. The ADC can provide both signed and unsigned results, and an optional gain stage is available to increase the dynamic range of the ADC.
It is a Successive Approximation Result (SAR) ADC. A SAR ADC measures one bit of the con­version result at a time. The ADC has a pipeline architecture. This means that a new analog voltage can be sampled and a new ADC measurement started on each ADC clock cycle. Each sample will be converted in the pipeline, where the total sample and conversion time is seven ADC clock cycles for 12-bit result and 5 ADC clock cycles for 8-bit result.
ADC measurements can be started by application software or an incoming event from another peripheral in the device. Four different result registers with individual channel selection (MUX registers) are provided to make it easier for the application to keep track of the data. It is also possible to use DMA to move ADC results directly to memory or peripherals.
Both internal and external analog reference voltages can be used. An accurate internal 1.0V reference is available.
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40
Figure 24-1. ADC overview
Channel A MUX selection Channel B MUX selection Channel C MUX selection Channel D MUX selection
XMEGA A3
Internal inputs
Pin inputsPin inputs
1-64 X
Configuration
Reference selection
ADC
Event
Trigger
Channel A
Register
Channel B
Register
Channel C
Register
Channel D
Register
Each ADC has four MUX selection registers with a corresponding result register. This means that four channels can be sampled within 1.5 µs without any intervention by the application other than starting the conversion. The results will be available in the result registers.
The ADC may be configured for 8- or 12-bit result, reducing the minimum conversion time (prop­agation delay) from 3.5 µs for 12-bit to 2.5 µs for 8-bit result.
ADC conversion results are provided left- or right adjusted with optional ‘1’ or ‘0’ padding. This eases calculation when the result is represented as a signed integer (signed 16-bit number).
PORTA and PORTB each has one ADC. Notation of these peripherals are ADCA and ADCB, respectively.
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41

25. DAC - 12-bit Digital to Analog Converter

25.1 Features

One DAC with 12-bit resolution
Up to 1 Msps conversion rate for each DAC
Flexible conversion range
Multiple trigger sources
1 continuous output or 2 Sample and Hold (S/H) outputs for each DAC
Built-in offset and gain calibration
High drive capabilities
Low Power Mode

25.2 Overview

The XMEGA A3 devices features two 12-bit, 1 Msps DACs with built-in offset and gain calibra­tion, see Figure 25-1 on page 42.
A DAC converts a digital value into an analog signal. The DAC may use an internal 1.1 voltage as the upper limit for conversion, but it is also possible to use the supply voltage or any applied voltage in-between. The external reference input is shared with the ADC reference input.
XMEGA A3
Figure 25-1. DAC overview
Configuration
Reference selection
Channel A
Register
DAC
Channel B
Register
Event
Trigger
Channel A
Channel B
Each DAC has one continuous output with high drive capabilities for both resistive and capaci­tive loads. It is also possible to split the continuous time channel into two Sample and Hold (S/H) channels, each with separate data conversion registers.
A DAC conversion may be started from the application software by writing the data conversion registers. The DAC can also be configured to do conversions triggered by the Event System to have regular timing, independent of the application software. DMA may be used for transferring data from memory locations to DAC data registers.
The DAC has a built-in calibration system to reduce offset and gain error when loading with a calibration value from software.
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PORTB each has one DAC. Notation of this peripheral is DACB.
42

26. AC - Analog Comparator

26.1 Features

Four Analog Comparators
Selectable Power vs. Speed
Selectable hysteresis
– 0, 20 mV, 50 mV
Analog Comparator output available on pin
Flexible Input Selection
– All pins on the port – Output from the DAC – Bandgap reference voltage. – Voltage scaler that can perform a 64-level scaling of the internal VCC voltage.
Interrupt and event generation on
– Rising edge – Falling edge –Toggle
Window function interrupt and event generation on
– Signal above window – Signal inside window – Signal below window

26.2 Overview

XMEGA A3
XMEGA A3 features four Analog Comparators (AC). An Analog Comparator compares two volt­ages, and the output indicates which input is largest. The Analog Comparator may be configured to give interrupt requests and/or events upon several different combinations of input change.
Both hysteresis and propagation delays may be adjusted in order to find the optimal operation for each application.
A wide range of input selection is available, both external pins and several internal signals can be used.
The Analog Comparators are always grouped in pairs (AC0 and AC1) on each analog port. They have identical behavior but separate control registers.
Optionally, the state of the comparator is directly available on a pin.
PORTA and PORTB each has one AC pair. Notations are ACA and ACB, respectively.
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Figure 26-1. Analog comparator overview
Pin inputs Internal inputs
XMEGA A3
Pin inputs Internal inputs VCC scaled
Pin inputs Internal inputs
Pin inputs Internal inputs VCC scaled
+
+
-
-
AC0
AC1
Interrupt
sensitivity
control
Pin 0 output
Interrupts
Events
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26.3 Input Selection

The Analog comparators have a very flexible input selection and the two comparators grouped in a pair may be used to realize a window function. One pair of analog comparators is shown in
Figure 26-1 on page 44.
Input selection from pin
Internal signals available on positive analog comparator inputs
Internal signals available on negative analog comparator inputs
Output from 12-bit DAC

26.4 Window Function

The window function is realized by connecting the external inputs of the two analog comparators in a pair as shown in Figure 26-2.
XMEGA A3
– Pin 0, 1, 2, 3, 4, 5, 6 selectable to positive input of analog comparator – Pin 0, 1, 3, 5, 7 selectable to negative input of analog comparator
– Output from 12-bit DAC
– 64-level scaler of the VCC, available on negative analog comparator input – Bandgap voltage reference
Figure 26-2. Analog comparator window function
+
AC0
Upper limit of window
Input signal
Lower limit of window
-
+
AC1
-
Interrupt
sensitivity
control
Interrupts
Events
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45

