ATMEL AT49F8192-90RI, AT49F8192-90RC, AT49F8192-12TI, AT49F8192-12TC, AT49F8192-12RI Datasheet

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Features
Single Voltage Operation
– 5V Read – 5V Reprogramming
Fast Read Access Time - 90 ns
Sector Architecture
– One 8K Words (16K bytes) Boot Block with Programming Lockout – Two 8K Words (16K bytes) Parameter Blocks – One 488K Words (976K bytes) Main Memory Array Block
Fast Sector Erase Time - 10 seconds
Word-By-Word Programming - 50 µs/Word
Hardware Data Protection
DAT A Polling For End Of Program Detection
Low Power Dissipation
– 50 mA Active Current – 300 µA CMOS Standby Current
Typical 10,000 Write Cycles
8-Megabit (512K x 16) 5-volt Only CMOS Flash
Description
The AT49F8192 is a 5-volt-only, 8 megabit Flash Memory organized as 512K words of 16 bits each. Manufactured with Atmel's advanced nonvolatile CMOS technology, the device offers access times to 90 ns with pow er dissipati on of just 275 mW. Wh en deselected, the CMOS standby current is less than 300 µA.
Pin Configurations
Pin Name Function
A0 - A18 Addresses CE OE WE Write Enable RESET I/O0 - I/O15 Data Inputs/Outputs NC No Connect
Chip Enable Output Enable
Reset
SOIC (SOP)
TSOP Top View
Type 1
Memory
AT49F8192 AT49F8192T
0588D-A–10/97
1
The device contains a u se r-e nabl ed “boot block” protection feature. Two versions of the feature are available: the AT49F8192 locates the boot block at lowest ord er addresses (“bottom boot”); the AT49F8192T locates it at highest order addresses (“top boot”).
To allow for simple in-system reprogrammability, the AT49F8192 does not require high input voltages for pro­gramming. Five-v olt-only com mands dete rmine the read and programming operation of the device. Reading data out of the de vice is simila r to read ing from an EPRO M; it has standard CE
, OE, and WE inputs to avoid bus conten­tion. Reprogramming the AT49F8192 is performed by first erasing a block of data and then programming on a word­by-word basis.
The device is erased by executing the erase command sequence; the device internally controls the erase opera-
Block Diagram
V
GND
OE
WE
CE
RESET
ADDRESS
INPUTS
CC
CONTROL
LOGIC
Y DECODER
X DECODER
DATA INPUTS/OUTPUTS
I/O0 - I/O15
INPUT/OUTPUT
BUFFERS
PROGRAM DATA
LATCHES Y-GATING
MAIN MEMORY (488K WORDS)
PARAMETER
BLOCK 2
8K WORDS
PARAMETER
BLOCK 1
8K WORDS
BOOT BLOCK
8K WORDS
tion. The memory is div ided into three blo cks for erase operations. There are two 8K word parameter block sec­tions and one sector consisting of the boot block and the main memory array block. The AT49F819 2 is p rogrammed on a word-by-word basis. The device has the capability to protect the data in the boot block; this feature is enabled by a command sequence. Once the boot block pr ogramming lockout feature is enabled, the data in the boot block can­not be changed when input levels of 5.5 volts or less are used. The typical number of program and erase cycles is in excess of 10,000 cycles.
The optional 8K word boot block section includes a repro­gramming lock o ut featur e to pro vide data i ntegrity. The boot sector is des igned to contain us er secure code, and when the feature is enabled, the boot sector is permanently protected from being reprogrammed.
AT49F8192 AT49F8192T
DATA INPUTS/OUTPUTS
I/O0 - I/O15
INPUT/OUTPUT
BUFFERS
PROGRAM DATA
LATCHES
7FFFF 7FFFF
06000
05FFF 04000
03FFF
02000
01FFF 00000 00000
Y-GATING
BOOT BLOCK
8K WORDS
PARAMETER
BLOCK 1
8K WORDS
PARAMETER
BLOCK 2
8K WORDS
MAIN MEMORY (488K WORDS)
7E000
7DFFF 7C000
7BFFF
7A000
79FFF
Device Operation
READ:
When CE at the memory location determined by the address pins is asserted on the outputs . The outputs ar e put in the high impedance state whenever CE control gives designers flexibility in preventing bus conten­tion.
COMMAND SEQUENCES:
ered on it will be reset to the read or standby mode depending upon the state of the control line inputs. In order to perform other device functions, a series of command sequences are entered into the device. The command sequences are shown in the Comma nd Definitions ta ble (I/O8 - I/O15 are don't care inputs for the command codes). The command sequences are written by applying a low pulse on the WE tively) and OE
2
The AT49F8192 is accessed like an EPROM .
and OE are low and WE is high, the da ta stor ed
or OE is high. This dual-line
When the device is first pow-
or CE input with CE or WE low ( respec-
high. The addre ss is latche d on the fall ing
AT49F8192/8192T
edge of CE latched by the first rising edge of CE
or WE, whichever occurs last. The data is
or WE. Standard microprocessor write timings are used. The ad dress loca ­tions used in the command sequences are not affected by entering the command sequences.
