ATMEL AT27C040-70TI, AT27C040-70RI, AT27C040-70RC, AT27C040-70PI, AT27C040-70PC Datasheet

AT27C040

1

4-Megabit
(512K x 8)
OTP EPROM

AT27C040

Features

• Fast Read Access Time - 70 ns

• Low Power CMOS Operation

100 µA max. Standby
30 mA max. Active at 5 MHz

• JEDEC Standard Packages

32-Lead 600-mil PDIP
32-Lead 450-mil SOIC (SOP)
32-Lead PLCC
32-Lead TSOP

• 5V ± 10% Supply

• High Reliability CMOS Technology

2000V ESD Protection
200 mA Latchup Immunity

• Rapid

™

Programming Algorithm - 100 µs/byte (typical)

• CMOS and TTL Compatible Inputs and Outputs

• Integrated Product Identification Code

• Commercial and Industrial Temperature Ranges

Description

The AT27C040 chip is a low- power, high-pe rformance, 4,194,304-bit one-time pro­grammable read only memory (OTP EPROM) organized as 512K by 8 bits . The
AT27C040 requires only one 5V power suppl y in no rmal read mode operatio n. Any
byte can be accessed in less than 70 ns, eliminating the need for speed reducing
WAIT states on high-performance microprocessor systems.

Atmel's scaled CM OS tec hnology pr ovides l ow active power c onsumption , and fast
programming. Power consumption is typically 8 mA in active mode and less than 10

µ

A in standby mode.

0189E-A–7/97

Pin Configurations

Pin Name Function

A0 - A18 Addresses
O0 - O7 Outputs
CE

Chip Enable

OE

Output Enable

PDIP, SOIC Top View

TSOP Top View

PLCC Top View

(continued)

AT27C040

2

The AT27C040 is available in a choice of industry standard
JEDEC-approved one -time programm able (OTP) plasti c
PDIP, PLCC, SOI C (SOP), and TSOP pac kages. The
device features two-line control (CE

, OE) to eliminate bus

contention in high-speed systems.
Atmel's AT27C040 has additi onal feature s to ensure high

quality and efficient produc tion use. The Rapid

™

Program­ming Algorith m reduc es the tim e requi red to pro gram the
part and guarantees reliable programming. Programming
time is typically only 100

µ

s/byte. The Integrat ed Product
Identification Code electronically identifies the device and
manufacturer. This feature is used by industry standard
programming eq uipme nt to selec t the pro per prog ramming
algorithms and voltages.

Switching Considerations

Switching between active and standby conditions via the
Chip Enable pin may produce tr ans ie nt volta ge excursions.
Unless accommodated by the system design, these tran­sients may exceed data sheet limits, resulting in device
non-conformance . At a mini mum, a 0.1

µ

F high frequency,
low inherent inductance, ceramic capacitor should be uti­lized for each device. This capacitor shoul d be connected
between the V

CC

and Ground terminals of the device, as
close to the device as possible. Additionally, to stabilize the
supply voltage level on printed circuit boards with large
EPROM arrays, a 4.7

µ

F bulk electrolytic capacitor should

be utilized, agai n connec ted betwe en the V

CC

and Ground
terminals. This capacitor should be positioned as close as
possible to the point where the power supply is connected
to the array.

AT27C040

3

Block Diagram

Absolute Maximum Ratings*

*NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a

stress rating only and functio nal ope ratio n of th e de vic e at thes e or an y other c onditi ons be y ond those in dicat ed in the op er­ational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods
may affect device reliability.

Temperature Under Bias ......................-55°C to +125°C

Storage Temperature............................-65°C to +150°C

Voltage on Any Pin with

Respect to Ground ..............................-2.0V to +7.0V

(1)

Voltage on A9 with

Respect to Ground ...........................-2.0V to +14.0V

(1)

VPP Supply Voltage with

Respect to Ground ............................-2.0V to +14.0V

(1)

Operating Modes

Notes: 1. X can be VIL or VIH.

2. Refer to Programming Characteristics

3. V

H

= 12.0 ± 0.5V.

4. Two identifier bytes may be selected. All Ai inputs are held low (VIL), except A9 which is set to VH and A0 which is toggled
low (V

IL

) to select the Manufacturer’s Identificaton byte and high (VIH) to select the Device Code byte.

