Power Supply Voltage Operating Range: 1.8V to 3.6V
•
Low External Component Count
•
48QFN Package
Applications
•
Low Band IEEE 802.15.4/ZigBee™-based Systems
•
Industrial, Commercial, Home Lighting Control, Security, and HVAC
•
Inventory Management
•
Health Monitoring
•
Wireless PC Peripherals such as Mouse, Keyboard, and Joystick
•
Consumer Electronics Remote Controls and Toys
Description
The Atmel AT86RF210 Z-Link™ Transceiver is a fully integated, low-cost ZigBee
transceiver cap able of transmitting and receiving B PSK modulated digital data over a
frequency range of 868 MHz and 902–928 MHz using a minimum number of external
components. It combines excellent RF performance with low cost, small size and low
current consumpt ion . The AT86RF210 includes a c r ystal st abilized Fractional-N s ynthesizer, BPSK transmitter and receiver, and full Direct Sequence Sp read Spectrum
Signal (DSSS) processing, including spreading and despreading. The device is fully
compatable with IEEE 802.15.4 and ZigBee standards. It includes internal voltage
regulation and battery monitoring circuitr y and requires a minimum number of external
support components.
™
AT86RF210
Z-Link
™
Transceiver
868/902–928 MHz
Direct Sequence
Spread Spectrum
BPSK Transceiver
Preliminary
Figure 1. Block D iagram
Rx In
Sw Out
Ant In
Sw In
Tx Out
Low Noise
Amp
T/R Switch
Power Amp
I/Q Mixer
IF Amp
X
Polyphase
Filter
Synthesizer
Modulator
Demodulator
Despreader
Spreader
Data In
SPI Bus
Data Out
SDO
SDI
SCLK
SEL
5033AS–WIRE–10/03
Figure 1. Functional Block Diagram
SUB
LNAIN
LNAVSS
RSWOUT
VSS
ANT
VSS
TSWIN
VSS
PA OUT
VSS
TR
SW
PA
Regulator
LNAOUT
LNA
PA
GND
FSK
TUNE LOGIC
Fine
Atten
BPSKO
OK
MOD
VDDA
VSSA
/2
with
Buffers
FROM TXD
Spreader
VCO
Fcx2
Cap
Array
VDDD
VSSD
Reg Filter
Lim/PPF DC DIST
Image
P
P
F
M
U
X
1
Reject
Filter
1.200 MHz
bandwidth
Control
PPF
AUTOCAL
Circuit
P
P
F
M
U
X
2
DC DIST/BG/PTAT with
main BandGAP
/N-M
SDMOD
Tune W ord
Charge
Pump
PRGM
DIV
Coarse
Lock/Lock
Detect
Phase
Detector
VDD
DBLR
RSSI
IQ-Limiter Strip
1.2 MHz
Low
Voltage
Detect
Clock
Distribution
Xstal Osc
S
T
A
T
U
S
TEST
POR
Despreader
BPSK
Demod
Mode
Logic
Serial
Configruation
Register
RXD
CCA
START
TXD
NC
CHP_RDY
RESET_
RX
TX
CLK
SEL
SCL
SDO
PAREG
VCOREG
VCO
NC
NC
VCO
VSS
VCO
TUNE
CPVCO
CPOUT
XTALGND
XTAL1
XTAL2
SDI
Table 1. Absolute Maximum Ratings*
Storage Temperature ..............................................−65 to +150
Maximum Input Voltage...........................................VDD + 0.5V
Maximum Operating Voltage (VDD ) ................................... 4,5
*NOTE: Stresses beyond those listed in this table may cause per-
manent damage to the device. This is a stress rating
only; functional operation of the device at these or any
other co ndit ions beyond thos e indic ate d in the op eration al sec t io ns of the specification is not implied.
