ATMEL AT49LV4096-20TI, AT49LV4096-20TC, AT49LV4096-20RI, AT49LV4096-20RC, AT49LV4096-15TI Datasheet

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Low Voltage Operation
- 2.7V Read
- 5V Program/Erase
Fast Read Access Time - 120 ns
Internal Erase/Program Control
Sector Architecture
- One 8K Words (16K bytes) Boot Block with Programming Lockout
- Two 8K Words (16K bytes) Parameter Blocks
- One 232K Words (464K bytes) Main Memory Array Block
Fast Sector Erase Time - 10 seconds
Word-By-Word Programming - 10 µs/Word
Hardware Data Protection
DATA Polling For End Of Program Detection
Low Power Dissipation
- 25 mA Active Current
- 50 µA CMOS Standby Current
Typical 10,000 Write Cycles
Description
The AT49BV4096 and AT49LV4096 are 3-volt, 4-megabit Flash Memories organized as 256K words of 16 bits each. Manufactured with Atmel’s advanced nonvolatile CMOS technology, the devices offer access times to 120 ns with power dissipation of just 67 mW at 2.7V read. When deselected, the CMOS standby current is less than 50 µA.
To allow for simple in-system reprogrammability, the AT49BV4096/LV4096 does not require high input voltages for programming. Reading data out of the device is similar to reading from an EPROM; it has standard
CE, OE, and WE inputs to avoid bus
4-Megabit (256K x 16) 3-volt Only CMOS Flash Memory
AT49BV4096 AT49LV4096 Preliminary
Pin Configurations
Pin Name Function
A0 - A17 Addresses CE Chip Enable OE Output Enable WE Write Enable RESET Reset
V
PP
I/O0 - I/O15 NC No Connect
A15
A14
A13
A12
A11
A10
A9
NC
NC
WE
RESET
VPP
NC
NC
NC
A17
A6 A4
A2
Program/Erase Power Supply
Data Inputs/Outputs
TSOP Top View
Type 1
1
2
3
4
5
6
7
A8
8
9
10
11
12
13
14
15
16 18
A7
19 I/O8
A5
20
21
22
A3
23
24
A1
(continued)
AT49BV4096/LV4096
SOIC (SOP)
VPP
1 2
NC
A17
3
A7
4
A6
5
A5
6
A4
7
A3
8 9
A2
10
A1
11
A0
NC I/O15
I/O14 I/O13 I/O12 VCC I/O3
I/O2 I/O1 I/O0 GND A0
A16 GND
I/O7 I/O6 I/O5 I/O4 I/O11
I/O10 I/O9
OE CE
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
3217
31
30
29
28
27
26
25
CE
GND
OE I/O0 I/O8 I/O1 I/O9 I/O2
I/O10
I/O3
I/O11
12 13
14
15 16 17 18 19 20 21 22
RESET
44
WE
43
A8
42
A9
41
A10
40
A11
39
A12
38
A13
37
A14
36
A15
35
A16
34
NC
33
GND
32 31
I/O15
I/O7
30
I/O14
29
I/O6
28
I/O1327 I/O5
26
I/O1225 I/O4
24
VCC23
0874A–5/97
contention. Reprogramming the AT49BV4096/LV4096 is performed by first erasing a block of data and then pro­gramming on a word-by-word basis.
The device is erased by executing the erase command sequence; the device internally controls the erase oper a­tion. The memory is divided into three blocks for erase op­erations. There are two 8K word parameter block sections and one sector consisting of the boot block and the main memory array block. The AT49B V4096/LV4096 is pro­grammed on a word-by-word basis.
The device has the capability to protect the data in the boot block; this feature is en abled by a command se-
Block Diagram
quence. Once the boot block programming lockout feature is enabled, the data in the boot block cannot be changed when input levels of 3.6 volts or less are used. The typical number of program and erase cycles is in excess of 10,000 cycles.
The optional 8K word boot block section includes a repro­gramming lock out feature to provide data integrity. The boot sector is designed to contain user secure code, and when the feature is enabled, the boot sector is pr otected from being reprogrammed.
During a chip erase, sector erase, or word programming, the V
pin must be at 5V ± 10%.
PP
Device Operation
READ:
EPROM. When data stored at the memory location determined by the ad­dress pins is asserted on the outputs. The outputs are put in the high impedance state whenever This dual-line control gives designers flexibility in prevent­ing bus contention.
