ATMEL AT28HC64B-90TI, AT28HC64B-90TC, AT28HC64B-90SI, AT28HC64B-90SC, AT28HC64B-90PI Datasheet

Features

PDIP, SOIC

Top View

0274D

Fast Read Access Time - 55 ns

•

Automatic Page Write Operation

•

Internal Address and Data Latches for 64-Bytes

Fast Write Cycle Tim es

•

Page Write Cycle Tim e: 10 ms Ma xi mum
1 to 64-Byte Page Write Opera tio n

Low Power Dissipation

•

40 mA Active Current
100 µA CMOS Standby Current

Hardware and Software Data Protection

•

DATA Polling and Toggl e Bit for End of Write Detec tion

•

High Reliabili ty C MOS Technology

•

Endurance: 100,000 Cycles
Data Retention: 10 Years

Single 5V ± 10% Supply

•

CMOS and TTL Compatible Inputs and Outputs

•

JEDEC Approved Byte-Wid e Pin ou t

•

Commercial and Industrial Temperature Ranges

•

AT28HC64B

64K (8K x 8)
High Speed
CMOS

2

E

PROM with

Page Write and

Description

The AT28HC64B is a high-performance electrically er asable and programmable read
only memory (EEPROM). Its 64K of memory is organized as 8,192 words by 8 bits.
Manufactured with Atmel’s advanced nonvolatile CMOS technology , the device offers
access times to 55 ns with power dissipation of just 220 mW. When the device is
deselected, the CMOS standby current is less than 100 µA.

The AT28HC64B is accessed like a Static RAM for the read or write cycle without the
need for external components. The device contains a 64-byte page register to allow

(continued)

Pin Configurations

Pin Name Function

A0 - A12 Addresses
CE Chip Enable
OE Output E nable
WE Write Enable
I/O0 - I/O7 Data Inputs/Outputs
NC No Connect
DC Don’t Connec t

TSOP

Top View

PLCC

Top View

Software Data
Protection

AT28HC64B

Note: PLCC package pins 1 and
17 are DON’T CONNECT.

2-267

Description (Continued)

writing of up to 64-bytes simultaneously. During a write cy­cle, the addresses and 1 to 64-bytes of data are internally
latched, freeing the address and data bus for other opera­tions. Following the initiation of a write cycle, the device
will automatically write the latched data using an internal
control timer. The end of a write cycle can be detected by
DATA Polling of I/O7. Once the end of a write cycle has
been detected, a new access for a read or write can begin.

Block Diagram

Atmel’s AT 28HC64B has additional features to ensure
high quality and manufacturability. The device utilizes in­ternal error correction for extended endurance and im­proved data retention. An optional software data protec­tion mechanism is available to guard against inadvertent
writes. The device also includes an extra 64-bytes of
EEPROM for device identification or tracking.

Absolute Maximum Ratings*

Temperature Under Bias.................-55°C to +125°C

Storage Temperature...................... -65°C to +150°C

All Input Voltages
(including NC Pins)

with Respect to Ground ................... -0.6V to +6.25V

All Output Voltages

with Respect to Ground .............-0.6V to V

Voltage on OE and A9

with Respect to Ground ................... -0.6V to +13.5V

2-268 AT28HC64B

+ 0.6V

CC

*NOTICE: Stresses beyond those listed un der “Abso lute Maxi-

mum Ratings” may cause permanen t dama ge to th e de vice .
This is a stress rating only and functional operation of the
device at these or any other conditions beyond those indi­cated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.

Device Operation

READ: The AT28HC64B is accessed like a Static RAM.

CE and OE are low and WE is high, the data stored

When
at the memory location determined by the address pins is
asserted on the outputs. The outputs are put in the high­impedance state when either
line control gives designers flexibility in preventing bus
contention in their systems.

BYTE WRITE: A low pulse on the

WE low (respectively) and OE high initiates a write cy-

or
cle. The address is latched on the falling edge of
WE, whichever occurs last. The data is latched by the firs t
rising edge of
started, it will automatically time itself to completion. Once
a programming operation has been initiated and for the
duration of t
ing operation.

PAGE WRITE: The page write operation of the
AT28HC64B allows 1 to 64-bytes of data to be written into
the device during a single internal programming period. A
page write operation is initiated in the same manner as a
byte write; after the first byte is written, it can then be fol­lowed by 1 to 63 additional bytes. Each successive byte
must be loaded within 150 µs (t
If the t

BLC

accepting data and commence the internal programming
operation. All bytes during a page write oper ation must re­side on the same page as defined by the state of the A6 to
A12 inputs. For each
page write operation, A6 to A12 must be the same.