Exposure to the absolute maximum rating conditions for
extended periods may affect device reliability.
gain max setting
Rx IP3Input IP3−30dBm
Rx LO LeakageReceiver LO leakage (all possible paths)−80dBm
PinMaximum input signal; LNA gain min setting−20dBm
EDthreshDefault energy detection threshold
(programmable)
Ttx/rxTurnaround time, trans mit to receive100usec
Trx/txTurnaround time, receive to transmit100usec
RJAMadjReceiver relative jamming resistance adjacent
channel (desired signal = −89 dBm)
RJAMaltReceiv er r elativ e jam ming res istanc e alternate
channel (desired signal = −89 dBm)
IFCFIF center frequency 1.2MHz
850930MHz
−95dBm
−40dBm
−84dBm
0dB
30dB
IFBW IF bandwidth 600KHz
ImregIF image rejection−35dB
RX IFS/NRX IF SNR (600 KHz BW) Min input signal =
−100 dBm
Rx DRReceiver max data rate 40Kb/s
RSSI GNRSSI Gai n1.0uA/dB
RSSI RGRSSI RANGE−105−30dBm
5033AS–WIRE–10/03
10dB
3
Table 5. Transmitter AC Characteristics
SymbolParameterMinTypMaxUnit
Tx PoutTransmitter output power:
Vdd = 1.8V
Vdd = 3.6V
RsymTx symbol rate 915 MHz band40Kbit/s
RsymTx symbol rate 868 MHz band20Kbit/s
EVMTransmit error vector magnitude measured over
1000 chips
PSDTransmit power spectral density 915 MHz band;
|f–fc| >1.2 MHz (absolute measured in 100 KHz
resolution BW)
Tx PvarTransmitter power variation over temperature3dB
Tx/Rx ZAntenna swi tch impedance50Ohm
Tx spurTransmit spurious within ±2 MHz−25dBc
Tx spurTransmit spurious beyond ±2 MHz−35dBc
Tx PconTransmitter power control resolution0.250.75 dB
Tx PranTransmitter power control range25dB
Tx lvtTransmitter low-voltage threshold1.81.9Volt
Tx lvpoTransmitter low-voltage output power0.250.50mwatt
Tx totTransmitter turn-on time 90% full power10usec
6
12
35%
−20dBm
dBm
Tx tofftTransmitter turn-off time less than 10% of output
power
10usec
Table 6. Synthesizer AC Characteristics
SymbolParameterMinTypMaxUnit
F LOCarrier frequency850930MHz
LOPNLO phase noise (integrated 10 Hz–100 KHz rms)6deg
FpullCrystal oscillator frequency pulli ng @ 25°C20ppm
LopnoLocal oscillator phase noise 2.0 MHz offset from LO−95dBc
TXtal Crystal oscillator settling time150usec
TSynthPhase locked loop settling time 100usec
SynthresSynthesizer tuning resolution500Hz
Table 7. Serial Configuration Register* (Continued)
SymbolParameterMinTypMaxUnit
TCLKHCLK hold time25nsec
TCLKWCLK pulse width50nsec
TSDISSDI setup time25nsec
TSDIHSDI hold time25nsec
TSDODSDO delay time25nsec
Note:*Rise and fall time is measured 10%–90%. Delay, setup, and hold times are measured 50%–50%
Table 8. Low Battery Detector Characteristics
SymbolParameterMinTypMaxUnit
Lvbat 0Low voltage battery detector threshold voltage mode
0 (5 bit resolution)
1.53.5Volt
Table 9. Preliminary PIN Description QFN48
Startup
PINNumType
SUB1V_I/OGNDSubstrate connection
LNARFIN2RF_INALow-noise amplifier RF input
LNAVSS3RF_I/ONAAnalog ground for the LNA
RSWOUT4RF_I/ONATransmit- re c ei ve switc h out . Signal fr o m AN T is routed through the
VSS5R F_I/ONATransmit-receive switch isolation ground 1.
ANT6RF_I/ONAAntenna RF input/output. Nominal impedance 50Ω, part of T/R
VSS7R F_I/O NATransmit-receive switch isolation ground 2.
TSWIN8RF_I/ONATransmit-receive switch input. Signal from PA comes into TR switch
PAOUT9RF_I/ONAPA signal routed into the T/R switch from the PA.
VSS10Pin not used
CondDescription
TR switch to the LNA input.
switch. R o u te s signal t o th e LN A or fro m the PA.
and is routed to ANT.
VDDA11V_INASecondary analog power supp ly input. Set in proximity to power
amplifier circuits.