27. OCD - On-chip Debug

27.1 Features

Complete Program Flow Control
– Go, Stop, Reset, Step into, Step over, Step out, Run-to-Cursor
Debugging on C and high-level language source code level
Debugging on Assembler and disassembler level
1 dedicated program address or source level breakpoint for AVR Studio / debugger
4 Hardware Breakpoints
Unlimited Number of User Program Breakpoints
Unlimited Number of User Data Breakpoints, with break on:
– Data location read, write or both read and write – Data location content equal or not equal to a value – Data location content is greater or less than a value – Data location content is within or outside a range – Bits of a data location are equal or not equal to a value
Non-Intrusive Operation
– No hardware or software resources in the device are used
High Speed Operation
– No limitation on debug/programming clock frequency versus system clock frequency

27.2 Overview

XMEGA A3
The XMEGA A3 has a powerful On-Chip Debug (OCD) system that - in combination with Atmel’s development tools - provides all the necessary functions to debug an application. It has support for program and data breakpoints, and can debug an application from C and high level language source code level, as well as assembler and disassembler level. It has full Non-Intrusive Opera­tion and no hardware or software resources in the device are used. The ODC system is accessed through an external debugging tool which connects to the JTAG or PDI physical inter­faces. Refer to ”Program and Debug Interfaces” on page 47.
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46

28. Program and Debug Interfaces

28.1 Features

PDI - Program and Debug Interface (Atmel proprietary 2-pin interface)
JTAG Interface (IEEE std. 1149.1 compliant)
Boundary-scan capabilities according to the IEEE Std. 1149.1 (JTAG)
Access to the OCD system
Programming of Flash, EEPROM, Fuses and Lock Bits

28.2 Overview

The programming and debug facilities are accessed through the JTAG and PDI physical inter­faces. The PDI physical uses one dedicated pin together with the Reset pin, and no general purpose pins are used. JTAG uses four general purpose pins on PORTB.

28.3 JTAG interface

The JTAG physical layer handles the basic low-level serial communication over four I/O lines named TMS, TCK, TDI, and TDO. It complies to the IEEE Std. 1149.1 for test access port and boundary scan.
XMEGA A3

28.4 PDI - Program and Debug Interface

The PDI is an Atmel proprietary protocol for communication between the microcontroller and Atmel’s development tools.
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47

29. Pinout and Pin Functions

The pinout of XMEGA A3 is shown in ”Pinout/Block Diagram” on page 2. In addition to general I/O functionality, each pin may have several function. This will depend on which peripheral is enabled and connected to the actual pin. Only one of the alternate pin functions can be used at time.

29.1 Alternate Pin Function Description

The tables below show the notation for all pin functions available and describe its function.

29.1.1 Operation/Power Supply

VCC Digital supply voltage
AVCC Analog supply voltage
GND Ground

29.1.2 Port Interrupt functions

SYNC Port pin with full synchronous and limited asynchronous interrupt function
ASYNC Port pin with full synchronous and full asynchronous interrupt function
XMEGA A3

29.1.3 Analog functions

ACn Analog Comparator input pin n
AC0OUT Analog Comparator 0 Output
ADCn Analog to Digital Converter input pin n
DACn Digital to Analog Converter output pin n
AREF Analog Reference input pin
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29.1.4 Timer/Counter and AWEX functions

OCnx Output Compare Channel x for Timer/Counter n
O
Cxn Inverted Output Compare Channel x for Timer/Counter n

29.1.5 Communication functions

SCL Serial Clock for TWI
SDA Serial Data for TWI
SCLIN Serial Clock In for TWI when external driver interface is enabled
SCLOUT Serial Clock Out for TWI when external driver interface is enabled
SDAIN Serial Data In for TWI when external driver interface is enabled
SDAOUT Serial Data Out for TWI when external driver interface is enabled
XCKn Transfer Clock for USART n
RXDn Receiver Data for USART n
TXDn Transmitter Data for USART n
S Slave Select for SPI
S
XMEGA A3
MOSI Master Out Slave In for SPI
MISO Master In Slave Out for SPI
SCK Serial Clock for SPI

29.1.6 Oscillators, Clock and Event

TOSCn Timer Oscillator pin n
XTALn Input/Output for inverting Oscillator pin n
CLKOUT Peripheral Clock Output
EVOUT Event Channel 0 Output

29.1.7 Debug/System functions

TEST Test pin
PROG Programming pin
RESET Reset pin
PDI_CLK Program and Debug Interface Clock pin
PDI_DATA Program and Debug Interface Data pin
T C K JTA G Tes t C lo ck
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TDI JTAG Test Data In
T D O JTAG Tes t D at a O u t
T M S JTAG Tes t M od e S e l e c t
49
XMEGA A3

