512K (32K x 16)
OTP CMOS
EPROM
Features
Fast Read Access Ti me - 45 ns
•
Low Power CMOS Operation
•
100 µA max. Standby
30 mA max. Active at 5 MHz
JEDEC Standard Packages
•
44-Lead PLCC
40-Lead TSOP (10mm x 14mm)
5V ± 10% Power Supply
•
High Reliability CMOS Techn ol og y
•
2000V ESD Protection
200 mA Latchup Imm un ity
RapidProgramming Algorithm - 50 µs/word (typical)
•
CMOS and TTL Compatible Inputs and Outputs
•
Integrated Produc t Ide nti fication Code
•
Commercial and Industrial Temperature Ranges
•
Description
The AT27C516 is a low-power, high performance 524,288 bit one-time programmable read only memory (OTP EPROM) organized 32K by 16 bits. It requires only one
5V power supply in normal read mode operation. Any word can be accessed in less
than 45 ns, eliminating the need for speed reducing WAIT states. The by-16 organization make this part ideal for high-performance 16 and 32 bit microprocessor systems.
(continued)
AT27C516
Pin Configurations
Pin Name Function
A0 - A14 Addresses
O0 - O15 Outputs
CE Chip Enable
OE Output Enable
PGM Program Strobe
NC No Connect
Note: Both GND pins must
be connected.
PLCC Top View
AT27C516
TSOP Top View
Type 1
Note: PLCC Package Pins 1
and 23 are DON’T CONNECT.
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Description (Continued)
In read mode, the AT27C516 typically consumes 15 mA.
Standby mode supply current is typically less than 10
The AT27C516 is available in industry standard
JEDEC-approved one-time programmable (OTP) plastic
PLCC and TSOP packages. The device features two-line
control (
systems.
With 32K word storage capability, the AT27C516 allows
firmware to be stored reliably and to be accessed by the
system without the delays of mass storage media.
Atmel’s 27C516 have additional features to ensure high
quality and efficient production use. The Rapid
ming Algorithm reduces the time required to program the
part and guarantees reliable programming. Programming
time is typically only 50 µs/word. The Integrated Product
Identification Code electronically identifies the device and
manufacturer. This feature is used by industry standard
programming equipment to select the proper programming algorithms and voltages.
CE, OE) to eliminate bus contention in high-speed
µA.
Program-
System Considerations
Switching between active and standby conditions via the
Chip Enable pin may produce transient voltage excursions. Unless accommodated by the system design, these
transients may exceed data sheet limits, resulting in device non-conformance. At a minimum, a 0.1 µF high frequency, low inherent inductance, ceramic capacitor
should be utilized for each device. This capacitor should
be connected between the V
the device, as close to the device as possible. Additionally,
to stabilize the supply voltage level on printed circuit
boards with large EPROM arrays, a 4.7 µF bulk electrolytic
capacitor should be utilized, again connected between the
and Ground terminals. This capacitor should be posi-
V
CC
tioned as close as possible to the point where the power
supply is connected to the array.
and Ground terminals of
CC
3-146 AT27C516
AT27C516
Block Diagram
Absolute Maximum Ra ti ngs *
Temperature Under Bias ................ -55°C to +125°C
Storage Temperature...................... -65°C to +150°C
Voltage on Any Pin with
Respect to Ground.........................-2.0V to +7.0V
Voltage on A9 with
Respect to Ground ......................-2.0V to +14.0V
VPP Supply Voltage with
Respect to Ground.......................-2.0V to +14.0V
*NOTICE: Stresses beyond those listed unde r “Absolu te Maxi-
mum Ratings” may cause permanent da ma ge to th e de vice .
This is a stress rating only and functional operation of the
device at these or any other conditions beyond those indicated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
Note: 1. Minimum voltage is -0.6V dc which may undershoot to -
2.0V for pulses of less than 20 ns. Maximum outpu t
pin voltage is V
to +7.0V for pulses of less than 20 ns.
+ 0.75V dc which may overshoot
CC
(1)
(1)
(1)
Operating Modes
Mode \ Pin
Read V
Output Disable X V
Standby V
Rapid Program
(2)
PGM Verify V
PGM Inhibit V
Product Identification
Notes: 1. X can be VIL or VIH.
2. Refer to Programming characteristics.
= 12.0 ± 0.5V.
3. V
H
(4)
CE OE PGM Ai V
IL
IH
V
IL
IL
IH
V
IL
Outputs
OUT
High Z
D
IN
D
OUT
V
IL
IH
(1)
X
Ai X D
X X X High Z
XX X X
V
IH
V
IL
V
IL
V
IH
Ai V
Ai V
PP
(5)
PP
PP
XX X VPPHigh Z
(3)
A9 = V
V
IL
X
A0 = VIH or VIL
A1 - A14 = V
4. Two identifier words may be sel ected. All Ai inputs are held
low (V
gled low (V
word and high (V
5. Standby V
V
), except A9 which is set to VH and A0 which is tog-
IL
will cause a slight increase in ISB.
PP
H
IL
) to select the Manuf ac tu rer’s Identifi ca ti on
IL
CC
) to select the Device Code word.
IH
current (ISB) is specified with V
V
CC
Identification
Code
= VCC. VCC >
PP
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