- One 8K Words (16K bytes) Boot Block with Programming Lockout
- Two 8K Words (16K bytes) Parameter Blocks
- One 232K Words (464K bytes) Main Memory Array Block
Fast Sector Erase Time - 10 seconds
•
Word-By-Word Programming - 10 µs/Word
•
Hardware Data Protection
•
DATA Polling For End Of Program Detection
•
Low Power Dissipation
•
- 25 mA Active Current
- 50 µA CMOS Standby Current
Typical 10,000 Write Cycles
•
Description
The AT49BV4096 and AT49LV4096 are 3-volt, 4-megabit Flash Memories organized
as 256K words of 16 bits each. Manufactured with Atmel’s advanced nonvolatile
CMOS technology, the devices offer access times to 120 ns with power dissipation of
just 67 mW at 2.7V read. When deselected, the CMOS standby current is less than
50 µA.
To allow for simple in-system reprogrammability, the AT49BV4096/LV4096 does not
require high input voltages for programming. Reading data out of the device is similar
to reading from an EPROM; it has standard
CE, OE, and WE inputs to avoid bus
4-Megabit
(256K x 16)
3-volt Only
CMOS Flash
Memory
contention. Reprogramming the AT49BV4096/LV4096 is
performed by first erasing a block of data and then programming on a word-by-word basis.
The device is erased by executing the erase command
sequence; the device internally controls the erase oper ation. The memory is divided into three blocks for erase operations. There are two 8K word parameter block sections
and one sector consisting of the boot block and the main
memory array block. The AT49B V4096/LV4096 is programmed on a word-by-word basis.
The device has the capability to protect the data in the
boot block; this feature is en abled by a command se-
Block Diagram
quence. Once the boot block programming lockout feature
is enabled, the data in the boot block cannot be changed
when input levels of 3.6 volts or less are used. The typical
number of program and erase cycles is in excess of
10,000 cycles.
The optional 8K word boot block section includes a reprogramming lock out feature to provide data integrity. The
boot sector is designed to contain user secure code, and
when the feature is enabled, the boot sector is pr otected
from being reprogrammed.
During a chip erase, sector erase, or word programming,
the V
pin must be at 5V ± 10%.
PP
Device Operation
READ:
EPROM. When
data stored at the memory location determined by the address pins is asserted on the outputs. The outputs are put
in the high impedance state whenever
This dual-line control gives designers flexibility in preventing bus contention.
COMMAND SEQUENCES:
ered on it will be reset to the read or standby mode depending upon the state of the control line inputs. In order
to perform other device functions, a series of command
sequences are entered into the device. The command sequences are shown in the Command Definitions table
(I/O8 - I/O15 are don’t care inputs for the command
codes). The command sequences are written by applying
a low pulse on the
(respectively) and
falling edge of
is latched by the first rising edge of
microprocessor write timings are used. The address locations used in the command sequences are not affected by
entering the command sequences.
The AT49BV4096/LV4096 is accessed like an
CE and OE are low and W E is high, the
CE or OE is high.
When the device is first pow-
WE or CE input with CE or WE low
OE high. The address is latched on the
CE or WE, whichever occurs last. The data
CE or WE. Standard
RESET input pin is provided to ease some
RESET:
system applications. When
the device is in its standard operating mode. A low level on
the
puts the outputs of the device in a high impedance state.
When a high level is reasserted on the
device returns to the Read or Standby mode, depending
upon the state of the control inputs. By applying a 12V ±
0.5V input signal to the
can be reprogrammed even if the boot block program lockout feature has been enabled (see Boot Block Programming Lockout Override section).
ERASURE:
be erased. The erased state of memory bits is a logical “1”.
The entire device can be erased by using the Chip Erase
command or individual sectors can be erased by using the
Sector Erase commands.