29.2 Alternate Pin Functions

The tables below show the main and alternate pin functions for all pins on each port. They also show which peripheral that makes use of or enables the alternate pin function.
Table 29-1. Port A - Alternate functions
PORT A PIN # INTERRUPT ADCA POS ADCA NEG
GND 60
AVC C 61
PA0 62 SYNC ADC0 ADC0 ADC0 AC0 AC0 AREFA
PA1 63 SYNC ADC1 ADC1 ADC1 AC1 AC1
PA2 64 SYNC/ASYNC ADC2 ADC2 ADC2 AC2
PA3 1 SYNC ADC3 ADC3 ADC3 AC3 AC3
PA4 2 SYNC ADC4 ADC4 ADC4 AC4
PA5 3 SYNC ADC5 ADC5 ADC5 AC5 AC5
PA6 4 SYNC ADC6 ADC6 ADC6 AC6
PA7 5 SYNC ADC7 ADC7 ADC7 AC7 AC0 OUT
ADAA
GAINPOS
ADCA
GAINNEG ACA POS ACA NEG ACA OUT REFA
Table 29-2. Port B - Alternate functions
PORT B PIN # INTERRUPT
PB0 6 SYNC ADC0 ADC0 ADC0 AC0 AC0 AREFB
PB1 6 SYNC ADC1 ADC1 ADC1 AC1 AC1
PB2 8 SYNC/ASYNC ADC2 ADC2 ADC2 AC2 DAC0
PB3 9 SYNC ADC3 ADC3 ADC3 AC3 AC3 DAC1
PB4 10 SYNC ADC4 ADC4 ADC4 AC4 TMS
PB5 11 SYNC ADC5 ADC5 ADC5 AC5 AC5 TDI
PB6 12 SYNC ADC6 ADC6 ADC6 AC6 TCK
PB7 13 SYNC ADC7 ADC7 ADC7 AC7 AC0 OUT TDO
GND 14
VCC 15
ADCB
POS
ADCB
NEG
ADCB
GAINPOS
ADCB
GAINNEG ACB POS ACB NEG ACB OUT DACB REFB JTAG
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50
XMEGA A3
Table 29-3. Port C - Alternate functions
PORT C PIN # INTERRUPT TCC0 AWEXC TCC1 USARTC0 USARTC1 SPIC TWIC CLOCKOUT EVENTOUT
PC0 16 SYNC OC0A OC0A SDA
PC1 17 SYNC OC0B OC0A XCK0 SCL
PC2 18 SYNC/ASYNC OC0C OC0B RXD0
PC3 19 SYNC OC0D OC0B TXD0
PC4 20 SYNC OC0C OC1A SS
PC5 21 SYNC OC0C OC1B XCK1 MOSI
PC6 22 SYNC OC0D RXD1 MISO
PC7 23 SYNC OC0D TXD1 SCK CLKOUT EVOUT
GND 24
VCC 25
Table 29-4. Port D - Alternate functions
PORT D PIN # INTERRUPT TCD0 TCD1 USARTD0 USARTD1 SPID CLOCKOUT EVENTOUT
PD0 26 SYNC OC0A
PD1 27 SYNC OC0B XCK0
PD2 28 SYNC/ASYNC OC0C RXD0
PD3 29 SYNC OC0D TXD0
PD4 30 SYNC OC1A SS
PD5 31 SYNC OC1B XCK1 MOSI
PD6 32 SYNC RXD1 MISO
PD7 33 SYNC TXD1 SCK CLKOUT EVOUT
GND 34
VCC 35
Table 29-5. Port E - Alternate functions
PORT E PIN # INTERRUPT TCE0 TCE1 USARTE0 USARTE1 SPIE TWIE CLOCKOUT EVENTOUT TOSC
PE0 36 SYNC OC0A SDA
PE1 37 SYNC OC0B XCK0 SCL
PE2 38 SYNC/ASYNC OC0C RXD0
PE3 39 SYNC OC0D TXD0
PE4 40 SYNC OC1A SS
PE5 41 SYNC OC1B XCK1 MOSI
PE6 42 SYNC RXD1 MISO TOSC1
PE7 43 SYNC TXD1 SCK CLKOUT EVOUT TOSC1
GND 44
VCC 45
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51
Table 29-6. Port F - Alternate functions
PORT F PIN # INTERRUPT TCF0 USARTF0
PF0 46 SYNC OC0A
PF1 47 SYNC OC0B XCK0
PF2 48 SYNC/ASYNC OC0C RXD0
PF3 49 SYNC OC0D TXD0
PF4 50 SYNC
PF5 51 SYNC
PF6 54 SYNC
PF7 55 SYNC
GND 52
VCC 53
Table 29-7. Port R - Alternate functions
PORT R PIN # INTERRUPT PROGR XTAL
PDI 56 PDI_DATA
RESET 57 PDI_CLOCK
PRO 58 SYNC XTAL2
PR1 59 SYNC XTAL1
XMEGA A3
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30. Peripheral Module Address Map

The address maps show the base address for each peripheral and module in XMEGA A3. For complete register description and summary for each peripheral module, refer to the XMEGA A Manual.
Base Address Name Description
0x0000 GPIO General Purpose IO Registers 0x0010 VPORT0 Virtual Port 0 0x0014 VPORT1 Virtual Port 1 0x0018 VPORT2 Virtual Port 2 0x001C VPORT3 Virtual Port 2 0x0030 CPU CPU 0x0040 CLK Clock Control 0x0048 SLEEP Sleep Controller 0x0050 OSC Oscillator Control 0x0060 DFLLRC32M DFLL for the 32 MHz Internal RC Oscillator 0x0068 DFLLRC2M DFLL for the 2 MHz RC Oscillator 0x0070 PR Power Reduction 0x0078 RST Reset Controller 0x0080 WDT Watch-Dog Timer 0x0090 MCU MCU Control 0x00A0 PMIC Programmable MUltilevel Interrupt Controller 0x00B0 PORTCFG Port Configuration 0x00C0 AES AES Module 0x0100 DMA DMA Controller 0x0180 EVSYS Event System 0x01C0 NVM Non Volatile Memory (NVM) Controller 0x0200 ADCA Analog to Digital Converter on port A 0x0240 ADCB Analog to Digital Converter on port B 0x0320 DACB Digital to Analog Converter on port B 0x0380 ACA Analog Comparator pair on port A 0x0390 ACB Analog Comparator pair on port B 0x0400 RTC Real Time Counter 0x0480 TWIC Two Wire Interface on port C 0x04A0 TWIE Two Wire Interfaceon port E 0x0600 PORTA Port A 0x0620 PORTB Port B 0x0640 PORTC Port C 0x0660 PORTD Port D 0x0680 PORTE Port E 0x06A0 PORTF Port F 0x07E0 PORTR Port R 0x0800 TCC0 Timer/Counter 0 on port C 0x0840 TCC1 Timer/Counter 1 on port C 0x0880 AWEXC Advanced Waveform Extension on port C 0x0890 HIRESC High Resolution Extension on port C 0x08A0 USARTC0 USART 0 on port C 0x08B0 USARTC1 USART 1 on port C 0x08C0 SPIC Serial Peripheral Interface on port C 0x08F8 IRCOM Infrared Communication Module 0x0900 TCD0 Timer/Counter 0 on port D 0x0940 TCD1 Timer/Counter 1 on port D 0x0990 HIRESD High Resolution Extension on port D 0x09A0 USARTD0 USART 0 on port D 0x09B0 USARTD1 USART 1 on port D 0x09C0 SPID Serial Peripheral Interface on port D 0x0A00 TCE0 Timer/Counter 0 on port E 0x0A40 TCE1 Timer/Counter 1 on port E 0x0A80 AWEXE Advanced Waveform Extensionon port E 0x0A90 HIRESE High Resolution Extension on port E 0x0AA0 USARTE0 USART 0 on port E 0x0AB0 USARTE1 USART 1 on oirt E 0x0AC0 SPIE Serial Peripheral Interface on port E 0x0B00 TCF0 Timer/Counter 0 on port F 0x0B90 HIRESF High Resolution Extension on port F 0x0BA0 USARTF0 USART 0 on port F
XMEGA A3
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XMEGA A3

