Two-wire Serial
EEPROM
with Permanent
and Reversible
Software Write
Description
The AT34C02B provides 2048 bits of serial electrically-erasable and programmable
read only memory (EEPROM) organized as 256 words of 8 bits each. The first-half of
the device incorporates a permanent and a reversible software write protection feature
while hardware write protection for the entire array is available via an external pin.
Once the permanent software write protection is enabled, by sending a special command to the device, it cannot be reversed. However, the reversible software write
protection is enabled and can be reversed by sending a special command. The hardware write protection is controlled with the WP pin and can be used to protect the
entire array, whether or not the software write protection has been enabled. This
allows the user to protect none, first-half, or all of the array depending on the application. The device is optimized for use in many industrial and commercial applications
where low-power and low-voltage operations are essential. The AT34C02B is available in space saving 8-lead JEDEC SOIC,
TSSOP, and 8-ball dBGA2 packages and is accessed via a Two-wire serial interface.
It is available in 1.7V (1.7V to 3.6V).
Table 1. Pin Configurations
Pin NameFunction
A0 - A2Address Inputs
SDASerial Data
SCLSerial Clock Input
WPWrite Protect
VCC
SCL
SDA
8-lead Ultra Thin Mini-MAP (MLP 2x3), 8-lead
8-ball dBGA2
8
7
WP
6
5
Bottom View
1
A0
2
A1
3
A2
4
GND
8-lead Ultra Thin Mini-MAP
8
CC
7
WP
6
SCL
5
DA
(MLP 2x3)
Bottom View
1
A0
2
A1
3
A2
4
GN
Protect
2K (256 x 8)
AT34C02B
Note: Not recommended for new
design; please refer to
AT34C02C datasheet.
8-lead TSSOP
1
A0
2
A1
3
A2
4
ND
8
VC
7
WP
6
SC
5
SD
8-lead SOIC
1
A0
2
A1
3
A2
4
ND
VC
8
WP
7
SC
6
SD
5
Rev. 3417E–SEEPR–1/07
1
Absolute Maximum Ratings*
A
S
G
A
S
V
A
W
Operating Temperature..................................–55°C to +125°C
Storage Temperature .....................................–65°C to +150°C
Voltage on Any Pin
with Respect to Ground .................................... –1.0V to +7.0V
Maximum Operating Voltage .......................................... 6.25V
DC Output Current........................................................ 5.0 mA
Figure 1. Block Diagram
CC
ND
P
CL
DA
2
1
0
START
STOP
LOGIC
LOAD
DEVICE
ADDRESS
COMPARATOR
R/W
*NOTICE:Stresses beyond those listed under “Absolute
CONTROL
WRITE PROTECT
CIRCUITRY
COMP
DATA WORD
ADDR/COUNTER
SERIAL
LOGIC
INCLOAD
Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability.
EN
H.V. PUMP/TIMING
DATA RECOVERY
SOFTWARE WRITE
PROTECTED AREA
(00H - 7FH)
X DEC
EEPROM
Y DEC
D
2
AT34C02B
IN
D
OUT
SERIAL MUX
D
/ACK
OUT
LOGIC
3417E–SEEPR–1/07
AT34C02B
Pin DescriptionSERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each
EEPROM device and negative edge clock data out of each device.
SERIAL DATA (SDA): The SDA pin is bidirectional for serial data transfer. This pin is
open-drain driven and may be wire-ORed with any number of other open-drain or open
collector devices.
DEVICE/PAGE ADDRESSES (A2, A1, A0): The A2, A1, and A0 pins are device
address inputs that are hardwired (directly to GND or to Vcc) for compatibility with other
AT24Cxx devices. When the pins are hardwired, as many as eight 2K devices may be
addressed on a single bus system. (Device addressing is discussed in detail under
“Device Addressing,” page 9.) A device is selected when a corresponding hardware and
software match is true. If these pins are left floating, the A2, A1, and A0 pins will be
internally pulled down to GND. However, due to capacitive coupling that may appear
during customer applications, Atmel recommends always connecting the address pins
to a known state. When using a pull-up resistor, Atmel recommends using 10kΩ or less.