CHIP ERASE:
time by using the 6-byte chip erase software code. After
the chip erase has been initiated, the device will internally
time the erase operation so that no external clocks are required. The maximum time to erease the chip is t
A
RESET is at a logic high level,
RESET input halts the present device operation and
RESET pin, the
RESET pin the boot block array
Before a word can be reprogrammed, it must
The entire device can be erased at one
.
EC
2
AT49BV/LV4096
AT49BV/LV4096
If the boot block lockout has been enabled, the Chip Erase
will not erase the data in the boot block; it will erase the
main memory block and the parameter blocks only. After
the chip erase, the device will return to the read or standby
mode.
SECTOR ERASE: As an alternative to a full chip erase,
the device is organized into three sectors that can be individually erased. There are two 8K word parameter block
sections and one sector consisting of the boot block and
the main memory array block. The Sector Erase command
is a six bus cycle operation. The sector address is latched
on the falling
data input command is latched at the rising edge of
The sector erase starts after the rising edge of
sixth cycle. The erase operation is internally controlled; it
will automatically time to completion. When the boot block
programming lockout feature is not enabled, the boot
block and the main memory block will erase together (from
the same sector erase command). Once the boot region
has been protected, only the main memory array sector
will erase when its sector erase command is issued.
WORD PROGRAMMING: Once a memory block is
erased, it is programmed (to a logical “0”) on a word-byword basis. Programming is accomplished via the internal
device command register and is a 4 bus cycle operation.
The device will automatically generate the required internal program pulses.
Any commands written to the chip during the embedded
programming cycle will be ignored. If a hardware reset
happens during programming, the data at the location being programmed will be corrupted. Please note that a data
“0” cannot be programmed back to a “1”; only erase operations can convert “0”s to “1”s. Programming is completed
after the specified t
ture may also be used to indicate the end of a program
cycle.
BOOT BLOCK PROGRAMMING LOCKOUT: The device has one designated block that has a programming
lockout fea ture. This feature p revents programming of
data in the designated block once the featur e has been
enabled. The size of the block is 8K words. This block,
referred to as the boot block, can contain secure code that
is used to bring up the system. Enabling the lockout feature will allow the boot code to stay in the device while data
in the rest of the device is updated. This featur e does not
have to be activated; the boot block’s usage as a write
protected region is optional to the user. The address range
of the boot block is 00000H to 01FFFH.
Once the feature is enabled, the data in the boot block can
no longer be erased or programmed when input levels of
5.5V or less are used. Data in the main memory block can
still be changed through the regular programming method.
To activate the lockout feature, a series of six program
WE edge of the sixth cycle while the 30H
WE.
WE of the
cycle time. The DATA polling fea-
BP
commands to specific addresses with specific data must
be performed. Please refer to the Command Definitions
table.
BOOT BLOCK LOCKOUT DETECTION: A software
method is available to determine if programming of the
boot block section is locked out. When the device is in the
software product identification mode (see Software Product Identification Entry and Exit sections) a read from address location 00002H will show if programming the boot
block is locked out. If the data on I/O0 is low, the boot
block can be programmed; if the data on I/O0 is high, the
program lockout feature has been enabled and the block
cannot be programmed. The software product identification exit code should be used to return to standard operation.
BOOT BLOCK PROGRAMMING LOCKOUT OVERRIDE: The user can override the boot block programming
lockout by taking the
this protected boot block data can be altered through a
chip erase, sector erase or word programming. When the
RESET pin is brought back to TTL levels the boot block
programming lockout feature is again active.
PRODUCT IDENTIFICATION: The product identification
mode identifies the device and manufacturer as A tmel. It
may be accessed by hardware or software operation. The
hardware operation mode can be used by an external programmer to identify the correct programming algorithm for
the Atmel product.
For details, see Operating Modes (for hardware operation)
or Software Product Identification. The manufacturer and
device code is the same for both modes.