31. Instruction Set Summary

Mnemonics Operands Description Operation Flags #Clocks
Arithmetic and Logic Instructions
ADD Rd, Rr Add without Carry Rd Rd + Rr Z,C,N,V,S,H 1
ADC Rd, Rr Add with Carry Rd Rd + Rr + C Z,C,N,V,S,H 1
ADIW Rd, K Add Immediate to Word Rd Rd + 1:Rd + K Z,C,N,V,S 2
SUB Rd, Rr Subtract without Carry Rd Rd - Rr Z,C,N,V,S,H 1
SUBI Rd, K Subtract Immediate Rd Rd - K Z,C,N,V,S,H 1
SBC Rd, Rr Subtract with Carry Rd Rd - Rr - C Z,C,N,V,S,H 1
SBCI Rd, K Subtract Immediate with Carry Rd Rd - K - C Z,C,N,V,S,H 1
SBIW Rd, K Subtract Immediate from Word Rd + 1:Rd Rd + 1:Rd - K Z,C,N,V,S 2
AND Rd, Rr Logical AND Rd Rd • Rr Z,N,V,S 1
ANDI Rd, K Logical AND with Immediate Rd Rd • K Z,N,V,S 1
OR Rd, Rr Logical OR Rd Rd v Rr Z,N,V,S 1
ORI Rd, K Logical OR with Immediate Rd Rd v K Z,N,V,S 1
EOR Rd, Rr Exclusive OR Rd Rd ⊕ Rr Z,N,V,S 1
COM Rd One’s Complement Rd $FF - Rd Z,C,N,V,S 1
NEG Rd Two’s Complement Rd $00 - Rd Z,C,N,V,S,H 1
SBR Rd,K Set Bit(s) in Register Rd Rd v K Z,N,V,S 1
CBR Rd,K Clear Bit(s) in Register Rd Rd • ($FFh - K) Z,N,V,S 1
INC Rd Increment Rd Rd + 1 Z,N,V,S 1
DEC Rd Decrement Rd Rd - 1 Z,N,V,S 1
TST Rd Test for Zero or Minus Rd Rd • Rd Z,N,V,S 1
CLR Rd Clear Register Rd Rd ⊕ Rd Z,N,V,S 1
SER Rd Set Register Rd $FF None 1
MUL Rd,Rr Multiply Unsigned R1:R0 Rd x Rr (UU) Z,C 2
MULS Rd,Rr Multiply Signed R1:R0 Rd x Rr (SS) Z,C 2
MULSU Rd,Rr Multiply Signed with Unsigned R1:R0 Rd x Rr (SU) Z,C 2
FMUL Rd,Rr Fractional Multiply Unsigned R1:R0 Rd x Rr<<1 (UU) Z,C 2
FMULS Rd,Rr Fractional Multiply Signed R1:R0
FMULSU Rd,Rr Fractional Multiply Signed with Unsigned R1:R0 Rd x Rr<<1 (SU) Z,C 2
DES K Data Encryption if (H = 0) then R15:R0
RJMP k Relative Jump PC PC + k + 1 None 2
IJMP Indirect Jump to (Z) PC(15:0)
EIJMP Extended Indirect Jump to (Z) PC(15:0)
JMP k Jump PC k None 3
RCALL k Relative Call Subroutine PC PC + k + 1 None 2 / 3
ICALL Indirect Call to (Z) PC(15:0)
EICALL Extended Indirect Call to (Z) PC(15:0)
else if (H = 1) then R15:R0←←
Branch Instructions
PC(21:16)←←Z,0
PC(21:16)←←Z,EIND
PC(21:16)←←Z,0
PC(21:16)←←Z,EIND
Rd x Rr<<1 (SS) Z,C 2
Encrypt(R15:R0, K) Decrypt(R15:R0, K)
None 2
None 2
None 2 / 3
None 3
1/2
(1)
(1)
(1)
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XMEGA A3
Mnemonics Operands Description Operation Flags #Clocks
CALL k call Subroutine PC k None 3 / 4
RET Subroutine Return PC STACK None 4 / 5
RETI Interrupt Return PC STACK I 4 / 5
CPSE Rd,Rr Compare, Skip if Equal if (Rd = Rr) PC PC + 2 or 3 None 1 / 2 / 3
CP Rd,Rr Compare Rd - Rr Z,C,N,V,S,H 1
CPC Rd,Rr Compare with Carry Rd - Rr - C Z,C,N,V,S,H 1
CPI Rd,K Compare with Immediate Rd - K Z,C,N,V,S,H 1
SBRC Rr, b Skip if Bit in Register Cleared if (Rr(b) = 0) PC PC + 2 or 3 None 1 / 2 / 3
SBRS Rr, b Skip if Bit in Register Set if (Rr(b) = 1) PC PC + 2 or 3 None 1 / 2 / 3
SBIC A, b Skip if Bit in I/O Register Cleared if (I/O(A,b) = 0) PC PC + 2 or 3 None 2 / 3 / 4
SBIS A, b Skip if Bit in I/O Register Set If (I/O(A,b) =1) PC PC + 2 or 3 None 2 / 3 / 4
BRBS s, k Branch if Status Flag Set if (SREG(s) = 1) then PC PC + k + 1 None 1 / 2
BRBC s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PC PC + k + 1 None 1 / 2
BREQ k Branch if Equal if (Z = 1) then PC PC + k + 1 None 1 / 2
BRNE k Branch if Not Equal if (Z = 0) then PC PC + k + 1 None 1 / 2
BRCS k Branch if Carry Set if (C = 1) then PC PC + k + 1 None 1 / 2
BRCC k Branch if Carry Cleared if (C = 0) then PC PC + k + 1 None 1 / 2
BRSH k Branch if Same or Higher if (C = 0) then PC PC + k + 1 None 1 / 2
BRLO k Branch if Lower if (C = 1) then PC PC + k + 1 None 1 / 2
BRMI k Branch if Minus if (N = 1) then PC PC + k + 1 None 1 / 2
BRPL k Branch if Plus if (N = 0) then PC PC + k + 1 None 1 / 2
BRGE k Branch if Greater or Equal, Signed if (N V= 0) then PC PC + k + 1 None 1 / 2
BRLT k Branch if Less Than, Signed if (N V= 1) then PC PC + k + 1 None 1 / 2
BRHS k Branch if Half Carry Flag Set if (H = 1) then PC PC + k + 1 None 1 / 2
BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC PC + k + 1 None 1 / 2
BRTS k Branch if T Flag Set if (T = 1) then PC PC + k + 1 None 1 / 2
BRTC k Branch if T Flag Cleared if (T = 0) then PC PC + k + 1 None 1 / 2
BRVS k Branch if Overflow Flag is Set if (V = 1) then PC PC + k + 1 None 1 / 2
BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC PC + k + 1 None 1 / 2