COMMAND SEQUENCES:
ered on it will be reset to the read or standby mode de­pending upon the state of the control line inputs. In order to perform other device functions, a series of command sequences are entered into the device. The command se­quences are shown in the Command Definitions table (I/O8 - I/O15 are don’t care inputs for the command codes). The command sequences are written by applying a low pulse on the (respectively) and falling edge of is latched by the first rising edge of microprocessor write timings are used. The address loca­tions used in the command sequences are not affected by entering the command sequences.
The AT49BV4096/LV4096 is accessed like an
CE and OE are low and W E is high, the
CE or OE is high.
When the device is first pow-
WE or CE input with CE or WE low
OE high. The address is latched on the
CE or WE, whichever occurs last. The data
CE or WE. Standard
RESET input pin is provided to ease some
RESET:
system applications. When the device is in its standard operating mode. A low level on the puts the outputs of the device in a high impedance state. When a high level is reasserted on the device returns to the Read or Standby mode, depending upon the state of the control inputs. By applying a 12V ±
0.5V input signal to the can be reprogrammed even if the boot block program lock­out feature has been enabled (see Boot Block Program­ming Lockout Override section).
ERASURE:
be erased. The erased state of memory bits is a logical “1”. The entire device can be erased by using the Chip Erase command or individual sectors can be erased by using the Sector Erase commands.
CHIP ERASE:
time by using the 6-byte chip erase software code. After the chip erase has been initiated, the device will internally time the erase operation so that no external clocks are re­quired. The maximum time to erease the chip is t
A
RESET is at a logic high level,
RESET input halts the present device operation and
RESET pin, the
RESET pin the boot block array
Before a word can be reprogrammed, it must
The entire device can be erased at one
.
EC
2
AT49BV/LV4096
AT49BV/LV4096
If the boot block lockout has been enabled, the Chip Erase will not erase the data in the boot block; it will erase the main memory block and the parameter blocks only. After the chip erase, the device will return to the read or standby mode.
SECTOR ERASE: As an alternative to a full chip erase, the device is organized into three sectors that can be indi­vidually erased. There are two 8K word parameter block sections and one sector consisting of the boot block and the main memory array block. The Sector Erase command is a six bus cycle operation. The sector address is latched on the falling data input command is latched at the rising edge of The sector erase starts after the rising edge of sixth cycle. The erase operation is internally controlled; it will automatically time to completion. When the boot block programming lockout feature is not enabled, the boot block and the main memory block will erase together (from the same sector erase command). Once the boot region has been protected, only the main memory array sector will erase when its sector erase command is issued.
WORD PROGRAMMING: Once a memory block is erased, it is programmed (to a logical “0”) on a word-by­word basis. Programming is accomplished via the internal device command register and is a 4 bus cycle operation. The device will automatically generate the required inter­nal program pulses.
Any commands written to the chip during the embedded programming cycle will be ignored. If a hardware reset happens during programming, the data at the location be­ing programmed will be corrupted. Please note that a data “0” cannot be programmed back to a “1”; only erase opera­tions can convert “0”s to “1”s. Programming is completed after the specified t ture may also be used to indicate the end of a program cycle.
BOOT BLOCK PROGRAMMING LOCKOUT: The de­vice has one designated block that has a programming lockout fea ture. This feature p revents programming of data in the designated block once the featur e has been enabled. The size of the block is 8K words. This block, referred to as the boot block, can contain secure code that is used to bring up the system. Enabling the lockout fea­ture will allow the boot code to stay in the device while data in the rest of the device is updated. This featur e does not have to be activated; the boot block’s usage as a write protected region is optional to the user. The address range of the boot block is 00000H to 01FFFH.
Once the feature is enabled, the data in the boot block can no longer be erased or programmed when input levels of
5.5V or less are used. Data in the main memory block can still be changed through the regular programming method. To activate the lockout feature, a series of six program
WE edge of the sixth cycle while the 30H
WE.
WE of the
cycle time. The DATA polling fea-
BP
commands to specific addresses with specific data must be performed. Please refer to the Command Definitions table.
BOOT BLOCK LOCKOUT DETECTION: A software method is available to determine if programming of the boot block section is locked out. When the device is in the software product identification mode (see Software Prod­uct Identification Entry and Exit sections) a read from ad­dress location 00002H will show if programming the boot block is locked out. If the data on I/O0 is low, the boot block can be programmed; if the data on I/O0 is high, the program lockout feature has been enabled and the block cannot be programmed. The software product identifica­tion exit code should be used to return to standard opera­tion.
BOOT BLOCK PROGRAMMING LOCKOUT OVER­RIDE: The user can override the boot block programming
lockout by taking the this protected boot block data can be altered through a chip erase, sector erase or word programming. When the RESET pin is brought back to TTL levels the boot block programming lockout feature is again active.
