ATMEL AT28C16E-15SI, AT28C16E-15SC, AT28C16E-15PI, AT28C16E-15PC, AT28C16E-15JI Datasheet

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AT28C16
16K (2K x 8) CMOS E2PROM
0540A
Fast Read Access Time - 150 ns
Fast Byte Write - 200 µs or 1 ms
Self-Timed Byte Write Cycle
Internal Address and Data Latches Internal Control Timer Automatic Clear Before Write
Direct Microprocessor Con trol
DATA POLLING
Low Power
30 mA Active Current 100 µA CMOS Standby Current
High Reliabili ty
Endurance: 104 or 105 Cycles Data Retention: 10 Years
5V ± 10% Supply
CMOS & TTL Compatible Inpu ts an d Outp uts
JEDEC Approved Byte Wide Pino ut
Commercial and Industrial Temperature Ranges
Description
The AT28C16 is a low-power, high-performance Electrically Erasable and Program­mable Read Only Memory with easy to use features. The AT28C16 is a 16K memory organized as 2,048 words by 8 bits. The device is manufac tured with Atmel’s reliable nonvolatile CMOS technology.
The AT28C16 is accessed like a static RAM for the read or write cycles without the need of external components. During a byte write, the address and data are latched
(continued)
Pin Configurations
AT28C16
Pin Name Function
A0 - A10 Addresses CE Chip Enable OE Output E nable WE Write Enable I/O0 - I/O7 Data Inputs/Outputs NC No Connect DC Don’t Connec t
Note: PLCC package pins 1 and 17 are DON’T CONNECT.
PLCC
Top View
PDIP, SOIC
Top View
2-165
Description (Continued)
internally, freeing the microprocessor address and data bus for other operations. Following the initiation of a write cycle, the device will go to a busy state and automatically clear and write the latched data using an internal control timer. The end of a write cycle can be determined by DATA POLLING of I/O7. Once the end of a write cycle has been detected, a new access for a read or a write can begin.
Block Diagram
The CMOS technology offers fast access times of 150 ns at low power dissipation. When the chip is deselected the standby current is less than 100 µA.
Atmel’s 28C16 has additional features to ensure high quality and manufacturability. The device utilizes error cor­rection int ernally for extended e ndurance and for im­proved data retention characteristics. An extra 32-bytes of
2
PROM are available for device identification or tracking.
E
Absolute Maximum Ratings*
Temperature Under Bias.................-55°C to +125°C
Storage Temperature...................... -65°C to +150°C
All Input Voltages (including NC Pins)
with Respect to Ground ................... -0.6V to +6.25V
All Output Voltages
with Respect to Ground .............-0.6V to V
Voltage on OE and A9
with Respect to Ground ................... -0.6V to +13.5V
2-166 AT28C16
+ 0.6V
CC
*NOTICE: Stresses beyond those listed un der “Abso lute Maxi-
mum Ratings” may cause permanen t dama ge to th e de vice . This is a stress rating only and functional operation of the device at these or any other conditions beyond those indi­cated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Device Operation
READ: The AT28C16 is accessed like a Static RAM.
CE and OE are low and WE is high, the data stored
When at the memory location determined by the address pins is asserted on the outputs. The outputs are put in a high im­pedance state whenever control gives designers increased flexibility in preventing bus contention.
BYTE WRITE: Writing data into the AT28C16 is similar to writing into a Static RAM. A low pulse on the input with ates a byte write. The address location is latched on the last falling edge of the first rising edge. Internally, the device performs a self­clear before write. Once a byte write has been started, it will automatically time itself to completion. Once a pro­gramming operation has been initiated and for the dura­tion of t operation.
FAST BYTE WRITE: The AT28C16E offers a byte write time of 200 µs maximum. This feature allows the entire device to be rewritten in 0.4 seconds.
DATA POLLING: The AT28C16 provides DA TA POLL­ING to signal t he completion of a write cycle. During a write cycle, an attempted read of the data being written results in the complement of that data for I/O outputs are indeterminate). When the write cycle is fin­ished, true data appears on all outputs.
OE high and CE or WE low (respectively) initi-
WE (or CE); the new data is latched on
, a read operation will effectively be a polling
WC
CE or OE is high. This dual line
WE or CE
(the other
7
AT28C16
WRITE PROTECTION: Inadvertent writes to the device
are protected against in the following ways. (a) sense— if VCC is below 3.8V (typical) the write function is inhibited. (b) V reached 3.8V the device will automatically time out 5 ms (typical) before allowing a byte write. (c) Write Inhibit— holding any one of byte write cycles.
CHIP CLEAR: The contents of the entire memory of the AT28C16 may be set to the high state by the CHIP CLEAR operation. By setting is cleared when a 10 msec low pulse is applied to
DEVICE IDENTIFICATION: A n extra 32-byt es of
2
PROM memory are available to the user for device
E identification. By raising A9 to 12 ± 0.5V and using ad­dress locations 7E0H to 7FFH the additional bytes may be written to or read from in the same manner as the regular memory array.
power on delay— once VCC has
CC
OE low, CE high or WE high inhibits
CE low and OE to 12 volts, the chip
VCC
WE.
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