BRIE k Branch if Interrupt Enabled if (I = 1) then PC PC + k + 1 None 1 / 2
BRID k Branch if Interrupt Disabled if (I = 0) then PC PC + k + 1 None 1 / 2
Data Transfer Instructions
MOV Rd, Rr Copy Register Rd Rr None 1
MOVW Rd, Rr Copy Register Pair Rd+1:Rd Rr+1:Rr None 1
LDI Rd, K Load Immediate Rd K None 1
LDS Rd, k Load Direct from data space Rd (k) None 2
LD Rd, X Load Indirect Rd (X) None 1
LD Rd, X+ Load Indirect and Post-Increment RdX←←(X)
LD Rd, -X Load Indirect and Pre-Decrement X X - 1,
Rd (X)←←
X + 1
X - 1 (X)
None 1
None 2
LD Rd, Y Load Indirect Rd (Y) (Y) None 1
LD Rd, Y+ Load Indirect and Post-Increment RdY←←(Y)
Y + 1
None 1
(1)
(1)
(1)
(1)(2)
(1)(2)
(1)(2)
(1)(2)
(1)(2)
(1)(2)
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XMEGA A3
Mnemonics Operands Description Operation Flags #Clocks
LD Rd, -Y Load Indirect and Pre-Decrement YRd←←Y - 1
(Y)
None 2
LDD Rd, Y+q Load Indirect with Displacement Rd (Y + q) None 2
LD Rd, Z Load Indirect Rd (Z) None 1
LD Rd, Z+ Load Indirect and Post-Increment RdZ←←(Z),
LD Rd, -Z Load Indirect and Pre-Decrement ZRd←←Z - 1,
Z+1
(Z)
None 1
None 2
LDD Rd, Z+q Load Indirect with Displacement Rd (Z + q) None 2
STS k, Rr Store Direct to Data Space (k) Rd None 2
ST X, Rr Store Indirect (X) Rr None 1
ST X+, Rr Store Indirect and Post-Increment (X)X←←Rr,
ST -X, Rr Store Indirect and Pre-Decrement X
(X)←←
X + 1
X - 1, Rr
None 1
None 2
ST Y, Rr Store Indirect (Y) Rr None 1
ST Y+, Rr Store Indirect and Post-Increment (Y)Y←←Rr,
ST -Y, Rr Store Indirect and Pre-Decrement Y
(Y)←←
Y + 1
Y - 1, Rr
None 1
None 2
STD Y+q, Rr Store Indirect with Displacement (Y + q) Rr None 2
ST Z, Rr Store Indirect (Z) Rr None 1
ST Z+, Rr Store Indirect and Post-Increment (Z)Z←←Rr
Z + 1
None 1
ST -Z, Rr Store Indirect and Pre-Decrement Z Z - 1 None 2
STD Z+q,Rr Store Indirect with Displacement (Z + q) Rr None 2
LPM Load Program Memory R0 (Z) None 3
LPM Rd, Z Load Program Memory Rd (Z) None 3
LPM Rd, Z+ Load Program Memory and Post-Increment RdZ←←(Z),
Z + 1
None 3
ELPM Extended Load Program Memory R0 (RAMPZ:Z) None 3
ELPM Rd, Z Extended Load Program Memory Rd (RAMPZ:Z) None 3
ELPM Rd, Z+ Extended Load Program Memory and Post-
Increment
RdZ←←(RAMPZ:Z),
Z + 1
None 3
SPM Store Program Memory (RAMPZ:Z) R1:R0 None -
SPM Z+ Store Program Memory and Post-Increment
by 2
(RAMPZ:Z)Z←←R1:R0,
Z + 2
None -
IN Rd, A In From I/O Location Rd I/O(A) None 1
OUT A, Rr Out To I/O Location I/O(A) Rr None 1
PUSH Rr Push Register on Stack STACK Rr None 1
POP Rd Pop Register from Stack Rd STACK None 2
Bit and Bit-test Instructions
LSL Rd Logical Shift Left Rd(n+1)
LSR Rd Logical Shift Right Rd(n)
Rd(0)
Rd(7)
Rd(n),
0,
Rd(7)
C
Rd(n+1),
0,
Rd(0)
C
Z,C,N,V,H 1
Z,C,N,V 1
(1)(2)
(1)(2)
(1)(2)
(1)(2)
(1)(2)
(1)(2)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
8068C–AVR–06/08
56
XMEGA A3
Mnemonics Operands Description Operation Flags #Clocks
ROL Rd Rotate Left Through Carry Rd(0)
ROR Rd Rotate Right Through Carry Rd(7)
ASR Rd Arithmetic Shift Right Rd(n) Rd(n+1), n=0..6 Z,C,N,V 1
SWAP Rd Swap Nibbles Rd(3..0) Rd(7..4) None 1
BSET s Flag Set SREG(s) 1SREG(s)1
BCLR s Flag Clear SREG(s) 0SREG(s)1
SBI A, b Set Bit in I/O Register I/O(A, b) 1 None 1
CBI A, b Clear Bit in I/O Register I/O(A, b) 0 None 1
BST Rr, b Bit Store from Register to T T Rr(b) T 1
BLD Rd, b Bit load from T to Register Rd(b) T None 1
SEC Set Carry C 1C1
CLC Clear Carry C 0C1
SEN Set Negative Flag N 1N1
CLN Clear Negative Flag N 0N1
SEZ Set Zero Flag Z 1Z1
CLZ Clear Zero Flag Z 0Z1
SEI Global Interrupt Enable I 1I1
CLI Global Interrupt Disable I 0I1
SES Set Signed Test Flag S 1S1
CLS Clear Signed Test Flag S 0S1
SEV Set Two’s Complement Overflow V 1V1
CLV Clear Two’s Complement Overflow V 0V1
SET Set T in SREG T 1T1
CLT Clear T in SREG T 0T1
SEH Set Half Carr y Flag in SREG H 1H1
CLH Clear Half Carry Flag in SREG H 0H1
MCU Control Instructions
BREAK Break (See specific descr. for BREAK) None 1
NOP No Operation None 1
SLEEP Sleep (see specific descr. for Sleep) None 1
WDR Watchdog Reset (see specific descr. for WDR) None 1
Rd(n+1)
Rd(n)
C,
C
C
Rd(n),
Rd(7)
C,
Rd(n+1),
Rd(0)
Z,C,N,V,H 1
Z,C,N,V 1
8068C–AVR–06/08
Notes: 1. Cycle times for Data memory accesses assume internal memory accesses, and are not valid
for accesses via the external RAM interface.
2. One extra cycle must be added when accessing Internal SRAM.
57