PRODUCT IDENTIFICATION: The product identification mode identifies the device and manufacturer as A tmel. It may be accessed by hardware or software operation. The hardware operation mode can be used by an external pro­grammer to identify the correct programming algorithm for the Atmel product.
For details, see Operating Modes (for hardware operation) or Software Product Identification. The manufacturer and device code is the same for both modes.
DATA POLLING: The AT49BV4096/LV4096 features DATA polling to indicate the end of a program cycle. Dur­ing a program cycle an attempted read of the last byte loaded will result in the complement of the loaded data on I/O7. Once the program cycle has been completed, true data is valid on all outputs and the next cycle may begin. Duri ng a chip o r sector erase ope ration, an attempt to read the device will give a “0” on I/O7. Once the program or erase cycle has completed, true data will be read from the device. program cycle.
TOGGLE BIT: In addition to AT49BV4096/LV4096 provides another method for deter­mining the end of a program or erase cycle. During a pro­gram or erase operation, successive attempts to read data from the device will result in I/O6 toggling between one and zero. Once the program cycle has completed, I/O6 will stop toggling and valid data will be read. Examining the toggle bit may begin at any time during a program cycle.
HARDWARE DATA PROTECTION: Hardware features protect against inadvertent programs to the AT49BV4 096/LV4096 in the following ways: ( a) V
DATA polling may begin at any time during the
RESET pin to 12 ± 0.5 volts. By doing
DATA polling the
CC
3
sense: if VCC is below 1.8V (typical), the program function is inhibited. (b) V reached the V
CC
power on delay: once VCC has
CC
sense level, the device will automat­ically time out 10 ms (typical) before programming. (c) Program inhibit: holding any one of
OE low, CE high or WE high inhibits program cycles. (d) Noise filter: pulses of less than 15 ns (typical) on the
WE or CE inputs will not
initiate a program cycle.
INPUT LEVELS:
power supply, the address inputs and control inputs (
While operating with a 2.7V to 3.6V
OE, CE, and WE) may be driven from 0 to 5.5V without ad­versely affecting the operation of the device. The I/O lines can only be driven from 0 to V
+ 0.6V.
CC
Command Definition (in Hex)
Command Sequence
Read Chip Erase
Sector Erase
Word Program
Boot Block Lockout
Product ID Entry
Product ID
(3)
Exit Product ID
(3)
Exit
Notes: 1. The DATA FORMAT in each bus cycle is as follows :
2. The 8K word boot sector has the address rang e
3. Either one of the Product ID Exit commands
Bus
Cycles
1AddrD 6 5555 AA 2AAA 55 5555 80 5555 AA 2AAA 55 5555 10
6 5555 AA 2AAA 55 5555 80 5555 AA 2AAA 55 SA
4 5555 AA 2AAA 55 5555 A0 Addr D
(2)
6 5555 AA 2AAA 55 5555 80 5555 AA 2AAA 55 5555 40
3 5555 AA 2AAA 55 5555 90
3 5555 AA 2AAA 55 5555 F0
1xxxxF0
I/O15 - I/O8 (Don’t Care); I/O7 - I/O0 (Hex) 00000H to 01FFF H. can be used.
1st Bus
Cycle
Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data
OUT
(1)
2nd Bus
Cycle
3rd Bus
Cycle
4. SA = sector addresses: SA = 03XXX for PARAMETER BLOCK 1 SA = 05XXX for PARAMETER BLOCK 2 SA = 1FXXX for MAIN MEMORY ARRAY
5. When the boot block programming lockout feature is not enabled, the boot block and the main memory block will erase
4th Bus
Cycle
5th Bus
Cycle
(4, 5)
IN
6th Bus
Cycle
30
Absolute Maximum Ratings*
Temperature Under Bias.................-55°C to +125°C
Storage Temperature......................-65°C to +150°C
All Input Voltages (including NC Pins)
with Respect to Ground ................... -0.6V to +6.25V
All Output Voltages
with Respect to Ground .............-0.6V to V
Voltage on
OE
with Respect to Ground ................... -0.6V to +13.5V
4
AT49BV/LV4096
+ 0.6V
CC
*NOTICE: Stresses beyond thos e listed under “Absolute Maxi-
mum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or an y ot he r con ditions beyond t ho se ind i­cated in the oper ational sections of this specification is not implied. Exposure to absolute maximum rating conditio ns for extended periods may affect device reliability.
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