RESET:
A RESET
tem applications. When RESET
input pin is provided to eas e some sys-
is at a l ogic high le ve l, t he device is in its sta nda rd ope ra tin g mo de. A lo w level on the RESET
input halts the pre sent d evice o perati on and puts the outputs of the de vice in a hig h impeda nce sta te. When a high level is reas serted on the RESE T
pin, the device returns to the Read or Standby mo de, dependi ng upon the state of the control inputs. By applying a 12V ± 0.5V input signal to the RE SE T
pin the boot block array can be repro ­grammed even if the boot block program lockout feature has been enabled (see Boot Block Pro gramming Loc kout Override section).
AT49F8192/8192T
ERASURE:
be erased. The erased s tate of the memory bits i s a log ic al “1”. The entire device can be erased at one time by using a 6-byte software code.
After the software chip erase has been ini tiated , the devi ce will internally time the eras e operatio n so that no ex ternal clocks are required. The maximum time needed to erase the whole chip is t
CHIP ERASE:
the Chip Erase function is disabled; sector erases for the parameter blocks a nd ma in me mory b lock will s till op erate . After the full chip erase the device will return back to read mode. Any command during chip erase will be ignored.
SECTOR ERASE:
the device is organized into three sectors that can be indi­vidually erased. There are two 8K word parameter block sections and one sector consisting of the boot block and the main memory array blo ck. The Secto r Erase comm and is a six bus cycle operation. The sector address is latched on the falling WE input command is latched at the rising edge of WE sector erase starts after the rising edge of WE cycle. The erase oper ation is internal ly controlled; it will automatically time to c omple tion. W hen the b oot block pro­gramming lockout featur e is not enabled, the boot block and the main memory block will erase together (from the same sector erase command). Once the boot region has been protected, only the main memory array sector will erase when its sector erase command is issued.
WORD PROGRAMMING:
erased, it is programmed (to a logical “0”) on a word-by­word basis. Programming is accomplished via the internal device command register and is a 4 bus cycle operation. The device will autom ati ca ll y ge nerate the required int ernal program pulses.
Any commands written to the chip during the embedded programming cycle will be ignored. If a hardware reset hap­pens during programming, the data at the location being programmed will be corrupted. Please note that a data “0” cannot be programmed back to a “1”; only erase operations can convert “0”s to “1”s. Programming is completed after the specified tBP cycle time. The DATA also be used to indicate the end of a program cycle.
BOOT BLOCK PROGRAMMING LOCKOUT:
has one designated block that has a programming lockout feature. This feature prevents programmi ng of data in the designated block once the feature has been enabled. The size of the block is 8K wo rds. This bl ock, referr ed to as the boot block, ca n conta in se cure code th at is used to brin g up the system. Enablin g the l ockout fe ature will all ow the boot code to stay in the device while data in the rest of the device is updated. This feature does not have to be acti­vated; the boot blo ck' s usage as a wr it e protected region is
Before a word can be reprogrammed, it must
.
EC
If the boot block lockout has bee n en abl ed ,
As an alternative to a full chip erase,
edge of the sixth cycle while the 30H data
. The
of the si xth
Once a memory block is
polling feature may
The device
optional to the user. The address range of the 48F8192 boot block is 00000H to 01FFFH while the address range of the 49F8192T is 7E000H to 7FFFFH.
Once the feature is enabl ed, the da ta in the bo ot block c an no longer be erased or programmed when input levels of
5.5V or less are u sed. Dat a in the m ain mem ory bloc k can still be changed through the regular programming method. To activate the lockout feature, a series of six program commands to specific addresses with specific data must be performed. Please refer to the Command Definitions table.
BOOT BLOCK LOCKOUT DETECTION:
method is available to determine if programming of the boot block section is locked out. When the device is in the soft­ware product identification mode (see Software Product Identification Entry and Exit sections) a read from address location 00002H wil l s how i f pr ogram mi ng the b oot block is locked out. If the data on I/O0 is low, the boot block can be programmed; if the data on I/O0 is high, the program lock­out feature has been enabled and the bl ock ca nnot be pro­grammed. The software product identification exit code should be used to return to standard operation.
BOOT BLOCK PROGRAMMING LOCKOUT OVER­RIDE:
The user can override the boot block programming lockout by ta king the RES ET entire chip eras e, s ecto r era se or wor d pr ogramm ing oper ­ation. When the RESET the boot block programming lockout feature is again active.
