ATMEL AT27C1024-90JI, AT27C1024-90JC, AT27C1024-70VI, AT27C1024-70VC, AT27C1024-70PI Datasheet
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Features
• Fast Read Access Time - 45 ns
• Low Power CMOS Operation
– 100 µA max. Standby
– 30 mA max. Active at 5 MHz
• JEDEC Standard Packages
– 40-Lead 600-mil PDIP
– 44-Lead PLCC
– 40-Lead TSOP (10 mm x 14 mm)
• Direct Upgrade from 512K (AT27C516) EPROM
• 5V ± 10% Power Supply
• High Reliability CMOS Technology
– 2000V ESD Protection
– 200 mA Latchup Immunity
™
• Rapid
• CMOS and TTL Compatible Inputs and Outputs
• Integrated Product Identification Code
• Commercial and Industrial Temperature Ranges
Programming Algorithm - 100 µs/word (typical)
AT27C1024
AT27C1024
1-Megabit
(64K x 16)
OTP EPROM
Description
The AT27C1024 is a low-power, high-performance 1,048,576 bit one-time programmable read only memory (OT P EPROM) o rganized 64K by 16 bi ts. It requi res only
one 5V power supply in normal read mode operation. Any word can be accessed in
less than 45 ns, eliminating the need for speed reducing WAIT states. The by-16
organization m ake t his part ide al fo r hi gh-pe rforma nce 1 6- a nd 32- bit microp roce ssor
systems.
Pin Configurations
Pin Name Function
A0 - A15 Addresses
O0 - O15 Outputs
CE Chip Enable
OE Output Enable
PGM Program Strobe
NC No Connect
Note: Both GND pins must be
connected.
PDIP Top View
(continued)
AT27C1024
PLCC Top View
TSOP Top View
Type 1
0019I-A–7/97
1
AT27C1024
µ
µ
µ
µ
In read mode, the AT27C1024 typically consumes 15 mA.
Standby mode supply current is typically less than 10
The AT27C1024 is available in industry standard JEDECapproved one-time programmable (OTP) plastic PDIP,
PLCC, and TSOP packages. The device features two-line
control (CE
systems.
With high density 64K word storage capability, th e
AT27C1024 allows firmware to be store d reliabl y and to be
accessed by the system without the delays of mass storage
media.
Atmel’s 27C1024 have additional features to ensure high
quality and efficient production use. The Rapid
ming Algori thm reduc es the tim e requi red to pro gram the
part and guarantees reliable programming. Programming
time is typically only 100
Identification Code electronically identifies the device and
manufacturer. This feature is used by industry standard
programming eq uipme nt to sel ect the pro per prog ramming
algorithms and voltages.
, OE) to eliminate bus cont ention in high-s peed
™
s/word. The Integrated Product
A.
Program-
System Considerations
Switching between active and standby conditions via the
Chip Enable pin may produce tr ans ie nt v olta ge e xcur sion s.
Unless accommodated by the system design, these transients may exceed data sheet limits, resulting in device
non-conformance . At a minim um, a 0.1
low inherent inductance, ceramic capacitor should be utilized for each device. This capacitor shoul d be connected
between the V
close to the device as possible. Additionally, to stabilize the
supply voltage level on printed circuit boards with large
EPROM arrays, a 4.7
be utilized, agai n connec ted betwe en the V
terminals. This capacitor should be positioned as close as
possible to the point where the power supply is connected
to the array.
and Ground terminals of the device, as
CC
F bulk electrolytic capacitor should
F high frequency,
and Ground
CC
2
Block Diagram
Absolute Maximum Ratings*
AT27C1024
Temperature Under Bias ......................-55°C to +125°C
Storage Temperature............................-65°C to +150°C
Voltage on Any Pin with
Respect to Ground ..............................-2.0V to +7.0V
Voltage on A9 with
Respect to Ground ...........................-2.0V to +14.0V
VPP Supply Voltage with
Respect to Ground ............................-2.0V to +14.0V
Operating Modes
Mode/Pin
Read V
Output Disable X V
Standby V
Rapid Program
PGM Verify V
PGM Inhibit V
Product Identification
Notes: 1. X can be VIL or VIH.
2. Refer to Programming Characteris tics.
3. VH = 12.0 ± 0.5V.
4. Two identifier words may be selected. All Ai inputs are held low (V
5. Standby V
(2)
low (V
(4)
) to select the Manufacturer’s Identification word and high (VIH) to select the Device Code word.
IL
current (ISB) is specified with VPP = VCC. V
CC
CE OE PGM Ai V
V
IL
IH
V
IL
IL
IH
V
IL
IL
IH
XX X X
V
IH
V
IL
XX X V
V
IL
*NOTICE: Stresses beyond those listed under “Absolute Maxi-
mum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional
operation of the device at these or any other conditions beyond those indicated in the operational sec-
(1)
tions of this specification is not implied. Exposure to
absolute maximum rating conditions for extended
periods may affect device reliability.
(1)
Note: Minimum voltage is -0.6V DC which may undershoot to
-2.0V for pulses of less than 20 ns. Maximum output pin
(1)
voltage is V
for pulses of less than 20 ns.
(1)
X
Ai X D
+ 0.75V DC which may overshoot to +7.0V
CC
PP
Outputs
OUT
XXXHigh Z
(5)
V
IL
V
IH
X
> VPP will cause a slight increase in ISB.
CC
Ai V
Ai V
(3)
H
or VIL
IH
IL
A9 = V
A0 = V
A1 - A15 = V
), except A9 which is set to VH and A0 which is toggled
IL
V
PP
PP
PP
CC
High Z
D
IN
D
OUT
High Z
Identification Code
3
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