WRITE PROTECT (WP): The write protect input, when connected to GND, allows normal write operations. When WP is connected directly to Vcc, all write operations to the
memory are inhibited. If the pin is left floating, the WP pin will be internally pulled down
to GND. However, due to capacitive coupling that may appear during customer applications, Atmel recommends always connecting the WP pins to a known state. When using
a pull-up resistor, Atmel recommends using 10kΩ or less.
Table 2. AT34C02B Write Protection Modes
WP Pin Status
V
CC
GND or FloatingNot ProgrammedNot ProgrammedNormal Read/Write
GND or FloatingProgrammed–
GND or Floating–Programmed
Table 3. Pin Capacitance
Permanent Write Protect
Register
––Full Array (2K)
(1)
Reversible Write Protect
Register
Part of the Array Write
Protected
First-Half of Array
(1K: 00H - 7FH)
First-Half of Array
(1K: 00H - 7FH)
Applicable over recommended operating range from TA = 25°C, f = 100 kHz, VCC = +1.7V
SymbolTest ConditionMaxUnitsConditions
C
I/O
C
IN
Note:1. This parameter is characterized and is not 100% tested.
Input/Output Capacitance (SDA)8pFV
Input Capacitance (A0, A1, A2, SCL)6pFVIN = 0V
I/O
= 0V
3417E–SEEPR–1/07
3
Table 4. DC Characteristics
Applicable over recommended operating range from: T
= –40°C to +85°C, V
AI
= +1.7V to +3.6V, (unless otherwise noted)
CC
SymbolParameterTest ConditionMinTypMaxUnits
V
I
I
I
I
I
I
V
V
V
V
CC1
CC
CC
SB1
SB2
LI
LO
IL
IH
OL2
OL1
Supply Voltage1.73.6V
Supply Current VCC = 3.6VREAD at 100 kHz0.41.0mA
Supply Current VCC = 3.6VWRITE at 100 kHz2.03.0mA
Standby Current VCC = 1.7VVIN = VCC or V
Standby Current VCC = 3.6VVIN = VCC or V
Input Leakage CurrentVIN = VCC or V
Output Leakage CurrentV
Input Low Level
Input High Level
(1)
(1)
OUT
= V
CC
or V
SS
SS
SS
SS
–0.6V
VCC x 0.7VCC + 0.5V
0.63.0µA
1.64.0µA
0.103.0µA
0.053.0µA
x 0.3V
CC
Output Low Level VCC = 3.0VIOL = 2.1 mA0.4V
Output Low Level VCC = 1.7VIOL = 0.15 mA0.2V
Note:1. VIL min and VIH max are reference only and are not tested.
4
AT34C02B
3417E–SEEPR–1/07
Table 5. AC Characteristics
AT34C02B
Applicable over recommended operating range from T
= –40°C to +85°C, VCC = +1.7V to +3.6V, CL = 1 TTL Gate and
AI
100 pF (unless otherwise noted)
SymbolParameter
f
SCL
t
LOW
t
HIGH
t
I
t
AA
t
BUF
t
HD.STA
t
SU.STA
t
HD.DAT
t
SU.DAT
t
R
t
F
t
SU.STO
t
DH
t
WR
Endurance
Note:1. This parameter is characterized and is not 100% tested.
Clock Frequency, SCL100400kHz
Clock Pulse Width Low4.71.2µs
Clock Pulse Width High4.00.6µs
Noise Suppression Time
(1)
Clock Low to Data Out Valid0.14.50.10.9µs
Time the bus must be free before a new
transmission can start
(1)
Start Hold Time4.00.6µs
Start Set-up Time4.70.6µs
Data In Hold Time00µs
Data In Set-up Time200100ns
Inputs Rise Time
Inputs Fall Time
(1)
(1)
Stop Set-up Time4.70.6µs
Data Out Hold Time10050ns
Write Cycle Time55ms
(1)
25°C, Page Mode
1.7V2.7V, 3.6V
UnitsMinMaxMinMax
10050ns
4.71.2µs
1.00.3µs
300300ns
1M1M
Write
Cycles
3417E–SEEPR–1/07
5
Memory Organization AT34C02B, 2K Serial EEPROM: The 2K is internally organized with 16 pages of 16
bytes each. Random word addressing requires a 8-bit data word address.