The A0 to A5 inputs specify which bytes within the page
are to be written. The bytes may be loaded in any order
and may be altered within the same load period. Only
bytes which are specified for writing will be written; unnec­essary cycling of other bytes within the page does not oc­cur.

DATA POLLING: The AT28HC64B features DATA Poll­ing to indicate the end of a write cycle. During a byte or
page write cycle, an attempted read of the last byte written
will result in the complement of the written data to be pre­sented on I/O7. Once the write cycle has been completed,
true data is valid on all outputs, and the next write cycle
may begin.
write cycle.

TOGGLE BIT: In addition to
AT28HC64B provides another method for determining the
end of a write cycle. During the write operation, succes­sive attempts to read data from the device will result in
I/O6 toggling between one and zero. Once the write has
completed, I/O6 will stop toggling, and valid data will be

CE or WE. Once a byte write has been

, a read operation will effectively be a poll-

WC

limit is exceeded, the AT28HC64B will cease

WE high to low transition during the

DATA Polling may begin at any time during the

CE or OE is high. This dual

WE or CE input with CE

CE or

) of the previous byte.

BLC

DATA P olling, the

AT28HC64B

read. Toggle bit reading may begin at any time during the
write cycle.

DATA PROTECTION: If precautions are not taken, inad­vertent writes may occur during transitions of the host sys­tem power supply. Atmel has incorporated both hardware
and software features that will protect the memory agains t
inadvertent writes.

HARDWARE DATA PROTECTION: Hardware features
protect against inadvertent writes to the AT28HC64B in
the following ways: (a) V
(typical), the write function is inhibited; (b) V
delay - once V
matically time out 5 ms (typical) before allowing a write; (c)
write inhibit - holding any one of
high inhibits write cycles; (d) noise filter - pulses of less
than 15 ns (typical) on the
a write cycle.

SOFTWARE DATA PROTECTION: A software-control­led data protection feature has been implemented on the
AT28HC64B. When enabled, the software data protection
(SDP), will prevent inadvertent writes. The SDP feature
may be enabled or disabled by the user; the AT28HC64B
is shipped from Atmel with SDP disabled.

SDP is enabled by the user issuing a series of three write
commands in which three specific bytes of data are written
to three specific addresses (refer to the

Protection Algorithm

ing the 3-byte command sequence and waiting t
entire AT28HC64B will be protected against inadvertent
writes. It should be noted that even after SDP is enabled,
the user may still perform a byte or page write to the
AT28HC64B. This is done by preceding the data to be
written by the same 3-byte command sequence used to
enable SDP.

Once set, SDP remains active unless the disable com­mand sequence is issued. Power transitions do not dis­able SDP, and SDP protects the AT28HC64B during
power-up and power-down conditions. All command se­quences must conform to the page write timing specifica­tions. The data in the enable and disable command se­quences is not actually written into the device; their ad­dresses may still be written with user data in either a byte
or page write operation.

After setting SDP, any attempt to write to the device with­out the 3-byte command sequence will start the internal
write timers. No data will be written to the device, however.
For the duration of t
polling operations.

has reached 3.8V, the device will auto-

CC

diagram in this data sheet). After writ-

WC

sense - if VCC is below 3.8V

CC

power-on

CC

OE low, CE high or WE

WE or CE inputs will not initiate

Software Data

, the

WC

, read operations will effectively be

(continued)

2-269

Device Operation (Continued)

DEVICE IDENTIFICA TION: An extra 64-bytes of

EEPROM memory are av ailable to the user for device
identification. By raising A9 to 12V ± 0.5V and using ad-

dress locations 1FC0H to 1FFFH, the additional bytes
may be written to or read from in the same manner as the
regular memory array.

DC and AC Operating Range

AT28HC64B-55 AT28HC64B-70 AT28HC64B-90 AT28HC64B-120

Operating
Temperature (Case)

Power Supply 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10%

V

CC

Com. 0°C - 70°C 0°C - 70°C 0°C - 70°C 0°C - 70°C
Ind. -40°C - 85°C -40°C - 85°C -40°C - 85°C

Operating Modes

Mode CE OE WE I/O

X

V

IL

V

IH
(1)

Read V

(2)

Write
Standby/Write Inhibit V

IL

V

IL
IH

Write Inhibit X X V
Write Inhibit X V
Output Disable X V
Chip Erase V

Notes: 1. X can be VIL or VIH.

