Datasheet AT27C400-90TI, AT27C400-90TC, AT27C400-90RI, AT27C400-70PC, AT27C400-15TI Datasheet (ATMEL)

0844A-A–7/97

Features

• Fast Read Access Time - 70 ns

• Word-wide or Byte-wide Configurable

• 4 Megabit Flash and Mask ROM Compatible

• Low Power CMOS Operation

–100 µA Maximum Standby
– 50 mA Maximum Active at 5 MHz

• Wide Selec tion of JEDEC Standard Packages

– 40-Lead 600 mil PDIP
– 40-Lead SOIC (SOP)
– 48-Lead TSOP (12 mm x 20 mm)

• 5V ± 10% Power Supply

• High Reliability CMOS Technology

– 2,000V ESD Protection
– 200 mA Latchup Immunity

• Rapid

• CMOS and TTL Compatible Inputs and Outputs

• Integrated Product Identification Code

• Commercial and Industrial Temperature Ranges

™

Programming Algorithm - 50 µs/word (typical)

AT27C400

4-Megabit
(256K x 16 or
512K x 8) OTP
EPROM

Description

The AT27C400 is a low-power, high-performance 4,194,304-bit one-time programma­ble read only memory (OTP EPROM) organized as either 256K by 16 or 512K by 8
bits. It requires a single 5 V power supply in normal r ead mode oper ation. Any word
can be accessed in less than 70 ns, elimi nating the need for speed-re ducing WAIT
states. The by-16 organization makes this part ideal for high-performance 16- and 32­bit microprocessor systems.

PDIP Top View

SOIC (SOP)

Pin Configurations

1

40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21

A8
A9
A10
A11
A12
A13
A14
A15
A16
BYTE/VPP
GND
015/A-1
O7
O14
O6
O13
O5
O12
O4
VCC

2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20

A17

GND

O10

O11

1

40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21

A8
A9
A10
A11
A12
A13
A14
A15
A16
BYTE/VPP
GND
015/A-1
O7
O14
O6
O13
O5
O12
O4
VCC

2

A7

3

A6

4

A5

5

A4

6

A3

7

A2

8

A1

9

A0

10

CE

11
12

OE

13

O0

14

O8

15

O1

16

O9

17

O2

18
19

O3

20

TSOP

Type 1

1

A15

2

A14

3

A13

4

A12

5

A11

6

A10

7

A9

8

A8

9

NC

10

NC

11

NC

12

NC

13

NC

14

NC

15

NC

16

NC

17

A17

18

A7

19

A6

20

A5

21

A4

22

A3

23

A2

24

A1

48

A16

47

BYTE/VPP

46

GND

45

015/A-1

44

I/O7

43

O14

42

O6

41

O13

40

O5

39

O12

38

O4

37

VCC

36

O11

35

O3

34

O10

33

O2

32

O9

31

O1

30

O8

29

O0

28

OE

27

GND

26

CE

25

A0

Pin Name Function

A0 - A17 Addresses
O0 - O15 Outputs
O15/A-1 Output/Address

BYTE
CE

OE

/VPP

Byte Mode/
Program Supply

Chip Enable
Output Enable

NC No Connect

Note: Both GND pins must be
connected.

A17

GND

O10

O11

A7
A6
A5
A4
A3
A2
A1
A0

CE

OE
O0
O8
O1
O9
O2

O3

AT27C400
Preliminary

1

Description

µ

µ

µ

µ

The AT27C400 can be organized as either word-wide or
byte-wide. The organization is selected v ia the BYTE
pin. When BYTE/VPP is asserted high (VIH), the word-wide
organization is s elected and the O15/A-1 p in is use d for
O15 data output. When BYTE
byte-wide organization is selected and the O15/A-1 pi n is
used for the address pin A-1. When the AT27C400 is logi­cally regarded as x1 6 (word-wide ), but read in the by te­wide mode, then with A-1 = V
word are s el ec ted a nd wi th A- 1 = V
16-bit word are selected.

In read mode, the AT27C400 typically consumes 15 mA.
Standby mode supply current is typically less than 10

The AT27C400 i s available in industry s tandard
JEDEC-approved one-time programmable (OTP) PDIP,
SOIC (SOP), and TSOP packages. The device features
two-line control (CE
high-speed systems.