Mode/Pin CE OE Ai V

PP

Outputs

Read V

IL

V

IL

Ai X

(1)

D

OUT

Output Disable X V

IH

XXHigh Z

Standby V

IH

XX X High Z

Rapid Program

(2)

V

IL

V

IH

Ai V

PP

D

IN

PGM Verify X V

IL

Ai V

PP

D

OUT

PGM Inhibit V

IH

V

IH

XVPPHigh Z

Product Identification

(4)

V

IL

V

IL

A9 = V

H

(3)

A0 = VIH or VIL

A1 - A18 = V

IL

X Identification Code

AT27C040

4

DC and AC Operating Conditions for Read Operation

AT27C040

-70 -90 -12 -15

Operating
Temperature (Case)

Com. 0°C - 70°C 0°C - 70°C 0°C - 70°C 0°C - 70°C
Ind. -40°C - 85°C -40°C - 85°C -40°C - 85°C -40°C - 85°C

V

CC

Powe r S uppl y 5V ± 10% 5V ± 10 % 5V ± 10% 5V ± 10%

AC Characteristics for Read Operation

Note: 2, 3, 4, 5 - see AC Waveforms for Read Operation

Symbol Parameter Condition

AT27C040

Units

-70 -90 -12 -15

Min Max Min Max Min Max Min Max

t

ACC

(3)

Address to Output Delay

CE

= OE

= V

IL

70 90 1 20 15 0 ns

t

CE

(2)

CE to Output Delay OE = V

IL

70 90 120 150 ns

t

OE

(2)(3)

OE to Output Delay CE = V

IL

30 35 35 40 ns

t

DF

(4)(5)

OE or CE High to Output
Float, whichever occurred
first

20 20 30 30 ns

t

OH

Output Hold from Address,
CE

or OE, whichever

occurred first

0000ns

DC and Operating Characteristics for Read Operation

Notes: 1. VCC must be applied simultaneously or before VPP, and removed simultaneously or after VPP.

2. V

PP

may be connected directly to VCC, except during programming. The supply current would then be the sum of ICC and

I

PP

.

Symbol Paramter Condition Min Max Units

I

LI

Input Load Current VIN = 0V to V

CC

±1

µ

A

I

LO

Output Leakage Current V

OUT

= 0V to V

CC

±5

µ

A

I

PP1

(2)

V

PP

(1)

Read/Standby Current VPP = V

CC

10

µ

A

I

SB

V

CC1

(1)

Standby Current

I

SB1

(CMOS), CE = VCC ± 0.3V 100

µ

A

I

SB2

(TTL), CE = 2.0 to V

CC

+ 0.5V 1 mA

I

CC

VCC Active Current

f = 5 MHz, I

OUT

= 0 mA,

CE

= V

IL

30 mA

V

IL

Input Low Voltage -0.6 0.8 V

V

IH

Input High Voltage 2.0

V

CC

+

0.5

V

V

OL

Output Low Voltage IOL = 2.1 mA 0.4 V

V

OH

Output High Voltage IOH = -400 µA2.4V

AT27C040

5

AC Waveforms for Read Operation

(1)

Notes: 1. Tiiming measurement references are 0.8V and 2.0V. Input AC drive levels are 0.45V and 2.4V, unless otherwise specified.

2. OE

may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE.

3. OE may be delayed up to t

ACC

- tOE after the address is valid without impact on t

ACC

.

4. This parameter is only sampled and is not 100% tested.

5. Output float is defined as the point when data is no longer driven.

Pin Capacitance

(f = 1 MHz, T = 25°C)

(1)

Note: 1. Typical values for nominal supply voltage. This parameter is only sampled and is not 100% tested.

Typ Max Units Conditions

C

IN

48pFV

IN

= 0V

C

OUT

812pFV

OUT

= 0V

Output Test LoadInput Test Waveforms and Measurement Levels

AT27C040

6

Programming Waveforms

(1)

Notes: 1. The Input Timing Reference is 0.8V for VIL and 2.0V for VIH.

2. t

OE

and t

DFP

are characteristics of the device but must be accommodated by the programmer.

3. When programming the AT27C040 a 0.1 µF capacitor i s required across VPP and ground to supress spurious voltage tran-

sients.

DC Programming Characteristics

TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V

Symbol Parameter Test Conditions

Limits

UnitsMin Max

I

LI

Input Load Current V

IN

= VIL, V

IH

±10

µ

A

V

IL

Input Low Level -0.6 0.8 V

V

IH

Input High Level 2.0 V

CC

+ 0.7 V

V

OL

Output Low Voltage IOL = 2.1 mA 0.4 V

V

OH

Output High Voltage I

OH

= -400 µA2.4 V

I

CC2

VCC Supply Current (Program and Verify) 40 mA

I

PP2

VPP Supply Current CE = V

IL

20 mA

V

ID

A9 Product Identification Voltage 11.5 12.5 V

AT27C040

7

AC Programming Characteristics

TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V

Notes: 1. VCC must be applied simultaneously or before VPP and removed simultaneously or after VPP.