Device OperationCLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an exter-
nal device. Data on the SDA pin may change only during SCL low time periods (see
Figure 4 on page 7). Data changes during SCL high periods will indicate a start or stop
condition as defined below.
START CONDITION: A high-to-low transition of SDA with SCL high is a start condition
which must precede any other command (see Figure 5 on page 8).
STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition.
After a read sequence, the stop command will place the EEPROM in a standby power
mode (see Figure 5 on page 8).
ACKNOWLEDGE: All addresses and data words are serially transmitted to and from
the EEPROM in 8-bit words. The EEPROM sends a zero to acknowledge that it has
received each word. This happens during the ninth clock cycle.
STANDBY MODE: The AT34C02B features a low-power standby mode which is
enabled: (a) upon power-up or (b) after the receipt of the STOP bit and the completion of
any internal operations.
MEMORY RESET: After an interruption in protocol, power loss or system reset, any
Two-wire part can be reset by following these steps:
(a) Clock up to 9 cycles, (b) look for SDA high in each cycle while SCL is high and then
(c) create a start condition.
6
AT34C02B
3417E–SEEPR–1/07
Figure 2. Bus Timing SCL: Serial Clock SDA: Serial Data I/O
S
S
Figure 3. Write Cycle Timing SCL: Serial Clock SDA: Serial Data I/O
AT34C02B
CL
DA
Note:1. The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle.
8th BIT
WORDn
ACK
STOP
CONDITION
(1)
t
wr
START
CONDITION
Figure 4. Data Validity
7
3417E–SEEPR–1/07
Figure 5. Start and Stop Condition
Figure 6. Output Acknowledge
8
AT34C02B
3417E–SEEPR–1/07
AT34C02B
Device AddressingThe 2K EEPROM device requires an 8-bit device address word following a start condi-
tion to enable the chip for a read or write operation (see Figure 10 on page 13).
The device address word consists of a mandatory one-zero sequence for the first four
most-significant bits (1010) for normal read and write operations and 0110 for writing to
the write protect register.
The next 3 bits are the A2, A1 and A0 device address bits for the AT34C02B EEPROM.
These 3 bits must compare to their corresponding hard-wired input pins.
The eighth bit of the device address is the read/write operation select bit. A read operation is initiated if this bit is high and a write operation is initiated if this bit is low.
Upon a compare of the device address, the EEPROM will output a zero. If a compare is
not made, the chip will return to a standby state. The device will not acknowledge if the
write protect register has been programmed and the control code is 0110.
Write OperationsBYTE WRITE: A write operation requires an 8-bit data word address following the
device address word and acknowledgment. Upon receipt of this address, the EEPROM
will again respond with a zero and then clock in the first 8-bit data word. Following
receipt of the 8-bit data word, the EEPROM will output a zero and the addressing
device, such as a microcontroller, must terminate the write sequence with a stop condition. At this time the EEPROM enters an internally-timed write cycle, t
nonvolatile memory. All inputs are disabled during this write cycle and the EEPROM will
not respond until the write is complete (see Figure 11 on page 13).
, to the
WR
The device will acknowledge a write command, but not write the data, if the software or
hardware write protection has been enabled. The write cycle time must be observed
even when the write protection is enabled.
PAGE WRITE: The 2K device is capable of 16-byte page write.
A page write is initiated the same as a byte write, but the microcontroller does not send
a stop condition after the first data word is clocked in. Instead, after the EEPROM
acknowledges receipt of the first data word, the microcontroller can transmit up to fifteen
more data words. The EEPROM will respond with a zero after each data word received.
The microcontroller must terminate the page write sequence with a stop condition (see
Figure 12 on page 14).