32. Electrical Characteristics - TBD

32.1 Absolute Maximum Ratings*

XMEGA A3
Operating Temperature.................................. -55°C to +125°C
*NOTICE: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent dam-
Storage Temperature ..................................... -65°C to +150°C
age to the device. This is a stress rating only and functional operation of the device at these or
Voltage on any Pin with respect to Ground..-0.5V to V
CC
+0.5V
other conditions beyond those indicated in the operational sections of this specification is not
Maximum Operating Voltage ............................................ 3.6V
implied. Exposure to absolute maximum rating conditions for extended periods may affect
DC Current per I/O Pin ............................................... 20.0 mA
DC Current
V
and GND Pins................................ 200.0 mA
CC
device reliability.

32.2 DC Characteristics

TA = -40°C to 85°C, VCC = 1.6V to 3.6V (unless otherwise noted)
Symbol Parameter Condition Min. Typ. Max. Units
V
IL
V
IL1
V
IH
V
IH1
V
OL
V
OH
I
IL
I
IH
R
RST
R
PU
Input Low Voltage, except XTAL1 pin V
Input Low Voltage, XTAL1 pins V
Input High Voltage, except XTAL1 pin V
Input High Voltage, XTAL1 pin V
Output Low Voltage
Output High Voltage
Input Leakage Current I/O Pin
Input Leakage Current I/O Pin
Reset Pull-up Resistor kΩ
I/O Pin Pull-up Resistor kΩ
Active 32 MHz mA
Active 20 MHz mA
Power Supply Current
Active 8MHz mA
µA
µA
I
CC
Idle 20 MHz mA
WDT disabled µA
Idle 32 MHz mA
Power-down mode
WDT slow sampling µA
WDT fast sampling
Note: 1. “Max” means the highest value where the pin is guaranteed to be read as low
2. “Min” means the lowest value where the pin is guaranteed to be read as high
8068C–AVR–06/08
58

