ATMEL AT27C010 User Manual

BDTIC www.BDTIC.com/ATMEL

Features

•Fast Read Access Time – 45 ns

•Low-Power CMOS Operation

–100 µA Max Standby

–25 mA Max Active at 5 MHz

•JEDEC Standard Packages

–32-lead PDIP

–32-lead PLCC

–32-lead TSOP

•5V ± 10% Supply

•High Reliability CMOS Technology

–2000V ESD Protection

–200 mA Latchup Immunity

•Rapid Programming Algorithm – 100 µs/Byte (Typical)

•CMOS and TTL Compatible Inputs and Outputs

•Integrated Product Identification Code

•Industrial Temperature Range

•Green (Pb/Halide-free) Packaging Option

1. Description

The AT27C010 is a low-power, high-performance 1,048,576-bit one-time programmable read-only memory (OTP EPROM) organized as 128K by 8 bits. They require only one 5V power supply in normal read mode operation. Any byte can be accessed in less than 45 ns, eliminating the need for speed reducing WAIT states on high-perfor- mance microprocessor systems.

In read mode, the AT27C010 typically consumes only 8 mA. Standby mode supply current is typically less than 10 µA.

The AT27C010 is available in a choice of industry-standard JEDEC-approved onetime programmable (OTP) plastic PDIP, PLCC, and TSOP packages. All devices feature two line control (CE, OE) to give designers the flexibility to prevent bus contention.

With 128K byte storage capability, the AT27C010 allows firmware to be stored reliably and to be accessed by the system without the delays of mass storage media.

Atmel’s AT27C010 has additional features to ensure high quality and efficient production use. The Rapid Programming Algorithm reduces the time required to program the part and guarantees reliable programming. Programming time is typically only 100 µs/byte. The Integrated Product Identification Code electronically identifies the device and manufacturer. This feature is used by industry-standard programming equipment to select the proper programming algorithms and voltages.

1-Megabit

(128K x 8) OTP EPROM

AT27C010

0321M–EPROM–12/07

2. Pin Configurations

	Pin Name				Function
	A0 - A16				Addresses
	O0 - O7				Outputs
					Chip Enable
	CE
					Output Enable
	OE
					Program Strobe
	PGM
	NC				No Connect

2.132-lead PLCC Top View

	A12	A15	A16	VPP	VCC		PGM	NC
A7	4	3	2	1	32	31		30	A14
	5							29
A6	6							28	A13
A5	7							27	A8
A4	8							26	A9
A3	9							25	A11
A2	10							24	OE
A1	11							23	A10
A0	12							22	CE
O0	13	15	16	17	18	19		21	O7
	14							20
	O1	O2	GND	O3	O4		O5	O6

2.232-lead PDIP Top View

VPP		1	32		VCC
A16		2	31		PGM
A15		3	30		NC
A12		4	29		A14
A7		5	28		A13
A6		6	27		A8
A5		7	26		A9
A4		8	25		A11
A3		9	24		OE
A2		10	23		A10
A1		11	22		CE
A0		12	21		O7
O0		13	20		O6
O1		14	19		O5
O2		15	18		O4
GND		16	17		O3

2 AT27C010

2.332-lead TSOP (Type 1) Top View

A11	1			OE
		32
A9	2	31		A10
A8	3	30		CE
A13	4	29		O7
A14	5	28		O6
NC	6	27		O5
PGM	7	26		O4
VCC	8	25		O3
VPP	9	24		GND
A16	10	23		O2
A15	11	22		O1
A12	12	21		O0
A7	13	20		A0
A6	14	19		A1
A5	15	18		A2
A4	16	17		A3

0321M–EPROM–12/07

AT27C010

3. System Considerations

Switching between active and standby conditions via the Chip Enable pin may produce transient voltage excursions. Unless accommodated by the system design, these transients may exceed datasheet limits, resulting in device non-conformance. At a minimum, a 0.1 µF high frequency, low inherent inductance, ceramic capacitor should be utilized for each device. This capacitor should be connected between the VCC and Ground terminals of the device, as close to the device as possible. Additionally, to stabilize the supply voltage level on printed circuit boards with large EPROM arrays, a 4.7 µF bulk electrolytic capacitor should be utilized, again connected between the VCC and Ground terminals. This capacitor should be positioned as close as possible to the point where the power supply is connected to the array.

