The AT89C2051 is a low-vo ltage, high-pe rformanc e CMOS 8 -bit micr ocompu ter with
2K Bytes of Flash programmable and erasa ble read only memory (PERO M). The
device is manufactured using Atmel’s high density nonvolatile memory technology
and is compatibl e with the in dustry standard MCS-51™ instru ctio n set. By comb ining
a versatile 8-bit CPU with Flash on a monolithic chip, the Atmel AT89C2051 is a powerful microcomputer which provides a highly flexible and c ost effective solutio n to
many embedded control applications.
The AT89C2051 provides the following standard features: 2K Bytes of Flash, 128
bytes of RAM, 15 I/O lines, two 16-b it time r/cou nters, a five vect or two- level i nterru pt
architecture, a full duplex serial port, a precision analog comparator, on-chip oscillator
and clock circuitry. In a ddi tio n, the AT89C2051 is designe d wi th sta t ic l og ic for oper a tion down to zero frequency and supports two software selectable power saving
modes. The Idle Mode stops the CPU while allowing the RAM, timer/counters, serial
port and interrupt system to continue functioning. The Power Down Mode saves the
RAM contents but freezes the oscillator disabling all other chip functions until the next
hardware reset.
Pin Configuration
PDIP/SOIC
/VPP
Flash
AT89C2051
0368D-B–12/97
4-15
Block Diagram
4-16
AT89C2051
AT89C2051
Pin Description
V
CC
Supply voltage.
GND
Ground.
Port 1
Port 1 is an 8-bit bidirectional I/O port. Port pins P1.2 to
P1.7 provide interna l pullup s. P1. 0 and P1 .1 requ ire ext ernal pullups. P1.0 and P1.1 also serve as the positive input
(AIN0) and the negativ e input (AIN1), res pectively, of the
on-chip precision analog comparator. The Port 1 output
buffers can sink 20 mA and can drive LED displays directly.
When 1s are written to Port 1 pins, they can be used as
inputs. When pins P 1.2 to P1.7 ar e used a s inp uts an d are
externally pulled low, they will source current (I
of the internal pullups.
Port 1 also receives code data during Flash programming
and verification.
Port 3
Port 3 pins P3.0 to P3 .5, P3.7 are sev en bidirecti onal I/O
pins with inter nal pullups . P 3.6 i s har d-wire d as an input to
the output of the on-chip comparator and is not accessible
as a general purpose I/O pin. The Port 3 output buffers can
sink 20 mA. When 1s are writt en to Port 3 pins they are
pulled high by th e internal pullup s and can be use d as
inputs. As inputs, Port 3 pins that are externally being
pulled low will source current (I
Port 3 also se rves the fu nctio ns o f vari ous sp ecial feat ures
of the AT89C2051 as listed below:
) because of the pullups.
IL
) because
IL
XTAL2
Output from the inverting oscillator amplifier.
Oscillator Characteristics
XTAL1 and XTAL2 are the input and output, respecti vely,
of an inverting amplif ier which can be con figured for use as
an on-chip oscillator, as shown in Figure 1. Either a quartz
crystal or ceramic resonator may be used. To drive the
device from an external clock source, XTAL2 should be left
unconnected while XTAL1 is driven as shown in Fi gure 2.
There are no requirements on the duty cycle of the external
clock signal, since the input to the internal clocking circuitry
is through a divide-by-two flip-flop, but minimum and maximum voltage high and low tim e specificat ions must be
observed.
Port 3 also receives some control signals for Flash programming and verification.
RST
Reset input. All I/O pins are reset to 1s as soon as RST
goes high. Holding the RST pin high for two machine cycles
while the oscillator is running resets the device.
Each machine cycle takes 12 oscillator or clock cycles.
XTAL1
Input to the inverting os cillator ampl ifier and input to the
internal clock operating circuit.
(external interrupt 1)
Note:C1, C2 = 30 pF ± 10 pF for Cry s tals
= 40 pF ± 10 pF for Ceramic Resonators
Figure 2.
External Clock Drive Configuration
4-17
Special Function Registers
A map of the on-chip memory area called the Special Function Register (SFR) space is shown in the table below.