PAREG12A_ONAPA regulator ou tput. Settable cu rrent source output for charging a
large external capacitor during battery operation.
VCOVDD13V_INAVCO power supply input
VCOREG14V_INAExternal filter cap for the VCO regulator
No Connect15NAPin not used
No Connect16NAPin not used
VCOVSS17A_I/ONAVCO power supply ground
VCOTUNE18A_INALO VCO control input. An internal di ff erent ial varactor diode tunes the
LO frequency. The control voltage should be referenced to LOGND.
CPOUT19A_INACharge pump output
CPVSS20A_I/ONAAnalog synthesizer ground
CPVDD21V_INAAnalog synthesizer power supply
XTAL122A_INACrystal oscillator input 1. One side of oscillator crystal is connected
XTAL223A_INACrystal oscillator input 2. When internal oscillator is used, this pin
XTALVSS24A_I/ONACrystal oscilla tor ground
TXDAT25D_IHIGHTr ansmit data input from the controller
No Connect26D_ILOWPin not used
SDI27D_INASerial data input
SDO28D_ONAOutput from configuration data shift register. Data changes at the
SCLK29D_INASerial data clock
CondDescription
to this pin.
has crystal conne cted. When external clock is used, the external
clock is input on this pin.
Input to configuration data shift register. Data accepted at the rising
edge of SCL.
falling edge of SCL.
SEL30D_IHIGHSPI slave select line
SYSCLK31D_OHIGHCl ock output to controller. Can be divided by 1 to 16 .
TX32D_IHIGHMode control input. TX HIGH with RX LOW causes chip to go to
transmit.
RX33D_IHIGHMode control input. RX HIGH with TX LOW causes chip to go to
receive mode.
VDDDIG34V_INADigital power supply input
VSSDIG35V_I/ONADigital power supply ground.
START36D_IHIGHOscillator start. A transition on this pin will start the internal oscillato r.
A low on this pin allows the part to run from an external clock.
CHPRDY37D_OLOWChip ready. Handshake signal between the controller and the chip.
Also acts as fault interrupt.
RXDOUT38D_ONADigital da ta from demodulator
No Connect39NAPin not used
No Connect40NAPin not used
No Connect41Pin not used
PPFREG42V_I /OVD DFilter cap fo r internal low d ropout regulator for poly phase filter
RSSI43A_0Logarithmic detection current
XTALMODE44D_IOTBDTest pin. Enables nand tree test or scan test.
CCA45D_OLOWClear channel assessment. Digital signal i ndicates when channel
VDDA46V_INAAnalog (RF) power supply input
VSSA47V_I/OGNDAnalog (RF) power supply ground
LNAOUT48A_I/OLNA external inductor. Collector inductor for LNA. P/O RF tuning
CondDescription
network.
I/O Table Notes
•RF_IRF input
•RF_I/ORF input/output
•Voltage_I/OVoltage input/output
•V_IVoltage input
•A_IAnalog input
•A_OAnalog output
•D_IDigital input
•D_ODigital output
5033AS–WIRE–10/03
7
Figure 2. Typical ZigBee Application Schematic
This is a sample application schematic for RF210
(The pinout and component values are preliminary)
Receiver T uning
C10
TBDL0TBD
Receiver Matching
L1
C17
TBD
TBD
C15
TBD
C18
100P
PA Matching
C19
TBD
L2
C22
TBD
100p
TBD
L6
X
TBD
C21
C20
250u
Optional
Note: With pin 44 (Xstal_Sel) low RF210 uses system clock from controller
With pin 44 (Xstal_Sel) high RF210 uses external crystal placed across pin 22 & 23
Notes:1. This drawing is for general information only. Refer to JEDEC Drawing MO-220, Variation VKKD-2, for proper dimensions,
2325 Orchard Parkway
R
San Jose, CA 95131
5033AS–WIRE–10/03
tolerances, datums, etc.
2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the
terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area.
TITLE
48QN1, 48-lead 7.0 x 7.0 mm Body, 0.50 mm Pitch, Quad Flat
No Lead Package (QFN)
DRAWING NO.
48QN1
12/10/02
REV.
A
9
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