With high density 25 6K word or 512K byte storage capabil­ity, the AT27C400 allows firmware to be stored reliably and
to be accessed by the s ystem withou t the delay s of mass
storage media.

Atmel’s AT27C400 has additional features that ensure high
quality and efficient production use. The Rapid
ming Algori thm reduc es the tim e requi red to pro gram the
part and guarantees reliable programming. Programming
time is typically only 50
Identification Code electronically identifies the device and
manufacturer. This feature is used by industry standard
programming eq uipme nt to sel ect the pro per prog ramming
algorithms and voltages.

(Continued)

/VPP is asserted low (VIL), the

the lower 8 bits of the 16-bit

IL

, OE) to eliminate bus contention in

s/word. The Integrated Product

the upper 8 bits of the

IH

™

Program-

/V

PP

.

A

System Considerations

Switching between active and standby conditions via the
Chip Enable pin may produce tr ans ie nt v olta ge e xcur sion s.
Unless accommodated by the system design, these tran­sients may exceed data sheet limits, resulting in device
non-conforman ce. At a mi nimum, a 0.1
low inherent inductance, ceramic capacitor should be uti­lized for each device. This capacitor shoul d be connected
between the V
close to the device as possible. Additionally, to stabilize the
supply voltage level on printed circuit boards with large
EPROM arrays, a 4.7
be utilized, agai n connec ted betwe en the V
terminals. This capacitor should be positioned as close as
possible to the point where the power supply is connected
to the array.

and Ground terminals of the device, as

CC

F bulk electrolytic capacitor should

F high frequency,

and Ground

CC

2

AT27C400

Block Diagram

Absolute Maximum Ratings*

AT27C400

Temperature Under Bias ......................-55°C to +125°C

Storage Temperature............................-65°C to +150°C

Voltage on Any Pin with

Respect to Ground ..............................-2.0V to +7.0V

Voltage on A9 with

Respect to Ground ...........................-2.0V to +14.0V

VPP Supply Voltage with

Respect to Ground ............................-2.0V to +14.0V

Integrated UV Erase Dose...................7258 W •sec/cm

Operating Modes

Mode/Pin CE

Read Word-wide V
Read Byte-wide Upper V
Read Byte-wide Lower V
Output Disable X
Standby V
Rapid Program

(2)

IL

IL

IL

(1)

IH

V

IL

PGM Verify X V
PGM Inhibit V

Product Identification

(4)

IH

V

IL

OE Ai BYTE/V

V

IL

V

IL

V

IL

V

IH

(1)

X

V

IH

IL

V

IH

V

IL

*NOTICE: Stresses beyond those listed under “Absolute Maxi-

mum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional
operation of the device at these or any other condi­tions beyond those indicated in the operational sec-

(1)

tions of this specification is not implied. Exposure to
absolute maximum rating conditions for extended
periods may affect device reliability.

(1)

Note: 1. Minimum voltage is -0.6V dc which undershoot to -

2.0V for pulses of less than 20 ns. Maximum output

(1)

2

(1)

X

(1)

X

(1)

X

(1)

X

(1)

X

Ai V
Ai V

(1)

X

(3)

A9 = V

H

A0 = VIH or V

A1 - A17 = V

pin voltag e is V
+7.0V for pulses of less than 20 ns.

PP

V

IH

V

IL

V

IL

X High Z

(5)

X

PP

PP

V

PP

V

IL

IL

IH

+ 0.75V dc which may ov ersho ot t o

CC

Outputs

O0 - O

D

OUT

D

OUT

D

OUT

7

O8 - O

14

D

OUT

High Z V
High Z V

High Z

D

IN

D

OUT

High Z

Identificatio

n

Code

O15/A-1

D

OUT

IH

IL

Notes: 1. X can be VIL or VIH.

2. Refer to the programming characteristics tables in this data sheet.
= 12.0 ± 0.5V.

3. V

H

4. Two identifier words may be selected. All inputs are held low (VIL), except A9, which is set to VH, and A0, which is toggled

low (V

) to select the Manufacturer’s Identification word and high (VIH) to select the Device Code word.

IL

5. Standby VCC current (ISB) is specified with VPP = VCC. VCC > VPP will cause a slight increase in ISB.

3

DC and AC Operating Conditions for Read Operation

µ

µ

µ

µ

AT27C400

-70 -90 -12 -15

Operating

Com.