Note that not all of the addresses are occupied, and unoccupied addresses may not be implemented on the chip.
Read accesses to these addresses will in general return
random data, and write accesses will have an indeterminate effect.
User software should not write 1s to these unlisted locations, since they may be used in future products to invoke
new features. In th at case, th e reset or inac tive valu es of
the new bits will always be 0.
Table 1.
0F8H0FFH
0F0HB
0E8H0EFH
0E0HACC
0D8H0DFH
0D0HPSW
0C8H0CFH
0C0H0C7H
0B8HIP
0B0HP3
AT89C2051 SFR Map and Reset Values
0F7H
00000000
0E7H
00000000
0D7H
00000000
0BFH
XXX00000
0B7H
11111111
0A8HIE
0XX00000
0A0H0A7H
98HSCON
00000000
90HP1
11111111
88HTCON
00000000
80HSP
4-18
SBUF
XXXXXXXX
TMOD
00000000
00000111
TL0
00000000
DPL
00000000
AT89C2051
TL1
00000000
DPH
00000000
TH0
00000000
TH1
00000000
PCON
0XXX0000
0AFH
9FH
97H
8FH
87H
AT89C2051
Restrictions on Certain Instructions
The AT89C2051 and is an economical and cost-effective
member of Atmel’s growing family of microcontrollers. It
contains 2K bytes of flash progr am memory . It is fully compatible with the MCS-51 architecture, and can be programmed using the MCS-51 instruction set. However,
there are a few considerations one must keep in mind when
utilizing certain instructions to program this device.
All the instructions related to jumping or branching should
be restricted such that the destination address falls within
the physical program memory space of the device, which is
2K for the AT89C2051. This should be the responsibility of
the software programmer. For example, LJMP 7E0H would
be a valid instruction for the AT89C2051 (with 2K of memory), whereas LJMP 900H would not.
1. Branching instructions:
LCALL, LJMP, ACALL, AJMP, SJMP, JMP @A+DPTR
These unconditional branching instructions will execute
correctly as long as the programmer keeps in mind that the
destination branching address must fall within the physical
boundaries of the program memory size (locations 00H to
7FFH for the 89C2051). Vi ol ating the physical spac e l imits
may cause unknown program behavior.
CJNE [...], DJNZ [...], JB, JNB, JC, JNC, JBC, JZ, JNZ With
these conditional branching instructions the same rule
above applies. Again, violating the memory boundaries
may cause erratic execution.
For applications invol ving interrupts the normal inte rrupt
service routine address locations of the 80C51 family architecture have been preserved.
2. MOVX-related instructions, Data Memory:
The AT89C2051 contains 128 bytes of internal data memory. Thus, in the AT89C2051 the stack depth is limited to
128 bytes, the amount of av ailable RA M. External DATA
memory access is not supported in this device, nor is external PROGRAM memor y executio n. Therefore , no MOVX
[...] instructions should be included in the program.
A typical 80C51 assembler will still assemble instructions,
even if they are written in violation of the restrictions mentioned above. It is the responsibility of the controller user to
know the physical features and limitations of the device
being used and adjust the instructions used correspondingly.
Program Memory Lock Bits
On the chip are two lock bits whic h can be left unprogrammed (U) or can be programmed (P) to obtain the additional features listed in the table below:
Lock Bit Protection Modes
Program Lock Bits
LB1LB2Protection Type
1UUNo program lock features.
2PUFurther programming of the Flash
is disabled.
3PPSame as mode 2, also verify is
disabled.
Note:1. The Lock Bits ca n only be erase d with the Chip Er ase
operation.
(1)
Idle Mode
In idle mode, the CPU puts itself to sleep while all the onchip peripherals remain active. The mode is invoked by
software. The content of the on-chip RAM and all the special functions r egisters remain un changed during thi s
mode. The idle mode can be te rminated by any ena bled
interrupt or by a hardware reset.
P1.0 and P1.1 should be set to ’0’ if no external pullups are
used, or set to ’1’ if external pullups are used.