The data word address lower four bits are internally incremented following the receipt of
each data word. The higher data word address bits are not incremented, retaining the
memory page row location. When the word address, internally generated, reaches the
page boundary, the following byte is placed at the beginning of the same page. If more
than sixteen data words are transmitted to the EEPROM, the data word address will “roll
over” and previous data will be overwritten. The address “roll over” during write is from
the last byte of the current page to the first byte of the same page.
The device will acknowledge a write command, but not write the data, if the software or
hardware write protection has been enabled. The write cycle time must be observed
even when the write protection is enabled.
ACKNOWLEDGE POLLING: Once the internally-timed write cycle has started and the
EEPROM inputs are disabled, acknowledge polling can be initiated. This involves sending a start condition followed by the device address word. The read/write bit is
representative of the operation desired. Only if the internal write cycle has completed
will the EEPROM respond with a zero allowing the read or write sequence to continue.
3417E–SEEPR–1/07
9
Write ProtectionThe software write protection, once enabled, write protects only the first-half of the array
(00H - 7FH) while the hardware write protection, via the WP pin, is used to protect the
entire array.
PERMANENT SOFTWARE WRITE PROTECTION: The software write protection is
enabled by sending a command, similar to a normal write command, to the device which
programs the permanent write protect register. This must be done with the WP pin low.
The write protect register is programmed by sending a write command with the device
address of 0110 instead of 1010 with the address and data bit being don’t cares (see
Figure 7 on page 10). Once the software write protection has been enabled, the device
will no longer acknowledge the 0110 control byte. The software write protection cannot
be reversed even if the device is powered down. The write cycle time must be observed.
REVERSIBLE SOFTWARE WRITE PROTECTION: The reversible software write protection is enabled by sending a command, similar to a normal write command, to the
device which programs the reversible write protect register. This must be done with the
WP pin low. The write protect register is programmed by sending a write command
01100010 with pins A2 and A1 tied to ground or don't connect and pin A0 connected to
VHV (see Figure 8). The reversible write protection can be reversed by sending a command 01100110 with pin A2 tied to ground or no connect, pin A1 tied to VCC and pin A0
tied to VHV (see Figure 9).
HARDWARE WRITE PROTECTION: The WP pin can be connected to V
left floating. Connecting the WP pin to V
will write protect the entire array, regardless
CC
, GND, or
CC
of whether or not the software write protection has been enabled. The software write
protection register cannot be programmed when the WP pin is connected to V
. If the
CC
WP pin is connected to GND or left floating, the write protection mode is determined by
the status of the software write protect register.
Set PSWPWNot ProgrammedXACKCannot program write protect registers
Read
RSWP
Read
RSWP
Set RSWPWXProgrammedNo ACK
Set RSWPWXNot ProgrammedACKCannot program write protect registers
Clear
RSWP
Clear
RSWP
RProgrammedXNo ACK
RNot ProgrammedXACK
RXProgrammedNo ACK
RXNot ProgrammedACK
WProgrammedXNo ACK
WNot ProgrammedXACKCannot write to write protect registers
STOP - Indicates permanent write protect register is
programmed
Read out data don't care. Indicates PSWP register is
not programmed
STOP - Indicates permanent write protect register is
programmed
STOP - Indicates reversible write protect register is
programmed
Read out data don't care. Indicates RSWP register is
not programmed
STOP - Indicates reversible write protect register is
programmed
STOP - Indicates permanent write protect register is
programmed
Read OperationsRead operations are initiated the same way as write operations with the exception that
the read/write select bit in the device address word is set to one. There are three read
operations: current address read, random address read and sequential read.
12
CURRENT ADDRESS READ: The internal data word address counter maintains the
last address accessed during the last read or write operation, incremented by one. This
address stays valid between operations as long as the chip power is maintained. The
address “roll over” during read is from the last byte of the last memory page to the first
byte of the first page.
Once the device address with the read/write select bit set to one is clocked in and
acknowledged by the EEPROM, the current address data word is serially clocked out.
To end the command, the microcontroller does not respond with an input zero but does
generate a following stop condition (see Figure 13 on page 14).