0°C - 70°C0°C - 70°C0°C - 70°C0°C - 70°C
Temperature
(Case)

Power Supply 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10%

V

CC

Ind.

-40°C - 85°C-40°C - 85°C-40°C - 85°C-40°C - 85°C

DC and Operating Characteristics for Read Operation

Symbol Parameter Condition Min Max Units

I

LI

I

LO

I

PP1

I

SB

V
V
V
V

IL

IH
OL
OH

Input Load Current VIN = 0V to V
Output Leakage Current V

(2)

(1)

V

Read/Standby Current VPP = V

PP

(1)

V

Standby Current

CC

V

Active Current

CC

= 0V to V

OUT

I

(CMOS)

SB1

CE = V

(TTL)

I

SB2

CE = 2.0 to V
f = 5 MHz, I

CE = V

CC

CC ±

IL

CC

0.3V

CC

OUT

CC

+ 0.5V

= 0 mA,

Input Low Voltage -0.6 0.8 V
Input High Voltage 2.0 V
Output Low Voltage IOL = 2.1 mA 0.4 V
Output High Voltage IOH = -400 µA2.4V

Notes: 1. VCC must be applied simultaneously or beofre VPP, and removed simultaneously or after VPP.

2. VPP may be connected directly to VCC, except during programming. The supply current would then be the sum of ICC and
I

.

PP

AC Characteristics for Read Operation

AT27C400

± 1
± 5

10

100

A
A
A

A

1mA

40 mA

+ 0.5 V

CC

Symbol Parameter Condition Min Max Min Max Min Max Min Max Units

ACC

t

CE

t

OE

t

DF

t

OH

(2)

(2)(3)

(4)(5)

(4)

Output Delay
CE to Output Delay OE = V
OE to Output Delay CE = V
OE or CE High to Output Float,

whichever occurred first
Output Hold from Address,

CE or OE, whichever occurred first

Address to

(2)

t

tSTBYTE High to Output Valid 70 90 120 150 ns
t

STD

BYTE Low to Output Transition 40 40 50 60 ns

Notes: 2, 3, 4, 5. See the AC Waveforms for Read Operation diagram.

4

AT27C400

CE

= OE

= V

-70 -90 -12 -15

IL

IL

IL

70 90 120 150 ns
70 90 120 150 ns

30 35 40 50 ns
20 20 30 35 ns

5 555ns

= Advance Information

Byte-Wide Read Mode AC Waveforms

AT27C400

Note: BYTE/VPP = V

IL

Word-Wide Read Mode AC Waveforms

Note: BYTE/VPP = V

IH

BYTE Transition AC Wa veforms

Notes: 1. Timing measurement references are 0.8V and 2.0V. Input AC drive levels are 0.45V and 2.4V, unless otherwise specified.

2. OE

3. OE maybe delayed up to t

4. This parameter is only sampled and is not 100% tested.

5. Output float is defined as the point when data is no longer driven.

maybe delayed up to tCE - tOE after the falling edge of CE without impact on tCE.

- tOE after the address is valid without impact on t

ACC

ACC

.

5

Input Test Waveforms and Measurement Levels

tR, tF < 20 ns (10% to 90%)

Pin Capacitance

(f = 1 MHz T = 25°C)

(1)

Typ Max Units Conditions

Output Test Load

Note: CL = 100 pF including jig capacitance.

C

IN

C

OUT

Note: 1. Typical values for nominal supply voltage. This parameter is only sampled and is not 100% tested.

410 pF V
812 pF V

IN

OUT

= 0V

= 0V

6

AT27C400

AT27C400

µ

µ

Programming Waveforms

Notes: 1. The Input Timing Reference is 0.8V for VIL and 2.0V for VIH.

2. t

3. When programming the AT27C400, a 0.1

and t

OE

transients.

are characteristics of the device but mist be accomodated by the programmer.