32.3 Speed

XMEGA A3
The maximum frequency of the XMEGA A3 devices is depending on VCC. As shown in Figure
32-1 on page 59 the Frequency vs. VCC curve is linear between 1.8V < VCC < 2.7V.
Figure 32-1. Maximum Frequency vs. Vcc
MHz
32
12
1.6
1.8
Safe Operating Area
2.7
3.6
V
8068C–AVR–06/08
59
XMEGA A3
32.4 ADC Characteristics – TBD
Table 32-1. ADC Characteristics
Symbol Parameter Condition Min Typ Max Units
Resolution LSB
Integral Non-Linearity (INL) LSB
Differential Non-Linearity (DNL) LSB
Gain Error LSB
Offset Error LSB
Conversion Time µs
ADC Clock Frequency MHz
DC Supply Voltage mA
Source Impedance Ω
Start-up time µs
AVCC Analog Supply Voltage VCC - 0.3 VCC + 0.3 V
Table 32-2. ADC Gain Stage Characteristics
Symbol Parameter Condition Min Typ Max Units
Gain
Input Capacitance pF
Offset Error mV
Gain Error %
Signal Range V
DC Supply Current mA
Start-up time
# clk
cycles
8068C–AVR–06/08
60
XMEGA A3
32.5 DAC Characteristics – TBD
Table 32-3. DAC Characteristics
Symbol Parameter Condition Min Typ Max Units
Resolution LSB
Integral Non-Linearity (INL) LSB
Differential Non-Linearity (DNL) LSB
Gain Error LSB
Offset Error LSB
Calibrated Gain/Offset Error LSB
Output Range V
Output Settling Time µs
Output Capacitance nF
Output Resistance kΩ
Reference Input Voltage V
Reference Input Capacitance pF
Reference Input Resistance kΩ
Current Consumption mA
Start-up time µs
32.6 Analog Comparator Characteristics – TBD
Table 32-4. Analog Comparator Characteristics
Symbol Parameter Condition Min Typ Max Units
Offset mV
No
Hysteresis
High
High Speed mode
Propagation Delay
Low power mode
High Speed mode
Current Consumption
Low power mode
Start-up time µs
mVLow
ns
µA
8068C–AVR–06/08
61

33. Typical Characteristics - TBD

XMEGA A3
8068C–AVR–06/08
62

34. Packaging information

34.1 64A

PIN 1
PIN 1 IDENTIFIER
XMEGA A3
B
e
E1 E
D1
D
C
0°~7°
A1
L
Notes:
1.This package conforms to JEDEC reference MS-026, Variation AEB.
2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum plastic body size dimensions including mold mismatch.
3. Lead coplanarity is 0.10 mm maximum.
A2 A
SYMBOL
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN
A 1.20
A1 0.05 0.15
A2 0.95 1.00 1.05
D 15.75 16.00 16.25
D1 13.90 14.00 14.10 Note 2
E 15.75 16.00 16.25
E1 13.90 14.00 14.10 Note 2
B 0.30 0.45
C 0.09 0.20
L 0.45 0.75
e 0.80 TYP
NOM
MAX
NOTE
2325 Orchard Parkway
R
San Jose, CA 95131
8068C–AVR–06/08
TITLE
64A, 64-lead, 14 x 14 mm Body Size, 1.0 mm Body Thickness,
0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)
10/5/2001
DRAWING NO.
64A
REV.
B
63

34.2 64M1

D
Marked Pin# 1 ID
XMEGA A3
E
SEATING PLANE
C
TOP VIEW
A1
A
K
L
D2
E2
K
b
e
BOTTOM VIEW
1. JEDEC Standard MO-220, (SAW Singulation) Fig. 1, VMMD.
Note:
2. Dimension and tolerance conform to ASMEY14.5M-1994.
Pin #1 Corner
1 2 3
Option A
Option B
Option C
Pin #1 Triangle
Pin #1 Chamfer (C 0.30)
Pin #1 Notch (0.20 R)
SIDE VIEW
SYMBOL
A 0.80 0.90 1.00
A1 0.02 0.05
b 0.18 0.25 0.30
D
D2 5.20 5.40 5.60
E
E2 5.20 5.40 5.60
e 0.50 BSC
L 0.35 0.40 0.45
K 1.25 1.40 1.55
0.08
C
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN
8.90 9.00 9.10
8.90 9.00 9.10
NOM
MAX
NOTE
2325 Orchard Parkway
R
San Jose, CA 95131
8068C–AVR–06/08
TITLE
64M1, 64-pad, 9 x 9 x 1.0 mm Body, Lead Pitch 0.50 mm,
5.40 mm Exposed Pad, Micro Lead Frame Package (MLF)
DRAWING NO.
64M1
5/25/06
REV.
G
64

35. Errata

35.1 All rev.

XMEGA A3
No known errata.
8068C–AVR–06/08
65

36. Datasheet Revision History

36.1 8068C – 06/08
1. Updated ”Features” on page 1.
2. Updated Figure 2-1 on page 2.
3. Updated ”Overview” on page 3.
4. Updated Table 7-2 on page 13.
5. Replaced Figure 24-1 on page 41 by a correct one.
6. Updated “Features” and ”Overview” on page 42.
7. Updated all tables in section ”Alternate Pin Functions” on page 50.
36.2 8068B – 06/08
XMEGA A3
36.3 8068A – 02/08
1. Updated ”Features” on page 1.
2. Updated ”Pinout/Block Diagram” on page 2 and ”Pinout and Pin Functions” on page 48.
3. Updated ”Ordering Information” on page 2.
4. Updated ”Overview” on page 3, included the XMEGA A3 explanation text on page 6.
5. Added XMEGA A3 Block Diagram, Figure 3-1 on page 4.
6. Updated AVR CPU ”Overview” on page 6 and Updated Figure 6-1 on page 6.
7. Updated Event System block diagram, Figure 9-1 on page 16.
8. Updated ”PMIC - Programmable Multi-level Interrupt Controller” on page 24.
9. Updated ”AC - Analog Comparator” on page 43.
10. Updated ”I/O configuration” on page 26.
11. Inserted a new Figure 15-1 on page 31.
12. Updated ”Peripheral Module Address Map” on page 53.
13. Inserted ”Instruction Set Summary” on page 54.
14. Added Speed grades in ”Speed” on page 59.
8068C–AVR–06/08
1. Initial revision.
66