It should be noted th at when idl e is termi nated by a h ardware reset, the devic e normally res umes progr am execution, from where it le ft off, up to tw o machi ne c ycles before
the internal reset algorithm takes control. On-chip hardware
inhibits access to interna l RAM in this event, but access to
the port pins is not inhibited. To eliminate the possibility of
an unexpected write to a port pin when Idle is terminated by
reset, the instruction following the one that invokes Idle
should not be one th at writes to a p ort pin or to external
memory.
Power Down Mode
In the power down mode the oscillator is stopped, and the
instruction that in vokes po wer down is the last instruc tion
executed. The on-chip RAM and Special Function Registers retain their values until t he power do wn mode is ter minated. The only ex it fr om p ower down is a har dware re set.
Reset redefines the SF Rs b ut d oes no t c han ge t he o n-ch ip
RAM. The reset should not be activated before V
restored to its normal operating level and must be held
active long enough to allow the oscillator to restart and stabilize.
P1.0 and P1.1 should be set to ’0’ if no external pullups are
used, or set to ’1’ if external pullups are used.
CC
is
4-19
Programming The Flash
The AT89C2051 is sh ipped with the 2 K bytes of on-chip
PEROM code memory array in the erased state (i.e., contents = FFH) and ready to be programmed. The code memory array is programmed one byte at a time.
is programmed, to re-program any non-blank byte, the
entire memory array needs to be erased electrically.
Internal Address Counter:
internal PEROM address counter which is always reset to
000H on the rising edge of RST and i s adva nced by app lying a positive going pulse to pin XTAL1.
Programming Algorithm:
the following sequence is recommended.
1. Power-up sequence:
Apply power between V
Set RST and XTAL1 to GND
2. Set pin RST to ’H’
Set pin P3.2 to ’H’
3. Apply the appropriate combination of ’H’ or ’L’ logic
levels to pins P3.3, P3.4, P3.5, P3.7 to select one of the
programming operations shown in the PEROM Programming Modes table.
To Program and Verify the Array:
4. Apply data for Code byte at location 000H to P1.0 to
P1.7.
5. Raise RST to 12V to enable programming.
6. Pulse P3.2 once to program a byte in the PEROM array
or the lock bits. The byte-write cycle is self-timed and
typically takes 1.2 ms.
7. To verify the programmed data, lower RST from 12V to
logic ’H’ level and set pins P3.3 to P3.7 to the appropiate
levels. Output data can be read at the port P1 pins.
8. To program a byte at the next address location, pulse
XTAL1 pin once to advance the internal address counter.
Apply new data to the port P1 pins.
9. Repeat steps 5 through 8, changing data and advancing
the address counter for the entire 2K bytes array or until
the end of the object file is reached.
10.Power-off sequence:
set XTAL1 to ’L’
set RST to ’L’
Turn V
Polling:
Data
indicate the end of a write cycle. During a write cycle, an
attempted read of the last byte written will result in the complement of the written data on P1.7. Once the write cycle
has been completed, true data is va lid on all outputs, and
the next cycle may begin. Da ta
after a write cycle has been initiated.
power off
CC
The AT89C2051 fea tures Data
The AT89C2051 contai ns an
To program the AT89C2051,
and GND pins
CC
Polling may begi n any ti me
Once the array
Polling to
Ready/Busy
be monitored by the RDY/BSY
pulled low after P3.2 goes High during programming to indicate BUSY. P3.1 is pulled High again when programming is
done to indicate READY.
Program Verif y:
programmed code data can be read back via the data lines
for verification:
1. Reset the internal address counter to 000H by bringing
RST from ’L’ to ’H’.
2. Apply the appropriate control signals for Read Code data
and read the output data at the port P1 pins.
3. Pulse pin XTAL1 once to advance the internal address
counter.
4. Read the next code data byte at the port P1 pins.
5. Repeat steps 3 and 4 until the entire array is read.
The lock bits cannot be verified directly. Verification of the
lock bits is achieved by obs erving that their features are
enabled.