DFP

(1)

F capacitor is required across VPP and ground to suppress spurious voltage

DC Programming Characteristics

TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V

Symbol Parameter Test Conditions

I

LI

V

IL

V

IH

V

OL

V

OH

I

CC2

I

PP2

V

ID

Input Load Current VIN = VIL, V

IH

Input Low Level -0.6 0.8 V
Input High Level 2.0
Output Low Voltage IOL = 2.1 mA 0.4 V

Output High Voltage IOH = -400 µA2.4 V
VCC Supply Curr ent

(Program and Verify)
VPP Supply Current CE = V

IL

A9 Product Identification Voltage 11.5 12.5 V

Limits

±

10

+

V

CC

0.5

50 mA
30 mA

UnitsMin Max

A

V

7

AC Programming Characteristics

µ

µ

µ

µ

µ

µ

µ

µ

µ

TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V

Symbol Parameter Test Conditions

(1)

Limits

UnitsMin Max

t

AS

t

OES

t

DS

t

AH

t

DH

t

DFP

t

VPS

t

VCS

t

PW

t

OE

t

PRT

Notes: 1. V

Address Setup Time
OE Setup Time 2
Data Setup Time 2
Address Hold Time 0
Data Hold Time 2
OE High to

Output Float Delay
VPP Setup Time 2
VCC Setup Time 2
CE Program Pulse Width
Data Valid from OE 150 ns
BYTE/VPP Pulse Rise Time

During Programming

2. This parameter is only sampled and is not 100%

3. Program Pulse width tolerance is 50

Input Rise and Fall Times

(10% to 90%) 20ns

Input Pulse Levels

(2)

0.45V to 2.4V

Input Timing Reference Level

0.8V to 2.0V

Output Timing Reference Level

(3)

must be applied simultaneously or before VPP and removed simultaneously or after VPP.

CC

tested. Ouput Float is defined as the point where data is no longer driven — see timing diagram.

sec ± 5%.

0.8V to 2.0V

47.5 52.5

2

s
s
s
s
s

0130ns

s
s
s

50 ns

Atmel’s 27C400 Integrated Product Identification Code

Pins

A0 O15 O14 O13 O12 O11 O10 O9 O8

Codes

Manufacturer 0 0 0 0 1 1 1 1 0 1E1E
Device Type 1 1 1 1 1 0 1 0 0 F4F4

8

AT27C400

O7 O6 O5 O4 O3 O2 O1 O0

Hex

Data

Rapid Programming Algorithm

µ

µ

A 50 µs CE pulse width is used to program. The address is
set to the first location. V
is raised to 13.0V. Each address is first pr ogrammed with
one 50
reprogramming loop is executed for each address. In the
event a word fails to pass verification, up to 10 successive
50

s CE pulse without verification. Then a verification/

s pulses are applied with a verification after each

is raised to 6.5V and BYTE/V

CC

PP

AT27C400

pulse. If the word fails to verify after 10 pulses have been
applied, the part is considered failed. After the word verifies
properly, the next address is selected until all have been
checked. V
words are read again and compared with the original data
to determine if the devi ce passes or fails.

is then lowere d to 5.0V and VCC to 5.0V. All

PP

9

Order ing Information

(mA)

I

t

ACC

(ns)

70

90

120

150

CC

40 0.1 AT27C400-70PC

40 0.1 AT27C400-70PI

40 0.1 AT27C400-90PC

40 0.1 AT27C400-90PI

40 0.1 AT27C400-12PC

40 0.1 AT27C400-12PI

40 0.1 AT27C400-15PC

40 0.1 AT27C400-15PI

Ordering Code Package Operation RangeActive Standby

AT27C400-70RC
AT27C400-70TC

AT27C400-70RI
AT27C400-70TI

AT27C400-90RC
AT27C400-90TC

AT27C400-90RI
AT27C400-90TI

AT27C400-12RC
AT27C400-12TC

AT27C400-12RI
AT27C400-12TI

AT27C400-15RC
AT27C400-15TC

AT27C400-15RI
AT27C400-15TI

40P6
40R
48T

40P6
40R
48T

40P6
40R
48T

40P6
40R
48T

40P6
40R
48T

40P6
40R
48T

40P6
40R
48T

40P6
40R
48T

Commercial

(0°C to 70°C)

Industrial

(-40°C to 85°C)

Commercial

(0°C to 70°C)

Industrial

(-40°C to 85°C)

Commercial

(0°C to 70°C)

Industrial

(-40°C to 85°C)

Commercial

(0°C to 70°C)

Industrial

(-40°C to 85°C)

40P6
40R
48T

10

= Advance Information

Package Type

40-Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)
40-Lead, 0.450" Wide, Plastic Gull Wing Small Outline Package (SOIC/SOP)
48-Lead, Plastic Thin Small Outline Package (TSOP) 12 x 20 mm

AT27C400