2. This parameter is only sampled and is not 100% tested. Output Float is defined as the point where data is no longer driven
— see timing diagram.

3. Program Puls e width tolerance is 100

µ

sec ± 5%.

Symbol Parameter Test Conditions

(1)

Limits

UnitsMin Max

t

AS

Address Setup Time

Input Rise and Fall Times

(10% to 90%) 20ns

Input Pulse Levels

0.45V to 2.4V

Input Timing Reference Level

0.8V to 2.0V

Output Timing Reference Level

0.8V to 2.0V

2

µ

s

t

OES

OE Setup Time 2

µ

s

t

DS

Data Setup Time 2

µ

s

t

AH

Address Hold Time 0

µ

s

t

DH

Data Hold Time 2

µ

s

t

DFP

OE High to Output Float Delay

(2)

0 130 ns

t

VPS

VPP Setup Time 2

µ

s

t

VCS

VCC Setup Time 2

µ

s

t

PW

CE Program Pulse Width

(3)

95 105

µ

s

t

OE

Data Valid from OE

(2)

150 ns

t

PRT

VPP Pulse Rise Time During Programming 50 ns

Atmel's 27C040 Integrated Product Identification Code

Codes

Pins

Hex Data

A0 O7 O6 O5 O4 O3 O2 O1 O0

Manufacturer

000011110 1E

Device Type

100001011 0B

AT27C040

8

Rapid Programming Algorithm

A 100 µs CE pulse width is used to prog ram. The ad dress
is set to the first location. V

CC

is raised to 6.5V and VPP is
raised to 13.0V. Each address is first programmed with one
100

µ

s CE pulse without verification. Then a verifica­tion/reprogramming loop is exec uted for each address. In
the event a byte fails to pass verification, up to 10 succes­sive 100

µ

s pulses are applied with a verification after each

pulse. If the byte fails to verify after 10 pulses have been
applied, the part is con sidere d failed . After th e byte ve rifie s
properly, the next address is selected until all have been
checked. V

PP

is then lowere d to 5.0V an d VCC to 5.0V. All
bytes are read again and compared with the original data to
determine if the device passes or fails.

AT27C040

9

Ordering Information

t

ACC

(ns)

I

CC

(mA)

Ordering Co de Package Operation RangeActive Standby

70 30 0.1 AT27C040-70JC 32J Commercial

AT27C040-70PC 32 P 6 (0°C to 70°C)
AT27C040-70RC 32R
AT27C040-70TC 32T

30 0.1 AT27C040-70JI 32J Industrial

AT27C040-70PI 32P6 (-40°C to 85°C)
AT27C040-70RI 32R
AT27C040-70TI 32T

90 30 0.1 AT27C040-90JC 32J Commercial

AT27C040-90PC 32P6 (0°C to 70°C)
AT27C040-90RC 32R
AT27C040-90TC 32T

30 0.1 AT27C040-90JI 32J Industrial

AT27C040-90PI 32P6 (-40°C to 85°C)
AT27C040-90RI 32R
AT27C040-90TI 32T

120 30 0.1 AT27C040-12JC 32J Commercial

AT27C040-12PC 32P6 (0°C to 70°C)
AT27C040-12RC 32R
AT27C040-12TC 32T

30 0.1 AT27C040-12JI 32J Industrial

AT27C040-12PI 32P6 (-40°C to 85°C)
AT27C040-12RI 32R
AT27C040-12TI 32T

150 30 0.1 AT27C040-15JC 32J Commercial

AT27C040-15PC 32P6 (0°C to 70°C)
AT27C040-15RC 32R
AT27C040-15TC 32T

30 0.1 AT27C040-15JI 32J Industrial

AT27C040-15PI 32P6 (-40°C to 85°C)
AT27C040-15RI 32R
AT27C040-15TI 32T

Package Type

32J 32-Lead, Plastic J-Leaded Chip Carrier (PLCC)
32P6 32-Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)
32R 32-Lead, 0.450" Wide, Plastic Gull Wing Small Outline (SOIC)
32T 32-Lead, Plastic Thin Small Outline Package (TSOP)