Chip Erase:
two Lock Bits are erased electrically by using the proper
combination of control signals and by holding P3.2 low for
10 ms. The code array is written with all “1”s in the Chip
Erase operation and must be executed before any nonblank memory byte can be re-programmed.
Reading the Signature Bytes:
read by the same procedure as a normal verification of
locations 000H, 001H, and 002H, except that P 3.5 and
P3.7 must be pulled to a logic low. The values retur ned are
as follows.
Every code byte in the Flash array c an be written and the
entire array can be erased by using the app ropriat e combi nation of control signals. The write operation cycle is s elftimed and once initiated, will automatically time itself to
completion.
All major programmi ng ve ndors of fer worl dwide s upport fo r
the Atmel microcontroller series. Please contact your local
programming vendor for the appropriate software revision.
4-20
AT89C2051
AT89C2051
Flash Programming Modes
ModeRST/VPPP3.2/PROGP3.3P3.4P3.5P3.7
Write Code Data
(1)(3)
12VLHHH
Read Code Data
Write Lock Bit - 112VHHHH
Chip Erase12VHLLL
Read Signature ByteHHLLLL
Notes: 1. The internal PEROM address counter is reset to 000H on the rising edge of RST and is advanced by a positive pulse at
2. Chip Erase requires a 10-ms PROG
3. P3.1 is pulled Low during programming to indicate RDY/BSY.
Figure 3.
(1)
Bit - 212VHHLL
XTAL 1 pin.
Programming the Flash Memory
pulse.
HHLLHH
(2)
Figure 4.
Verifying the Flash Memory
PP
4-21
Flash Programming and Verification Characteristics
TA = 0°C to 70°C, VCC = 5.0 ± 10%
SymbolParameterMinMaxUnits
V
PP
I
PP
t
DVGL
t
GHDX
t
EHSH
t
SHGL
t
GHSL
t
GLGH
t
ELQV
t
EHQZ
t
GHBL
t
WC
t
BHIH
t
IHIL
Note:1. Only used in 12-volt programming mode.
Programming Enable Voltage11.512.5V
Programming Enable Current250
Data Setup to PROG Low1.0
Data Hold After PROG1.0
P3.4 (ENABLE) High to V
PP
1.0
VPP Setup to PROG Low10
VPP Hold After PROG10
PROG Width1110
ENABLE Low to Data Valid1.0
Data Float After ENABLE01.0
PROG High to BUSY Low50ns
Byte Write Cycle Time2.0ms
RDY/BSY\ to Increment Clock Delay1.0
Increment Cloc k Hi gh200ns
A
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
µ
Flash Programming and Verification Waveforms
4-22
AT89C2051
Absolute Maximum Ratings*
AT89C2051
Operating Temperature................................. -55°C to +125°C
*NOTICE:Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent dam-
Storage Temperature..................................... -65°C to +150°C
age to the dev ice . This is a s tress rating only an d
functional oper ation of the de vi ce at these or any
Voltage on Any Pin
with Respect to Ground.....................................-1.0V to +7.0V
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
Maximum Operating Voltage............................................. 6.6V
conditions f or e xtended periods ma y af fect de vice
reliability .
DC Output Current......................................................25.0 mA
DC Characteristics
TA = -40°C to 85°C, VCC = 2.0V to 6.0V (unless otherwise noted)
SymbolParameterConditionMinMaxUnits
V
IL
V
IH
V
IH1
V
OL
V
OH
Input Low Voltage-0.50.2 V
Input High Vo ltage(Except XTAL1, RST)0.2 V
Input High Vo ltage(XTAL1, RST)0.7 V
Output Low Voltage
Comparator Input Offset VoltageVCC = 5V20mV
Comparator Input Common
0VCCV
Mode Voltage
RRSTReset Pulldown Resistor50300K
C
I
IO
CC
Pin CapacitanceTest Freq. = 1 MHz, TA = 25°C10pF
Power Supply CurrentActive Mode, 12 MHz, VCC = 6V/3V15/5.5mA
Power Down Mode
(2)
Idle Mode, 12 MHz, V
P1.0 & P1.1 = 0V or V
VCC = 6V P1.0 & P1.1 = 0V or V
VCC = 3V P1.0 & P1.1 = 0V or V
= 6V/3V
CC
CC
CC
CC
5/1mA
100
20
Notes: 1. Under steady state (non-transient) conditions, IOL must be external ly limited as follows:
Maximum I
Maximum total I
exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater
If I
OL
per port pin: 20 mA
OL
for all output pins: 80 mA
OL
than the listed test conditions.