2. Refer to the
in this data sheet.

AC Write Waveforms

IL

diagrams

IL
IH

(3)

VH

3. VH = 12.0V ± 0.5V.

V

IH

V

IL

X High Z

IH

X
X High Z

VIL High Z

D
D

OUT
IN

DC Characteristics

Symbol Parameter Condition Min Max Units

I

LI

I

LO

I

SB1

I

SB2

I

CC

V

IL

V

IH

V

OL

V

OH

Note: 1. I

2-270 AT28HC64B

Input Load Current VIN = 0V to VCC + 1V 10 µA
Output Leakage Current V
VCC Standby Current CMOS CE = V
VCC Standby Current TTL CE = 2.0V to VCC + 1V 2
V

Active Current f = 5 MHz; I

CC

= 0V to V

I/O

CC

CC

10 µA

- 0.3V to VCC + 1V Com., Ind. 100

= 0 mA 40 mA

OUT

(1)

(1)

Input Low Voltage 0.8 V
Input High Voltage 2.0 V
Output Low Voltage IOL = 2.1 mA .40 V
Output High Voltage IOH = -400 µA 2.4 V

SB1

and I

for the 55 ns part is 40 mA maximum.

SB2

µA

mA

AC Read Characteristics

AT28HC64B

AT28HC64B-55 AT28HC64B-70 AT28HC64B-90 AT28HC64B-120

Symbol Parameter

t

ACC

t

CE

t

OE

t

DF

t

OH

(1)
(2)

Address to Output Delay 55 70 90 120 ns
CE to Output Delay 55 70 90 120 ns
OE to Output Delay 0 30 0 35 0 40 0 50 ns

(3, 4)

OE to Output Float 0 30 0 35 0 40 0 50 ns
Output Hold 0 0 0 0 ns

AC Read Waveforms

(1, 2, 3, 4)

Min Max Min Max Min Max Min Max

Units

Notes: 1. CE may be delayed up to t

transition without impact on t
OE may be delayed up to tCE - tOE after the falling

2.
edge of
after an address change without impact on t

CE without impact on tCE or by t

- tCE after the address

ACC

.

ACC

ACC

- tOE
.

ACC

Input Test Waveforms and
Measurement Level

tR, tF < 5ns

Pin Capacitance (f = 1 MHz, T = 25°C)

Typ Max Units Conditions

C

IN

C

OUT

Note: 1. This parameter is characterized and is not 100% tested.

46pFV
812pFV

(1)

is specified from OE or CE, whichever occurs first

3. t

DF

= 5 pF).

(C

L

4. This parameter is characterized and is not 100% tested.

Output Test Load

= 0V

IN

= 0V

OUT

2-271

AC Write Characteristics

Symbol Parameter Min Max Units

t
t
t
t
t
t
t

AS
AH
CS
CH
WP
DS
DH

, t

, t

OES

OEH

Address, OE Set-up Time 0 ns
Address Hold Time 50 ns
Chip Select Set-up Time 0 ns
Chip Select Hold Time 0 ns
Write Pulse Width (WE or CE) 100 ns
Data Set-up Time 50 ns
Data, OE Hold Time 0 ns

AC Write Waveforms

WE Controlled

CE Controlled

2-272 AT28HC64B

AT28HC64B

Page Mode Characteristics

Symbol Parameter Min Max Units

t

WC

t

AS

t

AH

t

DS

t

DH

t

WP

t

BLC

t

WPH

Write Cycle Time 10 ms
Address Set-up Time 0 ns
Address Hold Time 50 ns
Data Set-up Time 50 ns
Data Hold Time 0 ns
Write Pulse Width 100 ns
Byte Load Cycle Time 150 µs
Write Pulse Width High 50 ns

Page Mode Write Waveform s

(1, 2)

Notes: 1. A6 through A12 must specify the same page add res s during each high to low transit io n of

2.

OE must be high only when WE and CE are both low.

Chip Erase Waveforms

tS = tH = 5 µsec (min. )

= 10 msec (min.)

t

W

VH = 12.0V ± 0.5V

2-273

WE (or CE).

Software Data
Protection Enable

Algorithm

(1)

Software Data
Protection Dis abl e

Algorithm

(1)

LOAD DATA AA

TO

ADDRESS 1555

LOAD DATA 55

TO

ADDRESS 0AAA

LOAD DATA A0

TO

ADDRESS 1555

LOAD DATA XX

TO

ANY ADDRESS

LOAD LAST BYTE

TO

LAST ADDRESS

WRITES ENABLED

(4)

ENTER DATA
PROTECT STATE

(2)

Notes for software program code:

1. Data Format: I/O7 - I/O0 (Hex);
Address Format: A12 - A0 (Hex).

2. Write Protect stat e wil l be act iv ated at end of write eve n if no

other data is loaded.