PRODUCT IDENTIFICATION:
mode identifies the device and manufacturer as Atmel. It may be accessed by hardware or software operation. The hardware operation mode can be used by an external pro­grammer to identify the correct programming algorithm for the Atmel product.
For details, see Operating Modes (for hardware operation) or Software Product Identification. The manufacturer and device code is the same for both modes.
DATA POLLING:
to indicate the end of a pr ogram cy cle. Duri ng a progr am cycle an attempted read of the last byte loaded will result in the complement of the loaded data on I/O7. Once the pro­gram cycle has been comp leted, true data is valid on all outputs and the next cycle may begin. During a chip or sec­tor erase operation , an atte mpt to rea d the devi ce will g ive a “0” on I/O7. Once the program or erase cycle has com­pleted, true data will be read from the device. DATA may begin at any time during the program cycle.
TOGGLE BIT:
provides another method for determining the end of a pro­gram or erase cycle. During a pro gram or er ase opera tion, successive attempts to read data from the device will result in I/O6 toggling between one and zero. Once the program cycle has completed, I/O6 will stop toggling and valid data
The AT49F8192 features DATA
In addition to DATA
pin to 12 volts during the
pin is brought back to T TL levels
The product identif ication
polling the AT49F8 192
A software
polling
polling
3
will be read. Examining the toggle bit may begin at any time during a program cycle.
HARDWARE DATA PROTECTION:
Hardware features protect against inadvertent programs to the AT49F8192 in the following ways: (a) V (typical), the prog ram func tion is inhi bited. (b) V on delay: once V
has reached the VCC sense level, the
CC
Command Definition (in Hex)
Command
Sequence
Read 1 Addr D Chip Erase 6 5555 AA 2AAA 55 5555 80 5555 AA 2AAA 55 5555 10 Sector
Erase Word
Program Boot Block
Lockout Product ID
Entry Product ID
Exit Product ID
Exit
Notes: 1. The DATA FORMAT in each bus cycle is as follows:
(2)
(3)
(3)
2. The 8K word boot sector has the address range
3. Either one of the Product ID Exit commands can be
4. SA = sector addresses:
Bus
Cycles
6 5555 AA 2AAA 55 5555 80 5555 AA 2AAA 55 SA
4 5555 AA 2AAA 55 5555 A0 Addr D
6 5555 AA 2AAA 55 5555 80 5555 AA 2AAA 55 5555 40
3 5555 AA 2AAA 55 5555 90
3 5555 AA 2AAA 55 5555 F0
1xxxxF0
I/O15 - I/O8 (Don't Care); I/O7 - I/O0 (Hex)
00000H to 01FFFH for the AT49F8192 and 7E000H to 7FFFFH for the AT49F8192T.
used.
For the AT49F8192 SA = 03XXX for PARAMETER BLOCK 1 SA = 05XXX for PARAMETER BLOCK 2 SA = 7FXXX for MAIN MEMORY ARRAY
sense: if VCC is below 3.8V
CC
CC
power
(1)
1st Bus
Cycle
Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data
OUT
2nd Bus
Cycle
device will au tomaticall y time out 10 ms (typical ) before programming. (c) Program inhibit: holding any one of OE low, CE high or W E high inhib its prog ram cy cles. ( d) Noise filter: pulses of les s than 15 ns (typ ical) on the W E inputs will not initiate a program cycle.
3rd Bus
Cycle
4th Bus
Cycle
IN
For the AT49F8192T SA = 7DXXX for PARAMETER BLOCK 1 SA = 7BXXX for PARAMETER BLOCK 2 SA = 79XXX for MAIN MEMORY ARRAY
5. When the boot block programming lockout feature is not enabled, the boot block and the main memory block w ill e rase toget her (f orm the s ame s ector eras e command). Once the boot region has been pro­tected, only the main memory array sector will erase when its sector erase command is issued.
5th Bus
Cycle
6th Bus
Cycle
(4)(5)
or CE
30
Absolute Maximum Ratings*
Temperature Under Bias................................ -55°C to +125°C
Storage Temperature..................................... -65°C to +150°C
All Input Voltages (including NC pins)
with Respect to Ground...................................-0.6V to +6.25V
All Output Voltages
with Respect to Ground.........................-0.6V to VCC to +0.6V
Voltage on OE
with Respect to Ground...................................-0.6V to +13.5V
4
AT49F8192/8192T
*NOTICE: Stresses beyong those listed under “Absolute
Maximum Ratings” may cause permanent dam­age to the dev ice . This is a s tress rating only an d functional oper ation of the device at thes e o r any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions f or e xtended periods ma y af fect de vice reliability .
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