2. Minimum V
for Power Down is 2V.
CC
V
A
µ
A
µ
A
µ
Ω
A
µ
A
µ
4-23
External Clock Drive Waveforms
Exter nal Clock Drive
SymbolParameterVCC = 2.7V to 6.0VVCC = 4.0V to 6.0VUnits
MinMa xMinMa x
1/t
CLCL
t
CLCL
t
CHCX
t
CLCX
t
CLCH
t
CHCL
Oscillator Frequency012024MHz
Clock Period83.341.6ns
High Time3015ns
Low Time3015ns
Rise Time2020ns
Fall Time2020ns
4-24
AT89C2051
AT89C2051
Serial Port Timing: Shift Register Mode Test Conditions
(VCC = 5.0V ± 20%; Load Capacitance = 80 pF)
SymbolParameter12 MHz OscVariable OscillatorUnits
MinMaxMinMax
t
XLXL
t
QVXH
t
XHQX
t
XHDX
t
XHDV
Shift Register Mode Timing Waveforms
Serial Port Clock Cycle Time1.012t
Output Data Setup to Clock Rising Edge70010t
Output Data Hold After Clock Rising Edge502t
Input Data Hold After Clock Rising Edge00ns
Clock Rising Edge to Input Data Valid70010t
CLCL
-133ns
CLCL
-117ns
CLCL
-133ns
CLCL
s
µ
AC Testing Input/Output Waveforms
Note:1. AC Inputs during testing are driven at VCC - 0.5V for
a logic 1 and 0.45V for a logic 0. Timing measurements are made at V
max. for a logic 0.
min. for a logic 1 and VIL
IH
(1)
Float Waveforms
Note:1. For timing purposes, a port pin is no longer float-
ing when a 100 mV change from load voltage
occurs. A port pin begins to float when 100 mV
change frothe loaded V
(1)
OH/VOL
lev el oc curs.
4-25
AT89C2051
TYPICAL ICC - ACTIVE (85°C)
20
15
I
C
C
10
m
5
A
0
06121824
Vcc=5.0V
Vcc=6.0V
Vcc=3.0V
FREQUENCY (MHz)
AT89C2051
TYPICAL ICC - IDLE (85°C)
3
I
2
C
C
1
m
A
0
036912
FREQUENCY (MHz)
Vcc=5.0V
Vcc=6.0V
Vcc=3.0V
TYPICAL ICC vs. VOLTAGE- POWER DOWN (85°C)
20
15
I
C
C
10
µ
5
A
0
3.0V4.0V5.0V6.0V
Notes: 1.XTAL1 tied to GND for ICC (power down)
2. P.1.0 and P1.1 = VCC or GND
3. Lock bits programmed
4-26
AT89C2051
AT89C2051
Vcc VOLTAGE
Ordering Information
AT89C2051
Speed
(MHz)
122.7V to 6.0VAT89C2051-12PC
244.0V to 6.0VAT89C2051-24PC
Power
SupplyOrdering CodePackageOperation Range
AT89C2051-12SC
AT89C2051-12PI
AT89C2051-12SI
AT89C2051-12PA
AT89C2051-12SA
AT89C2051-24SC
AT89C2051-24PI
AT89C2051-24SI
20P3
20S
20P3
20S
20P3
20S
20P3
20S
20P3
20S
Commercial
(0°C to 70°C)
Industrial
(-40°C to 85°C)
Automotive
(-40°C to 105°C)
Commercial
(0°C to 70°C)
Industrial
(-40°C to 85°C)
Package Type
20P320 Lead, 0.300” Wide, Plastic Dual In- line Package (PDIP)
20S20 Lead, 0.300” Wide, Plastic Gull Wing Small Outline (SOIC)
4-27
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