RANDOM READ: A random read requires a “dummy” byte write sequence to load in the
data word address. Once the device address word and data word address are clocked
in and acknowledged by the EEPROM, the microcontroller must generate another start
condition. The microcontroller now initiates a current address read by sending a device
address with the read/write select bit high. The EEPROM acknowledges the device
address and serially clocks out the data word. To end the command, the microcontroller
AT34C02B
3417E–SEEPR–1/07
AT34C02B
does not respond with a zero but does generate a following stop condition (see Figure
14 on page 14).
SEQUENTIAL READ: Sequential reads are initiated by either a current address read or
a random address read. After the microcontroller receives a data word, it responds with
an acknowledge. As long as the EEPROM receives an acknowledge, it will continue to
increment the data word address and serially clock out sequential data words. When the
memory address limit is reached, the data word address will “roll over” and the sequential read will continue. The sequential read operation is terminated when the
microcontroller does not respond with a zero but does generate a following stop condition (see Figure 15 on page 14).
PERMANENT WRITE PROTECT REGISTER (PSWP) STATUS: To find out if the register has been programmed, the same procedure is used as to program the register
except that the R/W bit is set to 1. If the device sends an acknowledge, then the permanent write protect register has not been programmed. Otherwise, it has been
programmed and the device is permanently write protected at the first half of the array.
Table 10. PSWP Status
PinPreambleRW
CommandA2A1A0B7B6B5B4B3B2B1B0
Read PSWPA2A1 A0 0 1 1 0 A2A1A0 1
REVERSIBLE WRITE PROTECT REGISTER(RSWP) STATUS: To find out if the register has been programmed, the same procedure is used as to program the register
except that the R/W bit is set to 1. If the sends an device acknowledge, then the reversible write protect register has not been programmed. Otherwise, it has been
programmed and the device is write protected (reversible) at the first half of the array.
8A28-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
8Y68-lead, 2.00 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
8U3-18-ball, die Ball Grid Array Package (dBGA2)
Options
–1.7Low Voltage (1.7V to 3.6V)
3417E–SEEPR–1/07
15
Packaging Information
8S1 – JEDEC SOIC
C
1
E
N
∅
E1
L
Top View
End View
e
D
Side View
B
A
SYMBOL
A1
A1.35–1.75
A10.10–0.25
b0.31–0.51
C0.17–0.25
D4.80–5.00
E13.81–3.99
E5.79–6.20
e1.27 BSC
L0.40–1.27
∅0˚–8˚
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN
NOM
MAX
NOTE
16
Note:
These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
R
TITLE
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
DRAWING NO.
AT34C02B
10/7/03
REV.
8S1B
3417E–SEEPR–1/07
8A2 – TSSOP
Pin 1 indicator
this corner
AT34C02B
123
N
Top View
b
e
D
Side View
A2
E1
E
L1
L
End View
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
A
D2.903.003.102, 5
E6.40 BSC
E14.304.404.503, 5
A––1.20
A20.801.001.05
b0.19–0.304
e0.65 BSC
L0.450.600.75
L11.00 REF
MIN
NOM
MAX
NOTE
Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,
3417E–SEEPR–1/07
datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm
(0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
2325 Orchard Parkway
R
San Jose, CA 95131
TITLE
8A2, 8-lead, 4.4 mm Body, Plastic
Thin Shrink Small Outline Package (TSSOP)
DRAWING NO.
8A2
5/30/02
REV.
B
17
8Y6 – Mini-MAP
A
Pin 1
Index
Area
E
D
A2
A3
E2
A1
SYMBOL
D2.00 BSC
E3.00 BSC
D21.401.501.60
E2 --1.40
A --0.60
A10.00.020.05
A2--0.55
A30.20 REF
L0.200.300.40
e0.50 BSC
b0.200.250.302
D2
e (6X)
1.50 REF.
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN
NOM
MAX
b
(8X)
Pin 1 ID
L (8X)
NOTE
Notes:1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, for proper dimensions,
tolerances, datums, etc.
2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the
terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area.