Table of Contents

Features ..................................................................................................... 1
Typical Applications ................................................................................ 1
1 Ordering Information ............................................................................... 2
2 Pinout/Block Diagram .............................................................................. 2
3 Overview ................................................................................................... 3
3.1Block Diagram ...........................................................................................................4
4 Resources ................................................................................................. 5
4.1Recommended reading .............................................................................................5
5 Disclaimer ................................................................................................. 5
6 AVR CPU ................................................................................................... 6
6.1Features ....................................................................................................................6
XMEGA A3
6.2Overview ....................................................................................................................6
6.3Register File ..............................................................................................................7
6.4ALU - Arithmetic Logic Unit .......................................................................................7
6.5Program Flow ............................................................................................................7
7 Memories .................................................................................................. 8
7.1Features ....................................................................................................................8
7.2Overview ....................................................................................................................8
7.3In-System Programmable Flash Program Memory ...................................................9
7.4Data Memory ...........................................................................................................10
7.5Calibration Row .......................................................................................................12
7.6User Signature Row ................................................................................................12
7.7Flash and EEPROM Page Size ...............................................................................13
8 DMAC - Direct Memory Access Controller .......................................... 14
8.1Features ..................................................................................................................14
8.2Overview ..................................................................................................................14
9 Event System .......................................................................................... 15
9.1Features ..................................................................................................................15
9.2Overview ..................................................................................................................15
10 System Clock and Clock options ......................................................... 17
10.1Features ................................................................................................................17
8068C–AVR–06/08
i
10.2Overview ................................................................................................................17
10.3Clock Options ........................................................................................................18
11 Power Management and Sleep Modes ................................................. 20
11.1Features ................................................................................................................20
11.2Overview ................................................................................................................20
11.3Sleep Modes ..........................................................................................................20
12 System Control and Reset .................................................................... 22
12.1Features ................................................................................................................22
12.2Resetting the AVR .................................................................................................22
12.3Reset Sources .......................................................................................................22
12.4WDT - Watchdog Timer .........................................................................................23
13 PMIC - Programmable Multi-level Interrupt Controller ....................... 24
13.1Features ................................................................................................................24
XMEGA A3
13.2Overview ................................................................................................................24
13.3Interrupt vectors .....................................................................................................24
14 I/O Ports .................................................................................................. 26
14.1Features ................................................................................................................26
14.2Overview ................................................................................................................26
14.3I/O configuration ....................................................................................................26
14.4Input sensing .........................................................................................................29
14.5Port Interrupt ..........................................................................................................29
14.6Alternate Port Functions ........................................................................................29
15 T/C - 16-bits Timer/Counter with PWM ................................................. 30
15.1Features ................................................................................................................30
15.2Overview ................................................................................................................30
16 AWEX - Advanced Waveform Extension ............................................. 32
16.1Features ................................................................................................................32
16.2Overview ................................................................................................................32
17 Hi-Res - High Resolution Extension ..................................................... 33
17.1Features ................................................................................................................33
17.2Overview ................................................................................................................33
18 RTC - Real-Time Counter ....................................................................... 34
18.1Features ................................................................................................................34
8068C–AVR–06/08
ii
18.2Overview ................................................................................................................34
19 TWI - Two Wire Interface ....................................................................... 35
19.1Features ................................................................................................................35
19.2Overview ................................................................................................................35
20 SPI - Serial Peripheral Interface ............................................................ 36
20.1Features ................................................................................................................36
20.2Overview ................................................................................................................36
21 USART ..................................................................................................... 37
21.1Features ................................................................................................................37
21.2Overview ................................................................................................................37
22 IRCOM - IR Communication Module ..................................................... 38
22.1Features ................................................................................................................38
22.2Overview ................................................................................................................38
XMEGA A3
23 Crypto Engine ......................................................................................... 39
23.1Features ................................................................................................................39
23.2Overview ................................................................................................................39
24 ADC - 12-bit Analog to Digital Converter ............................................. 40
24.1Features ................................................................................................................40
24.2Overview ................................................................................................................40
25 DAC - 12-bit Digital to Analog Converter ............................................. 42
25.1Features ................................................................................................................42
25.2Overview ................................................................................................................42
26 AC - Analog Comparator ....................................................................... 43
26.1Features ................................................................................................................43
26.2Overview ................................................................................................................43
26.3Input Selection .......................................................................................................45
26.4Window Function ...................................................................................................45
27 OCD - On-chip Debug ............................................................................ 46
27.1Features ................................................................................................................46
27.2Overview ................................................................................................................46
28 Program and Debug Interfaces ............................................................. 47
28.1Features ................................................................................................................47
28.2Overview ................................................................................................................47
8068C–AVR–06/08
iii
28.3JTAG interface .......................................................................................................47
28.4PDI - Program and Debug Interface ......................................................................47
29 Pinout and Pin Functions ...................................................................... 48
29.1Alternate Pin Function Description ........................................................................48
29.2Alternate Pin Functions .........................................................................................50
30 Peripheral Module Address Map .......................................................... 53
31 Instruction Set Summary ....................................................................... 54
32 Electrical Characteristics - TBD ............................................................ 58
32.1Absolute Maximum Ratings* .................................................................................58
32.2DC Characteristics .................................................................................................58
32.3Speed ....................................................................................................................59
32.4ADC Characteristics – TBD ...................................................................................60
32.5DAC Characteristics – TBD ...................................................................................61
XMEGA A3
32.6Analog Comparator Characteristics – TBD ...........................................................61
33 Typical Characteristics - TBD ............................................................... 62
34 Packaging information .......................................................................... 63
34.164A ........................................................................................................................63
34.264M1 ......................................................................................................................64
35 Errata ....................................................................................................... 65
35.1All rev. ....................................................................................................................65
36 Datasheet Revision History ................................................................... 66
36.18068C – 06/08 .......................................................................................................66
36.28068B – 06/08 .......................................................................................................66
36.38068A – 02/08 .......................................................................................................66
Table of Contents....................................................................................... i
8068C–AVR–06/08
iv
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8068C–AVR–06/08
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