3. Write Protect stat e wil l be dea ctivated at end of write period

even if no oth er data is loaded .

4. 1 to 64-bytes of data are loaded.

LOAD DATA AA

TO

ADDRESS 1555

LOAD DATA 55

TO

ADDRESS 0AAA

LOAD DATA 80

TO

ADDRESS 1555

LOAD DATA AA

TO

ADDRESS 1555

LOAD DATA 55

TO

ADDRESS 0AAA

LOAD DATA 20

TO

ADDRESS 1555

LOAD DATA XX

TO

ANY ADDRESS

LOAD LAST BYTE

TO

LAST ADDRESS

(4)

EXIT DATA
PROTECT STATE

(3)

Software Prot ec te d Wr ite Cyc le Wa veforms

(1, 2)

Notes: 1. A6 through A12 must specif y th e sa me page address during each high to low t ran si tion of

the software code ha s be en ent ere d.

2. OE must be high only when WE and CE are both low.

2-274 AT28HC64B

WE (or CE) after

AT28HC64B

Data Polling Characteristics

(1)

Symbol Parameter Min Typ Max Units

t

DH

t

OEH

t

OE

t

WR

Notes: 1. These parameters are characterized and not 100% tested. 2. See AC Read Characteristics.

Data Hold Time 0 ns
OE Hold Time 0 ns
OE to Output Delay

(2)

Write Recovery Time 0 ns

Data Polling Waveforms

ns

Toggle Bit Characteristics

(1)

Symbol Parameter Min Typ Max Units

t

DH

t

OEH

t

OE

t

OEHP

t

WR

Notes: 1. These parameters are characterized an d no t 10 0% tested.

Toggle Bit Waveforms

Data Hold Time 10 ns
OE Hold Time 10 ns
OE to Output Delay

(2)

OE High Pulse 150 ns
Write Recovery Time 0 ns

2. See AC Read Characteristics.

(1, 2, 3)

ns

Notes: 1. Toggling either

operate toggle bit.

2. Beginning and ending state of I/O6 will vary.

OE or CE or both OE and CE will

3. Any address location may be used, but the
address should not vary.

2-275

2-276 AT28HC64B

AT28HC64B

Ordering Information

t

ACC

(ns)

55 40 0.1 AT28HC64B-55JC 32J Commercial

70 40 0.1 AT28HC64B-70JC 32J Commercial

90 40 0.1 AT28HC64B-90JC 32J Commercial

120 40 0.1 AT28HC64B-12JC 32J Commercial

Active Standby

(mA)

I

CC

40 0.1

40 0.1

40 0.1

(1)

Ordering Code

AT28HC64B-55PC 28P6 (0°C to 70°C)
AT28HC64B-55SC 28S

AT28HC64B-70PC 28P6 (0°C to 70°C)
AT28HC64B-70SC 28S
AT28HC64B-70TC 28T

AT28HC64B-70JI 32J Industrial
AT28HC64B-70PI 28P6 (-40°C to 85°C)
AT28HC64B-70SI 28S
AT28HC64B-70TI 28T

AT28HC64B-90PC 28P6 (0°C to 70°C)
AT28HC64B-90SC 28S
AT28HC64B-90TC 28T

AT28HC64B-90JI 32J Industrial
AT28HC64B-90PI 28P6 (-40°C to 85°C)
AT28HC64B-90SI 28S
AT28HC64B-90TI 28T

AT28HC64B-12PC 28P6 (0°C to 70°C)
AT28HC64B-12SC 28S
AT28HC64B-12TC 28T

AT28HC64B-12JI 32J Industrial
AT28HC64B-12PI 28P6 (-40°C to 85°C)
AT28HC64B-12SI 28S
AT28HC64B-12TI 28T

Package Operation Range

Note: 1. See Valid Part Number table below.

2-277

Valid Part Numbers

The following table lists standard Atmel products that can be ordered.

Device Numbers Speed Package and Temperature Combinations

AT28HC64B
AT28HC64B
AT28HC64B
AT28HC64B

55
70
90
12

PC, SC
JI, PC, PI, SC, SI, TC, TI
JI, PC, PI, SC, SI, TC, TI
JI, PC, PI, SC, SI, TC, TI

Package Type

32J 32 Lead, Plastic J-L ea ded Chip Carrier (PLCC)
28P6 28 Lead, 0.600" Wide, Plast ic Dual Inlin e Pac kage (PDIP)
28S 28 Lead, 0.300" Wide, Plastic Gull Wing S mall Outlin e (SOIC)
28T 28 Lead, Plastic Thin Small Outline Package (TSOP)

2-278 AT28HC64B