TITLE
18
2325 Orchard Parkway
R
San Jose, CA 95131
AT34C02B
8Y6, 8-lead 2.0 x 3.0 mm Body, 0.50 mm Pitch, Utlra Thin Mini-Map,
Dual No Lead Package (DFN) ,(MLP 2x3)
DRAWING NO.
8Y6
3417E–SEEPR–1/07
8/26/05
REV.
C
8U3-1 – dBGA2
AT34C02B
E
D
PIN 1 BALL PAD CORNER
Top View
PIN 1 BALL PAD CORNER
2
31
4
(d1)
d
8
67
5
e
(e1)
Bottom View
8 SOLDER BALLS
1. This drawing is for general information only.
2. Dimension ‘b’ is measured at maximum solder ball diameter
A
1.
A
1
2
A
Side View
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
A 0.71 0.81 0.91
A1 0.10 0.15 0.20
A2 0.40 0.45 0.50
b 0.20 0.25 0.30 2
D 1.50 BSC
E 2.00 BSC
e 0.50 BSC
e1 0.25 REF
d 1.00 BSC
d1 0.25 REF
MIN
NOM
MAX
b
NOTE
3417E–SEEPR–1/07
1150 E. Cheyenne Mtn. Blvd.
R
Colorado Springs, CO 80906
TITLE
8U3-1, 8-ball, 1.50 x 2.00 mm Body, 0.50 mm pitch,
Small Die Ball Grid Array Package (dBGA2)
DRAWING NO.
PO8U3-1 A
6/24/03
REV.
19
Revision History
Doc. Rev.DateComments
3417E1/2007Revision History Implemented.
Pg 1: Added note: Not Recommended for new design; Please
refer to AT34C02C datasheet.
20
AT34C02B
3417E–SEEPR–1/07
Atmel CorporationAtmel Operations
2325 Orchard Parkway
San Jose, CA 95131, USA
Tel: 1(408) 441-0311
Fax: 1(408) 487-2600
Regional Headquarters
Europe
Atmel Sarl
Route des Arsenaux 41
Case Postale 80
CH-1705 Fribourg
Switzerland
Tel: (41) 26-426-5555
Fax: (41) 26-426-5500
Asia
Room 1219
Chinachem Golden Plaza
77 Mody Road Tsimshatsui
East Kowloon
Hong Kong
Tel: (852) 2721-9778
Fax: (852) 2722-1369
Japan
9F, Tonetsu Shinkawa Bldg.
1-24-8 Shinkawa
Chuo-ku, Tokyo 104-0033
Japan
Tel: (81) 3-3523-3551
Fax: (81) 3-3523-7581
Memory
2325 Orchard Parkway
San Jose, CA 95131, USA
Tel: 1(408) 441-0311
Fax: 1(408) 436-4314
Microcontrollers
2325 Orchard Parkway
San Jose, CA 95131, USA
Tel: 1(408) 441-0311
Fax: 1(408) 436-4314
La Chantrerie
BP 70602
44306 Nantes Cedex 3, France
Tel: (33) 2-40-18-18-18
Fax: (33) 2-40-18-19-60
ASIC/ASSP/Smart Cards
Zone Industrielle
13106 Rousset Cedex, France
Tel: (33) 4-42-53-60-00
Fax: (33) 4-42-53-60-01
1150 East Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906, USA
Tel: 1(719) 576-3300
Fax: 1(719) 540-1759
Scottish Enterprise Technology Park
Maxwell Building
East Kilbride G75 0QR, Scotland
Tel: (44) 1355-803-000
Fax: (44) 1355-242-743
1150 East Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906, USA
Tel: 1(719) 576-3300
Fax: 1(719) 540-1759
Biometrics/Imaging/Hi-Rel MPU/
High Speed Converters/RF Datacom
Avenue de Rochepleine
BP 123
38521 Saint-Egreve Cedex, France
Tel: (33) 4-76-58-30-00
Fax: (33) 4-76-58-34-80
Literature Requests
www.atmel.com/literature
Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any
intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDI-
TIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY
WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT
OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no
representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications
and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided
otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use
as components in applications intended to support or sustain life