4. Block Diagram

5.	Absolute Maximum Ratings*
Temperature Under Bias		................................ -55°C to +125°C	*NOTICE: Stresses beyond those listed under “Absolute Max-
			imum Ratings” may cause permanent damage to
Storage Temperature .....................................		-65°C to +150°C	the device. This is a stress rating only and func-
			tional operation of the device at these or any other
Voltage on Any Pin with		-2.0V to +7.0V(1)	conditions beyond those indicated in the opera-
Respect to Ground .........................................			tional sections of this specification is not implied.
Voltage on A9 with			Exposure to absolute maximum rating conditions
		-2.0V to +14.0V(1)	for extended periods may affect device reliability.
Respect to Ground ......................................
VPP Supply Voltage with		-2.0V to +14.0V(1)
Respect to Ground .......................................
Note:	1. Minimum voltage is -0.6V DC which may undershoot to -2.0V for pulses of less than 20 ns. Maximum output pin voltage is
	VCC + 0.75V DC which may overshoot to +7.0 volts for pulses of less than 20 ns.

3

0321M–EPROM–12/07

6.

Operating Modes

Mode/Pin

CE

OE

PGM

Ai

VPP

Outputs

Read

V

IL

V

IL

X(1)

Ai

X

D

OUT

Output Disable

X

VIH

X

X

X

High Z

Standby

VIH

X

X

X

X

High Z

Rapid Program(2)

V

IL

V

IH

V

IL

Ai

V

PP

D

IN

PGM Verify

VIL

VIL

VIH

Ai

VPP

DOUT

PGM Inhibit

VIH

X

X

X

VPP

High Z

Product Identification(4)

A9 = VH(3)

V

IL

V

IL

X

A0 = V or V

IL

X

Identification Code

IH

A1 - A16 = VIL

Note:

1.

X can be VIL or VIH.

2. Refer to Programming Characteristics.

3. VH = 12.0 ± 0.5V.

4. Two identifier bytes may be selected. All Ai inputs are held low (VIL), except A9 which is set to VH and A0 which is toggled

low (VIL) to select the Manufacturer’s Identification byte and high (VIH) to select the Device Code byte.

7. DC and AC Operating Conditions for Read Operation

AT27C010

-45

-70

Operating Temp. (Case)

Ind.

-40° C - 85° C

-40° C - 85° C

VCC Power Supply

5V ± 10%

5V ± 10%

8. DC and Operating Characteristics for Read Operation

Symbol

Parameter

Condition

Min

Max

Units

ILI

Input Load Current

VIN = 0V to VCC

Ind.

± 1

µA

ILO

Output Leakage Current

VOUT = 0V to VCC

Ind.

± 5

µA

IPP1(2)

VPP(1)) Read/Standby Current

VPP = VCC

10

µA

ISB1 (CMOS),

= VCC ± 0.3V

100

µA

ISB

VCC(1) Standby Current

CE

ISB2 (TTL), CE = 2.0 to VCC + 0.5V

1

mA

ICC

VCC Active Current

f = 5 MHz, IOUT = 0 mA,

= VIL

25

mA

CE

VIL

Input Low Voltage

-0.6

0.8

V

VIH

Input High Voltage

2.0

VCC + 0.5

V

VOL

Output Low Voltage

IOL = 2.1 mA

0.4

V

VOH

Output High Voltage

IOH = -400 µA

2.4

V

Note:

1.

VCC must be applied simultaneously or before VPP, and removed simultaneously or after VPP.

2. VPP may be connected directly to VCC, except during programming. The supply current would then be the sum of ICC and IPP.

4 AT27C010

0321M–EPROM–12/07