DATA POLLING: The AT49BV4096/LV4096 features
DATA polling to indicate the end of a program cycle. During a program cycle an attempted read of the last byte
loaded will result in the complement of the loaded data on
I/O7. Once the program cycle has been completed, true
data is valid on all outputs and the next cycle may begin.
Duri ng a chip o r sector erase ope ration, an attempt to
read the device will give a “0” on I/O7. Once the program
or erase cycle has completed, true data will be read from
the device.
program cycle.
TOGGLE BIT: In addition to
AT49BV4096/LV4096 provides another method for determining the end of a program or erase cycle. During a program or erase operation, successive attempts to read data
from the device will result in I/O6 toggling between one
and zero. Once the program cycle has completed, I/O6 will
stop toggling and valid data will be read. Examining the
toggle bit may begin at any time during a program cycle.
HARDWARE DATA PROTECTION: Hardware features
protect against inadvertent programs to the
AT49BV4 096/LV4096 in the following ways: ( a) V
DATA polling may begin at any time during the
RESET pin to 12 ± 0.5 volts. By doing
DATA polling the
CC
3
sense: if VCC is below 1.8V (typical), the program function
is inhibited. (b) V
reached the V
CC
power on delay: once VCC has
CC
sense level, the device will automatically time out 10 ms (typical) before programming. (c)
Program inhibit: holding any one of
OE low, CE high or
WE high inhibits program cycles. (d) Noise filter: pulses of
less than 15 ns (typical) on the
WE or CE inputs will not
initiate a program cycle.
INPUT LEVELS:
power supply, the address inputs and control inputs (
While operating with a 2.7V to 3.6V
OE,
CE, and WE) may be driven from 0 to 5.5V without adversely affecting the operation of the device. The I/O lines
can only be driven from 0 to V
+ 0.6V.
CC
Command Definition (in Hex)
Command
Sequence
Read
Chip Erase
Sector
Erase
Word
Program
Boot Block
Lockout
Product ID
Entry
Product ID
(3)
Exit
Product ID
(3)
Exit
Notes: 1. The DATA FORMAT in each bus cycle is as follows :
2. The 8K word boot sector has the address rang e
3. Either one of the Product ID Exit commands
Bus
Cycles
1AddrD
65555AA2AAA555555805555AA2AAA55555510
65555AA2AAA555555805555AA2AAA55SA
45555AA2AAA555555A0AddrD
(2)
65555AA2AAA555555805555AA2AAA55555540
35555AA2AAA55555590
35555AA2AAA555555F0
1xxxxF0
I/O15 - I/O8 (Don’t Care); I/O7 - I/O0 (Hex)
00000H to 01FFF H.
can be used.
1st Bus
Cycle
AddrDataAddrDataAddrDataAddrDataAddrDataAddrData
OUT
(1)
2nd Bus
Cycle
3rd Bus
Cycle
4. SA = sector addresses:
SA = 03XXX for PARAMETER BLOCK 1
SA = 05XXX for PARAMETER BLOCK 2
SA = 1FXXX for MAIN MEMORY ARRAY
5. When the boot block programming lockout feature is not
enabled, the boot block and the main memory block will erase
4th Bus
Cycle
5th Bus
Cycle
(4, 5)
IN
6th Bus
Cycle
30
Absolute Maximum Ratings*
Temperature Under Bias.................-55°C to +125°C
Storage Temperature......................-65°C to +150°C
All Input Voltages
(including NC Pins)
with Respect to Ground ................... -0.6V to +6.25V
All Output Voltages
with Respect to Ground .............-0.6V to V
Voltage on
OE
with Respect to Ground ................... -0.6V to +13.5V
4
AT49BV/LV4096
+ 0.6V
CC
*NOTICE: Stresses beyond thos e listed under “Absolute Maxi-
mum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the
device at these or an y ot he r con ditions beyond t ho se ind icated in the oper ational sections of this specification is not
implied. Exposure to absolute maximum rating conditio ns
for extended periods may affect device reliability.
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